DE60017271D1 - Trägerloses polierband zum chemisch-mechanischen polieren - Google Patents

Trägerloses polierband zum chemisch-mechanischen polieren

Info

Publication number
DE60017271D1
DE60017271D1 DE60017271T DE60017271T DE60017271D1 DE 60017271 D1 DE60017271 D1 DE 60017271D1 DE 60017271 T DE60017271 T DE 60017271T DE 60017271 T DE60017271 T DE 60017271T DE 60017271 D1 DE60017271 D1 DE 60017271D1
Authority
DE
Germany
Prior art keywords
belt
polishing
chemical
carrier
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60017271T
Other languages
English (en)
Inventor
Cangshan Xu
S Lombardo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Praxair Surface Technologies Inc
Original Assignee
Lam Research Corp
Peripheral Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp, Peripheral Products Inc filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60017271D1 publication Critical patent/DE60017271D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001Manufacture of flexible abrasive materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
DE60017271T 1999-08-31 2000-08-31 Trägerloses polierband zum chemisch-mechanischen polieren Expired - Lifetime DE60017271D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/386,741 US6406363B1 (en) 1999-08-31 1999-08-31 Unsupported chemical mechanical polishing belt
PCT/US2000/024207 WO2001015867A1 (en) 1999-08-31 2000-08-31 Unsupported polishing belt for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
DE60017271D1 true DE60017271D1 (de) 2005-02-10

Family

ID=23526859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60017271T Expired - Lifetime DE60017271D1 (de) 1999-08-31 2000-08-31 Trägerloses polierband zum chemisch-mechanischen polieren

Country Status (10)

Country Link
US (2) US6406363B1 (de)
EP (1) EP1214175B1 (de)
JP (1) JP2003508905A (de)
KR (1) KR20020068032A (de)
AT (1) ATE286448T1 (de)
AU (1) AU7108000A (de)
DE (1) DE60017271D1 (de)
PT (1) PT1214175E (de)
TW (1) TW466157B (de)
WO (1) WO2001015867A1 (de)

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US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
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US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
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US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
JP4947583B2 (ja) * 2007-03-30 2012-06-06 東洋ゴム工業株式会社 研磨パッドの製造方法
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
WO2013151946A1 (en) * 2012-04-02 2013-10-10 Thomas West Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
SG11201906131WA (en) * 2017-01-20 2019-08-27 Applied Materials Inc A thin plastic polishing article for cmp applications
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法

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Also Published As

Publication number Publication date
US6656030B2 (en) 2003-12-02
US6406363B1 (en) 2002-06-18
EP1214175B1 (de) 2005-01-05
KR20020068032A (ko) 2002-08-24
ATE286448T1 (de) 2005-01-15
TW466157B (en) 2001-12-01
AU7108000A (en) 2001-03-26
EP1214175A1 (de) 2002-06-19
PT1214175E (pt) 2005-05-31
JP2003508905A (ja) 2003-03-04
US20020068513A1 (en) 2002-06-06
WO2001015867A1 (en) 2001-03-08

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Legal Events

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8332 No legal effect for de