DE60020389D1 - Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau - Google Patents

Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau

Info

Publication number
DE60020389D1
DE60020389D1 DE60020389T DE60020389T DE60020389D1 DE 60020389 D1 DE60020389 D1 DE 60020389D1 DE 60020389 T DE60020389 T DE 60020389T DE 60020389 T DE60020389 T DE 60020389T DE 60020389 D1 DE60020389 D1 DE 60020389D1
Authority
DE
Germany
Prior art keywords
planarizing
polishing pad
abrasive
abrasive particles
lubricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60020389T
Other languages
English (en)
Other versions
DE60020389T2 (de
Inventor
M Sabde
Wonchee Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE60020389D1 publication Critical patent/DE60020389D1/de
Application granted granted Critical
Publication of DE60020389T2 publication Critical patent/DE60020389T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
DE60020389T 1999-07-20 2000-07-19 Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau Expired - Lifetime DE60020389T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US356808 1994-12-15
US09/356,808 US6306012B1 (en) 1999-07-20 1999-07-20 Methods and apparatuses for planarizing microelectronic substrate assemblies
PCT/US2000/019692 WO2001005555A1 (en) 1999-07-20 2000-07-19 Methods and apparatuses for planarizing microelectronic substrate assemblies

Publications (2)

Publication Number Publication Date
DE60020389D1 true DE60020389D1 (de) 2005-06-30
DE60020389T2 DE60020389T2 (de) 2006-04-27

Family

ID=23403035

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60020389T Expired - Lifetime DE60020389T2 (de) 1999-07-20 2000-07-19 Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau

Country Status (8)

Country Link
US (5) US6306012B1 (de)
EP (1) EP1227912B1 (de)
JP (1) JP2003504223A (de)
KR (1) KR100749693B1 (de)
AT (1) ATE296185T1 (de)
AU (1) AU6112600A (de)
DE (1) DE60020389T2 (de)
WO (1) WO2001005555A1 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306012B1 (en) * 1999-07-20 2001-10-23 Micron Technology, Inc. Methods and apparatuses for planarizing microelectronic substrate assemblies
US6383934B1 (en) 1999-09-02 2002-05-07 Micron Technology, Inc. Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids
US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6387289B1 (en) 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6612901B1 (en) * 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6652764B1 (en) * 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6722943B2 (en) 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6730592B2 (en) * 2001-12-21 2004-05-04 Micron Technology, Inc. Methods for planarization of metal-containing surfaces using halogens and halide salts
US20030119316A1 (en) * 2001-12-21 2003-06-26 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
US6935933B1 (en) * 2001-12-21 2005-08-30 Lsi Logic Corporation Viscous electropolishing system
US6884723B2 (en) * 2001-12-21 2005-04-26 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using complexing agents
US7121926B2 (en) * 2001-12-21 2006-10-17 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
US7049237B2 (en) * 2001-12-21 2006-05-23 Micron Technology, Inc. Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
US6869335B2 (en) 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
US6860798B2 (en) 2002-08-08 2005-03-01 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
US6841991B2 (en) 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
DE10261465B4 (de) * 2002-12-31 2013-03-21 Advanced Micro Devices, Inc. Anordnung zum chemisch-mechanischen Polieren mit einem verbesserten Konditionierwerkzeug
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
IL156094A0 (en) * 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
US7040965B2 (en) * 2003-09-18 2006-05-09 Micron Technology, Inc. Methods for removing doped silicon material from microfeature workpieces
US6939211B2 (en) * 2003-10-09 2005-09-06 Micron Technology, Inc. Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
US20050159088A1 (en) * 2004-01-15 2005-07-21 Ecolab Inc. Method for polishing hard surfaces
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US7264539B2 (en) 2005-07-13 2007-09-04 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
US7326105B2 (en) 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
US7438626B2 (en) 2005-08-31 2008-10-21 Micron Technology, Inc. Apparatus and method for removing material from microfeature workpieces
US7294049B2 (en) 2005-09-01 2007-11-13 Micron Technology, Inc. Method and apparatus for removing material from microfeature workpieces
US20070147551A1 (en) * 2005-12-26 2007-06-28 Katsumi Mabuchi Abrasive-free polishing slurry and CMP process
US7754612B2 (en) 2007-03-14 2010-07-13 Micron Technology, Inc. Methods and apparatuses for removing polysilicon from semiconductor workpieces
US8226775B2 (en) * 2007-12-14 2012-07-24 Lam Research Corporation Methods for particle removal by single-phase and two-phase media
DE102009048436B4 (de) * 2009-10-07 2012-12-20 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
CN102615571A (zh) * 2011-01-28 2012-08-01 中芯国际集成电路制造(上海)有限公司 抛光装置及方法
JP2013049112A (ja) * 2011-08-31 2013-03-14 Kyushu Institute Of Technology ポリシングパッド及びその製造方法
US10071459B2 (en) 2013-09-25 2018-09-11 3M Innovative Properties Company Multi-layered polishing pads
WO2015047939A1 (en) 2013-09-25 2015-04-02 3M Innovative Properties Company Composite ceramic abrasive polishing solution
CN107735471B (zh) * 2015-07-10 2021-02-12 费罗公司 用于抛光有机聚合物基眼用基材的浆液组合物和添加剂以及方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617320A (en) * 1968-08-06 1971-11-02 Hooker Chemical Corp Metallizing substrates
US4826563A (en) 1988-04-14 1989-05-02 Honeywell Inc. Chemical polishing process and apparatus
US4927869A (en) 1988-09-15 1990-05-22 Ppg Industries, Inc. Chemically treated glass fibers for reinforcing polymers
US5380528A (en) * 1990-11-30 1995-01-10 Richardson-Vicks Inc. Silicone containing skin care compositions having improved oil control
CA2091420A1 (en) * 1992-03-17 1993-09-18 Richard W. Jahnke Compositions containing combinations of surfactants and derivatives of succinic acylating agent or hydroxyaromatic compounds and methods of using the same
US5554320A (en) * 1993-11-22 1996-09-10 Yianakopoulos; Georges Liquid cleaning compositions
JP3305557B2 (ja) * 1995-04-10 2002-07-22 大日本印刷株式会社 研磨テープ、その製造方法および研磨テープ用塗工剤
US5705470A (en) 1995-06-16 1998-01-06 Edward F. Topa Sprayable cleaning gel, dispenser, and method of using same
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5916012A (en) 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
JPH1034514A (ja) * 1996-07-24 1998-02-10 Sanshin:Kk 表面研磨加工方法及びその装置
US5722877A (en) 1996-10-11 1998-03-03 Lam Research Corporation Technique for improving within-wafer non-uniformity of material removal for performing CMP
US5972792A (en) 1996-10-18 1999-10-26 Micron Technology, Inc. Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5702292A (en) 1996-10-31 1997-12-30 Micron Technology, Inc. Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine
US5876268A (en) * 1997-01-03 1999-03-02 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
US6062958A (en) * 1997-04-04 2000-05-16 Micron Technology, Inc. Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
DE59810610D1 (de) * 1997-04-30 2004-02-26 Stopinc Ag Huenenberg Schiebeverschluss für ein Metallschmelze enthaltendes Gefäss
US5934978A (en) * 1997-08-15 1999-08-10 Advanced Micro Devices, Inc. Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects
US5997384A (en) 1997-12-22 1999-12-07 Micron Technology, Inc. Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates
US6200896B1 (en) 1998-01-22 2001-03-13 Cypress Semiconductor Corporation Employing an acidic liquid and an abrasive surface to polish a semiconductor topography
US6124207A (en) * 1998-08-31 2000-09-26 Micron Technology, Inc. Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries
US5972124A (en) 1998-08-31 1999-10-26 Advanced Micro Devices, Inc. Method for cleaning a surface of a dielectric material
US6572453B1 (en) 1998-09-29 2003-06-03 Applied Materials, Inc. Multi-fluid polishing process
US6039633A (en) * 1998-10-01 2000-03-21 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
US6634927B1 (en) 1998-11-06 2003-10-21 Charles J Molnar Finishing element using finishing aids
US6267644B1 (en) * 1998-11-06 2001-07-31 Beaver Creek Concepts Inc Fixed abrasive finishing element having aids finishing method
US6206756B1 (en) 1998-11-10 2001-03-27 Micron Technology, Inc. Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6276996B1 (en) * 1998-11-10 2001-08-21 Micron Technology, Inc. Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6048256A (en) * 1999-04-06 2000-04-11 Lucent Technologies Inc. Apparatus and method for continuous delivery and conditioning of a polishing slurry
US6306012B1 (en) 1999-07-20 2001-10-23 Micron Technology, Inc. Methods and apparatuses for planarizing microelectronic substrate assemblies
US6291407B1 (en) * 1999-09-08 2001-09-18 Lafrance Manufacturing Co. Agglomerated die casting lubricant
US6572731B1 (en) * 2002-01-18 2003-06-03 Chartered Semiconductor Manufacturing Ltd. Self-siphoning CMP tool design for applications such as copper CMP and low-k dielectric CMP

Also Published As

Publication number Publication date
EP1227912A1 (de) 2002-08-07
US6306012B1 (en) 2001-10-23
JP2003504223A (ja) 2003-02-04
US6881127B2 (en) 2005-04-19
KR20020032532A (ko) 2002-05-03
EP1227912B1 (de) 2005-05-25
US7083700B2 (en) 2006-08-01
KR100749693B1 (ko) 2007-08-17
US6903018B2 (en) 2005-06-07
US20010051496A1 (en) 2001-12-13
DE60020389T2 (de) 2006-04-27
WO2001005555A1 (en) 2001-01-25
US20010055936A1 (en) 2001-12-27
ATE296185T1 (de) 2005-06-15
AU6112600A (en) 2001-02-05
US20010041508A1 (en) 2001-11-15
US7138072B2 (en) 2006-11-21
EP1227912A4 (de) 2003-07-23
US20020177390A1 (en) 2002-11-28

Similar Documents

Publication Publication Date Title
DE60020389D1 (de) Verfahren und vorrichtung zum planarisieren von mikroelektronischem substratenaufbau
ATE320881T1 (de) Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür
WO2004072199A3 (en) Mixed-abrasive polishing composition and method for using the same
EP1702714B1 (de) Verfahren zur Instandhaltung harter Oberflächen
SG163546A1 (en) Use of cmp for aluminum mirror and solar cell fabrication
SG135188A1 (en) Methods and apparatuses for electrochemical-mechanical polishing
MY144187A (en) A cmp composition with a polymer additive for polishing noble metals
ATE445230T1 (de) Verfahren zum planarisieren der oberfläche eines halbleiterwafers
TW200616758A (en) Polishing tape and polishing method thereof
AU5148198A (en) Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
DE60307111D1 (de) Verfahren zum chemisch mechanisch polieren von materialien mit einer niedrigen dielektrizitätskonstanten
EP0878269A3 (de) Abrichtvorrichtung zum Abrichten von Polierkissen
TW429462B (en) Manufacturing method and processing device for semiconductor device
EP1184134A3 (de) Bearbeitungszentrum mit Abrichtwerkzeug
ATE314903T1 (de) Schleifblatt mit schlitzen zum staubsaugen, vorrichtung zur endbearbeitung von oberflächen und schleifblatthalterung
ATE232436T1 (de) Verfahren und vorrichtung zum bearbeiten eines werkstücks
EP0934801A3 (de) Verfahren und Vorrichtung zum Polieren von Werkstücken
EP1125688A4 (de) Poliervorrichtung und halbleiter-herstellungsverfahren unter verwendung desselben
RU2590749C2 (ru) Шлифовальник
ATE355153T1 (de) Maschine zur bandschleifbearbeitung von werkstückoberflächen eines werkstücks
RU2000114936A (ru) Способ очистки шлифовальных кругов
TW200726578A (en) Tool trimmer for polishing pad and method of the same
WO1999053528A8 (en) Surface treatment process and system
TW200721291A (en) Method for conditioning a polishing pad
KR20060079012A (ko) 버핑 패드 컨디셔닝용 드레서의 제작 방법

Legal Events

Date Code Title Description
8364 No opposition during term of opposition