DE3728151A1 - Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state - Google Patents

Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state

Info

Publication number
DE3728151A1
DE3728151A1 DE19873728151 DE3728151A DE3728151A1 DE 3728151 A1 DE3728151 A1 DE 3728151A1 DE 19873728151 DE19873728151 DE 19873728151 DE 3728151 A DE3728151 A DE 3728151A DE 3728151 A1 DE3728151 A1 DE 3728151A1
Authority
DE
Germany
Prior art keywords
contact metal
injection
liquid state
printed circuits
direct injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873728151
Other languages
German (de)
Inventor
Theo Dipl Ing Schmeller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19873728151 priority Critical patent/DE3728151A1/en
Publication of DE3728151A1 publication Critical patent/DE3728151A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal

Abstract

The invention relates to a method and a device for making direct contact with single-layer and multilayer printed circuit boards, in the case of which method liquid contact metal is injected through an injection nozzle on to the inner wall of the opening with which contact is to be made, at high pressure, by means of an injection device.

Description

Stand der TechnikState of the art

Die gedruckte Schaltung ist in der Mikroelektronik von heute das Leiterbahnensystem zur Herstellung elektrischer Verbindungen zwischen einzelnen Bau­ elementen auf einer Isolierstoff-Trägerplatte. Dabei werden die Leiterbahnen aus einer aufgebrachten flächigen Kupferkaschierung mit lichtempfindlicher Beschichtung herausgeätzt, nachdem das Leiterbahnen­ bild darauf optisch übertragen, entwickelt und fixiert wurden.The printed circuit is in microelectronics today's conductor track system for manufacturing electrical connections between individual construction elements on an insulating board. The conductor tracks are applied from one flat copper cladding with photosensitive Coating etched out after the conductor tracks image transferred to it optically, developed and fixed were.

In diese Platinen werden Bohrungen gebohrt. Diese Bohrungen dienen entweder der Aufnahme der einsteck­ baren elektronischen Bauelemente oder vielfach nur der Durchkontaktierung, d. h. der elektr. leitenden Über­ tragung. Bei den doppelseitigen Platinen bzw. bei den Multilayer-Platinen werden Vorder- und Rückseite der Leiterbahnen bildmäßig punktweise durchkontaktiert.Holes are drilled in these boards. These Holes either serve to accommodate the insert baren electronic components or in many cases only the Vias, d. H. the electr. senior about wearing. With the double-sided boards or with the Multilayer boards are front and back of the Conductively through-connected conductor tracks point by point.

Bekannte Verfahren zur Durchkontaktierung von Leiter­ platten sind die Beschichtung durch Aufdrucken einer elektrisch leitfähigen Paste mittels elastisch verform­ baren Druckstempels (DE 31 45 584), die Metallisierung einer aufgerauhten Seitenwand durch Kathodenzerstäubung mit anschließender galvanischer Verstärkung (DE- 05 29 20 091) und verschiedene mechanische Verfahren mittels Unterdruck oder spezieller Bohrverfahren.Known methods of through-contacting conductors plates are the coating by printing one electrically conductive paste by means of elastic deformation ble pressure stamp (DE 31 45 584), the metallization a roughened side wall by sputtering with subsequent galvanic reinforcement (DE- 05 29 20 091) and various mechanical processes by means of negative pressure or special drilling methods.

Die industrielle Herstellung der Durchkontaktierung, insbesondere bei den Multilayer-Platinen durch alle verklebten einzelnen Leiterplatten, erfolgt derzeit weitgehend - in mehreren Arbeitsgängen gestuft - auf elektrochemischen/galvanischem Weg, mit bekannt hohem Aufwand (siehe "Gedruckte Schaltungen" Francis Verlag München). The industrial production of the via, especially with the multilayer boards by everyone glued individual circuit boards, is currently taking place largely - graded in several work steps - in an electrochemical / galvanic way, with known high effort (see "Printed Circuits" Francis Munich publishing house).  

Verfahren zum Herstellen verschmierungsfreier Bohrungen (EP 02 08 012), Reinigung, Aktivierung (DE 35 28 575) usw. sind bekannt. Ebenso ist bekannt (DE 29 53 899), daß Indium- Legierungen isolierende Materialien benetzt.Process for producing lubrication-free bores (EP 02 08 012), cleaning, activation (DE 35 28 575) etc. known. It is also known (DE 29 53 899) that indium Alloys insulating materials wetted.

Beschreibung des VerfahrensDescription of the procedure

An den durchzukontaktierenden Punkten der Leiter- Platinen werden diese mit Durchgangslöchern versehen. Danach ist zur sicheren Durchkontaktierung der einzel­ nen Leiterplatten die zu kontaktierende Bohrungsinnen­ wand von Spänen zu befreien und je nach Bedarf mit einem Flußmittel zu benetzen. Sind die zu kontaktierenden Öffnungen konstruktiv bereits vorhanden, entfällt dieser Aufwand.At the points of the conductor Boards are provided with through holes. After that, the individual is safely through-plated PCBs the inner holes to be contacted free of chips and depending on the need to wet a flux. Are the openings to be contacted constructive this effort does not already exist.

Über der Bohrung wird eine Einspritzvorrichtung (E) positioniert. Aus dieser Einspritzvorrichtung wird unter hohem Druck flüssiges Kontakt-Metall durch eine Ein­ spritzdüse (2) auf die Innenwand der Bohrung gespritzt. Bedingt durch den hohen Einspritzdruck und der extrem kleinen Metallpartikel werden diese Metallpartikel in die Oberfläche mit hohem Rauheitswert tief einge­ preßt. Auf Grund der geringen Menge der Metallpartikel erstarren diese sehr schnell noch in der Oberflächen­ struktur der Bohrungsinnenwand und können sich somit nicht durch Kohäsion/Oberflächenspannung perlförmig an der Bohrungswandung ablegen. Wiederholtes Aufspritzen in kurzem Zeitabstand verstärkt die Kontaktauflage auf die gewünschte Materialstärke bzw. erbringt den benötigten Leitungsquerschnitt.An injector (E) is positioned over the hole. From this injector, liquid contact metal is injected under high pressure through an injection nozzle ( 2 ) onto the inner wall of the bore. Due to the high injection pressure and the extremely small metal particles, these metal particles are pressed deep into the surface with a high roughness value. Due to the small amount of metal particles, they solidify very quickly in the surface structure of the inner wall of the bore and can therefore not deposit on the bore wall in the form of pearls due to cohesion / surface tension. Repeated spraying at short intervals strengthens the contact pad to the desired material thickness or provides the required cable cross-section.

Konstruktive Elemente des Düsenkörpers (2) und der Düsennadel (1) bestimmen wesentlich die Güte der Kontak­ tierung. Der Abspritzdruck, der Abspritzwinkel, die Abspritzzeit sind abhängig vom Durchmesser der zu kon­ taktierenden Bohrung; die Spritztemperatur ist abhängig von der Beschaffenheit des Kontaktmetalls bzw. der -legierung und müssen am konkreten Fall geklärt werden. Structural elements of the nozzle body ( 2 ) and the nozzle needle ( 1 ) essentially determine the quality of the contacting. The spray pressure, the spray angle and the spray time depend on the diameter of the bore to be contacted; the spray temperature depends on the nature of the contact metal or alloy and must be clarified in the specific case.

Die Kontaktierung sollte unter Schutzgasatmosphäre erfolgen.The contact should be made under a protective gas atmosphere respectively.

Sowohl der Düsenkörper als auch der Gegenhalter (7) sind mit metallabweisenden, wärmeisolierenden Auflagen (4, 6) versehen. Im Gegenhalter ist eine Metallabsaugung-Auf­ fangeinrichtung integiert.Both the nozzle body and the counter-holder ( 7 ) are provided with metal-repellent, heat-insulating pads ( 4, 6 ). A metal suction catcher is integrated in the counter holder.

Bei Verwendung von Kontaktmetall-Legierungen werden eutektoide Lote empfohlen.When using contact metal alloys eutectoid solders recommended.

Tolerierte Bohrungen können nach dem Einspritzen zur Erreichung der Maßhaltigkeit mittels eines Dornes kalibriert werden.Tolerated holes can be used after injection Dimensional accuracy is achieved using a mandrel be calibrated.

Vorteile dieses VerfahrensAdvantages of this procedure

  • a) Durchkontaktierung direkt im Anschluß an das Bohren möglich;a) through-plating directly after the Drilling possible;
  • b) Beibehaltung der Koordinaten der Bohrung; d. h. ledig­ lich "Werkzeugwechsel",b) maintaining the coordinates of the hole; d. H. single "Tool change",
  • c) problemlose Integration der Kontaktierungs-Station in Bearbeitungszentren-Transferstraßen,c) problem-free integration of the contacting station in machining center transfer lines,
  • d) kurze Zeiten der Durchkontaktierung,d) short times of through-plating,
  • e) keinerlei Abwässer - Problemmüll,e) no waste water - problem waste,
  • f) Verlustmetall gut wiederverwendbar.f) lost metal well reusable.

Erklärung der ZeichnungspositionenExplanation of the drawing positions

a) Isoliermaterial - Schichten (Prepregs)
b) Kontaktmetall - Schichten
E Einspritzvorrichtung
1 Düsennadel
2 Düsenkörper
3 Heizelement
4 Isolierstück
5 Leiterplatte
6 Auflage
7 Gegenhalter
8 Absaugunga) Insulating material - layers (prepregs)
b) contact metal layers
E injector
1 nozzle needle
2 nozzle bodies
3 heating element
4 insulating piece
5 circuit board
6 edition
7 counterholders
8 suction

Claims (5)

1. Verfahren und Vorrichtung zur Herstellung von Durchkontaktierungen in gedruckten Schaltungen, gekennzeichnet durch die Direkt-Einspritzung des Kontaktmetalls in flüssigem Zustand.1. Method and device for the production of plated-through holes in printed circuits, characterized by the direct injection of the contact metal in the liquid state. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß alle Schichten der durchzukontaktierenden Öffnung der Leiterplatte auf genanntem Weg mit einer leitfähigen Metallschicht überzogen werden.2. The method according to claim 1, characterized in that that all layers of the plated-through hole Open the circuit board in the above-mentioned way with be coated with a conductive metal layer. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktierung über eine Einspritzvorrich­ tung erfolgt, bei der dieselbe um den Düsenkör­ per mit einer elastischen, wärmeisolierenden und metallabweisenden Auflage versehen ist.3. The method according to claim 1, characterized in that contacting via an injection device tion takes place in the same around the nozzle body per with an elastic, heat insulating and metal-resistant pad is provided. 4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß im Gegenhalter eine Absaug- und Auffangein­ richtung integriert ist.4. The method according to claim 1, characterized in that in the counter holder a suction and catch direction is integrated. 5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Einspritzvorrichtung, bestehend aus dem Einspritzkörper mit Düsenhalter, der Einspritz­ pumpe, der Heizung, des Vorratsbehälters und des Motors räumlich eine Einheit bilden.5. The method according to claim 1, characterized in that the injector consisting of the Injection body with nozzle holder, the injection pump, heater, reservoir and Spatially form a unit.
DE19873728151 1987-08-24 1987-08-24 Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state Withdrawn DE3728151A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873728151 DE3728151A1 (en) 1987-08-24 1987-08-24 Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873728151 DE3728151A1 (en) 1987-08-24 1987-08-24 Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state

Publications (1)

Publication Number Publication Date
DE3728151A1 true DE3728151A1 (en) 1989-03-09

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ID=6334345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873728151 Withdrawn DE3728151A1 (en) 1987-08-24 1987-08-24 Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state

Country Status (1)

Country Link
DE (1) DE3728151A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876842A (en) * 1995-06-07 1999-03-02 International Business Machines Corporation Modular circuit package having vertically aligned power and signal cores
WO2001015504A1 (en) * 1999-08-25 2001-03-01 Gemplus Method for making hybrid smart cards and smart cards obtained by said method
US6452117B2 (en) 1999-08-26 2002-09-17 International Business Machines Corporation Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
US6519824B2 (en) * 2000-03-24 2003-02-18 Olympus Optical Co., Ltd. Electric wiring forming system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876842A (en) * 1995-06-07 1999-03-02 International Business Machines Corporation Modular circuit package having vertically aligned power and signal cores
WO2001015504A1 (en) * 1999-08-25 2001-03-01 Gemplus Method for making hybrid smart cards and smart cards obtained by said method
FR2797976A1 (en) * 1999-08-25 2001-03-02 Gemplus Card Int METHOD OF MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED THEREBY
US6452117B2 (en) 1999-08-26 2002-09-17 International Business Machines Corporation Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
US6581280B2 (en) 1999-08-26 2003-06-24 International Business Machines Corporation Method for filling high aspect ratio via holes in electronic substrates
US6519824B2 (en) * 2000-03-24 2003-02-18 Olympus Optical Co., Ltd. Electric wiring forming system

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