DE3885160T2 - Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur. - Google Patents
Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur.Info
- Publication number
- DE3885160T2 DE3885160T2 DE88201242T DE3885160T DE3885160T2 DE 3885160 T2 DE3885160 T2 DE 3885160T2 DE 88201242 T DE88201242 T DE 88201242T DE 3885160 T DE3885160 T DE 3885160T DE 3885160 T2 DE3885160 T2 DE 3885160T2
- Authority
- DE
- Germany
- Prior art keywords
- processing
- semiconductor chips
- associated equipment
- edge semiconductor
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8706615A IT1229640B (it) | 1987-06-29 | 1987-06-29 | Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3885160D1 DE3885160D1 (de) | 1993-12-02 |
DE3885160T2 true DE3885160T2 (de) | 1994-04-07 |
Family
ID=11121454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88201242T Expired - Fee Related DE3885160T2 (de) | 1987-06-29 | 1988-06-20 | Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4897369A (de) |
EP (1) | EP0297648B1 (de) |
JP (1) | JPH01220832A (de) |
DE (1) | DE3885160T2 (de) |
IT (1) | IT1229640B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2645478B2 (ja) * | 1988-10-07 | 1997-08-25 | 富士通株式会社 | 半導体装置の製造方法 |
US5128281A (en) * | 1991-06-05 | 1992-07-07 | Texas Instruments Incorporated | Method for polishing semiconductor wafer edges |
JPH0715897B2 (ja) * | 1991-11-20 | 1995-02-22 | 株式会社エンヤシステム | ウエ−ハ端面エッチング方法及び装置 |
JP2628424B2 (ja) * | 1992-01-24 | 1997-07-09 | 信越半導体株式会社 | ウエーハ面取部の研磨方法及び装置 |
US5424224A (en) * | 1993-01-19 | 1995-06-13 | Texas Instruments Incorporated | Method of surface protection of a semiconductor wafer during polishing |
US5595522A (en) * | 1994-01-04 | 1997-01-21 | Texas Instruments Incorporated | Semiconductor wafer edge polishing system and method |
EP0694957B1 (de) * | 1994-07-29 | 2001-11-07 | STMicroelectronics S.r.l. | Verfahren zur Behandlung von Halbleiterscheiben mit Flüssigkeiten |
US6523553B1 (en) * | 1999-03-30 | 2003-02-25 | Applied Materials, Inc. | Wafer edge cleaning method and apparatus |
US6465353B1 (en) * | 2000-09-29 | 2002-10-15 | International Rectifier Corporation | Process of thinning and blunting semiconductor wafer edge and resulting wafer |
US20050211379A1 (en) * | 2004-03-29 | 2005-09-29 | Hung-Wen Su | Apparatus and method for removing metal from wafer edge |
US20050252547A1 (en) * | 2004-05-11 | 2005-11-17 | Applied Materials, Inc. | Methods and apparatus for liquid chemical delivery |
JP4993721B2 (ja) * | 2007-07-02 | 2012-08-08 | シャープ株式会社 | 薄板処理方法および薄板処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3951728A (en) * | 1974-07-30 | 1976-04-20 | Hitachi, Ltd. | Method of treating semiconductor wafers |
JPS5433676A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Wafer processing unit |
JPS55143037A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Treating method of semiconductor complex |
JPS5928036Y2 (ja) * | 1980-07-15 | 1984-08-14 | 信越化学工業株式会社 | 化学エツチング処理装置 |
JPS5958827A (ja) * | 1982-09-28 | 1984-04-04 | Toshiba Corp | 半導体ウエ−ハ、半導体ウエ−ハの製造方法及び半導体ウエ−ハの製造装置 |
JPS5994425A (ja) * | 1982-11-19 | 1984-05-31 | Nec Kyushu Ltd | 半導体製造装置 |
JPS59117123A (ja) * | 1982-12-23 | 1984-07-06 | Toshiba Corp | レジスト除去装置 |
JPS6072234A (ja) * | 1983-09-28 | 1985-04-24 | Mitsubishi Electric Corp | 半導体ウエハ−の水洗装置 |
JPS61230332A (ja) * | 1985-04-04 | 1986-10-14 | Mitsubishi Electric Corp | ウエハ等薄板体の搬送装置 |
JPS6296400A (ja) * | 1985-10-23 | 1987-05-02 | Mitsubishi Metal Corp | ウエハの製造方法 |
-
1987
- 1987-06-29 IT IT8706615A patent/IT1229640B/it active
-
1988
- 1988-06-20 DE DE88201242T patent/DE3885160T2/de not_active Expired - Fee Related
- 1988-06-20 EP EP88201242A patent/EP0297648B1/de not_active Expired - Lifetime
- 1988-06-22 US US07/210,049 patent/US4897369A/en not_active Expired - Lifetime
- 1988-06-28 JP JP63158213A patent/JPH01220832A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0297648A2 (de) | 1989-01-04 |
US4897369A (en) | 1990-01-30 |
IT8706615A0 (it) | 1987-06-29 |
IT1229640B (it) | 1991-09-04 |
EP0297648A3 (en) | 1990-05-30 |
EP0297648B1 (de) | 1993-10-27 |
DE3885160D1 (de) | 1993-12-02 |
JPH01220832A (ja) | 1989-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |