DE60017271D1 - Trägerloses polierband zum chemisch-mechanischen polieren - Google Patents
Trägerloses polierband zum chemisch-mechanischen polierenInfo
- Publication number
- DE60017271D1 DE60017271D1 DE60017271T DE60017271T DE60017271D1 DE 60017271 D1 DE60017271 D1 DE 60017271D1 DE 60017271 T DE60017271 T DE 60017271T DE 60017271 T DE60017271 T DE 60017271T DE 60017271 D1 DE60017271 D1 DE 60017271D1
- Authority
- DE
- Germany
- Prior art keywords
- belt
- polishing
- chemical
- carrier
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/386,741 US6406363B1 (en) | 1999-08-31 | 1999-08-31 | Unsupported chemical mechanical polishing belt |
PCT/US2000/024207 WO2001015867A1 (en) | 1999-08-31 | 2000-08-31 | Unsupported polishing belt for chemical mechanical polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60017271D1 true DE60017271D1 (de) | 2005-02-10 |
Family
ID=23526859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60017271T Expired - Lifetime DE60017271D1 (de) | 1999-08-31 | 2000-08-31 | Trägerloses polierband zum chemisch-mechanischen polieren |
Country Status (10)
Country | Link |
---|---|
US (2) | US6406363B1 (de) |
EP (1) | EP1214175B1 (de) |
JP (1) | JP2003508905A (de) |
KR (1) | KR20020068032A (de) |
AT (1) | ATE286448T1 (de) |
AU (1) | AU7108000A (de) |
DE (1) | DE60017271D1 (de) |
PT (1) | PT1214175E (de) |
TW (1) | TW466157B (de) |
WO (1) | WO2001015867A1 (de) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6908374B2 (en) * | 1998-12-01 | 2005-06-21 | Nutool, Inc. | Chemical mechanical polishing endpoint detection |
EP1052062A1 (de) * | 1999-05-03 | 2000-11-15 | Applied Materials, Inc. | Vorbehandlung eines fixierten Schleifmittels |
US7516536B2 (en) * | 1999-07-08 | 2009-04-14 | Toho Engineering Kabushiki Kaisha | Method of producing polishing pad |
US6869343B2 (en) * | 2001-12-19 | 2005-03-22 | Toho Engineering Kabushiki Kaisha | Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool |
US6406363B1 (en) * | 1999-08-31 | 2002-06-18 | Lam Research Corporation | Unsupported chemical mechanical polishing belt |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
US6884153B2 (en) * | 2000-02-17 | 2005-04-26 | Applied Materials, Inc. | Apparatus for electrochemical processing |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US6848970B2 (en) * | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US6991526B2 (en) * | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
KR100857504B1 (ko) * | 2000-12-01 | 2008-09-08 | 도요 고무 고교 가부시키가이샤 | 연마 패드용 쿠션층 |
US6896776B2 (en) * | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
US6561889B1 (en) | 2000-12-27 | 2003-05-13 | Lam Research Corporation | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
US6572463B1 (en) | 2000-12-27 | 2003-06-03 | Lam Research Corp. | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same |
US6609961B2 (en) | 2001-01-09 | 2003-08-26 | Lam Research Corporation | Chemical mechanical planarization belt assembly and method of assembly |
US7201829B2 (en) | 2001-03-01 | 2007-04-10 | Novellus Systems, Inc. | Mask plate design |
JP4570286B2 (ja) * | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
US7238092B2 (en) * | 2001-09-28 | 2007-07-03 | Novellus Systems, Inc. | Low-force electrochemical mechanical processing method and apparatus |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
US6722946B2 (en) * | 2002-01-17 | 2004-04-20 | Nutool, Inc. | Advanced chemical mechanical polishing system with smart endpoint detection |
US6942546B2 (en) | 2002-01-17 | 2005-09-13 | Asm Nutool, Inc. | Endpoint detection for non-transparent polishing member |
US6926589B2 (en) * | 2002-03-22 | 2005-08-09 | Asm Nutool, Inc. | Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing |
US6857947B2 (en) | 2002-01-17 | 2005-02-22 | Asm Nutool, Inc | Advanced chemical mechanical polishing system with smart endpoint detection |
US6837983B2 (en) * | 2002-01-22 | 2005-01-04 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
US6935922B2 (en) * | 2002-02-04 | 2005-08-30 | Kla-Tencor Technologies Corp. | Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing |
AU2003224233A1 (en) * | 2002-03-13 | 2003-09-29 | Nutool, Inc. | Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20040072445A1 (en) * | 2002-07-11 | 2004-04-15 | Applied Materials, Inc. | Effective method to improve surface finish in electrochemically assisted CMP |
KR100823187B1 (ko) * | 2002-07-19 | 2008-04-18 | 삼성에스디아이 주식회사 | 음극선관용 섀도우 마스크 |
US20050061674A1 (en) * | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
US7112270B2 (en) * | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
US7121937B2 (en) | 2003-03-17 | 2006-10-17 | 3M Innovative Properties Company | Abrasive brush elements and segments |
US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
US20050121141A1 (en) * | 2003-11-13 | 2005-06-09 | Manens Antoine P. | Real time process control for a polishing process |
US7186164B2 (en) * | 2003-12-03 | 2007-03-06 | Applied Materials, Inc. | Processing pad assembly with zone control |
US7655565B2 (en) * | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
US7316605B1 (en) * | 2006-07-03 | 2008-01-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7422982B2 (en) * | 2006-07-07 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
JP4947583B2 (ja) * | 2007-03-30 | 2012-06-06 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
US20100112919A1 (en) * | 2008-11-03 | 2010-05-06 | Applied Materials, Inc. | Monolithic linear polishing sheet |
US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
WO2013151946A1 (en) * | 2012-04-02 | 2013-10-10 | Thomas West Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
TWI769988B (zh) * | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
US10099339B2 (en) * | 2016-06-02 | 2018-10-16 | Semiconductor Manufacturing International (Shanghai) Corporation | Chemical mechanical polishing (CMP) apparatus and method |
SG11201906131WA (en) * | 2017-01-20 | 2019-08-27 | Applied Materials Inc | A thin plastic polishing article for cmp applications |
JP7317532B2 (ja) * | 2019-03-19 | 2023-07-31 | キオクシア株式会社 | 研磨装置及び研磨方法 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58163638A (ja) | 1982-03-25 | 1983-09-28 | Mitsuboshi Belting Ltd | ゴム製歯付ベルトの製造用組立モ−ルド |
US4576612A (en) | 1984-06-01 | 1986-03-18 | Ferro Corporation | Fixed ophthalmic lens polishing pad |
US4728552A (en) | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US4927432A (en) | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
US4753838A (en) | 1986-06-16 | 1988-06-28 | Tsuguji Kimura | Polishing sheet material and method for its production |
JPS63267155A (ja) | 1987-04-24 | 1988-11-04 | Babcock Hitachi Kk | 研磨装置 |
US4841680A (en) | 1987-08-25 | 1989-06-27 | Rodel, Inc. | Inverted cell pad material for grinding, lapping, shaping and polishing |
JPH01193166A (ja) | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
US4962562A (en) | 1989-01-18 | 1990-10-16 | Minnesota Mining And Manufacturing Company | Compounding, glazing or polishing pad |
US5234867A (en) | 1992-05-27 | 1993-08-10 | Micron Technology, Inc. | Method for planarizing semiconductor wafers with a non-circular polishing pad |
US5020283A (en) | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5177908A (en) | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
US5257478A (en) | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5197999A (en) | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
US5287663A (en) | 1992-01-21 | 1994-02-22 | National Semiconductor Corporation | Polishing pad and method for polishing semiconductor wafers |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5487697A (en) | 1993-02-09 | 1996-01-30 | Rodel, Inc. | Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads |
US5329734A (en) | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
GB9310398D0 (en) * | 1993-05-20 | 1993-07-07 | Minnisota Mining And Manufactu | Process for the manufacture of endless coated abrasive articles |
US5681612A (en) * | 1993-06-17 | 1997-10-28 | Minnesota Mining And Manufacturing Company | Coated abrasives and methods of preparation |
US5454844A (en) * | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
WO1995022438A1 (en) * | 1994-02-22 | 1995-08-24 | Minnesota Mining And Manufacturing Company | Method for making an endless coated abrasive article and the product thereof |
US5489233A (en) | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5534106A (en) | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
ATE186001T1 (de) | 1994-08-09 | 1999-11-15 | Ontrak Systems Inc | Linear poliergerät und wafer planarisierungsverfahren |
US5593344A (en) | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
US5575707A (en) | 1994-10-11 | 1996-11-19 | Ontrak Systems, Inc. | Polishing pad cluster for polishing a semiconductor wafer |
JP2898896B2 (ja) | 1995-01-10 | 1999-06-02 | ニッタ株式会社 | ポリウレタン製ベルト |
DE69635816T2 (de) | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5578096A (en) * | 1995-08-10 | 1996-11-26 | Minnesota Mining And Manufacturing Company | Method for making a spliceless coated abrasive belt and the product thereof |
US5603311A (en) * | 1995-08-17 | 1997-02-18 | Reimann & Georger | Belt based cutting system |
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
JP2830907B2 (ja) | 1995-12-06 | 1998-12-02 | 日本電気株式会社 | 半導体基板研磨装置 |
US5916012A (en) * | 1996-04-26 | 1999-06-29 | Lam Research Corporation | Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher |
US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
US5876268A (en) * | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
US5871390A (en) | 1997-02-06 | 1999-02-16 | Lam Research Corporation | Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing |
US6328642B1 (en) | 1997-02-14 | 2001-12-11 | Lam Research Corporation | Integrated pad and belt for chemical mechanical polishing |
US6146248A (en) | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6736714B2 (en) | 1997-07-30 | 2004-05-18 | Praxair S.T. Technology, Inc. | Polishing silicon wafers |
US6135859A (en) * | 1999-04-30 | 2000-10-24 | Applied Materials, Inc. | Chemical mechanical polishing with a polishing sheet and a support sheet |
US6406363B1 (en) * | 1999-08-31 | 2002-06-18 | Lam Research Corporation | Unsupported chemical mechanical polishing belt |
-
1999
- 1999-08-31 US US09/386,741 patent/US6406363B1/en not_active Expired - Lifetime
-
2000
- 2000-08-31 PT PT00959821T patent/PT1214175E/pt unknown
- 2000-08-31 AT AT00959821T patent/ATE286448T1/de not_active IP Right Cessation
- 2000-08-31 DE DE60017271T patent/DE60017271D1/de not_active Expired - Lifetime
- 2000-08-31 KR KR1020027002730A patent/KR20020068032A/ko not_active Application Discontinuation
- 2000-08-31 WO PCT/US2000/024207 patent/WO2001015867A1/en active IP Right Grant
- 2000-08-31 AU AU71080/00A patent/AU7108000A/en not_active Abandoned
- 2000-08-31 JP JP2001520264A patent/JP2003508905A/ja active Pending
- 2000-08-31 EP EP00959821A patent/EP1214175B1/de not_active Expired - Lifetime
- 2000-12-14 TW TW089117774A patent/TW466157B/zh not_active IP Right Cessation
-
2001
- 2001-11-09 US US10/036,624 patent/US6656030B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6656030B2 (en) | 2003-12-02 |
US6406363B1 (en) | 2002-06-18 |
EP1214175B1 (de) | 2005-01-05 |
KR20020068032A (ko) | 2002-08-24 |
ATE286448T1 (de) | 2005-01-15 |
TW466157B (en) | 2001-12-01 |
AU7108000A (en) | 2001-03-26 |
EP1214175A1 (de) | 2002-06-19 |
PT1214175E (pt) | 2005-05-31 |
JP2003508905A (ja) | 2003-03-04 |
US20020068513A1 (en) | 2002-06-06 |
WO2001015867A1 (en) | 2001-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |