DE3587830D1 - Apparat zur Herstellung von Halbleiteranordnungen. - Google Patents
Apparat zur Herstellung von Halbleiteranordnungen.Info
- Publication number
- DE3587830D1 DE3587830D1 DE3587830T DE3587830T DE3587830D1 DE 3587830 D1 DE3587830 D1 DE 3587830D1 DE 3587830 T DE3587830 T DE 3587830T DE 3587830 T DE3587830 T DE 3587830T DE 3587830 D1 DE3587830 D1 DE 3587830D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor devices
- manufacturing semiconductor
- manufacturing
- devices
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25358584A JPS61133386A (ja) | 1984-11-30 | 1984-11-30 | プラズマエツチング装置 |
JP25358184A JPS61131532A (ja) | 1984-11-30 | 1984-11-30 | シ−ト状材料の熱処理装置 |
JP25358984A JPS61131522A (ja) | 1984-11-30 | 1984-11-30 | 半導体処理装置 |
JP25359184A JPS61133388A (ja) | 1984-11-30 | 1984-11-30 | ドライエツチング装置 |
JP25358284A JPS61133314A (ja) | 1984-11-30 | 1984-11-30 | 熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3587830D1 true DE3587830D1 (de) | 1994-06-23 |
DE3587830T2 DE3587830T2 (de) | 1994-09-22 |
Family
ID=27530261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3587830T Expired - Lifetime DE3587830T2 (de) | 1984-11-30 | 1985-11-29 | Apparat zur Herstellung von Halbleiteranordnungen. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4693777A (de) |
EP (1) | EP0187249B1 (de) |
DE (1) | DE3587830T2 (de) |
Families Citing this family (131)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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IT1185964B (it) * | 1985-10-01 | 1987-11-18 | Sgs Microelettronica Spa | Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico |
EP0265517A1 (de) * | 1986-05-16 | 1988-05-04 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Fördervorrichtung für gegenstände |
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JPS6362233A (ja) * | 1986-09-03 | 1988-03-18 | Mitsubishi Electric Corp | 反応性イオンエツチング装置 |
FR2610450A1 (fr) * | 1987-01-29 | 1988-08-05 | France Etat | Dispositif de traitement thermique de plaquettes semi-conductrices |
JPS63204726A (ja) * | 1987-02-20 | 1988-08-24 | Anelva Corp | 真空処理装置 |
US4786616A (en) * | 1987-06-12 | 1988-11-22 | American Telephone And Telegraph Company | Method for heteroepitaxial growth using multiple MBE chambers |
JPS6419198A (en) * | 1987-07-15 | 1989-01-23 | Hitachi Ltd | Vacuum pump |
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JP2768685B2 (ja) * | 1988-03-28 | 1998-06-25 | 株式会社東芝 | 半導体装置の製造方法及びその装置 |
DE3814924A1 (de) * | 1988-05-03 | 1989-11-16 | Leybold Ag | Vorrichtung zum ein- und ausschleusen von substraten aus einem vakuumkessel |
ES2163388T3 (es) * | 1988-05-24 | 2002-02-01 | Unaxis Balzers Ag | Instalacion de vacio. |
US5235995A (en) * | 1989-03-27 | 1993-08-17 | Semitool, Inc. | Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization |
US4911810A (en) * | 1988-06-21 | 1990-03-27 | Brown University | Modular sputtering apparatus |
US4869198A (en) * | 1988-09-30 | 1989-09-26 | Union Tool Corporation | Vacuum debubbler machine |
US5019233A (en) * | 1988-10-31 | 1991-05-28 | Eaton Corporation | Sputtering system |
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JP2528962B2 (ja) * | 1989-02-27 | 1996-08-28 | 株式会社日立製作所 | 試料処理方法及び装置 |
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US5868854A (en) * | 1989-02-27 | 1999-02-09 | Hitachi, Ltd. | Method and apparatus for processing samples |
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US5288333A (en) * | 1989-05-06 | 1994-02-22 | Dainippon Screen Mfg. Co., Ltd. | Wafer cleaning method and apparatus therefore |
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US4376581A (en) * | 1979-12-20 | 1983-03-15 | Censor Patent- Und Versuchs-Anstalt | Method of positioning disk-shaped workpieces, preferably semiconductor wafers |
JPS5713743A (en) * | 1980-06-30 | 1982-01-23 | Toshiba Corp | Plasma etching apparatus and etching method |
JPS5723228A (en) * | 1980-07-16 | 1982-02-06 | Mitsubishi Electric Corp | Dry etching device |
JPS5747876A (en) * | 1980-09-03 | 1982-03-18 | Toshiba Corp | Plasma etching apparatus and method |
JPS5856336A (ja) * | 1981-09-29 | 1983-04-04 | Nec Corp | 複合ドライエツチング装置 |
JPS58101478A (ja) * | 1981-12-12 | 1983-06-16 | Toshiba Corp | 多結晶シリコン太陽電池の製造方法 |
JPS58196063A (ja) * | 1982-05-10 | 1983-11-15 | Matsushita Electric Ind Co Ltd | 光起電力素子の製造方法 |
EP0113983B1 (de) * | 1982-12-16 | 1987-04-22 | Fujitsu Limited | Herstellung eines Halbleiterbauelements mittels Molekularstrahlepitaxie |
JPS59123226A (ja) * | 1982-12-28 | 1984-07-17 | Fujitsu Ltd | 半導体装置の製造装置 |
JPS59186326A (ja) * | 1983-04-06 | 1984-10-23 | Hitachi Ltd | プラズマ処理装置 |
-
1985
- 1985-11-27 US US06/802,468 patent/US4693777A/en not_active Expired - Lifetime
- 1985-11-29 DE DE3587830T patent/DE3587830T2/de not_active Expired - Lifetime
- 1985-11-29 EP EP85115144A patent/EP0187249B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0187249A3 (en) | 1989-03-29 |
EP0187249A2 (de) | 1986-07-16 |
DE3587830T2 (de) | 1994-09-22 |
EP0187249B1 (de) | 1994-05-18 |
US4693777A (en) | 1987-09-15 |
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