DE3687220D1 - Verfahren und vorrichtung zur detektion von musterfehlern. - Google Patents

Verfahren und vorrichtung zur detektion von musterfehlern.

Info

Publication number
DE3687220D1
DE3687220D1 DE8686117339T DE3687220T DE3687220D1 DE 3687220 D1 DE3687220 D1 DE 3687220D1 DE 8686117339 T DE8686117339 T DE 8686117339T DE 3687220 T DE3687220 T DE 3687220T DE 3687220 D1 DE3687220 D1 DE 3687220D1
Authority
DE
Germany
Prior art keywords
detecting pattern
pattern errors
errors
detecting
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686117339T
Other languages
English (en)
Other versions
DE3687220T2 (de
Inventor
Hiroyuki Onishi
Tetsuo Sano
Tetsuo Hoki
Eiji Kodama
Hisayuki Tsujinaka
Ryuji Kitakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Application granted granted Critical
Publication of DE3687220D1 publication Critical patent/DE3687220D1/de
Publication of DE3687220T2 publication Critical patent/DE3687220T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G06V10/7515—Shifting the patterns to accommodate for positional errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
DE8686117339T 1985-12-13 1986-12-12 Verfahren und vorrichtung zur detektion von musterfehlern. Expired - Fee Related DE3687220T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60281558A JPH0621769B2 (ja) 1985-12-13 1985-12-13 パタ−ン欠陥検出方法およびその装置

Publications (2)

Publication Number Publication Date
DE3687220D1 true DE3687220D1 (de) 1993-01-14
DE3687220T2 DE3687220T2 (de) 1993-07-01

Family

ID=17640856

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686117339T Expired - Fee Related DE3687220T2 (de) 1985-12-13 1986-12-12 Verfahren und vorrichtung zur detektion von musterfehlern.

Country Status (5)

Country Link
US (1) US4803734A (de)
EP (1) EP0225651B1 (de)
JP (1) JPH0621769B2 (de)
KR (1) KR910007789B1 (de)
DE (1) DE3687220T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0658216B2 (ja) * 1986-01-13 1994-08-03 株式会社日立製作所 パタ−ン欠陥判定装置
JP2539856B2 (ja) * 1987-10-15 1996-10-02 株式会社ヒューテック 印刷パタ―ン周期長のずれ検知方法
US5073952A (en) * 1988-09-07 1991-12-17 Sigmax Kabushiki Kaisha Pattern recognition device
FR2647574B1 (fr) * 1989-05-12 1991-09-06 Automatisme Robotique Applique Procedes et dispositifs pour effectuer des controles de fabrication visuels d'une serie de pieces identiques
JP2833137B2 (ja) * 1990-04-05 1998-12-09 松下電器産業株式会社 パターンマッチング方法
US5258855A (en) * 1991-03-20 1993-11-02 System X, L. P. Information processing methodology
US6683697B1 (en) * 1991-03-20 2004-01-27 Millenium L.P. Information processing methodology
DE69325497T2 (de) * 1992-12-22 2000-01-05 Konishiroku Photo Ind Farbbildverarbeitungsgerät zur Glättung eines Bildes
US5305392A (en) * 1993-01-11 1994-04-19 Philip Morris Incorporated High speed, high resolution web inspection system
US5852685A (en) * 1993-07-26 1998-12-22 Cognitronics Imaging Systems, Inc. Enhanced batched character image processing
US5608816A (en) * 1993-12-24 1997-03-04 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting a wiring pattern according to a micro-inspection and a macro-inspection performed in parallel
JPH08204096A (ja) * 1995-01-30 1996-08-09 Nec Corp 半導体装置のリード外観検査方法および検査装置
JP3982646B2 (ja) * 1997-04-28 2007-09-26 財団法人くまもとテクノ産業財団 画像識別装置および方法および画像識別装置を備えた画像検出識別装置ならびに画像識別用プログラムを記録した媒体
US6529621B1 (en) * 1998-12-17 2003-03-04 Kla-Tencor Mechanisms for making and inspecting reticles
JP3593302B2 (ja) * 1999-06-15 2004-11-24 株式会社ミツトヨ 画像測定装置及び方法
JP4653339B2 (ja) * 2001-05-31 2011-03-16 大和製罐株式会社 画像マッチング処理方法
JP4653340B2 (ja) * 2001-05-31 2011-03-16 大和製罐株式会社 ３板式ｃｃｄカメラを用いた缶外観検査装置
JP2002358509A (ja) * 2001-06-01 2002-12-13 Dainippon Screen Mfg Co Ltd 穴検査装置
JP3904419B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 検査装置および検査システム
JP2003100826A (ja) * 2001-09-26 2003-04-04 Hitachi Ltd 検査データ解析プログラムと検査装置と検査システム
US20030086596A1 (en) * 2001-11-07 2003-05-08 Medical Metrics, Inc. Method, computer software, and system for tracking, stabilizing, and reporting motion between vertebrae
DK1519681T3 (da) * 2002-07-09 2007-04-10 Aecc Entpr Ltd Fremgangsmåde til billeddannelse af den relative bevægelse af skeletstykker
US7423280B2 (en) * 2004-08-09 2008-09-09 Quad/Tech, Inc. Web inspection module including contact image sensors
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) * 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
US8676293B2 (en) * 2006-04-13 2014-03-18 Aecc Enterprises Ltd. Devices, systems and methods for measuring and evaluating the motion and function of joint structures and associated muscles, determining suitability for orthopedic intervention, and evaluating efficacy of orthopedic intervention
US7792336B2 (en) * 2006-08-16 2010-09-07 International Business Machines Corporation Signature capture aesthetic/temporal qualification failure detection
US20090099481A1 (en) 2007-10-10 2009-04-16 Adam Deitz Devices, Systems and Methods for Measuring and Evaluating the Motion and Function of Joints and Associated Muscles
US9138163B2 (en) 2009-09-25 2015-09-22 Ortho Kinematics, Inc. Systems and devices for an integrated imaging system with real-time feedback loop and methods therefor
EP3649937A1 (de) 2010-12-13 2020-05-13 Statera Spine, Inc. Verfahren, systeme und vorrichtungen zur berichterstattung über klinische daten und für chirurgische navigation
JP6350204B2 (ja) * 2014-10-21 2018-07-04 株式会社ニューフレアテクノロジー 描画データ検証方法、プログラム、及びマルチ荷電粒子ビーム描画装置
US9430457B2 (en) * 2014-12-24 2016-08-30 Xerox Corporation Ambiguity reduction for image alignment applications
US20160354161A1 (en) 2015-06-05 2016-12-08 Ortho Kinematics, Inc. Methods for data processing for intra-operative navigation systems
US11216936B2 (en) 2016-02-19 2022-01-04 SCREEN Holdings Co., Ltd. Defect detection device, defect detection method, and program
JP6732518B2 (ja) * 2016-04-27 2020-07-29 キヤノン株式会社 画像処理装置および画像処理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313840A (en) * 1976-07-23 1978-02-07 Hitachi Ltd Analogy calculator
DE3380997D1 (de) * 1982-08-31 1990-01-25 Dainippon Printing Co Ltd Verfahren zur bilduntersuchung.
JPH0625657B2 (ja) * 1983-06-16 1994-04-06 大日本印刷株式会社 印刷物の絵柄検査方法および装置
JPS59157505A (ja) * 1983-02-28 1984-09-06 Hitachi Ltd パタ−ン検査装置
US4614430A (en) * 1983-04-28 1986-09-30 Hitachi Ltd. Method of detecting pattern defect and its apparatus
US4579455A (en) * 1983-05-09 1986-04-01 Kla Instruments Corporation Photomask inspection apparatus and method with improved defect detection
JPS601505A (ja) * 1983-06-20 1985-01-07 Hitachi Ltd パタ−ン検査装置
US4641350A (en) * 1984-05-17 1987-02-03 Bunn Robert F Fingerprint identification system
US4648053A (en) * 1984-10-30 1987-03-03 Kollmorgen Technologies, Corp. High speed optical inspection system
US4805123B1 (en) * 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems

Also Published As

Publication number Publication date
EP0225651A2 (de) 1987-06-16
KR910007789B1 (ko) 1991-10-02
DE3687220T2 (de) 1993-07-01
US4803734A (en) 1989-02-07
EP0225651A3 (en) 1990-01-10
JPH0621769B2 (ja) 1994-03-23
JPS62140009A (ja) 1987-06-23
EP0225651B1 (de) 1992-12-02
KR870006621A (ko) 1987-07-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee