DE4335525A1 - Cooling arrangement - Google Patents

Cooling arrangement

Info

Publication number
DE4335525A1
DE4335525A1 DE4335525A DE4335525A DE4335525A1 DE 4335525 A1 DE4335525 A1 DE 4335525A1 DE 4335525 A DE4335525 A DE 4335525A DE 4335525 A DE4335525 A DE 4335525A DE 4335525 A1 DE4335525 A1 DE 4335525A1
Authority
DE
Germany
Prior art keywords
cooling
heat
substrate
cooling arrangement
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4335525A
Other languages
German (de)
Inventor
Walter Dipl I Roethlingshoefer
Lothar Dr Schmidt
Ulrich Dr Goebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE4335525A priority Critical patent/DE4335525A1/en
Publication of DE4335525A1 publication Critical patent/DE4335525A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling arrangement is proposed which is used for dissipating heat from a semiconductor component (1) that is arranged on a substrate (12) which is a poor conductor of heat. The cooling arrangement comprises a heat sink (11) which is arranged between the semiconductor component (10) and the substrate (12) which is a poor conductor of heat, and has at least one cooling finger (14) which projects through a recess (15) in the substrate (12) which is a poor conductor of heat. <IMAGE>

Description

Stand der TechnikState of the art

Die Erfindung geht aus von einer Kühlanordnung nach der Gattung des Hauptanspruchs. Es ist bereits bekannt, bei Hybridschaltungen Halb­ leiterbauelemente auf Keramiksubstraten anzuordnen, um diese mit weiteren Bauelementen zu einer Hybridschaltung zu vereinen. Insbe­ sondere bei Leistungshalbleitern entsteht dabei eine hohe Abwärme, die durch das Keramiksubstrat, welches einen schlecht wärmeleitenden Körper darstellt, nur ungenügend abgeführt wird.The invention relates to a cooling arrangement according to the genus Main claim. It is already known in hybrid circuits half Arrange conductor components on ceramic substrates in order to to combine further components to form a hybrid circuit. In particular Especially with power semiconductors, there is a high level of waste heat, through the ceramic substrate, which has a poor heat conductivity Represents body, is insufficiently dissipated.

Vorteile der ErfindungAdvantages of the invention

Die erfindungsgemäße Kühlanordnung mit den kennzeichnenden Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß ein gut wärme­ leitender Übergang vom Halbleiterbauelement zu einem Kühlsubstrat eine gute Wärmeabfuhr bewirkt. Dadurch wird die Zuverlässigkeit des Bauelements und somit der gesamten Hybridschaltung erhöht.The cooling arrangement according to the invention with the characteristic features the main claim has the advantage that a good warmth conductive transition from the semiconductor device to a cooling substrate good heat dissipation. This will increase the reliability of the Component and thus the entire hybrid circuit increased.

Durch die in den Unteransprüchen aufgeführten Maßnahmen sind vor­ teilhafte Weiterbildungen und Verbesserungen der im Hauptanspruch angegebenen Kühlanordnung möglich. Besonders vorteilhaft ist es, den Kühlfinger mittels eines gut wärmeleitenden Klebstoffs auf dem Kühl­ substrat zu befestigen, da so ein guter Übergang der Wärme auf den Körper des Kühlsubstrats gewährleistet ist, wodurch sich die Wärme­ abstrahlung vorteilhaft erhöht. Ebenso dient die Verbindung des Halbleiterbauelements mit dem Kühlkörper mittels eines gut wärmelei­ tenden Klebstoffs einer vorteilhaften Erniedrigung des Wärmeüber­ gangswiderstands und somit einer Erhöhung des Wärmeflusses in Rich­ tung Kühlsubstrat. Wenn Kühlkörper und Halbleiterbauelement nahezu den gleichen Wärmeausdehnungskoeffizienten aufweisen, so wird die mechanische Verbindung zwischen Halbleiterbauelement und Kühlkörper durch thermische Spannungen nicht belastet, was den Vorteil der me­ chanischen Stabilität mit sich bringt. Überragt der Kühlkörper das Halbleiterbauelement in seinen Außenmaßen, kann auch bereits die überstehende Oberfläche des Kühlkörpers zur Wärmeabstrahlung dienen, was einen weiteren Vorteil darstellt. Eine Anpassung des Kühlfingers an die Form der Aussparung vereint die Funktion des Kühlfingers als Wärmeleiter mit seiner mechanischen Verankerung in der Aussparung. Dadurch entsteht der Vorteil des Verhinderns des Herausfallens des Kühlkörpers aus dem schlecht wärmeleitenden Substrat. Durch die An­ passung der Länge des Kühlfingers an die Dicke des schlecht wärme­ leitenden Substrats kann das Kühlsubstrat unmittelbar unter dem schlecht wärmeleitenden Substrat angeordnet werden, bzw. sogar das Kühlsubstrat vor der Befestigung des Kühlkörpers auf dem schlecht wärmeleitenden Substrat an diesem befestigt werden. Dadurch entsteht der Vorteil, daß keine feste Reihenfolge bei der Herstellung der Kühlanordnung befolgt werden muß. Durch die Anordnung mehrerer Kühl­ finger in Maxtrixform kann der wärmeleitende Effekt der Kühlanord­ nung vervielfacht werden. Leiterbahnen, die unter dem Kühlkörper entlanglaufen, können zwischen den in Matrixform angeordneten Kühl­ fingern hindurchgeführt sein. The measures listed in the subclaims provide for partial further training and improvements in the main claim  specified cooling arrangement possible. It is particularly advantageous Cold fingers on the cooler with a good heat-conducting adhesive to attach substrate because such a good transfer of heat to the Body of the cooling substrate is ensured, which increases the heat radiation advantageously increased. The connection of the Semiconductor component with the heat sink by means of a good heat tend adhesive of an advantageous reduction in heat transfer resistance and thus an increase in heat flow in Rich tion cooling substrate. When heat sink and semiconductor device almost have the same coefficient of thermal expansion, so mechanical connection between the semiconductor component and the heat sink not burdened by thermal stresses, which is the advantage of me brings mechanical stability with it. The heat sink towers above that Semiconductor component in its outer dimensions, can already protruding surface of the heat sink are used for heat radiation, which is another advantage. An adjustment of the cooling finger the function of the cooling finger on the shape of the recess combines Heat conductor with its mechanical anchoring in the recess. This has the advantage of preventing the falling out Heat sink from the poorly heat-conducting substrate. By the An Fit the length of the cooling finger to the thickness of the bad heat conductive substrate, the cooling substrate can be directly under the poorly heat-conducting substrate are arranged, or even that Cooling substrate before attaching the heat sink to the bad thermally conductive substrate to be attached to this. This creates the advantage that there is no fixed order in the production of Cooling arrangement must be followed. By arranging several cooling fingers in Maxtrix form can the heat-conducting effect of the cooling arrangement can be multiplied. Conductor tracks under the heat sink can run between the cooling arranged in matrix form fingers passed through.  

Zeichnungdrawing

Ausführungsbeispiele der Erfindung sind in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert.Embodiments of the invention are shown in the drawing and explained in more detail in the following description.

Es zeigtIt shows

Fig. 1 die Kühlanordnung in perspektivischer Ansicht, Fig. 1, the cooling arrangement in a perspective view;

Fig. 2 die Kühlanordnung in einer durchgeschnittenen Seitenansicht. Fig. 2 shows the cooling arrangement in a cut side view.

Beschreibung des AusführungsbeispielsDescription of the embodiment

In den Fig. 1 und 2 ist eine Kühlanordnung dargestellt. Ein fla­ ches quaderförmiges Halbleiterbauelement 10 weist zwei quadratische Kontaktflecken 19 an seiner Oberseite auf. Auf einem scheibenförmi­ gen, schlecht wärmeleitenden Substrat 12 befinden sich weitere Bau­ elemente 17, die an Leiterbahnen 16 angeschlossen sind. Von den Lei­ terbahnen 16 führen Anschlußdrähte 18 zu den Kontaktflecken 19 des Halbleiterbauelements 10. Das Halbleiterbauelement 10 ist auf einem flachen quaderförmigen Kühlkörper 11 aufgebracht, der wiederum auf dem schlecht wärmeleitenden Substrat 12 aufgebracht ist. Der Kühl­ körper 11 weist an seiner Unterseite in Matrixform angeordnete zy­ lindrische Kühlfinger 14 auf, die in entsprechend geformte Ausspa­ rungen 15 im schlecht wärmeleitenden Substrat 12 hineinragen. Die Unterseite des Kühlkörpers 11 liegt auf der Oberseite des schlecht wärmeleitenden Substrats 12 auf. Das schlecht wärmeleitende Substrat 12 ist mit seiner Unterseite auf der Oberseite eines flachen Kühl­ substrats 13 befestigt. Die Kühlfinger 14 berühren die Oberseite des Kühlsubstrats 13. Zwischen Halbleiterbauelement 10 und Kühlkörper 11 sowie zwischen den Kühlfingern 14 und dem Kühlsubstrat 13 befindet sich eine wärmeleitfähige Klebeschicht. In Figs. 1 and 2, a cooling arrangement is shown. A fla cheshaped semiconductor device 10 has two square contact pads 19 on its top. On a washer-shaped, poorly heat-conducting substrate 12 there are further construction elements 17 which are connected to conductor tracks 16 . From the Lei tracks 16 lead wires 18 to the pads 19 of the semiconductor device 10th The semiconductor component 10 is applied to a flat cuboidal heat sink 11 , which in turn is applied to the poorly heat-conducting substrate 12 . The cooling body 11 has on its underside in matrix form arranged cylindrical cooling fingers 14 which protrude into correspondingly shaped recesses 15 in the poorly heat-conducting substrate 12 . The underside of the heat sink 11 lies on the top of the poorly heat-conducting substrate 12 . The poorly heat-conducting substrate 12 is attached with its underside on the top of a flat cooling substrate 13 . The cooling fingers 14 touch the top of the cooling substrate 13 . A heat-conductive adhesive layer is located between the semiconductor component 10 and the heat sink 11 and between the cooling fingers 14 and the cooling substrate 13 .

Durch das Halbleiterbauelement 10 abgegebene Wärme gelangt über den Kühlkörper 11 und die daran angeformten Kühlfinger 14 an das Kühl­ substrat 13. Somit bilden die Kühlfinger 14 eine Wärmebrücke, um die Wärme vom Halbleiterbauelement 10 durch das schlecht wärmeleitende Substrat 12 zum Kühlsubstrat 13 zu leiten, von wo aus die Wärme ab­ geführt werden kann. Diese Anordnung eignet sich besonders für Hy­ bridschaltungen, da diese meist auf einem Keramiksubstrat aufgebaut sind, welches bekanntermaßen eine schlechte Wärmeleitfähigkeit auf­ weist.Heat emitted by the semiconductor component 10 reaches the cooling substrate 13 via the cooling body 11 and the cooling fingers 14 formed thereon. The cooling fingers 14 thus form a thermal bridge in order to conduct the heat from the semiconductor component 10 through the poorly heat-conducting substrate 12 to the cooling substrate 13 , from where the heat can be conducted away. This arrangement is particularly suitable for hybrid circuits, since these are usually built on a ceramic substrate, which is known to have poor thermal conductivity.

Claims (8)

1. Kühlanordnung für ein Halbleiterbauelement mit einem schlecht wärmeleitenden Substrat, dadurch gekennzeichnet, daß ein Kühlkörper (11) zwischen dem Halbleiterbauelement (10) und dem schlecht wärme­ leitenden Substrat (12) angeordnet ist, der wenigstens einen Kühl­ finger (14) aufweist, der durch eine Aussparung (15) im schlecht wärmeleitenden Substrat (12) ragt und zu einem unter dem schlecht wärmeleitenden Substrat (12) angeordneten Kühlsubstrat (13) einen gut wärmeleitenden Übergang bildet.1. Cooling arrangement for a semiconductor device with a poorly heat-conducting substrate, characterized in that a heat sink ( 11 ) between the semiconductor device ( 10 ) and the poorly heat-conducting substrate ( 12 ) is arranged, which has at least one cooling finger ( 14 ) protrudes through a recess ( 15 ) in the poorly heat-conducting substrate ( 12 ) and forms a good heat-conducting transition to a cooling substrate ( 13 ) arranged under the poorly heat-conducting substrate ( 12 ). 2. Kühlanordnung nach Anspruch 1, dadurch gekennzeichnet, daß der Kühlfinger (14) mittels eines gut wärmeleitenden Klebstoffs auf dem Kühlsubstrat (13) befestigt ist.2. Cooling arrangement according to claim 1, characterized in that the cooling finger ( 14 ) is fastened to the cooling substrate ( 13 ) by means of a good heat-conducting adhesive. 3. Kühlanordnung nach einem der Ansprüche 1 oder 2, dadurch gekenn­ zeichnet, daß der Kühlkörper (11) mittels eines gut wärmeleitenden Klebstoffs am Halbleiterbauelement (10) befestigt ist.3. Cooling arrangement according to one of claims 1 or 2, characterized in that the heat sink ( 11 ) is fastened to the semiconductor component ( 10 ) by means of a good heat-conducting adhesive. 4. Kühlanordnung nach einem der Ansprüche 1 bis 3, dadurch gekenn­ zeichnet, daß der Kühlkörper (11) nahezu den gleichen Wärmeausdeh­ nungskoeffizienten aufweist, wie das Halbleiterbauelement (10). 4. Cooling arrangement according to one of claims 1 to 3, characterized in that the cooling body ( 11 ) has almost the same coefficient of thermal expansion as the semiconductor component ( 10 ). 5. Kühlanordnung nach einem der Ansprüche 1 bis 4, dadurch gekenn­ zeichnet, daß der Kühlkörper (11) das Halbleiterbauelement (10) in seinen Außenmaßen überragt.5. Cooling arrangement according to one of claims 1 to 4, characterized in that the heat sink ( 11 ) projects beyond the semiconductor component ( 10 ) in its external dimensions. 6. Kühlanordnung nach einem der Ansprüche 1 bis 5, dadurch gekenn­ zeichnet, daß der wenigstens eine Kühlfinger (14) der Form der Aus­ sparung (15) in seiner Form angepaßt ist.6. Cooling arrangement according to one of claims 1 to 5, characterized in that the at least one cooling finger ( 14 ) of the shape of the cutout ( 15 ) is adapted in its shape. 7. Kühlanordnung nach einem der Ansprüche 1 bis 6, dadurch gekenn­ zeichnet, daß der wenigstens eine Kühlfinger (14) genauso lang ist, wie die Dicke des schlecht wärmeleitenden Substrats (12).7. Cooling arrangement according to one of claims 1 to 6, characterized in that the at least one cooling finger ( 14 ) is just as long as the thickness of the poorly heat-conducting substrate ( 12 ). 8. Kühlanordnung nach einem der Ansprüche 1 bis 6, dadurch gekenn­ zeichnet, daß mehrere Kühlfinger (14) vorgesehen sind, die in einer Matrixform angeordnet sind.8. Cooling arrangement according to one of claims 1 to 6, characterized in that a plurality of cooling fingers ( 14 ) are provided, which are arranged in a matrix shape.
DE4335525A 1993-10-19 1993-10-19 Cooling arrangement Ceased DE4335525A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4335525A DE4335525A1 (en) 1993-10-19 1993-10-19 Cooling arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4335525A DE4335525A1 (en) 1993-10-19 1993-10-19 Cooling arrangement

Publications (1)

Publication Number Publication Date
DE4335525A1 true DE4335525A1 (en) 1995-04-20

Family

ID=6500449

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4335525A Ceased DE4335525A1 (en) 1993-10-19 1993-10-19 Cooling arrangement

Country Status (1)

Country Link
DE (1) DE4335525A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998028790A1 (en) * 1996-12-24 1998-07-02 Robert Bosch Gmbh Mounting arrangement for a semiconductor component on a printed circuit board
FR2796801A1 (en) * 1999-07-23 2001-01-26 Valeo Electronique Assembly of printed circuit board and base comprises layer inserted between PCB and base, and having series of contact blocks extended through apertures of PCB
EP1524691A2 (en) * 2003-10-13 2005-04-20 Tyco Electronics Raychem GmbH Power unit comprising a heat sink, and assembly method
DE102005012218A1 (en) * 2005-03-15 2006-09-21 Infineon Technologies Ag Ball grid array type semiconductor component, has cooling unit from made of e.g. copper and including two sections, where one section is partially arranged between chip and substrate, and other section partially runs on housing surface
EP2005470A2 (en) * 2006-04-06 2008-12-24 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998028790A1 (en) * 1996-12-24 1998-07-02 Robert Bosch Gmbh Mounting arrangement for a semiconductor component on a printed circuit board
FR2796801A1 (en) * 1999-07-23 2001-01-26 Valeo Electronique Assembly of printed circuit board and base comprises layer inserted between PCB and base, and having series of contact blocks extended through apertures of PCB
WO2001008459A1 (en) * 1999-07-23 2001-02-01 Valeo Electronique Electronic assembly comprising a sole plate forming a heat sink
US6706972B1 (en) 1999-07-23 2004-03-16 Valeo Electronique Electronic assembly comprising a sole plate forming a heat sink
EP1524691A2 (en) * 2003-10-13 2005-04-20 Tyco Electronics Raychem GmbH Power unit comprising a heat sink, and assembly method
EP1524691A3 (en) * 2003-10-13 2007-04-18 Tyco Electronics Raychem GmbH Power unit comprising a heat sink, and assembly method
US7265983B2 (en) 2003-10-13 2007-09-04 Tyco Electronics Raychem Gmbh Power unit comprising a heat sink, and assembly method
DE102005012218A1 (en) * 2005-03-15 2006-09-21 Infineon Technologies Ag Ball grid array type semiconductor component, has cooling unit from made of e.g. copper and including two sections, where one section is partially arranged between chip and substrate, and other section partially runs on housing surface
DE102005012218B4 (en) * 2005-03-15 2012-12-06 Infineon Technologies Ag Semiconductor device and heat sink element for a semiconductor device
EP2005470A2 (en) * 2006-04-06 2008-12-24 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing
EP2005470A4 (en) * 2006-04-06 2010-12-22 Freescale Semiconductor Inc Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing
US8659146B2 (en) 2006-04-06 2014-02-25 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination
8170 Reinstatement of the former position
8110 Request for examination paragraph 44
8131 Rejection