DE502004011042D1 - Verfahren zum testen von unbestückten leiterplatten - Google Patents
Verfahren zum testen von unbestückten leiterplattenInfo
- Publication number
- DE502004011042D1 DE502004011042D1 DE502004011042T DE502004011042T DE502004011042D1 DE 502004011042 D1 DE502004011042 D1 DE 502004011042D1 DE 502004011042 T DE502004011042 T DE 502004011042T DE 502004011042 T DE502004011042 T DE 502004011042T DE 502004011042 D1 DE502004011042 D1 DE 502004011042D1
- Authority
- DE
- Germany
- Prior art keywords
- testing
- unprocessed
- pcb
- unprocessed pcb
- testing unprocessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10320925A DE10320925B4 (de) | 2003-05-09 | 2003-05-09 | Verfahren zum Testen von unbestückten Leiterplatten |
PCT/EP2004/002420 WO2004099802A1 (de) | 2003-05-09 | 2004-03-09 | Verfahren zum testen von unbestückten leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
DE502004011042D1 true DE502004011042D1 (de) | 2010-05-27 |
Family
ID=33394408
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10320925A Expired - Fee Related DE10320925B4 (de) | 2003-05-09 | 2003-05-09 | Verfahren zum Testen von unbestückten Leiterplatten |
DE502004011042T Expired - Lifetime DE502004011042D1 (de) | 2003-05-09 | 2004-03-09 | Verfahren zum testen von unbestückten leiterplatten |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10320925A Expired - Fee Related DE10320925B4 (de) | 2003-05-09 | 2003-05-09 | Verfahren zum Testen von unbestückten Leiterplatten |
Country Status (8)
Country | Link |
---|---|
US (1) | US7250782B2 (de) |
EP (1) | EP1623242B1 (de) |
JP (1) | JP4985940B2 (de) |
KR (1) | KR100782109B1 (de) |
CN (1) | CN100454032C (de) |
DE (2) | DE10320925B4 (de) |
TW (1) | TWI245908B (de) |
WO (1) | WO2004099802A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8134377B1 (en) | 2005-08-31 | 2012-03-13 | Lecroy Corporation | Adherable holder and locater tool |
DE102006056543A1 (de) * | 2006-11-29 | 2008-06-19 | Suss Microtec Test Systems Gmbh | Sondenhalter für eine Sonde zur Prüfung von Halbleiterbauelementen |
KR101078781B1 (ko) | 2010-02-01 | 2011-11-01 | 주식회사 고영테크놀러지 | 3차원 형상 검사방법 |
JP2011185702A (ja) * | 2010-03-08 | 2011-09-22 | Yamaha Fine Technologies Co Ltd | 回路基板の電気検査方法及び電気検査装置 |
CN102236032A (zh) * | 2010-05-07 | 2011-11-09 | 北京京东方光电科技有限公司 | 阵列检测设备 |
DE102010023187A1 (de) | 2010-06-09 | 2011-12-15 | Dtg International Gmbh | Vorrichtung und Verfahren zum Untersuchen von Leiterplatten |
US7986157B1 (en) * | 2010-09-02 | 2011-07-26 | Star Technologies Inc. | High speed probing apparatus for semiconductor devices and probe stage for the same |
US10557889B2 (en) * | 2012-05-07 | 2020-02-11 | Flextronics Ap, Llc | Universal device multi-function test apparatus |
US9989583B2 (en) * | 2013-03-13 | 2018-06-05 | Xcerra Corporation | Cross-bar unit for a test apparatus for circuit boards, and test apparatus containing the former |
DE102013102564A1 (de) * | 2013-03-13 | 2014-09-18 | Dtg International Gmbh | Traverseneinheit für eine Prüfvorrichtung für Leiterplatten, sowie Prüfvorrichtung damit |
CN104237579B (zh) * | 2014-09-17 | 2017-04-19 | 大族激光科技产业集团股份有限公司 | 四线测试探针装置及其应用方法 |
KR102229364B1 (ko) * | 2014-09-18 | 2021-03-19 | 삼성디스플레이 주식회사 | 표시장치의 테스트 장치 및 그 장치를 이용한 테스트 방법 |
CN104515876A (zh) * | 2014-11-26 | 2015-04-15 | 重庆长野汽车配件有限公司 | 电路板快速测试工装 |
CN104391139A (zh) * | 2014-12-08 | 2015-03-04 | 大族激光科技产业集团股份有限公司 | 一种测试探针压力监控的方法及装置 |
TWI530700B (zh) * | 2015-03-11 | 2016-04-21 | 旺矽科技股份有限公司 | 測試機台及其操作方法 |
GB2545496B (en) * | 2015-12-18 | 2020-06-03 | Teraview Ltd | A Test System |
WO2017117257A1 (en) * | 2015-12-28 | 2017-07-06 | Celadon Systems, Inc. | Modular rail systems, rail systems, mechanisms, and equipment for devices under test |
CN105954672B (zh) * | 2016-06-18 | 2018-07-10 | 东莞华贝电子科技有限公司 | 一种主板联测机及其测试方法 |
CN105939569B (zh) * | 2016-06-28 | 2018-07-17 | 广东欧珀移动通信有限公司 | Pcb板组件及具有其的移动终端 |
EP3740767A1 (de) | 2018-01-18 | 2020-11-25 | Xcerra Corp. | Kapazitive prüfnadel zum messen von elektrisch leitenden schichten in leiterplattenbohrungen |
CN109088676A (zh) * | 2018-07-02 | 2018-12-25 | 四川斐讯信息技术有限公司 | 一种射频测试头及射频测试仪 |
KR102466454B1 (ko) * | 2019-08-29 | 2022-11-14 | 주식회사 아이에스시 | 검사용 소켓 |
US11255877B2 (en) | 2020-07-17 | 2022-02-22 | Acculogic Corporation | Method and apparatus for testing printed circuit boards |
KR102549482B1 (ko) * | 2020-08-03 | 2023-06-30 | 가부시키가이샤 니혼 마이크로닉스 | 검사용 접속 장치 |
JP2023006993A (ja) | 2021-07-01 | 2023-01-18 | 株式会社日本マイクロニクス | 検査装置、位置調整ユニット及び位置調整方法 |
CN115184654A (zh) * | 2022-07-20 | 2022-10-14 | 燕麦(杭州)智能制造有限公司 | 测试针模、测试方法及存储介质 |
CN117250207B (zh) * | 2023-11-17 | 2024-01-30 | 四川睿杰鑫电子股份有限公司 | 一种柔性电路板检测装置及检查方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4123706A (en) * | 1975-03-03 | 1978-10-31 | Electroglas, Inc. | Probe construction |
AT391762B (de) * | 1985-11-26 | 1990-11-26 | Alcatel Austria Ag | Vorrichtung zum pruefen von leiterplatten |
US4926345A (en) * | 1988-03-25 | 1990-05-15 | Hughes Aircraft Company | Robotic component lead trimmer |
JPH02130477A (ja) * | 1988-11-11 | 1990-05-18 | Hitachi Ltd | プローピング方式 |
JPH0448698A (ja) * | 1990-06-14 | 1992-02-18 | Sony Corp | 電子部品取付装置 |
EP0468153B1 (de) * | 1990-07-25 | 1995-10-11 | atg test systems GmbH | Kontaktierungsvorrichtung für Prüfzwecke |
US5489855A (en) * | 1990-08-22 | 1996-02-06 | Poisel; C. Edward | Apparatus and process providing controlled probing |
JPH06260540A (ja) * | 1993-03-08 | 1994-09-16 | Nec Yamagata Ltd | プローバ |
US5394100A (en) * | 1993-05-06 | 1995-02-28 | Karl Suss America, Incorporated | Probe system with automatic control of contact pressure and probe alignment |
US5621333A (en) * | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
JP3549969B2 (ja) * | 1995-11-29 | 2004-08-04 | 日置電機株式会社 | エアプローブ使用x−y方式インサーキットテスタ |
JP3391617B2 (ja) * | 1995-12-26 | 2003-03-31 | 日置電機株式会社 | X−y方式インサーキットテスタのタイミングベルト駆動によるプロービング方法 |
CA2174784C (en) * | 1996-04-23 | 1999-07-13 | George Guozhen Zhong | Automatic multi-probe pwb tester |
JP2993430B2 (ja) * | 1996-07-18 | 1999-12-20 | 日本電気株式会社 | プローブ駆動装置 |
JP2870496B2 (ja) * | 1996-07-29 | 1999-03-17 | 日本電気株式会社 | 回路基板プロービング装置及び方法 |
JPH1062480A (ja) * | 1996-08-23 | 1998-03-06 | Shindenshi Kk | 基板検査装置 |
DE19700505A1 (de) * | 1997-01-09 | 1998-07-16 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten |
US5995232A (en) * | 1997-07-14 | 1999-11-30 | U.S. Philips Corporation | Method of and device for inspecting a PCB |
JP3368192B2 (ja) * | 1997-11-10 | 2003-01-20 | マイクロクラフト株式会社 | プリント基板検査装置 |
JP3028095B2 (ja) * | 1998-03-04 | 2000-04-04 | 日本電気株式会社 | プロービング装置および方法 |
DE19844428B4 (de) * | 1998-09-28 | 2004-05-13 | Atg Test Systems Gmbh & Co.Kg | Prüfsonde für einen Fingertester, ein Verfahren zum Ansteuern einer Prüfsonde, Fingertester zum Prüfen von Leiterplatten und ein Verfahren zum Prüfen von Leiterplatten mit einem Fingertester |
JP2000275274A (ja) * | 1999-03-26 | 2000-10-06 | Matsushita Electric Works Ltd | 回路の検査方法とこの検査方法に対応した回路基板 |
JP4260310B2 (ja) * | 1999-10-26 | 2009-04-30 | エスアイアイ・ナノテクノロジー株式会社 | 微小接触式プローバー |
AU2001230923A1 (en) * | 2000-01-14 | 2001-07-24 | Proteus Corporation | Robotic probe for testing printed circuit boards in-situ using a single printed circuit card slot |
DE20005123U1 (de) * | 2000-03-20 | 2001-08-02 | Atg Test Systems Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
JP2002062312A (ja) * | 2000-08-22 | 2002-02-28 | Toyo Denshi Giken Kk | コンタクト装置 |
DE10160119A1 (de) * | 2001-12-07 | 2003-10-02 | Atg Test Systems Gmbh | Prüfsonde für einen Fingertester |
DE10220343B4 (de) * | 2002-05-07 | 2007-04-05 | Atg Test Systems Gmbh & Co. Kg Reicholzheim | Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde |
-
2003
- 2003-05-09 DE DE10320925A patent/DE10320925B4/de not_active Expired - Fee Related
-
2004
- 2004-03-09 JP JP2006504608A patent/JP4985940B2/ja not_active Expired - Fee Related
- 2004-03-09 KR KR1020057021194A patent/KR100782109B1/ko active IP Right Grant
- 2004-03-09 WO PCT/EP2004/002420 patent/WO2004099802A1/de active Application Filing
- 2004-03-09 CN CNB2004800070259A patent/CN100454032C/zh not_active Expired - Fee Related
- 2004-03-09 EP EP04739062A patent/EP1623242B1/de not_active Expired - Fee Related
- 2004-03-09 DE DE502004011042T patent/DE502004011042D1/de not_active Expired - Lifetime
- 2004-03-23 TW TW093107836A patent/TWI245908B/zh not_active IP Right Cessation
-
2005
- 2005-09-13 US US11/225,334 patent/US7250782B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW200424537A (en) | 2004-11-16 |
WO2004099802A1 (de) | 2004-11-18 |
DE10320925A1 (de) | 2004-12-02 |
EP1623242B1 (de) | 2010-04-14 |
CN100454032C (zh) | 2009-01-21 |
US7250782B2 (en) | 2007-07-31 |
JP4985940B2 (ja) | 2012-07-25 |
KR20060026018A (ko) | 2006-03-22 |
CN1761883A (zh) | 2006-04-19 |
DE10320925B4 (de) | 2007-07-05 |
TWI245908B (en) | 2005-12-21 |
KR100782109B1 (ko) | 2007-12-05 |
EP1623242A1 (de) | 2006-02-08 |
US20060006891A1 (en) | 2006-01-12 |
JP2006525497A (ja) | 2006-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE502004011042D1 (de) | Verfahren zum testen von unbestückten leiterplatten | |
ATA8612001A (de) | Verfahren zum testen von software | |
DE602005000512D1 (de) | Verfahren und vorrichtung zum montieren von bauelementen | |
DE602005017318D1 (de) | Verfahren und Vorrichtung zum Bereitstellen von Entwurfsdaten | |
ATA7532003A (de) | Verfahren zum verwerten von schlacke | |
DE602006020904D1 (de) | Verfahren zum testen von antigen | |
DE602004032381D1 (de) | Verfahren und system zum automatisierten konfiguri | |
DE602004000617D1 (de) | Verfahren zum Einrichten von Netzwerkadressen | |
DE502004008042D1 (de) | Verfahren zum umformen von blechen | |
DE602004022156D1 (de) | Verfahren zum verbinden von strickwaren | |
DE602004029913D1 (de) | Verfahren zum waschen von festen körnern | |
DE60202443D1 (de) | Methode zum Testen eines elektronischen Bauteils | |
DE502005000866D1 (de) | Verfahren zum verbinden von bauteilen | |
DE502004003770D1 (de) | Verfahren zum verrunden von kanten an bauteilen | |
DE60322829D1 (de) | Verfahren zum Prüfen | |
DE602004028591D1 (de) | Verfahren zur durchführung von gleichgewichtsbegrenzten reaktionen | |
DE60217413D1 (de) | Verfahren zum abtrennen mehrerer hausnetze | |
ATA16312002A (de) | Verfahren zum verbrennen von kleinstückeligem brennstoff | |
AT500424B1 (de) | Verfahren zum sanieren von rohrleitungen | |
DE602004016631D1 (de) | Verfahren zum eintauchen von getreide | |
DE50313584D1 (de) | Verfahren zum einspritzen von kraftstoff | |
DE602004003163D1 (de) | Verfahren zur Bereitstellung von Proben zum Nachweis | |
DE50202273D1 (de) | Verfahren zum Verbinden von Bauteilen | |
DE502005007309D1 (de) | Verfahren zum Senken von Werkstücken | |
DE602004003119D1 (de) | Vorrichtung zum Entfernen von Störungen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: DTG INTERNATIONAL GMBH, ZUERICH, CH |
|
8364 | No opposition during term of opposition |