DE3681112D1 - Plasmaaetzverfahren zur herstellung von metall-halbleiter-kontakte des ohmischen typs. - Google Patents
Plasmaaetzverfahren zur herstellung von metall-halbleiter-kontakte des ohmischen typs.Info
- Publication number
- DE3681112D1 DE3681112D1 DE8686830254T DE3681112T DE3681112D1 DE 3681112 D1 DE3681112 D1 DE 3681112D1 DE 8686830254 T DE8686830254 T DE 8686830254T DE 3681112 T DE3681112 T DE 3681112T DE 3681112 D1 DE3681112 D1 DE 3681112D1
- Authority
- DE
- Germany
- Prior art keywords
- plasma etching
- etching method
- producing metal
- metal semiconductor
- semiconductor contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76804—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics by forming tapered via holes
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT22468/85A IT1200785B (it) | 1985-10-14 | 1985-10-14 | Migliorato procedimento di attaco in plasma (rie) per realizzare contatti metallo-semiconduttore di tipo ohmico |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3681112D1 true DE3681112D1 (de) | 1991-10-02 |
Family
ID=11196692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686830254T Expired - Fee Related DE3681112D1 (de) | 1985-10-14 | 1986-09-15 | Plasmaaetzverfahren zur herstellung von metall-halbleiter-kontakte des ohmischen typs. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4806199A (de) |
EP (1) | EP0219465B1 (de) |
JP (1) | JPH0821575B2 (de) |
DE (1) | DE3681112D1 (de) |
IT (1) | IT1200785B (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1201840B (it) * | 1986-08-28 | 1989-02-02 | Sgs Microelettronica Spa | Procedimento per realizzare contatti ohmici metallo-semiconduttore |
JPH0770523B2 (ja) * | 1987-05-19 | 1995-07-31 | 日本電気株式会社 | 半導体装置の製造方法 |
KR910008983B1 (ko) * | 1988-12-20 | 1991-10-26 | 현대전자산업 주식회사 | 비등방성 식각을 이용한 잔유물 제거방법 |
US5034091A (en) * | 1990-04-27 | 1991-07-23 | Hughes Aircraft Company | Method of forming an electrical via structure |
JP3185150B2 (ja) * | 1991-03-15 | 2001-07-09 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置の製造方法 |
US5312717A (en) * | 1992-09-24 | 1994-05-17 | International Business Machines Corporation | Residue free vertical pattern transfer with top surface imaging resists |
DE4339465C2 (de) * | 1993-11-19 | 1997-05-28 | Gold Star Electronics | Verfahren zur Behandlung der Oberfläche eines einer Trockenätzung ausgesetzten Siliciumsubstrats |
US5750441A (en) * | 1996-05-20 | 1998-05-12 | Micron Technology, Inc. | Mask having a tapered profile used during the formation of a semiconductor device |
US5893757A (en) * | 1997-01-13 | 1999-04-13 | Applied Komatsu Technology, Inc. | Tapered profile etching method |
US6117791A (en) | 1998-06-22 | 2000-09-12 | Micron Technology, Inc. | Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby |
US7173339B1 (en) | 1998-06-22 | 2007-02-06 | Micron Technology, Inc. | Semiconductor device having a substrate an undoped silicon oxide structure and an overlaying doped silicon oxide structure with a sidewall terminating at the undoped silicon oxide structure |
US6875371B1 (en) | 1998-06-22 | 2005-04-05 | Micron Technology, Inc. | Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby |
US6281142B1 (en) * | 1999-06-04 | 2001-08-28 | Micron Technology, Inc. | Dielectric cure for reducing oxygen vacancies |
JP4896367B2 (ja) * | 2003-10-23 | 2012-03-14 | パナソニック株式会社 | 電子部品の処理方法及び装置 |
WO2013092759A2 (en) * | 2011-12-21 | 2013-06-27 | Solvay Sa | Method for etching of sio2 layers on thin wafers |
CN103779271B (zh) * | 2012-10-26 | 2017-04-05 | 中微半导体设备(上海)有限公司 | 一种倒锥形轮廓刻蚀方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4268374A (en) * | 1979-08-09 | 1981-05-19 | Bell Telephone Laboratories, Incorporated | High capacity sputter-etching apparatus |
EP0040081B1 (de) * | 1980-05-12 | 1984-09-12 | Fujitsu Limited | Verfahren und Vorrichtung zum Plasma-Ätzen |
JPS56158873A (en) * | 1980-05-14 | 1981-12-07 | Hitachi Ltd | Dry etching method |
DE3103177A1 (de) * | 1981-01-30 | 1982-08-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von polysiliziumstrukturen bis in den 1 (my)m-bereich auf integrierte halbleiterschaltungen enthaltenden substraten durch plasmaaetzen |
US4599243A (en) * | 1982-12-23 | 1986-07-08 | International Business Machines Corporation | Use of plasma polymerized organosilicon films in fabrication of lift-off masks |
US4534826A (en) * | 1983-12-29 | 1985-08-13 | Ibm Corporation | Trench etch process for dielectric isolation |
US4484979A (en) * | 1984-04-16 | 1984-11-27 | At&T Bell Laboratories | Two-step anisotropic etching process for patterning a layer without penetrating through an underlying thinner layer |
US4528066A (en) * | 1984-07-06 | 1985-07-09 | Ibm Corporation | Selective anisotropic reactive ion etching process for polysilicide composite structures |
US4582581A (en) * | 1985-05-09 | 1986-04-15 | Allied Corporation | Boron trifluoride system for plasma etching of silicon dioxide |
US4631248A (en) * | 1985-06-21 | 1986-12-23 | Lsi Logic Corporation | Method for forming an electrical contact in an integrated circuit |
US4687543A (en) * | 1986-02-21 | 1987-08-18 | Tegal Corporation | Selective plasma etching during formation of integrated circuitry |
-
1985
- 1985-10-14 IT IT22468/85A patent/IT1200785B/it active
-
1986
- 1986-09-15 US US06/907,342 patent/US4806199A/en not_active Expired - Lifetime
- 1986-09-15 EP EP86830254A patent/EP0219465B1/de not_active Expired
- 1986-09-15 DE DE8686830254T patent/DE3681112D1/de not_active Expired - Fee Related
- 1986-10-14 JP JP61245142A patent/JPH0821575B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0219465A3 (en) | 1988-03-30 |
EP0219465B1 (de) | 1991-08-28 |
IT1200785B (it) | 1989-01-27 |
IT8522468A0 (it) | 1985-10-14 |
EP0219465A2 (de) | 1987-04-22 |
JPS6289333A (ja) | 1987-04-23 |
JPH0821575B2 (ja) | 1996-03-04 |
US4806199A (en) | 1989-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |