DE60016287D1 - Klebstoffgebundene mehrschichtfolien - Google Patents

Klebstoffgebundene mehrschichtfolien

Info

Publication number
DE60016287D1
DE60016287D1 DE60016287T DE60016287T DE60016287D1 DE 60016287 D1 DE60016287 D1 DE 60016287D1 DE 60016287 T DE60016287 T DE 60016287T DE 60016287 T DE60016287 T DE 60016287T DE 60016287 D1 DE60016287 D1 DE 60016287D1
Authority
DE
Germany
Prior art keywords
multilayer films
adhesive multilayer
adhesive
films
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60016287T
Other languages
English (en)
Other versions
DE60016287T2 (de
Inventor
Marie Singh
Timothy Spivey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lexmark International Inc
Original Assignee
Lexmark International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark International Inc filed Critical Lexmark International Inc
Application granted granted Critical
Publication of DE60016287D1 publication Critical patent/DE60016287D1/de
Publication of DE60016287T2 publication Critical patent/DE60016287T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/18Layered products comprising a layer of metal comprising iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • C09J2400/16Metal
    • C09J2400/163Metal in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00Presence of condensation polymers of aldehydes or ketones
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2469/00Presence of polycarbonate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00Presence of polyurethane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852Adhesive compositions
    • Y10T428/287Adhesive compositions including epoxy group or epoxy polymer
DE60016287T 1999-06-15 2000-06-12 Klebstoffgebundene mehrschichtfolien Expired - Fee Related DE60016287T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/333,455 US6210522B1 (en) 1999-06-15 1999-06-15 Adhesive bonding laminates
US333455 1999-06-15
PCT/US2000/016093 WO2000077116A1 (en) 1999-06-15 2000-06-12 Adhesive bonding laminates

Publications (2)

Publication Number Publication Date
DE60016287D1 true DE60016287D1 (de) 2004-12-30
DE60016287T2 DE60016287T2 (de) 2005-10-27

Family

ID=23302869

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60016287T Expired - Fee Related DE60016287T2 (de) 1999-06-15 2000-06-12 Klebstoffgebundene mehrschichtfolien

Country Status (8)

Country Link
US (1) US6210522B1 (de)
EP (1) EP1278806B1 (de)
JP (1) JP2003518520A (de)
KR (1) KR20030076729A (de)
AU (1) AU5607300A (de)
DE (1) DE60016287T2 (de)
MX (1) MXPA01012858A (de)
WO (1) WO2000077116A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620651B2 (en) 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
US6568775B2 (en) * 2001-10-31 2003-05-27 Hewlett-Packard Development Company, L.P. Dual mode communication device for a fluid ejection device
KR20060118408A (ko) * 2003-08-22 2006-11-23 테사 악티엔게젤샤프트 전기 모듈을 카드 본체에 삽입하기 위한 접착 필름의 용도
US7063402B2 (en) * 2003-11-24 2006-06-20 Eastman Kodak Company Flexible lamination for use with primary ink jet components
TWI220130B (en) * 2003-12-17 2004-08-11 Ind Tech Res Inst Inkjet printhead and manufacturing method thereof
US7448734B2 (en) * 2004-01-21 2008-11-11 Silverbrook Research Pty Ltd Inkjet printer cartridge with pagewidth printhead
US7404613B2 (en) * 2004-06-30 2008-07-29 Lexmark International, Inc. Inkjet print cartridge having an adhesive with improved dimensional control
KR100612325B1 (ko) * 2004-07-16 2006-08-16 삼성전자주식회사 접착성 절연층을 갖는 잉크 카트리지, 그 제조 방법 및이를 장착한 화상 형성 장치
US7275815B2 (en) * 2004-12-01 2007-10-02 Lexmark International, Inc. Die attach methods and apparatus for micro-fluid ejection device
US20070221318A1 (en) * 2006-03-24 2007-09-27 Martin Reiss Adhesion tape and method for mounting a chip onto a substrate
US8061811B2 (en) * 2006-09-28 2011-11-22 Lexmark International, Inc. Micro-fluid ejection heads with chips in pockets
TW200927462A (en) * 2007-10-25 2009-07-01 Crc For Advanced Composite Structures Ltd Customisable size load bearing polymer composite frame
CN102026815B (zh) * 2008-05-15 2013-11-06 惠普开发有限公司 喷墨打印装置及其制造方法
US8303076B2 (en) * 2009-11-04 2012-11-06 Xerox Corporation Solid ink jet printhead having a polymer layer and processes therefor
EP2390403B1 (de) * 2010-05-28 2012-07-04 Electrolux Home Products Corporation N.V. Verfahren zur Montage einer Blende eines Geräts, insbesondere eines Haushaltsgeräts
US8925223B2 (en) * 2011-06-30 2015-01-06 Jeffrey W. Snyder Laminated sheet construction with thermal adhesive surface and method for making same
US9027247B2 (en) * 2012-10-22 2015-05-12 Xerox Corporation Liquid adhesive application by contact printing
KR102285233B1 (ko) * 2015-02-27 2021-08-03 삼성전자주식회사 전자 장치

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US3900360A (en) 1972-10-20 1975-08-19 Heller William C Jun Self-heating composite bonding means and method
JPS5651107B2 (de) 1973-07-06 1981-12-03
CH628926A5 (de) 1977-02-16 1982-03-31 Guenter Schwarz Mehrschichtiges klebematerial.
US4273827A (en) 1978-06-09 1981-06-16 Theodore Sweeney & Company Adhesive assembly
US4313996A (en) 1979-05-21 1982-02-02 The Dow Chemical Company Formable metal-plastic-metal structural laminates
US4497678A (en) 1981-04-03 1985-02-05 The Standard Products Company Method of making a laminate construction
US4666758A (en) 1984-06-04 1987-05-19 Sierracin Corporation Low temperature laminatable polyurethane
JPS6170247U (de) 1984-10-05 1986-05-14
US4935086A (en) 1986-01-13 1990-06-19 Raytheon Company Process of bonding an electrical device package to a mounting surface
JP2573661B2 (ja) 1988-07-09 1997-01-22 キヤノン株式会社 感光感熱型接着剤
US5204399A (en) 1989-03-09 1993-04-20 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US5208188A (en) 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
CA2052427A1 (en) 1990-12-17 1992-06-18 Gary J. Jacaruso Bonding of thermoset composite structures
TW210422B (de) 1991-06-04 1993-08-01 Akzo Nv
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US5661336A (en) 1994-05-03 1997-08-26 Phelps, Jr.; Douglas Wallace Tape application platform and processes therefor
US5643390A (en) 1995-05-04 1997-07-01 The University Of Delaware Bonding techniques for high performance thermoplastic compositions
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JP2666788B2 (ja) 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法
JP3604248B2 (ja) 1997-02-25 2004-12-22 沖電気工業株式会社 半導体装置の製造方法
KR19980080755A (ko) 1997-03-27 1998-11-25 죤제이.맥아들 폴리메릭 용기에 가요성 회로를 결합하는 방법과, 밀봉 재료를사용하여 가요성 회로와 다른 요소의 섹션 위에 장벽층을 형성하는 방법
EP0986480A1 (de) 1997-06-06 2000-03-22 Minnesota Mining And Manufacturing Company Klebesystem für einem tintenstrahlschreiber und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
AU5607300A (en) 2001-01-02
WO2000077116A1 (en) 2000-12-21
MXPA01012858A (es) 2002-09-18
KR20030076729A (ko) 2003-09-29
US6210522B1 (en) 2001-04-03
JP2003518520A (ja) 2003-06-10
DE60016287T2 (de) 2005-10-27
EP1278806A1 (de) 2003-01-29
EP1278806A4 (de) 2003-05-07
EP1278806B1 (de) 2004-11-24

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