DE502004010430D1 - Isches bauteil mit hochaufgelöster strukturierung - Google Patents

Isches bauteil mit hochaufgelöster strukturierung

Info

Publication number
DE502004010430D1
DE502004010430D1 DE502004010430T DE502004010430T DE502004010430D1 DE 502004010430 D1 DE502004010430 D1 DE 502004010430D1 DE 502004010430 T DE502004010430 T DE 502004010430T DE 502004010430 T DE502004010430 T DE 502004010430T DE 502004010430 D1 DE502004010430 D1 DE 502004010430D1
Authority
DE
Germany
Prior art keywords
structuring
tempered
component
electronic component
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004010430T
Other languages
English (en)
Inventor
Walter Fix
Ronan Martin
Andreas Ullmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PolyIC GmbH and Co KG
Original Assignee
PolyIC GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PolyIC GmbH and Co KG filed Critical PolyIC GmbH and Co KG
Publication of DE502004010430D1 publication Critical patent/DE502004010430D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
DE502004010430T 2003-08-25 2004-08-14 Isches bauteil mit hochaufgelöster strukturierung Active DE502004010430D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10339036A DE10339036A1 (de) 2003-08-25 2003-08-25 Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu
PCT/DE2004/001816 WO2005022663A1 (de) 2003-08-25 2004-08-14 Organisches elektronisches bauteil mit hochaufgelöster struk­turierung und herstellungsverfahren dazu

Publications (1)

Publication Number Publication Date
DE502004010430D1 true DE502004010430D1 (de) 2010-01-07

Family

ID=34223146

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10339036A Ceased DE10339036A1 (de) 2003-08-25 2003-08-25 Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu
DE502004010430T Active DE502004010430D1 (de) 2003-08-25 2004-08-14 Isches bauteil mit hochaufgelöster strukturierung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10339036A Ceased DE10339036A1 (de) 2003-08-25 2003-08-25 Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu

Country Status (7)

Country Link
US (1) US7479670B2 (de)
EP (1) EP1658648B1 (de)
JP (1) JP2007503712A (de)
CN (1) CN1853289A (de)
AT (1) ATE450057T1 (de)
DE (2) DE10339036A1 (de)
WO (1) WO2005022663A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
DE102010042503A1 (de) 2010-10-15 2012-04-19 Siemens Aktiengesellschaft Lasersystem zur Bearbeitung von Oberflächen sowie entsprechendes Verfahren
DE102017116540A1 (de) * 2017-07-21 2019-01-24 Osram Oled Gmbh Organisches elektronisches Bauelement und Verfahren zur Herstellung eines organischen elektronischen Bauelements
AT17082U1 (de) * 2020-04-27 2021-05-15 Zkw Group Gmbh Verfahren zur befestigung eines elektronischen bauteils

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Also Published As

Publication number Publication date
ATE450057T1 (de) 2009-12-15
CN1853289A (zh) 2006-10-25
EP1658648A1 (de) 2006-05-24
US7479670B2 (en) 2009-01-20
WO2005022663A1 (de) 2005-03-10
WO2005022663A8 (de) 2005-06-02
EP1658648B1 (de) 2009-11-25
JP2007503712A (ja) 2007-02-22
US20070187671A1 (en) 2007-08-16
DE10339036A1 (de) 2005-03-31

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