DE4408356A1 - Circuit adaptor device - Google Patents

Circuit adaptor device

Info

Publication number
DE4408356A1
DE4408356A1 DE4408356A DE4408356A DE4408356A1 DE 4408356 A1 DE4408356 A1 DE 4408356A1 DE 4408356 A DE4408356 A DE 4408356A DE 4408356 A DE4408356 A DE 4408356A DE 4408356 A1 DE4408356 A1 DE 4408356A1
Authority
DE
Germany
Prior art keywords
circuit board
connection elements
socket
pins
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4408356A
Other languages
German (de)
Inventor
Ralf Dipl Ing Bierschenk
Matthias Dipl Ing Synold
Michael Dipl Ing Meder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE4408356A priority Critical patent/DE4408356A1/en
Publication of DE4408356A1 publication Critical patent/DE4408356A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

The device is provided to adapt circuits, where at least one circuit is arranged on a socket provided with connector elements. The socket includes a multi-layer circuit board (2) to which through-contacts are attached. The connector eyelet (1.1,3.1) are arranged in the through contacts (2.1). The socket preferably has a socket body (1) and an adaptor body (3) between which the multi-layer circuit board (2) is arranged. The connector elements may be arranged in the through contacts (2.1) in the form of sleeves (1.1) and/or pins (3.1). Each pin or socket (1.1,3.1) is fastened to the socket body (1) and the other connector elements are fastened to the adaptor body (3).

Description

Die Erfindung betrifft eine Vorrichtung zur Adap­ tierung von Schaltkreisen, bei der mindestens ein Schaltkreis an einer mit Anschlußelementen verse­ henen Fassung angeordnet ist.The invention relates to a device for adap circuitry with at least one Circuit on a verse with connectors that version is arranged.

Im Stand der Technik sind Vorrichtungen zur Adap­ tierung von Schaltkreisen in verschiedenen Ausfüh­ rungsformen bekannt. Dabei ist es üblich, Schalt­ kreise direkt auf Leiterplatten oder in speziellen Fassungen anzuordnen.Devices for adap are in the prior art circuitry in various designs known forms. It is common to switch circles directly on circuit boards or in special Arrange versions.

Derartige Fassungen können beispielsweise in Form eines Rahmens ausgebildet sein, an dem die An­ schlußelemente, die auch als Pins bezeichnet wer­ den, angebracht sind.Such sockets can be in the form, for example be formed of a frame on which the An closing elements, also known as pins are attached.

In EP 0 335 123 ist eine Fassung beschrieben, die eine zweiseitige Montage von Filterkondensatoren ermöglicht und damit eine Erhöhung der Packungs­ dichte erlaubt. Nach DE 40 15 788 ist eine Methode bekannt, bei der mit Hilfe von Andruckkontakten die Lagenzahl von mikroverdrahteten Leiterplatten erhöht werden kann.EP 0 335 123 describes a version which a two-sided installation of filter capacitors  enables and thus an increase in the pack density allowed. According to DE 40 15 788 a method is known in which with the help of pressure contacts the number of layers of micro-wired circuit boards can be increased.

Bei den im Stand der Technik bekannten Anordnungen ist nachteilig, daß die Anschlußelemente von Ober- und Unterseite eine konstruktive Einheit bilden und deshalb die Zuordnung von Signalen festgelegt ist. Die Änderung des Signalweges oder die Zuführung ei­ ner zusätzlichen Betriebsspannung ist dabei nicht oder nur mit hohem Aufwand möglich. Ferner ist nachteilig, daß derartige Veränderungen insbeson­ dere für hochfrequente Signale erhebliche Schwie­ rigkeiten verursachen.In the arrangements known in the prior art is disadvantageous that the connection elements from upper and bottom form a constructive unit and therefore the assignment of signals is fixed. The change in the signal path or the feed egg ner additional operating voltage is not or only possible with great effort. Further is disadvantageous that such changes in particular considerable difficulty for high-frequency signals cause problems.

Der Erfindung liegt die Aufgabe zugrunde, eine Vor­ richtung zur Adaptierung von Schaltkreisen anzuge­ ben, bei der die Signalwege und die Zuordnung der Signale sowie der Betriebsspannungen zwischen Adap­ teroberseite und Adapterunterseite beliebig verän­ dert werden können und die auch für hochfrequente Signale anwendbar ist.The invention has for its object a direction to adapt circuits ben, where the signal paths and the assignment of Signals as well as the operating voltages between Adap Change the top and the bottom of the adapter as required can be changed and also for high-frequency Signals is applicable.

Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß die Fassung eine mehrlagige Leiterplatte ent­ hält, an der Durchkontaktierungen angebracht sind, in denen die Anschlußelemente angeordnet sind.According to the invention, the object is achieved by that the socket ent a multilayer printed circuit board holds on which vias are attached, in which the connection elements are arranged.

Ferner ist es möglich, daß die Fassung aus einem Sockelkörper, einem Adapterkörper und einer dazwi­ schen angeordneten mehrlagigen Leiterplatte be­ steht.It is also possible that the version from a Base body, an adapter body and a dazwi  arranged multilayer printed circuit board stands.

Die erfindungsgemäße Anordnung ermöglicht die Her­ stellung einer elektrischen Verbindung zwischen den Anschlußelementen des Adapterkörpers und den An­ schlußelementen des Sockelkörpers in beliebiger Art und Weise.The arrangement according to the invention enables the Her position of an electrical connection between the Connection elements of the adapter body and the closing elements of the base body in any kind and way.

Die mehrlagige Leiterplatte weist Durchkontaktie­ rungen auf, in denen Anschlußelemente in Form von Buchsen und/oder Stiften angeordnet sind, wobei je­ weils Buchsen oder Stifte am Sockelkörper und die jeweiligen anderen Anschlußelemente am Adapter­ körper befestigt sind.The multilayer printed circuit board has plated-through holes on in which connection elements in the form of Sockets and / or pins are arranged, each because sockets or pins on the base body and respective other connection elements on the adapter body are attached.

Die mehrlagige Leiterplatte mit den Durchkontaktie­ rungen dient dazu, auf ihrer Oberseite den elektri­ schen Kontakt mit dem zu adaptierenden Schaltkreis, der sich im Sockelelement befindet, herzustellen. Die Zuordnung der elektrischen Verbindungen zwi­ schen den einzelnen Anschlußelementen der Ober- und Unterseite kann dabei in einer oder in mehreren Zwischenebenen vorgenommen werden. Auf der Unter­ seite der mehrlagigen Leiterplatte wird der Kontakt mit dem Adapterkörper hergestellt.The multilayer printed circuit board with the vias stanchions serves to keep the electri contact with the circuit to be adapted, which is located in the base element. The assignment of the electrical connections between the individual connection elements of the upper and Bottom can be in one or more Intermediate levels can be made. On the sub The contact becomes the side of the multilayer printed circuit board made with the adapter body.

Eine vorteilhafte Ausführung der erfindungsgemäßen Vorrichtung sieht vor, daß die Anschlußelemente in die Durchkontaktierungen der Leiterplatte einge­ preßt sind. Die Stifte und Buchsen sind dadurch elektrisch und mechanisch mit den Durchkontaktie­ rungen der Leiterplatte verbunden. An advantageous embodiment of the invention Device provides that the connection elements in the vias of the circuit board turned on are pressed. The pins and sockets are thereby electrical and mechanical with the vias the circuit board.  

Ferner ist es möglich, daß die Buchsen und Stifte in Form eines Rasters angeordnet sind, wobei je­ weils die Anschlußelemente der Oberseite und die Anschlußelemente der Unterseite abwechselnd in ei­ ner Reihe angebracht sind. Das Raster wird zweckmä­ ßig versetzt angeordnet, so daß die Anschlußele­ mente des Sockelkörpers sich zwischen den Anschluß­ elementen des Adapterkörpers befinden. Damit wird ein kurzer Signalweg und eine niedrige Kapazität gewährleistet. Die erfindungsgemäße Vorrichtung ist deshalb auch für hochfrequente Anwendungsfälle ge­ eignet.It is also possible that the sockets and pins are arranged in the form of a grid, each because the connection elements of the top and the Connection elements of the bottom alternately in egg ner row are attached. The grid is useful ßig staggered so that the connecting ele elements of the base body itself between the connection elements of the adapter body. So that will a short signal path and low capacity guaranteed. The device according to the invention is therefore also for high-frequency applications is suitable.

Besondere Vorteile der erfindungsgemäßen Vorrich­ tung bestehen in der beliebig wählbaren Zuordnung von oberen und unteren Anschlußelementen, in der Eignung für hohe Frequenzen und in ihrer einfachen und damit kostengünstigen Herstellungsmöglichkeit.Particular advantages of the device according to the invention tion consist in the arbitrary selectable assignment of upper and lower connection elements in the Suitability for high frequencies and in their simple and thus inexpensive manufacturing possibility.

Vorteilhaft ist weiterhin, daß an der mehrlagigen Leiterplatte auch Schichten zur elektromagnetischen Abschirmung und/oder zur Verbesserung der Wärmeab­ leitung angebracht werden können.It is also advantageous that the multilayer PCB also layers for electromagnetic Shielding and / or to improve the heat line can be attached.

Die Erfindung wird im folgenden anhand eines Ausführungsbeispieles näher erläutert. In der zuge­ hörigen Zeichnung zeigen:The invention is based on a Embodiment explained in more detail. In the zuge show proper drawing:

Fig. 1 die erfindungsgemäße Vorrichtung in Seitenansicht, Fig. 1, the device according to the invention in side view,

Fig. 2 einen Ausschnitt aus der Draufsicht auf die mehrlagige Leiterplatte und Fig. 2 shows a detail from the top view of the multi-layer circuit board and

Fig. 3 einen Teilschnitt durch die erfindungs­ gemäße Vorrichtung. Fig. 3 shows a partial section through the device according to the Invention.

Wie aus Fig. 1 ersichtlich ist, besteht die Vor­ richtung aus dem Adapterkörper 1, dem Sockelkörper 2 und der durchkontaktierten mehrlagigen Leiter­ platte 3.As can be seen from FIG. 1, the device consists of the adapter body 1 , the base body 2 and the plated-through multi-layer conductor plate 3 .

Der Adapterkörper 1 und der Sockelkörper 2 sind ge­ mäß der in Fig. 2 dargestellten Anordnung versetzt miteinander verbunden. Die Leiterplatte 3 ist von oben und unten jeweils durch eine Lötverbindung mit dem Adapterkörper 1 bzw. mit dem Sockelkörper 2 verbunden. Die Lötverbindung kann durch Reflow-Lö­ ten bei Verwendung von SMD′s erfolgen.The adapter body 1 and the base body 2 are connected in accordance with the arrangement shown in FIG. 2 offset. The circuit board 3 is connected from above and below by a solder connection to the adapter body 1 and to the base body 2 , respectively. The solder connection can be made by reflow soldering when using SMD's.

In die Durchkontaktierungen 3.1 der mehrlagigen Leiterplatte 3 sind Buchsen 1.1 und Stifte 2.1 ein­ gepreßt. Wie aus Fig. 3 ersichtlich ist, sind im dargestelltem Beispiel die Buchsen 1.1 an der Ober­ seite der Leiterplatte 3 und die Stifte 2.1 an ih­ rer Unterseite angebracht. Die Buchsen 1.1 und Stifte 2.1 sind mechanisch eingepreßt und dadurch mechanisch und elektrisch mit den Durchkontaktie­ rungen 3.1 der mehrlagigen Leiterplatte 3 verbun­ den. Die jeweilige Gestaltung der mehrlagige Lei­ terplatte 3 gewährleistet die gewünschten Verbin­ dungen der Anschlußelemente zu den Durchkontaktie­ rungen.In the plated-through holes 3.1 of the multilayer printed circuit board 3 , sockets 1.1 and pins 2.1 are pressed. As can be seen from Fig. 3, in the example shown, the sockets 1.1 on the upper side of the circuit board 3 and the pins 2.1 are attached to their underside. The sockets 1.1 and pins 2.1 are mechanically pressed in and thus mechanically and electrically with the through contacts 3.1 of the multilayer printed circuit board 3 . The respective design of the multilayer Lei terplatte 3 ensures the desired connec tions of the connecting elements to the Durchkontaktie stungen.

BezugszeichenlisteReference list

1 Adapterkörper
1.1 Buchse
2 Sockelkörper
2.1 Stift
3 mehrlagige Leiterplatte
3. 1 Durchkontaktierungen 1 adapter body
1.1 socket
2 base bodies
2.1 pen
3 multilayer printed circuit board
3. 1 vias

Claims (5)

1. Vorrichtung zur Adaptierung von Schaltkreisen, bei der mindestens ein Schaltkreis an einer mit An­ schlußelementen versehenen Fassung angeordnet ist, dadurch gekennzeichnet, daß die Fassung eine mehr­ lagige Leiterplatte (2) enthält, an der Durchkon­ taktierungen (2.1) angebracht sind, in denen die Anschlußelemente (1.1, 3.1) angeordnet sind.1. Device for adapting circuits in which at least one circuit is arranged on a socket provided with circuit elements, characterized in that the socket contains a multilayer printed circuit board ( 2 ), at the through contacts ( 2.1 ) are attached, in which the connection elements ( 1.1 , 3.1 ) are arranged. 2. Vorrichtung nach Anspruch 1, dadurch gekenn­ zeichnet, daß die Fassung einen Sockelkörper (1) und einen Adapterkörper (3) enthält, zwischen denen die mehrlagigen Leiterplatte (2) angeordnet ist.2. Device according to claim 1, characterized in that the socket contains a base body ( 1 ) and an adapter body ( 3 ), between which the multilayer printed circuit board ( 2 ) is arranged. 3. Vorrichtung nach Anspruch 1 oder 2, dadurch ge­ kennzeichnet, daß in den Durchkontaktierungen (2.1) der mehrlagige Leiterplatte (2) Anschlußelemente in Form von Buchsen (1.1) und/ oder Stiften (3.1) an­ geordnet sind. 3. Apparatus according to claim 1 or 2, characterized in that in the plated-through holes ( 2.1 ) of the multilayer printed circuit board ( 2 ) connection elements in the form of sockets ( 1.1 ) and / or pins ( 3.1 ) are arranged. 4. Vorrichtung nach Anspruch 3, dadurch gekenn­ zeichnet, daß jeweils Buchsen (1.1) oder Stifte (3.1) am Sockelkörper (1) und die jeweiligen ande­ ren Anschlußelemente am Adapterkörper (3) befestigt sind.4. Apparatus according to claim 3, characterized in that in each case sockets ( 1.1 ) or pins ( 3.1 ) on the base body ( 1 ) and the respective other ren connection elements on the adapter body ( 3 ) are attached. 5. Vorrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Buchsen (1.1) und Stifte (3.1) in der mehrlagigen Leiterplatte (2) in Form eines Rasters angeordnet sind, wobei jeweils abwechselnd in einer Reihe die Anschlußelemente der Oberseite und die Anschlußelemente der Unterseite angebracht sind.5. Device according to one of claims 1 to 4, characterized in that the sockets ( 1.1 ) and pins ( 3.1 ) in the multilayer printed circuit board ( 2 ) are arranged in the form of a grid, the connection elements of the top and in alternating rows the connection elements on the underside are attached.
DE4408356A 1994-03-14 1994-03-14 Circuit adaptor device Withdrawn DE4408356A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4408356A DE4408356A1 (en) 1994-03-14 1994-03-14 Circuit adaptor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4408356A DE4408356A1 (en) 1994-03-14 1994-03-14 Circuit adaptor device

Publications (1)

Publication Number Publication Date
DE4408356A1 true DE4408356A1 (en) 1995-09-21

Family

ID=6512579

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4408356A Withdrawn DE4408356A1 (en) 1994-03-14 1994-03-14 Circuit adaptor device

Country Status (1)

Country Link
DE (1) DE4408356A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752938A1 (en) * 1997-11-28 1999-06-02 Pelikan Produktions Ag Recoding of ink printheads

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1640005A1 (en) * 1968-01-17 1970-05-27 Amp Inc Procedure for connecting module assemblies
DE2514123A1 (en) * 1974-04-19 1975-10-30 Ibm ARRANGEMENT FOR A SEAL PACKING OF SEMICONDUCTIVE SUBSTRATES
US4084869A (en) * 1976-11-10 1978-04-18 Intel Corporation Interconnector for integrated circuit package
DE2806246A1 (en) * 1977-03-30 1978-10-12 Augat Inc ELECTRIC CIRCUIT BOARD
US4326765A (en) * 1980-04-15 1982-04-27 International Telephone And Telegraph Corporation Electronic device carrier
US4854882A (en) * 1988-12-12 1989-08-08 Augat Inc. Floatable surface mount terminal
DE9015468U1 (en) * 1990-11-12 1991-01-31 Block, Karl-Heinz, 2908 Friesoythe, De
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
DE4106184A1 (en) * 1991-02-27 1992-09-03 Standard Elektrik Lorenz Ag Chip support electric connector to socket - has spacer plate for securing rear side of chip support, with plate peripheral recesses
WO1992016091A1 (en) * 1991-03-01 1992-09-17 Carlstedt Elektronik Ab A package for integrated circuits
US5151039A (en) * 1990-04-06 1992-09-29 Advanced Interconnections Corporation Integrated circuit adapter having gullwing-shaped leads
DE4129964A1 (en) * 1991-09-10 1993-03-18 Standard Elektrik Lorenz Ag Fixing integrated circuit element onto printed circuit - attaching IC to plastics film having conductive tracks, cutting out film, sticking onto printed circuit, and connecting tracks
US5257165A (en) * 1992-02-13 1993-10-26 Jaton Technology Co., Ltd. Pin grid array adaptor mounting hardware
DD279787B5 (en) * 1989-02-02 1993-11-18 Jenoptik Jena Gmbh VERSION FOR RECEIVING ELECTRONIC COMPONENTS FOR PRINTED CIRCUITS

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1640005A1 (en) * 1968-01-17 1970-05-27 Amp Inc Procedure for connecting module assemblies
DE2514123A1 (en) * 1974-04-19 1975-10-30 Ibm ARRANGEMENT FOR A SEAL PACKING OF SEMICONDUCTIVE SUBSTRATES
US4084869A (en) * 1976-11-10 1978-04-18 Intel Corporation Interconnector for integrated circuit package
DE2806246A1 (en) * 1977-03-30 1978-10-12 Augat Inc ELECTRIC CIRCUIT BOARD
US4326765A (en) * 1980-04-15 1982-04-27 International Telephone And Telegraph Corporation Electronic device carrier
US4854882A (en) * 1988-12-12 1989-08-08 Augat Inc. Floatable surface mount terminal
DD279787B5 (en) * 1989-02-02 1993-11-18 Jenoptik Jena Gmbh VERSION FOR RECEIVING ELECTRONIC COMPONENTS FOR PRINTED CIRCUITS
US5151039A (en) * 1990-04-06 1992-09-29 Advanced Interconnections Corporation Integrated circuit adapter having gullwing-shaped leads
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
DE9015468U1 (en) * 1990-11-12 1991-01-31 Block, Karl-Heinz, 2908 Friesoythe, De
DE4106184A1 (en) * 1991-02-27 1992-09-03 Standard Elektrik Lorenz Ag Chip support electric connector to socket - has spacer plate for securing rear side of chip support, with plate peripheral recesses
WO1992016091A1 (en) * 1991-03-01 1992-09-17 Carlstedt Elektronik Ab A package for integrated circuits
DE4129964A1 (en) * 1991-09-10 1993-03-18 Standard Elektrik Lorenz Ag Fixing integrated circuit element onto printed circuit - attaching IC to plastics film having conductive tracks, cutting out film, sticking onto printed circuit, and connecting tracks
US5257165A (en) * 1992-02-13 1993-10-26 Jaton Technology Co., Ltd. Pin grid array adaptor mounting hardware

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752938A1 (en) * 1997-11-28 1999-06-02 Pelikan Produktions Ag Recoding of ink printheads
DE19752938C2 (en) * 1997-11-28 2000-05-31 Pelikan Produktions Ag Egg Recoding of ink printheads

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