DE3587732T2 - Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen. - Google Patents
Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen.Info
- Publication number
- DE3587732T2 DE3587732T2 DE3587732T DE3587732T DE3587732T2 DE 3587732 T2 DE3587732 T2 DE 3587732T2 DE 3587732 T DE3587732 T DE 3587732T DE 3587732 T DE3587732 T DE 3587732T DE 3587732 T2 DE3587732 T2 DE 3587732T2
- Authority
- DE
- Germany
- Prior art keywords
- components
- control data
- numerical control
- preparing numerical
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31047—Display image of finished workpiece on screen, show how, where to mount next part
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31068—Relative positioning of assembled parts with small geometric deviations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60032875A JPH0668696B2 (ja) | 1985-02-22 | 1985-02-22 | 挿入機用ncデータ作成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3587732D1 DE3587732D1 (de) | 1994-03-03 |
DE3587732T2 true DE3587732T2 (de) | 1994-05-19 |
Family
ID=12371047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3587732T Expired - Fee Related DE3587732T2 (de) | 1985-02-22 | 1985-10-14 | Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4706187A (de) |
EP (1) | EP0192822B1 (de) |
JP (1) | JPH0668696B2 (de) |
KR (1) | KR900004251B1 (de) |
DE (1) | DE3587732T2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62144392A (ja) * | 1985-12-19 | 1987-06-27 | ティーディーケイ株式会社 | 電子部品実装方法 |
AU7728187A (en) * | 1986-09-12 | 1988-03-17 | Digital Equipment Corporation | Cad of logic circuits: rule structure for inserting new elements |
JPH0833764B2 (ja) * | 1987-02-19 | 1996-03-29 | 横河電機株式会社 | Nc実装機の実装経路の決定方法 |
JPH0734165B2 (ja) * | 1987-04-07 | 1995-04-12 | 株式会社日立製作所 | プリント板組立ncデータ編集方法 |
JP2695798B2 (ja) * | 1987-10-14 | 1998-01-14 | 株式会社日立製作所 | 面付混載基板用ncデータ作成方法 |
US4924419A (en) * | 1988-05-24 | 1990-05-08 | Eastman Kodak Company | System and a method for detecting a malfunction in the operation of a parts assembly machine |
JP2776860B2 (ja) * | 1989-01-11 | 1998-07-16 | 株式会社日立製作所 | 電子部品装着装置及び装着方法 |
US5313401A (en) * | 1989-07-17 | 1994-05-17 | Canon Kabushiki Kaisha | Mounting system including a plurality of hand mechanisms for picking up, moving and mounting works on an object board |
JPH03100807A (ja) * | 1989-09-14 | 1991-04-25 | Hitachi Ltd | 対話型実装機ncデータ作成装置 |
DE3936079A1 (de) * | 1989-10-30 | 1991-05-02 | Truetzschler & Co | Verfahren und vorrichtung zum oeffnen von ballen aus fasermaterial, z. b. baumwolle, chemiefasern u. dgl. |
JP2619540B2 (ja) * | 1989-11-07 | 1997-06-11 | 富士通株式会社 | 自動組立機の部品実装順序決定処理方法 |
JP3092809B2 (ja) * | 1989-12-21 | 2000-09-25 | 株式会社日立製作所 | 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置 |
US5258915A (en) * | 1990-09-28 | 1993-11-02 | Hewlett-Packard Company | System and method for optimum operation assignments in printed circuit board manufacturing |
US5170554A (en) * | 1990-09-28 | 1992-12-15 | Hewlett-Packard Company | High mix printed circuit assembly technique |
JPH05304396A (ja) * | 1991-07-12 | 1993-11-16 | Canon Inc | 部品の実装順序の決定方法及びその装置 |
JP2974183B2 (ja) * | 1991-11-07 | 1999-11-08 | オークマ株式会社 | 数値制御工作機械における干渉チェック装置 |
US5339248A (en) * | 1992-08-27 | 1994-08-16 | Matsushita Electric Industrial Co., Ltd. | Apparatus for mounting electronic component on substrate |
US5283943A (en) * | 1992-08-31 | 1994-02-08 | Kermit Aguayo | Automated assembly apparatus |
DE19502434A1 (de) * | 1994-04-29 | 1995-11-02 | Hewlett Packard Co | System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen |
JP3449789B2 (ja) * | 1994-07-14 | 2003-09-22 | 松下電器産業株式会社 | 部品実装方法 |
US5933349A (en) * | 1995-12-29 | 1999-08-03 | Compaq Computer Corporation | Component placement |
KR980007918A (ko) * | 1996-06-29 | 1998-03-30 | 배순훈 | 자삽 경로 작성장치 및 그 자삽 경로생성 방법 |
MX9709038A (es) * | 1996-11-25 | 1998-08-30 | Samsung Electronics Co Ltd | Sistema y metodo de produccion de montajes de tableros de circuitos impresos. |
KR19980039100A (ko) * | 1996-11-27 | 1998-08-17 | 배순훈 | 부품의 클린칭 방향을 이용한 미삽 검사장치 및 방법 |
JP3422645B2 (ja) * | 1997-02-14 | 2003-06-30 | 富士通株式会社 | 回路素子配置装置 |
KR100287822B1 (ko) * | 1998-06-27 | 2001-04-16 | 전주범 | 부품 삽입기를 위한 자동 경로 생성 옵션의 설정방법 |
US6729018B1 (en) | 1999-09-03 | 2004-05-04 | Matsushita Electric Industrial Co., Ltd. | Apparatus for mounting components |
JP3609315B2 (ja) * | 2000-02-28 | 2005-01-12 | 富士通株式会社 | プリント配線板の製造データ作成システム、及びプリント配線板の製造システム |
EP1350419B1 (de) * | 2000-08-04 | 2013-02-20 | Panasonic Corporation | Verfahren zur optimierung der bestückungsfolge, vorichtung dafür und bestücker |
US6718630B2 (en) * | 2000-09-18 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting components on substrate |
EP1898326A4 (de) * | 2005-06-24 | 2009-07-29 | Fujitsu Ltd | Verfahren, programm und system zur unterstützung der entwicklung von bauelementen |
US8229778B2 (en) * | 2006-11-16 | 2012-07-24 | International Business Machines Corporation | Constructing change plans from component interactions |
US9008836B2 (en) * | 2007-01-09 | 2015-04-14 | Abb Inc. | Method and system for robotic assembly parameter optimization |
DE102007046434A1 (de) * | 2007-09-28 | 2008-12-04 | Siemens Ag | Verfahren zur Ermittlung einer optimalen Reihenfolge beim Bestücken von Substraten mit Bauelementen |
JP2009124019A (ja) * | 2007-11-16 | 2009-06-04 | Fujitsu Ltd | 基板ユニットの製造方法及びマウンタ装置 |
US10542650B2 (en) * | 2013-09-02 | 2020-01-21 | Fuji Corporation | Data processing device providing status information to be used by board working machine |
EP3439449B1 (de) | 2016-03-29 | 2021-06-30 | Fuji Corporation | Betriebsüberprüfungsvorrichtung einer maschine zur montage elektronischer komponenten |
US10657297B2 (en) * | 2018-06-01 | 2020-05-19 | Mentor Graphics Corporation | Part number consolidation in printed circuit board assembly design |
JP7393257B2 (ja) * | 2020-03-10 | 2023-12-06 | ヤマハ発動機株式会社 | 干渉確認装置及びそれを備えた実装機 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58112387A (ja) * | 1981-12-26 | 1983-07-04 | 池上通信機株式会社 | 電子部品のプリント基板への自動插入装置 |
JPS58163001A (ja) * | 1982-03-23 | 1983-09-27 | Toyoda Mach Works Ltd | 干渉チエツク機能を備えた数値制御装置 |
JPS58186548A (ja) * | 1982-04-21 | 1983-10-31 | Toyoda Mach Works Ltd | 自動プログラミング機能を備えた数値制御装置 |
JPS5936810A (ja) * | 1982-08-24 | 1984-02-29 | Mitsubishi Electric Corp | 数値制御加工機械の加工情報監視方法 |
JPS59216208A (ja) * | 1983-05-23 | 1984-12-06 | Mitsubishi Electric Corp | 数値制御装置 |
-
1985
- 1985-02-22 JP JP60032875A patent/JPH0668696B2/ja not_active Expired - Lifetime
- 1985-10-14 DE DE3587732T patent/DE3587732T2/de not_active Expired - Fee Related
- 1985-10-14 EP EP85113005A patent/EP0192822B1/de not_active Expired - Lifetime
- 1985-10-16 US US06/787,928 patent/US4706187A/en not_active Expired - Lifetime
- 1985-10-31 KR KR1019850008088A patent/KR900004251B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3587732D1 (de) | 1994-03-03 |
KR860006725A (ko) | 1986-09-13 |
EP0192822B1 (de) | 1994-01-19 |
JPS61194507A (ja) | 1986-08-28 |
US4706187A (en) | 1987-11-10 |
KR900004251B1 (ko) | 1990-06-18 |
EP0192822A3 (en) | 1989-04-26 |
JPH0668696B2 (ja) | 1994-08-31 |
EP0192822A2 (de) | 1986-09-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3587732T2 (de) | Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen. | |
DE3672059D1 (de) | Verfahren zum komprimieren von zwei-pegeldaten. | |
DE3481453D1 (de) | Verfahren zur platzierung von elementen. | |
DE3680824D1 (de) | Verfahren zum erzeugen von graphit. | |
DE3581428D1 (de) | Verfahren zum ueberziehen von arzneiformen. | |
DE3680281D1 (de) | Verfahren zum verbinden von silikonbeschichtetem gewebe. | |
DE3687982D1 (de) | Verfahren zur herstellung von numerischen regelungsdaten. | |
DE3673102D1 (de) | Verfahren zum stabilisieren von organopolysiloxanen. | |
DE3582856D1 (de) | Verfahren zum manipulieren von fluessigkeiten. | |
DE3586154D1 (de) | Verbessertes verfahren zur immunofixierungselektrophorese. | |
DE3771670D1 (de) | Verfahren zum entschleimen von triglyceridoelen. | |
DE3767747D1 (de) | Verfahren zum bestimmen von abmessungen. | |
DE3578942D1 (de) | Verfahren zum haerten von gelatine. | |
DE3688517D1 (de) | Anpassungsfaehiges verfahren zum komprimieren von zeichendaten. | |
DE3854230T2 (de) | Datenvorbereitungsverfahren für numerisches steuerverfahren. | |
DE3761556D1 (de) | Verfahren zum aufwickeln von faeden. | |
DE3861647D1 (de) | Verfahren zum konditionieren von schlamm. | |
DE3577113D1 (de) | Verfahren zum auswechsein von brueckenlagern. | |
DE3575437D1 (de) | Verfahren zur reinigung von farbstoffen. | |
DE3771176D1 (de) | Verfahren zum zusammenbauen von teilen. | |
DE3673060D1 (de) | Verfahren zur rueckgewinnung von fluorwasserstoff. | |
DE3674711D1 (de) | Verfahren zum entwaessern von braunkohle. | |
DE3766635D1 (de) | Verfahren zum praegen von filmen. | |
KR880700711A (ko) | Nc 데이터 작성 방법 | |
DE3586824D1 (de) | Verfahren zur vorbereitung von numerischen daten. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |