DE50111874D1 - Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung - Google Patents

Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung

Info

Publication number
DE50111874D1
DE50111874D1 DE50111874T DE50111874T DE50111874D1 DE 50111874 D1 DE50111874 D1 DE 50111874D1 DE 50111874 T DE50111874 T DE 50111874T DE 50111874 T DE50111874 T DE 50111874T DE 50111874 D1 DE50111874 D1 DE 50111874D1
Authority
DE
Germany
Prior art keywords
integrated circuit
determining properties
properties
determining
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50111874T
Other languages
English (en)
Inventor
K Kalus
Iouri Malov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synopsys Inc
Original Assignee
Sigma C Software AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sigma C Software AG filed Critical Sigma C Software AG
Priority to DE50111874T priority Critical patent/DE50111874D1/de
Application granted granted Critical
Publication of DE50111874D1 publication Critical patent/DE50111874D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
DE50111874T 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung Expired - Lifetime DE50111874D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50111874T DE50111874D1 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10059516 2000-11-30
DE50111874T DE50111874D1 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung
PCT/EP2001/014005 WO2002044699A2 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung

Publications (1)

Publication Number Publication Date
DE50111874D1 true DE50111874D1 (de) 2007-02-22

Family

ID=7665267

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50111874T Expired - Lifetime DE50111874D1 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung

Country Status (7)

Country Link
US (1) US7302090B2 (de)
EP (1) EP1337838B1 (de)
JP (1) JP4216592B2 (de)
KR (1) KR100846018B1 (de)
AU (2) AU2002238409A1 (de)
DE (1) DE50111874D1 (de)
WO (2) WO2002044699A2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1523696B1 (de) * 2002-07-15 2016-12-21 KLA-Tencor Corporation Defektinspektionsmethoden, die das aufnehmen des projizierten maskenabbildes unter verschiedenen lithographischen prozessvariablen beinhalten
US7124394B1 (en) * 2003-04-06 2006-10-17 Luminescent Technologies, Inc. Method for time-evolving rectilinear contours representing photo masks
US7698665B2 (en) * 2003-04-06 2010-04-13 Luminescent Technologies, Inc. Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern
US7480889B2 (en) * 2003-04-06 2009-01-20 Luminescent Technologies, Inc. Optimized photomasks for photolithography
JP4351928B2 (ja) * 2004-02-23 2009-10-28 株式会社東芝 マスクデータの補正方法、フォトマスクの製造方法及びマスクデータの補正プログラム
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
EP1745373A4 (de) * 2004-05-09 2009-04-15 Mentor Graphics Corp Defektortidentifikation für die mikroeinrichtungsherstellung und -prüfung
US7251807B2 (en) * 2005-02-24 2007-07-31 Synopsys, Inc. Method and apparatus for identifying a manufacturing problem area in a layout using a process-sensitivity model
EP1925020A4 (de) * 2005-09-13 2014-01-01 Luminescent Technologies Inc Systeme, masken und verfahren für die photolithografie
WO2007041600A2 (en) * 2005-10-03 2007-04-12 Luminescent Technologies, Inc. Mask-pattern determination using topology types
WO2007041602A2 (en) * 2005-10-03 2007-04-12 Luminescent Technologies, Inc. Lithography verification using guard bands
US7793253B2 (en) * 2005-10-04 2010-09-07 Luminescent Technologies, Inc. Mask-patterns including intentional breaks
US7703049B2 (en) 2005-10-06 2010-04-20 Luminescent Technologies, Inc. System, masks, and methods for photomasks optimized with approximate and accurate merit functions
KR101285967B1 (ko) * 2005-11-18 2013-07-12 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템
KR101315237B1 (ko) * 2006-02-01 2013-10-07 어플라이드 머티리얼즈 이스라엘 리미티드 패턴의 파라미터에서의 변화를 평가하는 방법 및 시스템
WO2007147826A1 (en) * 2006-06-23 2007-12-27 Sagantec Israel Ltd Layout processing system
US8644588B2 (en) 2006-09-20 2014-02-04 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8331645B2 (en) * 2006-09-20 2012-12-11 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8006203B2 (en) * 2008-08-28 2011-08-23 Synopsys, Inc. Bulk image modeling for optical proximity correction
US8797721B2 (en) 2010-02-02 2014-08-05 Apple Inc. Portable electronic device housing with outer glass surfaces
US8463016B2 (en) * 2010-02-05 2013-06-11 Luminescent Technologies, Inc. Extending the field of view of a mask-inspection image
US8612903B2 (en) 2010-09-14 2013-12-17 Luminescent Technologies, Inc. Technique for repairing a reflective photo-mask
US8555214B2 (en) 2010-09-14 2013-10-08 Luminescent Technologies, Inc. Technique for analyzing a reflective photo-mask
US8386968B2 (en) 2010-11-29 2013-02-26 Luminescent Technologies, Inc. Virtual photo-mask critical-dimension measurement
US8458622B2 (en) 2010-11-29 2013-06-04 Luminescent Technologies, Inc. Photo-mask acceptance technique
US9005852B2 (en) 2012-09-10 2015-04-14 Dino Technology Acquisition Llc Technique for repairing a reflective photo-mask
US8653454B2 (en) 2011-07-13 2014-02-18 Luminescent Technologies, Inc. Electron-beam image reconstruction
US9091935B2 (en) 2013-03-11 2015-07-28 Kla-Tencor Corporation Multistage extreme ultra-violet mask qualification
US9494854B2 (en) 2013-03-14 2016-11-15 Kla-Tencor Corporation Technique for repairing an EUV photo-mask
US11798157B2 (en) 2019-10-11 2023-10-24 The Regents Of The University Of Michigan Non-destructive imaging techniques for integrated circuits and other applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801954A (en) * 1996-04-24 1998-09-01 Micron Technology, Inc. Process for designing and checking a mask layout
US6078738A (en) * 1997-05-08 2000-06-20 Lsi Logic Corporation Comparing aerial image to SEM of photoresist or substrate pattern for masking process characterization
US6757645B2 (en) * 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US6091845A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask

Also Published As

Publication number Publication date
US20040136587A1 (en) 2004-07-15
WO2002044699A2 (de) 2002-06-06
WO2002044699A3 (de) 2002-09-19
AU2002227965A1 (en) 2002-06-11
KR20040022201A (ko) 2004-03-11
JP4216592B2 (ja) 2009-01-28
US7302090B2 (en) 2007-11-27
WO2002045014A2 (de) 2002-06-06
JP2004514938A (ja) 2004-05-20
KR100846018B1 (ko) 2008-07-11
EP1337838B1 (de) 2007-01-10
EP1337838A2 (de) 2003-08-27
AU2002238409A1 (en) 2002-06-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SYNOPSYS, INC., MOUNTAIN VIEW, CALIF., US

8328 Change in the person/name/address of the agent

Representative=s name: WSL PATENTANWAELTE, 65183 WIESBADEN