DE60016287D1 - Klebstoffgebundene mehrschichtfolien - Google Patents
Klebstoffgebundene mehrschichtfolienInfo
- Publication number
- DE60016287D1 DE60016287D1 DE60016287T DE60016287T DE60016287D1 DE 60016287 D1 DE60016287 D1 DE 60016287D1 DE 60016287 T DE60016287 T DE 60016287T DE 60016287 T DE60016287 T DE 60016287T DE 60016287 D1 DE60016287 D1 DE 60016287D1
- Authority
- DE
- Germany
- Prior art keywords
- multilayer films
- adhesive multilayer
- adhesive
- films
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2469/00—Presence of polycarbonate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/333,455 US6210522B1 (en) | 1999-06-15 | 1999-06-15 | Adhesive bonding laminates |
US333455 | 1999-06-15 | ||
PCT/US2000/016093 WO2000077116A1 (en) | 1999-06-15 | 2000-06-12 | Adhesive bonding laminates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60016287D1 true DE60016287D1 (de) | 2004-12-30 |
DE60016287T2 DE60016287T2 (de) | 2005-10-27 |
Family
ID=23302869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60016287T Expired - Fee Related DE60016287T2 (de) | 1999-06-15 | 2000-06-12 | Klebstoffgebundene mehrschichtfolien |
Country Status (8)
Country | Link |
---|---|
US (1) | US6210522B1 (de) |
EP (1) | EP1278806B1 (de) |
JP (1) | JP2003518520A (de) |
KR (1) | KR20030076729A (de) |
AU (1) | AU5607300A (de) |
DE (1) | DE60016287T2 (de) |
MX (1) | MXPA01012858A (de) |
WO (1) | WO2000077116A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6620651B2 (en) | 2001-10-23 | 2003-09-16 | National Starch And Chemical Investment Holding Corporation | Adhesive wafers for die attach application |
US6568775B2 (en) * | 2001-10-31 | 2003-05-27 | Hewlett-Packard Development Company, L.P. | Dual mode communication device for a fluid ejection device |
KR20060118408A (ko) * | 2003-08-22 | 2006-11-23 | 테사 악티엔게젤샤프트 | 전기 모듈을 카드 본체에 삽입하기 위한 접착 필름의 용도 |
US7063402B2 (en) * | 2003-11-24 | 2006-06-20 | Eastman Kodak Company | Flexible lamination for use with primary ink jet components |
TWI220130B (en) * | 2003-12-17 | 2004-08-11 | Ind Tech Res Inst | Inkjet printhead and manufacturing method thereof |
US7448734B2 (en) * | 2004-01-21 | 2008-11-11 | Silverbrook Research Pty Ltd | Inkjet printer cartridge with pagewidth printhead |
US7404613B2 (en) * | 2004-06-30 | 2008-07-29 | Lexmark International, Inc. | Inkjet print cartridge having an adhesive with improved dimensional control |
KR100612325B1 (ko) * | 2004-07-16 | 2006-08-16 | 삼성전자주식회사 | 접착성 절연층을 갖는 잉크 카트리지, 그 제조 방법 및이를 장착한 화상 형성 장치 |
US7275815B2 (en) * | 2004-12-01 | 2007-10-02 | Lexmark International, Inc. | Die attach methods and apparatus for micro-fluid ejection device |
US20070221318A1 (en) * | 2006-03-24 | 2007-09-27 | Martin Reiss | Adhesion tape and method for mounting a chip onto a substrate |
US8061811B2 (en) * | 2006-09-28 | 2011-11-22 | Lexmark International, Inc. | Micro-fluid ejection heads with chips in pockets |
TW200927462A (en) * | 2007-10-25 | 2009-07-01 | Crc For Advanced Composite Structures Ltd | Customisable size load bearing polymer composite frame |
CN102026815B (zh) * | 2008-05-15 | 2013-11-06 | 惠普开发有限公司 | 喷墨打印装置及其制造方法 |
US8303076B2 (en) * | 2009-11-04 | 2012-11-06 | Xerox Corporation | Solid ink jet printhead having a polymer layer and processes therefor |
EP2390403B1 (de) * | 2010-05-28 | 2012-07-04 | Electrolux Home Products Corporation N.V. | Verfahren zur Montage einer Blende eines Geräts, insbesondere eines Haushaltsgeräts |
US8925223B2 (en) * | 2011-06-30 | 2015-01-06 | Jeffrey W. Snyder | Laminated sheet construction with thermal adhesive surface and method for making same |
US9027247B2 (en) * | 2012-10-22 | 2015-05-12 | Xerox Corporation | Liquid adhesive application by contact printing |
KR102285233B1 (ko) * | 2015-02-27 | 2021-08-03 | 삼성전자주식회사 | 전자 장치 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900360A (en) | 1972-10-20 | 1975-08-19 | Heller William C Jun | Self-heating composite bonding means and method |
JPS5651107B2 (de) | 1973-07-06 | 1981-12-03 | ||
CH628926A5 (de) | 1977-02-16 | 1982-03-31 | Guenter Schwarz | Mehrschichtiges klebematerial. |
US4273827A (en) | 1978-06-09 | 1981-06-16 | Theodore Sweeney & Company | Adhesive assembly |
US4313996A (en) | 1979-05-21 | 1982-02-02 | The Dow Chemical Company | Formable metal-plastic-metal structural laminates |
US4497678A (en) | 1981-04-03 | 1985-02-05 | The Standard Products Company | Method of making a laminate construction |
US4666758A (en) | 1984-06-04 | 1987-05-19 | Sierracin Corporation | Low temperature laminatable polyurethane |
JPS6170247U (de) | 1984-10-05 | 1986-05-14 | ||
US4935086A (en) | 1986-01-13 | 1990-06-19 | Raytheon Company | Process of bonding an electrical device package to a mounting surface |
JP2573661B2 (ja) | 1988-07-09 | 1997-01-22 | キヤノン株式会社 | 感光感熱型接着剤 |
US5204399A (en) | 1989-03-09 | 1993-04-20 | National Starch And Chemical Investment Holding Corporation | Thermoplastic film die attach adhesives |
US5208188A (en) | 1989-10-02 | 1993-05-04 | Advanced Micro Devices, Inc. | Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
CA2052427A1 (en) | 1990-12-17 | 1992-06-18 | Gary J. Jacaruso | Bonding of thermoset composite structures |
TW210422B (de) | 1991-06-04 | 1993-08-01 | Akzo Nv | |
CA2131617C (en) * | 1992-03-30 | 1999-06-15 | Gary J. Jacaruso | Heating means for thermoplastic bonding |
CA2101454C (en) | 1992-07-31 | 1998-09-22 | Kenjiro Watanabe | Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head |
US5441918A (en) | 1993-01-29 | 1995-08-15 | Lsi Logic Corporation | Method of making integrated circuit die package |
DE69430453T2 (de) * | 1993-11-10 | 2002-11-07 | Minnesota Mining & Mfg | Klebendes Laminat |
US5519425A (en) | 1993-11-15 | 1996-05-21 | Xerox Corporation | Ink supply cartridge for an ink jet printer |
US5696546A (en) | 1993-11-15 | 1997-12-09 | Xerox Corporation | Ink supply cartridge with ink jet printhead having improved fluid seal therebetween |
US5661336A (en) | 1994-05-03 | 1997-08-26 | Phelps, Jr.; Douglas Wallace | Tape application platform and processes therefor |
US5643390A (en) | 1995-05-04 | 1997-07-01 | The University Of Delaware | Bonding techniques for high performance thermoplastic compositions |
FR2733952B1 (fr) | 1995-05-12 | 1997-06-06 | Renault | Dispositif d'arrimage d'une charge sur un vehicule automobile |
WO1996037915A1 (en) | 1995-05-26 | 1996-11-28 | Sheldahl, Inc. | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink |
JP2666788B2 (ja) | 1995-10-19 | 1997-10-22 | 日本電気株式会社 | チップサイズ半導体装置の製造方法 |
JP3604248B2 (ja) | 1997-02-25 | 2004-12-22 | 沖電気工業株式会社 | 半導体装置の製造方法 |
KR19980080755A (ko) | 1997-03-27 | 1998-11-25 | 죤제이.맥아들 | 폴리메릭 용기에 가요성 회로를 결합하는 방법과, 밀봉 재료를사용하여 가요성 회로와 다른 요소의 섹션 위에 장벽층을 형성하는 방법 |
EP0986480A1 (de) | 1997-06-06 | 2000-03-22 | Minnesota Mining And Manufacturing Company | Klebesystem für einem tintenstrahlschreiber und verfahren zu ihrer herstellung |
-
1999
- 1999-06-15 US US09/333,455 patent/US6210522B1/en not_active Expired - Lifetime
-
2000
- 2000-06-12 DE DE60016287T patent/DE60016287T2/de not_active Expired - Fee Related
- 2000-06-12 WO PCT/US2000/016093 patent/WO2000077116A1/en not_active Application Discontinuation
- 2000-06-12 EP EP00941359A patent/EP1278806B1/de not_active Expired - Lifetime
- 2000-06-12 MX MXPA01012858A patent/MXPA01012858A/es not_active Application Discontinuation
- 2000-06-12 AU AU56073/00A patent/AU5607300A/en not_active Abandoned
- 2000-06-12 KR KR1020017016105A patent/KR20030076729A/ko not_active Application Discontinuation
- 2000-06-12 JP JP2001503958A patent/JP2003518520A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
AU5607300A (en) | 2001-01-02 |
WO2000077116A1 (en) | 2000-12-21 |
MXPA01012858A (es) | 2002-09-18 |
KR20030076729A (ko) | 2003-09-29 |
US6210522B1 (en) | 2001-04-03 |
JP2003518520A (ja) | 2003-06-10 |
DE60016287T2 (de) | 2005-10-27 |
EP1278806A1 (de) | 2003-01-29 |
EP1278806A4 (de) | 2003-05-07 |
EP1278806B1 (de) | 2004-11-24 |
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