DE3781086D1 - Methode zur steigerung des haftvermoegens von polymeren materialien auf metallen. - Google Patents
Methode zur steigerung des haftvermoegens von polymeren materialien auf metallen.Info
- Publication number
- DE3781086D1 DE3781086D1 DE8787114913T DE3781086T DE3781086D1 DE 3781086 D1 DE3781086 D1 DE 3781086D1 DE 8787114913 T DE8787114913 T DE 8787114913T DE 3781086 T DE3781086 T DE 3781086T DE 3781086 D1 DE3781086 D1 DE 3781086D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesivity
- metals
- increasing
- polymer materials
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/246—Vapour deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/923,977 US4689111A (en) | 1986-10-28 | 1986-10-28 | Process for promoting the interlaminate adhesion of polymeric materials to metal surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3781086D1 true DE3781086D1 (de) | 1992-09-17 |
DE3781086T2 DE3781086T2 (de) | 1993-03-18 |
Family
ID=25449539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787114913T Expired - Fee Related DE3781086T2 (de) | 1986-10-28 | 1987-10-13 | Methode zur steigerung des haftvermoegens von polymeren materialien auf metallen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4689111A (de) |
EP (1) | EP0265765B1 (de) |
JP (1) | JPS63112679A (de) |
DE (1) | DE3781086T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8501773A (nl) * | 1985-06-20 | 1987-01-16 | Philips Nv | Werkwijze voor het vervaardigen van halfgeleiderinrichtingen. |
CA1286586C (en) * | 1987-03-26 | 1991-07-23 | Shigeki Yokoyama | Finish laminates for high frequency circuits |
US4797178A (en) * | 1987-05-13 | 1989-01-10 | International Business Machines Corporation | Plasma etch enhancement with large mass inert gas |
US4810326A (en) * | 1987-08-31 | 1989-03-07 | International Business Machines Corporation | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
US5443455A (en) * | 1993-07-27 | 1995-08-22 | Target Therapeutics, Inc. | Guidewire and method of pretreating metal surfaces for subsequent polymer coating |
GB9405518D0 (en) * | 1994-03-21 | 1994-05-04 | Mupor Ltd | Porous metal composite body |
US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
US6743319B2 (en) * | 1998-09-30 | 2004-06-01 | Paralec Inc. | Adhesiveless transfer lamination method and materials for producing electronic circuits |
US6212769B1 (en) * | 1999-06-29 | 2001-04-10 | International Business Machines Corporation | Process for manufacturing a printed wiring board |
EP1138804A3 (de) * | 2000-03-27 | 2003-06-25 | Infineon Technologies AG | Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu |
US7645832B2 (en) * | 2006-03-08 | 2010-01-12 | Exxonmobil Chemical Patents Inc. | Use of metal oxides and salts to enhance adhesion to steels |
JP5234011B2 (ja) * | 2010-01-07 | 2013-07-10 | 豊田合成株式会社 | 金属と樹脂との複合体の製造方法 |
TWI404615B (zh) * | 2010-04-01 | 2013-08-11 | A method of manufacturing an in-mold formed film having a metal surface | |
DE102015108237A1 (de) * | 2015-05-26 | 2016-12-01 | Thyssenkrupp Ag | Herstellung von Verbundmaterial mittels Plasmabeschichtung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3455775A (en) * | 1966-05-26 | 1969-07-15 | Bell Telephone Labor Inc | Metal-plastic laminate and method for the preparation thereof |
US4087300A (en) * | 1974-01-07 | 1978-05-02 | Edward Adler | Process for producing metal-plastic laminate |
US4277321A (en) * | 1979-04-23 | 1981-07-07 | Bell Telephone Laboratories, Incorporated | Treating multilayer printed wiring boards |
JPS5930832A (ja) * | 1982-08-13 | 1984-02-18 | Shin Etsu Chem Co Ltd | 表面特性の改質されたフツ素系樹脂成形品 |
JPS5938268A (ja) * | 1982-08-26 | 1984-03-02 | Sumitomo Chem Co Ltd | ポリオレフイン樹脂の接着方法 |
US4416725A (en) * | 1982-12-30 | 1983-11-22 | International Business Machines Corporation | Copper texturing process |
EP0133621B1 (de) * | 1983-08-02 | 1988-03-30 | Ibm Deutschland Gmbh | Verfahren zum Trockenätzen von Kupfer und seine Verwendung |
-
1986
- 1986-10-28 US US06/923,977 patent/US4689111A/en not_active Expired - Fee Related
-
1987
- 1987-07-20 JP JP62179273A patent/JPS63112679A/ja active Granted
- 1987-10-13 EP EP87114913A patent/EP0265765B1/de not_active Expired - Lifetime
- 1987-10-13 DE DE8787114913T patent/DE3781086T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0265765A3 (en) | 1990-03-07 |
JPS63112679A (ja) | 1988-05-17 |
DE3781086T2 (de) | 1993-03-18 |
JPH0238620B2 (de) | 1990-08-31 |
US4689111A (en) | 1987-08-25 |
EP0265765B1 (de) | 1992-08-12 |
EP0265765A2 (de) | 1988-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |