DE502004009900D1 - Verfahren und vorrichtung zur trocknung von schaltungssubstraten - Google Patents

Verfahren und vorrichtung zur trocknung von schaltungssubstraten

Info

Publication number
DE502004009900D1
DE502004009900D1 DE502004009900T DE502004009900T DE502004009900D1 DE 502004009900 D1 DE502004009900 D1 DE 502004009900D1 DE 502004009900 T DE502004009900 T DE 502004009900T DE 502004009900 T DE502004009900 T DE 502004009900T DE 502004009900 D1 DE502004009900 D1 DE 502004009900D1
Authority
DE
Germany
Prior art keywords
drying switching
switching substrates
substrates
drying
switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004009900T
Other languages
English (en)
Inventor
Elke Zakel
Ghassem Azdasht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pac Tech Packaging Technologies GmbH
Original Assignee
Pac Tech Packaging Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pac Tech Packaging Technologies GmbH filed Critical Pac Tech Packaging Technologies GmbH
Publication of DE502004009900D1 publication Critical patent/DE502004009900D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F26B3/30—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
DE502004009900T 2003-12-22 2004-12-22 Verfahren und vorrichtung zur trocknung von schaltungssubstraten Active DE502004009900D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10361075A DE10361075A1 (de) 2003-12-22 2003-12-22 Verfahren und Vorichtung zur Trocknung von Schaltungssubstraten
PCT/DE2004/002827 WO2005062358A1 (de) 2003-12-22 2004-12-22 Verfahren und vorrichtung zur trocknung von schaltungssubstraten

Publications (1)

Publication Number Publication Date
DE502004009900D1 true DE502004009900D1 (de) 2009-09-24

Family

ID=34706549

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10361075A Ceased DE10361075A1 (de) 2003-12-22 2003-12-22 Verfahren und Vorichtung zur Trocknung von Schaltungssubstraten
DE502004009900T Active DE502004009900D1 (de) 2003-12-22 2004-12-22 Verfahren und vorrichtung zur trocknung von schaltungssubstraten

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10361075A Ceased DE10361075A1 (de) 2003-12-22 2003-12-22 Verfahren und Vorichtung zur Trocknung von Schaltungssubstraten

Country Status (6)

Country Link
US (1) US8256131B2 (de)
EP (1) EP1697980B1 (de)
JP (1) JP2007524232A (de)
KR (1) KR20060127867A (de)
DE (2) DE10361075A1 (de)
WO (1) WO2005062358A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10361075A1 (de) * 2003-12-22 2005-07-28 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorichtung zur Trocknung von Schaltungssubstraten
JP6849368B2 (ja) * 2016-09-30 2021-03-24 芝浦メカトロニクス株式会社 基板処理装置

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Also Published As

Publication number Publication date
JP2007524232A (ja) 2007-08-23
WO2005062358A1 (de) 2005-07-07
KR20060127867A (ko) 2006-12-13
EP1697980B1 (de) 2009-08-12
DE10361075A1 (de) 2005-07-28
EP1697980A1 (de) 2006-09-06
US8256131B2 (en) 2012-09-04
US20080282574A1 (en) 2008-11-20

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Legal Events

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