DE3885834D1 - Lötstelle und Verfahren zu ihrer Bewerkstelligung. - Google Patents
Lötstelle und Verfahren zu ihrer Bewerkstelligung.Info
- Publication number
- DE3885834D1 DE3885834D1 DE88115732T DE3885834T DE3885834D1 DE 3885834 D1 DE3885834 D1 DE 3885834D1 DE 88115732 T DE88115732 T DE 88115732T DE 3885834 T DE3885834 T DE 3885834T DE 3885834 D1 DE3885834 D1 DE 3885834D1
- Authority
- DE
- Germany
- Prior art keywords
- accomplishing
- soldering point
- soldering
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62239817A JP2633580B2 (ja) | 1987-09-24 | 1987-09-24 | バンプ、バンプの形成方法および半導体素子 |
JP6138688 | 1988-03-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3885834D1 true DE3885834D1 (de) | 1994-01-05 |
DE3885834T2 DE3885834T2 (de) | 1994-04-28 |
Family
ID=26402429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88115732T Expired - Fee Related DE3885834T2 (de) | 1987-09-24 | 1988-09-23 | Lötstelle und Verfahren zu ihrer Bewerkstelligung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4970571A (de) |
EP (1) | EP0308971B1 (de) |
KR (1) | KR910006949B1 (de) |
DE (1) | DE3885834T2 (de) |
Families Citing this family (106)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5136363A (en) * | 1987-10-21 | 1992-08-04 | Kabushiki Kaisha Toshiba | Semiconductor device with bump electrode |
US5188702A (en) * | 1989-12-19 | 1993-02-23 | Nitto Denko Corporation | Process for producing an anisotropic conductive film |
EP0433996B1 (de) * | 1989-12-19 | 1997-06-04 | Nitto Denko Corporation | Verfahren zur Herstellung einer anisotrop leitenden Folie |
AU7954491A (en) * | 1990-05-14 | 1991-12-10 | Richard Lee Schendelman | Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction |
US5053851A (en) * | 1991-01-14 | 1991-10-01 | International Business Machines Corp. | Metal bump for a thermal compression bond and method for making same |
US5059553A (en) * | 1991-01-14 | 1991-10-22 | Ibm Corporation | Metal bump for a thermal compression bond and method for making same |
EP0560072A3 (de) * | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur |
US5246880A (en) * | 1992-04-27 | 1993-09-21 | Eastman Kodak Company | Method for creating substrate electrodes for flip chip and other applications |
US5213676A (en) * | 1992-05-11 | 1993-05-25 | Eastman Kodak Company | Method of generating a substrate electrode for flip chip and other applications |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2409312C3 (de) * | 1974-02-27 | 1981-01-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiteranordnung mit einer auf der Halbleiteroberfläche angeordneten Metallschicht und Verfahren zu ihrer Herstellung |
US4182781A (en) * | 1977-09-21 | 1980-01-08 | Texas Instruments Incorporated | Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating |
DE3343367A1 (de) * | 1983-11-30 | 1985-06-05 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit hoeckerartigen, metallischen anschlusskontakten und mehrlagenverdrahtung |
GB2184288A (en) * | 1985-12-16 | 1987-06-17 | Nat Semiconductor Corp | Oxidation inhibition of copper bonding pads using palladium |
CA1264871A (en) * | 1986-02-27 | 1990-01-23 | Makoto Hori | Positive ceramic semiconductor device with silver/palladium alloy electrode |
-
1988
- 1988-09-23 KR KR1019880012331A patent/KR910006949B1/ko not_active IP Right Cessation
- 1988-09-23 US US07/248,101 patent/US4970571A/en not_active Expired - Fee Related
- 1988-09-23 EP EP88115732A patent/EP0308971B1/de not_active Expired - Lifetime
- 1988-09-23 DE DE88115732T patent/DE3885834T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0308971A2 (de) | 1989-03-29 |
EP0308971A3 (en) | 1990-10-10 |
EP0308971B1 (de) | 1993-11-24 |
KR890005857A (ko) | 1989-05-17 |
KR910006949B1 (ko) | 1991-09-14 |
US4970571A (en) | 1990-11-13 |
DE3885834T2 (de) | 1994-04-28 |
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