DE3575239D1 - Leiterrahmen und elektronische vorrichtung mit dessen verwendung. - Google Patents

Leiterrahmen und elektronische vorrichtung mit dessen verwendung.

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Publication number
DE3575239D1
DE3575239D1 DE8585109305T DE3575239T DE3575239D1 DE 3575239 D1 DE3575239 D1 DE 3575239D1 DE 8585109305 T DE8585109305 T DE 8585109305T DE 3575239 T DE3575239 T DE 3575239T DE 3575239 D1 DE3575239 D1 DE 3575239D1
Authority
DE
Germany
Prior art keywords
electronic device
ladder frame
ladder
frame
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585109305T
Other languages
English (en)
Inventor
Ichio Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3575239D1 publication Critical patent/DE3575239D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00Cores, Yokes, or armatures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00Magnets
    • H01F7/06Electromagnets; Actuators including electromagnets
    • H01F7/08Electromagnets; Actuators including electromagnets with armatures
    • H01F7/16Rectilinearly-movable armatures
    • H01F7/1607Armatures entering the winding
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49544Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
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DE8585109305T 1984-07-25 1985-07-24 Leiterrahmen und elektronische vorrichtung mit dessen verwendung. Expired - Lifetime DE3575239D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15288484A JPS6132452A (ja) 1984-07-25 1984-07-25 リ−ドフレ−ムとそれを用いた電子装置

Publications (1)

Publication Number Publication Date
DE3575239D1 true DE3575239D1 (de) 1990-02-08

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DE8585109305T Expired - Lifetime DE3575239D1 (de) 1984-07-25 1985-07-24 Leiterrahmen und elektronische vorrichtung mit dessen verwendung.

Country Status (8)

Country Link
US (3) US4797787A (de)
EP (1) EP0173847B1 (de)
JP (1) JPS6132452A (de)
KR (1) KR930011455B1 (de)
DE (1) DE3575239D1 (de)
HK (1) HK107291A (de)
MY (1) MY101858A (de)
SG (1) SG97491G (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132452A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd リ−ドフレ−ムとそれを用いた電子装置
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Publication number Publication date
US5121300A (en) 1992-06-09
US4797787A (en) 1989-01-10
EP0173847B1 (de) 1990-01-03
SG97491G (en) 1992-01-17
HK107291A (en) 1992-01-03
US4907129A (en) 1990-03-06
KR860001478A (ko) 1986-02-26
KR930011455B1 (ko) 1993-12-08
EP0173847A1 (de) 1986-03-12
MY101858A (en) 1992-01-31
JPS6132452A (ja) 1986-02-15

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