DE50305265D1 - Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden - Google Patents

Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden

Info

Publication number
DE50305265D1
DE50305265D1 DE50305265T DE50305265T DE50305265D1 DE 50305265 D1 DE50305265 D1 DE 50305265D1 DE 50305265 T DE50305265 T DE 50305265T DE 50305265 T DE50305265 T DE 50305265T DE 50305265 D1 DE50305265 D1 DE 50305265D1
Authority
DE
Germany
Prior art keywords
hybrids
wafer
semiconductor wafers
hybrid
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50305265T
Other languages
English (en)
Inventor
Erich Reitinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ERS Electronic GmbH
Original Assignee
ERS Electronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=28798441&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE50305265(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by ERS Electronic GmbH filed Critical ERS Electronic GmbH
Priority to DE50305265T priority Critical patent/DE50305265D1/de
Application granted granted Critical
Publication of DE50305265D1 publication Critical patent/DE50305265D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
DE50305265T 2002-04-15 2003-04-15 Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden Expired - Lifetime DE50305265D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50305265T DE50305265D1 (de) 2002-04-15 2003-04-15 Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10216786A DE10216786C5 (de) 2002-04-15 2002-04-15 Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
DE50305265T DE50305265D1 (de) 2002-04-15 2003-04-15 Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden
PCT/EP2003/003937 WO2003088323A1 (de) 2002-04-15 2003-04-15 Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden

Publications (1)

Publication Number Publication Date
DE50305265D1 true DE50305265D1 (de) 2006-11-16

Family

ID=28798441

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10216786A Expired - Lifetime DE10216786C5 (de) 2002-04-15 2002-04-15 Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
DE50305265T Expired - Lifetime DE50305265D1 (de) 2002-04-15 2003-04-15 Verfahren und vorrichtung zur konditionierung von halbleiterwafern und/oder hybriden

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10216786A Expired - Lifetime DE10216786C5 (de) 2002-04-15 2002-04-15 Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden

Country Status (16)

Country Link
US (1) US7900373B2 (de)
EP (1) EP1495486B3 (de)
JP (1) JP4070724B2 (de)
KR (1) KR100625631B1 (de)
CN (1) CN100378903C (de)
AT (1) ATE341831T1 (de)
AU (1) AU2003224079A1 (de)
CA (1) CA2481260C (de)
DE (2) DE10216786C5 (de)
DK (1) DK1495486T5 (de)
ES (1) ES2274225T7 (de)
NO (1) NO336896B1 (de)
PL (1) PL211045B1 (de)
PT (1) PT1495486E (de)
RU (1) RU2284609C2 (de)
WO (1) WO2003088323A1 (de)

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US20170248973A1 (en) * 2016-02-29 2017-08-31 Cascade Microtech, Inc. Probe systems and methods including active environmental control
JP6256523B2 (ja) * 2016-05-16 2018-01-10 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
JP6256526B2 (ja) * 2016-05-25 2018-01-10 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
JP7012558B2 (ja) * 2018-02-26 2022-01-28 東京エレクトロン株式会社 検査装置及び検査装置の動作方法
JP2020049400A (ja) * 2018-09-25 2020-04-02 東京エレクトロン株式会社 ドライエアーの生成装置、ドライエアーの生成方法、および基板処理システム
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DE10216786A1 (de) 2003-11-06
CA2481260A1 (en) 2003-10-23
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PL211045B1 (pl) 2012-04-30
RU2004130436A (ru) 2005-07-10
KR100625631B1 (ko) 2006-09-20
JP2005528781A (ja) 2005-09-22
DE10216786B4 (de) 2004-07-15
DK1495486T3 (da) 2007-02-05
PT1495486E (pt) 2007-01-31
EP1495486B3 (de) 2009-10-21
CA2481260C (en) 2010-10-12
DK1495486T5 (da) 2010-03-08
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EP1495486B1 (de) 2006-10-04
US20050227503A1 (en) 2005-10-13
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ATE341831T1 (de) 2006-10-15
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