DE60016938D1 - Trocknungssystem unter verwendung einer überkritischen flüssigkeit - Google Patents

Trocknungssystem unter verwendung einer überkritischen flüssigkeit

Info

Publication number
DE60016938D1
DE60016938D1 DE60016938T DE60016938T DE60016938D1 DE 60016938 D1 DE60016938 D1 DE 60016938D1 DE 60016938 T DE60016938 T DE 60016938T DE 60016938 T DE60016938 T DE 60016938T DE 60016938 D1 DE60016938 D1 DE 60016938D1
Authority
DE
Germany
Prior art keywords
pressure vessel
cover
drying system
vessel
processes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60016938T
Other languages
English (en)
Other versions
DE60016938T2 (de
Inventor
James Tseronis
Heiko Moritz
Mohan Chandra
Ijaz Jafri
Jonathan Talbott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SC Fluids Inc
Original Assignee
SC Fluids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SC Fluids Inc filed Critical SC Fluids Inc
Publication of DE60016938D1 publication Critical patent/DE60016938D1/de
Application granted granted Critical
Publication of DE60016938T2 publication Critical patent/DE60016938T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/008—Processes carried out under supercritical conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE60016938T 1999-09-20 2000-09-20 Trocknungssystem unter verwendung einer überkritischen flüssigkeit Expired - Fee Related DE60016938T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15545499P 1999-09-20 1999-09-20
US155454P 1999-09-20
US09/632,770 US6508259B1 (en) 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading
US632770 2000-08-04
PCT/US2000/025726 WO2001022016A1 (en) 1999-09-20 2000-09-20 Supercritical fluid drying system

Publications (2)

Publication Number Publication Date
DE60016938D1 true DE60016938D1 (de) 2005-01-27
DE60016938T2 DE60016938T2 (de) 2005-12-15

Family

ID=26852346

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60016938T Expired - Fee Related DE60016938T2 (de) 1999-09-20 2000-09-20 Trocknungssystem unter verwendung einer überkritischen flüssigkeit

Country Status (10)

Country Link
US (1) US6508259B1 (de)
EP (1) EP1214555B1 (de)
JP (1) JP2003510801A (de)
KR (1) KR20020060182A (de)
CN (1) CN1127653C (de)
AT (1) ATE285555T1 (de)
AU (1) AU7593900A (de)
DE (1) DE60016938T2 (de)
IL (1) IL148424A0 (de)
WO (1) WO2001022016A1 (de)

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CN108140546B (zh) 2015-10-04 2022-04-12 应用材料公司 用于高纵横比特征的干燥工艺
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Also Published As

Publication number Publication date
IL148424A0 (en) 2002-09-12
CN1127653C (zh) 2003-11-12
ATE285555T1 (de) 2005-01-15
JP2003510801A (ja) 2003-03-18
KR20020060182A (ko) 2002-07-16
US6508259B1 (en) 2003-01-21
DE60016938T2 (de) 2005-12-15
WO2001022016A1 (en) 2001-03-29
EP1214555A4 (de) 2004-04-07
EP1214555A1 (de) 2002-06-19
EP1214555B1 (de) 2004-12-22
AU7593900A (en) 2001-04-24
CN1371462A (zh) 2002-09-25

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