DE3856336D1 - Mikrosonde - Google Patents

Mikrosonde

Info

Publication number
DE3856336D1
DE3856336D1 DE3856336T DE3856336T DE3856336D1 DE 3856336 D1 DE3856336 D1 DE 3856336D1 DE 3856336 T DE3856336 T DE 3856336T DE 3856336 T DE3856336 T DE 3856336T DE 3856336 D1 DE3856336 D1 DE 3856336D1
Authority
DE
Germany
Prior art keywords
microsensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3856336T
Other languages
English (en)
Other versions
DE3856336T2 (de
Inventor
Hisaaki Kawade
Kunihiro Sakai
Yoko Morikawa
Tetsuya Kaneko
Hideya Kumomi
Eigo Kawakami
Haruki Kawada
Hiroshi Matsuda
Hiroyasu Nose
Yoshihiro Yanagisawa
Toshimitsu Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22140388A external-priority patent/JPH0269618A/ja
Priority claimed from JP22223288A external-priority patent/JPH0271439A/ja
Priority claimed from JP63226420A external-priority patent/JP2553661B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE3856336D1 publication Critical patent/DE3856336D1/de
Publication of DE3856336T2 publication Critical patent/DE3856336T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/10—STM [Scanning Tunnelling Microscopy] or apparatus therefor, e.g. STM probes
    • G01Q60/16—Probes, their manufacture, or their related instrumentation, e.g. holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
    • G01Q70/08—Probe characteristics
    • G01Q70/10—Shape or taper
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q80/00—Applications, other than SPM, of scanning-probe techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/875—Scanning probe structure with tip detail
    • Y10S977/878—Shape/taper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/875—Scanning probe structure with tip detail
    • Y10S977/879—Material
DE3856336T 1987-09-24 1988-09-21 Mikrosonde Expired - Fee Related DE3856336T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP23749987 1987-09-24
JP23750087 1987-09-24
JP31895187 1987-12-18
JP22140388A JPH0269618A (ja) 1988-09-06 1988-09-06 エンコーダー
JP22223288A JPH0271439A (ja) 1988-09-07 1988-09-07 記録再生装置
JP63226420A JP2553661B2 (ja) 1987-09-24 1988-09-12 微小プローグ及びその製造方法

Publications (2)

Publication Number Publication Date
DE3856336D1 true DE3856336D1 (de) 1999-07-01
DE3856336T2 DE3856336T2 (de) 2000-01-27

Family

ID=27553969

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3850544T Expired - Lifetime DE3850544T2 (de) 1987-09-24 1988-09-21 Mikrosonde, deren Herstellung und elektronisches Gerät, das diese Mikrosonde gebraucht.
DE3856336T Expired - Fee Related DE3856336T2 (de) 1987-09-24 1988-09-21 Mikrosonde

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE3850544T Expired - Lifetime DE3850544T2 (de) 1987-09-24 1988-09-21 Mikrosonde, deren Herstellung und elektronisches Gerät, das diese Mikrosonde gebraucht.

Country Status (4)

Country Link
US (1) US5072116A (de)
EP (1) EP0309236B1 (de)
CA (1) CA1312952C (de)
DE (2) DE3850544T2 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994698A (en) * 1987-09-24 1999-11-30 Canon Kabushiki Kaisha Microprobe, preparation thereof and electronic device by use of said microprobe
US5634267A (en) * 1991-06-04 1997-06-03 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US5640762A (en) 1988-09-30 1997-06-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
ATE139051T1 (de) * 1988-10-04 1996-06-15 Canon Kk Gerät und verfahren zur aufzeichnung und wiedergabe und aufzeichnungsmedium für das aufzeichungs- und wiedergabeverfahren
US5241527A (en) * 1989-03-16 1993-08-31 Canon Kabushiki Kaisha Recording and reproducing apparatus and method using a recording layer having a positioning region
US4987303A (en) * 1989-04-07 1991-01-22 Olympus Optical Co., Inc. Micro-displacement detector device, piezo-actuator provided with the micro-displacement detector device and scanning probe microscope provided with the piezo-actuator
JP2775464B2 (ja) * 1989-04-27 1998-07-16 キヤノン株式会社 位置検出装置
JP2686645B2 (ja) * 1989-05-08 1997-12-08 キヤノン株式会社 走査型トンネル電流検出装置
GB8910566D0 (en) * 1989-05-08 1989-06-21 Amersham Int Plc Imaging apparatus and method
DE69127379T2 (de) * 1990-01-11 1998-03-19 Canon Kk Mikrosonde, Herstellungsverfahren zur Herstellung derselben und Informations-Eingabe- und/oder Ausgabe-Gerät welches dieselbe verwendet
JP2996748B2 (ja) * 1990-02-09 2000-01-11 キヤノン株式会社 位置ずれ検出装置および方法
JP2783646B2 (ja) * 1990-04-18 1998-08-06 キヤノン株式会社 情報記録再生装置
US5171992A (en) * 1990-10-31 1992-12-15 International Business Machines Corporation Nanometer scale probe for an atomic force microscope, and method for making same
CA2057619C (en) * 1990-12-17 1997-08-19 Takayuki Yagi Cantilever probe and apparatus using the same
JP3010318B2 (ja) * 1991-02-26 2000-02-21 キヤノン株式会社 微小プローブ、その製造方法、該プローブを用いた表面観察装置及び情報処理装置
US6828812B2 (en) * 1991-06-04 2004-12-07 Micron Technology, Inc. Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections
US6340894B1 (en) 1991-06-04 2002-01-22 Micron Technology, Inc. Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect
US5495179A (en) * 1991-06-04 1996-02-27 Micron Technology, Inc. Carrier having interchangeable substrate used for testing of semiconductor dies
US5541525A (en) * 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US6219908B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US5585282A (en) * 1991-06-04 1996-12-17 Micron Technology, Inc. Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor
US5239260A (en) * 1991-06-28 1993-08-24 Digital Equipment Corporation Semiconductor probe and alignment system
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
US5177439A (en) * 1991-08-30 1993-01-05 U.S. Philips Corporation Probe card for testing unencapsulated semiconductor devices
US5386720A (en) * 1992-01-09 1995-02-07 Olympus Optical Co., Ltd. Integrated AFM sensor
KR940001341A (ko) * 1992-06-29 1994-01-11 디. 아이. 캐플란 전자 장치로의 빠른 전기 접근을 위한 순간 접속법
JPH06187675A (ja) * 1992-09-25 1994-07-08 Canon Inc 情報処理装置、及びそれを用いる情報処理方法
US5483741A (en) * 1993-09-03 1996-01-16 Micron Technology, Inc. Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
US5326428A (en) 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
US5478779A (en) * 1994-03-07 1995-12-26 Micron Technology, Inc. Electrically conductive projections and semiconductor processing method of forming same
US5751683A (en) 1995-07-24 1998-05-12 General Nanotechnology, L.L.C. Nanometer scale data storage device and associated positioning system
US6339217B1 (en) 1995-07-28 2002-01-15 General Nanotechnology Llc Scanning probe microscope assembly and method for making spectrophotometric, near-field, and scanning probe measurements
US6353219B1 (en) 1994-07-28 2002-03-05 Victor B. Kley Object inspection and/or modification system and method
US6337479B1 (en) * 1994-07-28 2002-01-08 Victor B. Kley Object inspection and/or modification system and method
JPH0862230A (ja) * 1994-08-24 1996-03-08 Olympus Optical Co Ltd 集積型ｓｐｍセンサー
US5903161A (en) * 1995-01-26 1999-05-11 Denki Kagaku Kogyo Kabushiki Kaisha Electrically conductive rod-shaped single crystal product and assembly for measuring electrical properties employing such product, as well as processes for their production
US5532611A (en) * 1995-05-26 1996-07-02 International Business Machines Corporation Miniature probe positioning actuator
US5869974A (en) * 1996-04-01 1999-02-09 Micron Technology, Inc. Micromachined probe card having compliant contact members for testing semiconductor wafers
DE19622701A1 (de) * 1996-06-05 1997-12-18 Fraunhofer Ges Forschung Mikrobalken mit integrierter Abtast- bzw. Prüfspitze aus Diamant für den Einsatz in Rastersondenmikroskopen
JPH10313008A (ja) 1997-05-13 1998-11-24 Canon Inc 微細パターンの形成方法及び該微細パターンを有する電気素子
US6802646B1 (en) 2001-04-30 2004-10-12 General Nanotechnology Llc Low-friction moving interfaces in micromachines and nanomachines
US6752008B1 (en) 2001-03-08 2004-06-22 General Nanotechnology Llc Method and apparatus for scanning in scanning probe microscopy and presenting results
US6923044B1 (en) 2001-03-08 2005-08-02 General Nanotechnology Llc Active cantilever for nanomachining and metrology
US7196328B1 (en) 2001-03-08 2007-03-27 General Nanotechnology Llc Nanomachining method and apparatus
US6787768B1 (en) 2001-03-08 2004-09-07 General Nanotechnology Llc Method and apparatus for tool and tip design for nanomachining and measurement
EP1196939A4 (de) 1999-07-01 2002-09-18 Gen Nanotechnology Llc Vorrichtung und verfahren zur untersuchung und/oder veränderungsobjekt
US6931710B2 (en) 2001-01-30 2005-08-23 General Nanotechnology Llc Manufacturing of micro-objects such as miniature diamond tool tips
US7253407B1 (en) 2001-03-08 2007-08-07 General Nanotechnology Llc Active cantilever for nanomachining and metrology
JP4310076B2 (ja) * 2001-05-31 2009-08-05 キヤノン株式会社 結晶性薄膜の製造方法
US7053369B1 (en) 2001-10-19 2006-05-30 Rave Llc Scan data collection for better overall data accuracy
US6813937B2 (en) 2001-11-28 2004-11-09 General Nanotechnology Llc Method and apparatus for micromachines, microstructures, nanomachines and nanostructures
US6998689B2 (en) 2002-09-09 2006-02-14 General Nanotechnology Llc Fluid delivery for scanning probe microscopy
FR2856184B1 (fr) * 2003-06-13 2008-04-11 Commissariat Energie Atomique Dispositif d'enregistrement de donnees comportant des micro-pointes et un support d'enregistrement
JP4360863B2 (ja) 2003-08-07 2009-11-11 Ｎｅｃエレクトロニクス株式会社 走査型プローブ検査装置
US20100001229A1 (en) * 2007-02-27 2010-01-07 Hitachi Chemical Co., Ltd. Cmp slurry for silicon film
US9773889B2 (en) * 2014-07-18 2017-09-26 Taiwan Semiconductor Manufacturing Company Limited Method of semiconductor arrangement formation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH643397A5 (de) * 1979-09-20 1984-05-30 Ibm Raster-tunnelmikroskop.
US4575822A (en) * 1983-02-15 1986-03-11 The Board Of Trustees Of The Leland Stanford Junior University Method and means for data storage using tunnel current data readout
EP0194323B1 (de) * 1985-03-07 1989-08-02 International Business Machines Corporation Tunneleffektabtastungsmikroskop
JPS62209302A (ja) * 1986-03-10 1987-09-14 Shimadzu Corp 平行移動量検出装置

Also Published As

Publication number Publication date
DE3850544T2 (de) 1994-11-24
EP0309236A2 (de) 1989-03-29
DE3856336T2 (de) 2000-01-27
DE3850544D1 (de) 1994-08-11
CA1312952C (en) 1993-01-19
EP0309236A3 (de) 1992-07-01
EP0309236B1 (de) 1994-07-06
US5072116A (en) 1991-12-10

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee