DE3536431A1 - Soldering of surface mounted devices (SMDs) - Google Patents

Soldering of surface mounted devices (SMDs)

Info

Publication number
DE3536431A1
DE3536431A1 DE19853536431 DE3536431A DE3536431A1 DE 3536431 A1 DE3536431 A1 DE 3536431A1 DE 19853536431 DE19853536431 DE 19853536431 DE 3536431 A DE3536431 A DE 3536431A DE 3536431 A1 DE3536431 A1 DE 3536431A1
Authority
DE
Germany
Prior art keywords
omb
connections
spacer
circuit board
smd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19853536431
Other languages
German (de)
Inventor
Stauros Dr Smernos
Matjaz Dr Florjancic
Otto Thaidigsmann
Kurt Theil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19853536431 priority Critical patent/DE3536431A1/en
Publication of DE3536431A1 publication Critical patent/DE3536431A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

In order to improve the functional reliability of solder points (7) between the connections of a surface mounted device, referred to as an SMD (3) for short, such as a chip mounting board consisting of ceramic, and the connections of a printed circuit board (1), consisting of glass-epoxy for example, the SMD (3) is initially firmly connected to a spacer (2) which is in the form of a platelet and whose material has a higher coefficient of expansion than the SMD (3). This arrangement, which consists of an SMD (3) and a spacer (2), is subsequently fixed on the circuit board (1) such that the connections of the SMD (3) are located above those on the circuit board (1). The electrical connection between the connections is produced by subsequent soldering. The spacer (2) results in greater solder point heights being achieved, which have an elastic behaviour in response to shear forces. <IMAGE>

Description

Die Erfindung betrifft ein Verfahren der im Oberbegriff des Patentanspruchs 1 bezeichneten Art.The invention relates to a method in the preamble of claim 1 designated Art.

Im Handel sind oberflächenmontierbare elektrische Bauele­ mente, kurz OMB genannt, erhältlich, die sowohl als passive wie als aktive Bauelemente ausgebildet sein können und deren Anschlüsse durch Löten unmittelbar mit entsprechenden Anschlußflächen auf gedruckten Schaltungs­ platten verbunden werden. Da die Basismaterialien der üb­ licherweise verwendeten Schaltungsplatten und die Werk­ stoffe der OMB-Träger oder -Gehäuse im allgemeinen unter­ schiedliche thermische Ausdehnungskoeffizienten auf­ weisen, sind die Lötstellen bei Temperaturwechseln mecha­ nischen Spannungen ausgesetzt. Bei OMB's mit relativ kleiner Grundfläche und kurzen Längenabmessungen, z.B. MELFs (Metal Electrode Face Bonding), halten sich die mechanischen Belastungen der Lötstellen in Grenzen, in­ nerhalb derer die Funktionssicherheit der Lötverbindungen gewährleistet bleibt. Surface-mountable electrical components are commercially available mente, OMB for short, available both as be designed as passive as active components can and their connections by soldering directly with corresponding pads on printed circuit plates are connected. Since the base materials of the usual Licher circuit boards and the factory used substances of the OMB carrier or housing in general different coefficients of thermal expansion point, the soldering points are mecha when the temperature changes exposed to African tensions. At OMB's with relative small footprint and short length dimensions, e.g. MELFs (Metal Electrode Face Bonding), keep the mechanical loads on the solder joints within limits within which the functional reliability of the soldered connections remains guaranteed.  

Bei Bauelementen mit relativ großer Grundfläche, wie bei­ spielsweise Chipträgern, die übliche Kantenlängen von je­ weils mehreren Zentimetern haben, liegen die Verhältnisse anders. Sie sind zwar für eine Oberflächenmontage geeig­ net, können aber nur dann relativ problemlos gelötet wer­ den, wenn der Chipträger und die gedruckte Schaltungs­ platte, mit welcher der Chipträger durch Löten verbunden werden soll, aus identischem oder solchen Materialien be­ stehen, die einen nur geringfügig voneinander abweichen­ den thermischen Ausdehnungskoeffizienten aufweisen. Diese Materialkombination wird aus verschiedenen Gründen jedoch relativ selten verwendet.For components with a relatively large footprint, such as for example, chip carriers, the usual edge lengths of each because there are several centimeters, the conditions are different. They are suitable for surface mounting net, but can only relatively easily soldered who when the chip carrier and the printed circuit plate with which the chip carrier is connected by soldering should be made of identical or such materials stand that differ only slightly from each other have the coefficient of thermal expansion. These Material combination is used for various reasons used relatively rarely.

Häufig handelt es sich bei den Chipträgern um Keramik­ platten mit relativ niedrigem Ausdehnungskoeffizienten und bei den gedruckten Schaltungsplatten um Basismate­ rialien mit erheblich höheren Ausdehnungskoeffizienten. Bisherige Untersuchungen der Zuverlässigkeit der Löt­ stellen von LCCC (Leadless Ceramic Chip Carrier) auf kon­ ventionellem Epoxi-Glas Basismaterial haben gezeigt, daß die Lötverbindungen bereits nach wenigen Temperaturzyklen (z.B. nach MIL 883b -55°C -+125°C) versagen und da­ mit zu elektrischen Unterbrechungen führen. Die Ursache hierfür ist in den Scherspannungen zu sehen, welche auf­ grund der Unterschiede im Ausdehnungskoeffizienten der LCCC und des Epoxi-Glas Materials an den Lötverbindungen erzeugt werden.The chip carriers are often ceramic plates with a relatively low coefficient of expansion and for printed circuit boards around base mate materials with significantly higher expansion coefficients. Previous investigations of the reliability of the solder change from LCCC (Leadless Ceramic Chip Carrier) to con conventional epoxy glass base material have shown that the solder connections after just a few temperature cycles (e.g. according to MIL 883b -55 ° C - + 125 ° C) fail and there lead to electrical interruptions. The cause this can be seen in the shear stresses, which on due to the differences in the expansion coefficient of the LCCC and the epoxy glass material on the solder joints be generated.

Dies führte in der Vergangenheit zu verschiedenen Lösungsansätzen und Entwicklungen, mit welchen die Zu­ verlässigkeit der Lötverbindungen erhöht werden sollte. Dazu gehören: This has led to several in the past Approaches and developments with which the Zu reliability of the solder connections should be increased. This includes:  

Entwicklung neuer Basismaterialien mit thermischen Aus­ dehnungskoeffizienten, welche denjenigen der keramischen Chipträger angepaßt sind (z.B. Cu-Inv-Cu mit Dielek­ trikum).Development of new base materials with thermal break expansion coefficients, which those of the ceramic Chip carriers are adapted (e.g. Cu-Inv-Cu with Dielek trikum).

Epoxi-Glas Material mit Elastomerbeschichtung, welche die Scherspannungen verringern soll (EP 00 64 854).Epoxy glass material with elastomer coating, which the Shear stresses should reduce (EP 00 64 854).

Geänderte Bauelementegehäuse mit J-Anschlüssen zur Er­ höhung der mechanischen Nachgiebigkeit der Anschlüsse.Modified component housing with J connections to the Er increase the mechanical flexibility of the connections.

Eine weitere Möglichkeit ist die Verwendung besonderer Verbindungselemente, welche die in X-, Y- und Z-Richtung auftretenden Kräfte kompensieren. Ein solches Verbin­ dungselement für Chipträger ist aus der DE-PS 31 48 018 bekannt. Es besteht aus einem Isolierstoffrahmen mit auf Ober- und Unterseite hervorstehenden dünnen Drahtan­ schlüssen, die einerseits mit den Anschlüssen des Chip­ trägers und andererseits mit denen der gedruckten Schal­ tungsplatte durch Löten verbunden werden, wobei die An­ schlüsse der Leiterbahnen ein dem Anordnungsschema der Drahtanschlüsse entsprechendes Lochraster enthalten, in das die Drahtanschlüsse vor dem Löten eingesteckt werden.Another possibility is the use of special connecting elements that compensate for the forces occurring in the X, Y and Z directions. Such a connec tion element for chip carriers is known from DE-PS 31 48 018. It consists of an insulating frame with thin wire connections protruding on the top and bottom, which are connected on the one hand to the connections of the chip carrier and on the other hand to those of the printed circuit board by soldering, with the connections of the conductor tracks having a hole pattern corresponding to the arrangement of the wire connections included, into which the wire connections are inserted before soldering.

Der Erfindung liegt die Aufgabe zugrunde, ein einfaches und kostengünstiges Verfahren anzugeben, mit dem die An­ schlüsse insbesondere von relativ große Grundflächen auf­ weisenden OMB's unmittelbar mit den Anschlüssen von ge­ druckten Schaltungsplatten dauerhaft verbunden werden können. Diese Aufgabe wird erfindungsgemäß durch An­ wendung der im Kennzeichen des Patentanspruchs 1 angege­ benen Verfahrensschritte gelöst. Vorteilhafte Verfahrens­ schritte sind den Unteransprüchen zu entnehmen. Mit der Erfindung erzielbare Vorteile sind in der nachfolgenden Beschreibung angegeben. The invention has for its object a simple and inexpensive procedure with which the An open up in particular from relatively large footprints directing OMBs directly with the connections from ge printed circuit boards can be permanently connected can. This object is achieved by An application of the indicated in the characterizing part of patent claim 1 resolved process steps. Advantageous procedure steps can be found in the subclaims. With the Advantages achievable in the invention are as follows Description given.  

Aus der Zeitschrift Electronic Packaging and Production, (1984), Seite 122, sind zwar verschiedene Verfahren zur Einstellung definierter Lotspalthöhen bekannt. In dem Artikel "SMT-Forces Solder Paste Improvements" erwähnt T.Dixon in diesem Zusammenhang Lotperlen aus Pb oder einer Lotlegierung (5 % Sn/95% Pb) bzw. Keramikperlen, die den Lotpasten beigemengt werden. Ferner ist es be­ kannt, die Lotspalthöhe mittels sogenannter Preforms aus Lotlegierungen wie Sn oder Pb oder durch entsprechenden Kleberauftrag zu beeinflussen. Diese Verfahren eignen sich jedoch nicht für Lötstellenhöhen 100 µm, wie sie für das Löten von z.B. LCCC's erforderlich sind.From the magazine Electronic Packaging and Production, (1984), page 122, are different methods for Setting of defined solder gap heights known. By doing Article "SMT Forces Solder Paste Improvements" mentioned T.Dixon in this connection solder pearls from Pb or a solder alloy (5% Sn / 95% Pb) or ceramic beads, which are added to the solder pastes. It is also knows the solder gap height using so-called preforms Solder alloys such as Sn or Pb or by appropriate Affect glue application. These methods are suitable however not for solder joint heights of 100 µm as they for soldering e.g. LCCC's are required.

Die Merkmale der Erfindung werden anhand einer Zeichnung wie folgt näher erläutert. Die Zeichnung zeigt in teil­ weise geschnittener Darstellung eine aus einer gedruckten Schaltungsplatte 1, einem Abstandshalter 2 und einem OMB 3 aufgebaute Anordnung.The features of the invention are explained in more detail with reference to a drawing as follows. The drawing shows a partially cut representation of an arrangement composed of a printed circuit board 1 , a spacer 2 and an OMB 3 .

Bei der Schaltungsplatte 1 handelt es sich um eine kon­ ventionelle Ausführung mit preiswertem Basismaterial, wie z.B. Hartpapier oder eine Epoxi-Glasfaser-Kombination. Das OMB 3 besteht dagegen bei vorliegendem Ausführungs­ beispiel aus einer als Chipträger ausgebildeten Keramik­ platte. Letztere ist verfahrensbedingt an ihren vier äußeren Schmalseiten mit nutförmigen Ausschnitten 4 ver­ sehen, deren Anordnung mit dem Teilungsabstand ihrer auf der Ober- und Unterseite 5, 6 vorgesehenen Anschluß­ flächen übereinstimmt und mit denen die Ausschnitte 4 über einen Metallbelag elektrisch verbunden sind. The circuit board 1 is a conventional version with inexpensive base material, such as hard paper or an epoxy-glass fiber combination. In contrast, the OMB 3 in the present embodiment consists of a ceramic plate designed as a chip carrier. The latter is procedural ver see on its four outer narrow sides with groove-shaped cutouts 4 , the arrangement of which corresponds to the pitch of their connection surfaces provided on the top and bottom 5 , 6 and with which the cutouts 4 are electrically connected via a metal coating.

Bei dem Abstandshalter 2 handelt es sich um ein folien­ artiges Plättchen, das in Länge und Breite etwas kleinere Abmessungen aufweist, als die von den Anschlüssen der Keramikplatte des OMB 3 begrenzte Fläche. Der Abstands­ halter 2 kann aus Keramik, Metall oder Kunststoff be­ stehen. Er wird vor der Herstellung von Lötverbindungen zwischen OMB 3 und Schaltungsplatte 1 an der Unterseite 6 des OMB 3 befestigt. Dies geschieht bei Verwendung von Abstandshaltern 2 aus Keramik oder Metall, wie z.B. Kupfer, durch Sintern oder mittels eines zweckmäßiger­ weise wärmeleitfähigen Klebers, mit dem beide Teile nach entsprechender Zentrierung verbunden werden. Besteht der Abstandshalter 2 aus Kunststoff, so wird vorzugsweise eine vorvernetzte, also nicht ausgehärtete Klebefolie mit Glasfilamentgewebe (Prepreg) verwendet, die durch An­ wendung von Druck und Wärme innig mit der Unterseite 6 des OMB 3 verbunden wird.The spacer 2 is a foil-like plate which has somewhat smaller dimensions in length and width than the area delimited by the connections of the ceramic plate of the OMB 3 . The spacer 2 can be made of ceramic, metal or plastic. It is attached to the underside 6 of the OMB 3 before the solder connections between the OMB 3 and the circuit board 1 . This is done when using spacers 2 made of ceramic or metal, such as copper, by sintering or by means of an expediently heat-conductive adhesive, with which both parts are connected after appropriate centering. If the spacer 2 is made of plastic, a pre-crosslinked, that is, uncured adhesive film with glass filament fabric (prepreg) is preferably used, which is intimately connected to the underside 6 of the OMB 3 by applying pressure and heat.

Diese Anordnung wird anschließend mit dem Abstandshalter 2 so auf der Schaltungsplatte 1 positioniert und fixiert, daß sich die Anschlüsse des OMB 3 mit Abstand über den ihnen zugeordneten Anschlüssen der Schaltungsplatte 1 be­ finden.This arrangement is then positioned and fixed with the spacer 2 on the circuit board 1 so that the connections of the OMB 3 are at a distance above the associated connections of the circuit board 1 be.

Das Fixieren der aus Abstandshalter 2 und OMB 3 zusammen­ gefügten Anordnung auf der Schaltungsplatte 1 kann bei­ spielsweise mittels eines auf der Unterseite des Ab­ standshalters 2 oder der Oberfläche der Schaltungsplatte 1 applizierten Klebers erfolgen, wobei es Zweckmäßig­ keitsüberlegungen vorbehalten bleibt, ob eine gut wärme­ leitende flächenhafte oder eine für das OMB 3 im späteren Auswechselfall günstigere punktförmige Verbindung herge­ stellt wird. The fixation of the spacer 2 and OMB 3 assembled on the circuit board 1 can be done for example by means of an adhesive applied to the underside of the spacer 2 or the surface of the circuit board 1 , whereby it is expedient to reserve considerations as to whether a good heat conductor extensive or a point-like connection for the OMB 3 in the event of a later replacement is established.

Die elektrische Verbindung der Anschlüsse von Schaltungs­ platte 1 und OMB 3 wird anschließend mittels Wellenlöten vorgenommen. Hierbei bilden sich nach dem Erstarren des Lotes Lötstellen 7 aus, die den Spalt 8 zwischen den An­ schlüssen von Schaltungsplatte 1 und OMB 3 ausfüllen und sich beim Chipträger außerdem bis in die Ausschnitte 4 erstrecken. Anstelle des Wellenlötens kann auch das Re­ flowverfahren angewendet werden, bei dem Lötpaste auf die Anschlüsse der Schaltungsplatte 1 aufgetragen wird, bevor das OMB 3 mit dem Abstandshalter 2 auf der Schaltungs­ platte 1 fixiert wird. Bei Verwendung einer besonders ad­ häsiven Lötpaste genügt ein Positionieren und Andrücken des Abstandshalters 2 an die Schaltungsplatte 1. Das zu­ sätzliche Fixieren kann entfallen.The electrical connection of the connections of circuit board 1 and OMB 3 is then carried out by wave soldering. Here, after the solidification of the solder, solder joints 7 form , which fill the gap 8 between the connections to the circuit board 1 and OMB 3 and also extend into the cutouts 4 in the chip carrier. Instead of wave soldering, the reflow method can also be used, in which solder paste is applied to the connections of the circuit board 1 before the OMB 3 is fixed on the circuit board 1 with the spacer 2 . When using a particularly adhesive adhesive paste, it is sufficient to position and press the spacer 2 onto the circuit board 1 . The additional fixation can be omitted.

Wie eingangs bereits erwähnt, besteht zwischen den Aus­ dehnungskoeffizienten der Materialien von OMB 3 und Schaltungsplatte 1 im allgemeinen eine relativ große Differenz. Durch die feste Verbindung des Abstandshalters 2 mit dem OMB 3 wird der Ausdehnungskoeffizient der Ge­ samtanordnung erhöht und die Differenz zum höheren Aus­ dehnungskoeffizienten des Basismaterials der Schaltungs­ platte 1 verringert. Ein weiterer wesentlicher Faktor bei der Herstellung von elektrisch funktionssicheren Lötver­ bindungen ist das Maß der Lötstellenhöhe zwischen den An­ schlüssen von OMB 3 und Schaltungsplatte 1. Je größer die Differenz zwischen den Ausdehnungskoeffizienten der beiden Materialien ist, um so größer wird der für die Lötstellenhöhe maßgebende Abstand zwischen den zu verbin­ denden Anschlüssen bemessen und durch Auswahl ent­ sprechend dicker Abstandshalter 2 realisiert. Auf diese Weise können reproduzierbare Lötspalte 8 bzw. Lötstel­ lenhöhen von ca. 100 µm bis zu mehreren 100 µm problemlos eingestellt werden. Bei 84-poligen keramischen Chip­ trägern und Schaltungsträgern aus Epoxi-Glas beträgt die Höhe des Lötspaltes 8 beispielsweise ca. 400 µm.As already mentioned at the beginning, there is generally a relatively large difference between the expansion coefficients of the materials from OMB 3 and circuit board 1 . The fixed connection of the spacer 2 with the OMB 3 increases the expansion coefficient of the overall arrangement and the difference to the higher expansion coefficient of the base material of the circuit board 1 is reduced. Another important factor in the manufacture of electrically reliable solder connections is the dimension of the solder joint height between the connections of OMB 3 and circuit board 1 . The greater the difference between the expansion coefficients of the two materials, the greater the distance between the connections to be connected, which is decisive for the height of the solder joint, and which is selected by selecting thicker spacers 2 . In this way, reproducible soldering gaps 8 or soldering heights from approximately 100 μm to several 100 μm can be set without problems. With 84-pin ceramic chip carriers and circuit carriers made of epoxy glass, the height of the solder gap 8 is, for example, approximately 400 μm.

Durch die Verwendung von Abstandshaltern 2 werden größere Lötstellenhöhen mit besseren Elastizitätseigenschaften erreicht, die eine entscheidende Verringerung der mecha­ nischen Belastung der Lötstellen 7 bewirken. Außerdem wird deren thermische Belastung durch Entwärmung der Chips über Abstandshalter 2 und Schaltungsplatte 1 wirk­ sam reduziert.By using spacers 2 , larger solder joint heights with better elastic properties are achieved, which bring about a decisive reduction in the mechanical stress on the solder joints 7 . In addition, their thermal load is effectively reduced by heat removal of the chips via spacers 2 and circuit board 1 .

Claims (6)

1. Verfahren zur Herstellung von Lötverbindungen zwischen einem oberflächenmontierbaren Bauelement (OMB) und den Leiterbahnen einer gedruckten Schaltungsplatte, gekennzeichnet durch die Anwendung folgender Verfahrensschritte:
  • a) Befestigen eines plättchenförmigen Abstandshalters (2) an der Unterseite (6) des OMB (3),
  • b) Positionieren und Fixieren der aus Abstandshalter (2) und OMB (3) bestehenden Anordnung auf der Schaltungs­ platte (1) in der Weise, daß sich die Anschlüsse des OMB (3) mit Abstand über den ihnen zugeordneten An­ schlüssen der Schaltungsplatte (1) befinden,
  • c) Löten der elektrischen Verbindung zwischen den An­ schlüssen des OMB (3) und denen der Schaltungsplatte (1).
1. Process for producing soldered connections between a surface-mountable component (OMB) and the conductor tracks of a printed circuit board, characterized by the use of the following process steps:
  • a) attaching a plate-shaped spacer ( 2 ) to the underside ( 6 ) of the OMB ( 3 ),
  • b) Positioning and fixing the spacer ( 2 ) and OMB ( 3 ) existing arrangement on the circuit board ( 1 ) in such a way that the connections of the OMB ( 3 ) at a distance above the associated connections to the circuit board ( 1 ) are located,
  • c) Soldering the electrical connection between the connections of the OMB ( 3 ) and those of the circuit board ( 1 ).
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Abstandshalter (2) aus einer vorvernetzten Klebefolie mit Glasfilamentgewebe (Prepreg) besteht, die unter Ein­ wirkung von Druck und Wärme mit dem OMB (3) verbunden wird.2. The method according to claim 1, characterized in that the spacer ( 2 ) consists of a pre-crosslinked adhesive film with glass filament fabric (prepreg) which is connected to the OMB ( 3 ) under the action of pressure and heat. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Abstandshalter (2) aus einem Keramikplättchen be­ steht, das mittels eines wärmeleitfähigen Klebers an dem OMB (3) befestigt wird.3. The method according to claim 1, characterized in that the spacer ( 2 ) consists of a ceramic plate be, which is attached to the OMB ( 3 ) by means of a thermally conductive adhesive. 4. Verfahren nach Anspruch 1 und 3, dadurch gekennzeich­ net, daß der aus einem Keramikplättchen bestehende Ab­ standshalter (2) durch Sintern mit dem OMB (3) verbunden wird.4. The method according to claim 1 and 3, characterized in that the existing from a ceramic plate from spacer ( 2 ) is connected by sintering with the OMB ( 3 ). 5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Abstandshalter (2) aus einem Metallplättchen besteht, das mittels eines wärmeleitfähigen Klebers an dem OMB (3) befestigt wird.5. The method according to claim 1, characterized in that the spacer ( 2 ) consists of a metal plate which is attached to the OMB ( 3 ) by means of a thermally conductive adhesive. 6. Verfahren nach Anspruch 1 und 5, dadurch gekennzeich­ net, daß der aus einem Metallplättchen bestehende Ab­ standshalter (2) durch Sintern mit dem OMB (3) verbunden wird.6. The method according to claim 1 and 5, characterized in that the spacer ( 2 ) consisting of a metal plate is connected by sintering to the OMB ( 3 ).
DE19853536431 1985-10-12 1985-10-12 Soldering of surface mounted devices (SMDs) Withdrawn DE3536431A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853536431 DE3536431A1 (en) 1985-10-12 1985-10-12 Soldering of surface mounted devices (SMDs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853536431 DE3536431A1 (en) 1985-10-12 1985-10-12 Soldering of surface mounted devices (SMDs)

Publications (1)

Publication Number Publication Date
DE3536431A1 true DE3536431A1 (en) 1987-04-16

Family

ID=6283431

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853536431 Withdrawn DE3536431A1 (en) 1985-10-12 1985-10-12 Soldering of surface mounted devices (SMDs)

Country Status (1)

Country Link
DE (1) DE3536431A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322121A1 (en) * 1987-11-28 1989-06-28 British Aerospace Public Limited Company Surface mounting leadless components on conductor pattern supporting substrates
DE4020048A1 (en) * 1990-06-23 1992-01-02 Ant Nachrichtentech ARRANGEMENT OF SUBSTRATE AND COMPONENT AND METHOD FOR THE PRODUCTION
EP0746188A1 (en) * 1995-05-29 1996-12-04 STMicroelectronics S.A. Use of micromodule as surface mount package and corresponding method
FR2734984A1 (en) * 1995-05-29 1996-12-06 Sgs Thomson Microelectronics Surface Mounted Box for Integrated Circuit Micromodule
WO1998032314A2 (en) * 1997-01-16 1998-07-23 Ford Global Technologies, Inc. Solder joints for surface mount chips
EP1073322A1 (en) * 1999-07-29 2001-01-31 Delphi Technologies, Inc. A method of extending life expectancy of surface mount components
WO2001037624A1 (en) * 1999-11-16 2001-05-25 Visteon Global Technologies, Inc Apparatus and method for connecting printed circuit boards through soldered lap joints
WO2002058444A2 (en) * 2001-01-16 2002-07-25 Honeywell International Inc. High-g mounting arrangement for electronic chip carrier
DE10137668A1 (en) * 2001-08-01 2002-10-17 Infineon Technologies Ag Component used in production of integrated circuits comprises substrate, semiconductor components connected to substrate via contacts arranged between substrate and semiconductor components, and supporting bodies
DE102012105297A1 (en) * 2012-06-19 2013-12-19 Endress + Hauser Gmbh + Co. Kg Method for connecting a component to a carrier via a soldering and component for connecting to a carrier

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322121A1 (en) * 1987-11-28 1989-06-28 British Aerospace Public Limited Company Surface mounting leadless components on conductor pattern supporting substrates
DE4020048A1 (en) * 1990-06-23 1992-01-02 Ant Nachrichtentech ARRANGEMENT OF SUBSTRATE AND COMPONENT AND METHOD FOR THE PRODUCTION
EP0746188A1 (en) * 1995-05-29 1996-12-04 STMicroelectronics S.A. Use of micromodule as surface mount package and corresponding method
FR2734984A1 (en) * 1995-05-29 1996-12-06 Sgs Thomson Microelectronics Surface Mounted Box for Integrated Circuit Micromodule
FR2734983A1 (en) * 1995-05-29 1996-12-06 Sgs Thomson Microelectronics USE OF A MICROMODULE AS A SURFACE MOUNT HOUSING AND METHOD THEREOF
US5917706A (en) * 1995-05-29 1999-06-29 Sgs-Thomson Microelectronics S.A. Chip card micromodule as a surface-mount device
US6259022B1 (en) 1995-05-29 2001-07-10 Sgs-Thomson Microelectronics S.A. Chip card micromodule as a surface-mount device
WO1998032314A2 (en) * 1997-01-16 1998-07-23 Ford Global Technologies, Inc. Solder joints for surface mount chips
WO1998032314A3 (en) * 1997-01-16 1999-06-03 Ford Global Tech Inc Solder joints for surface mount chips
US5936846A (en) * 1997-01-16 1999-08-10 Ford Global Technologies Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips
US6445589B2 (en) 1999-07-29 2002-09-03 Delphi Technologies, Inc. Method of extending life expectancy of surface mount components
EP1073322A1 (en) * 1999-07-29 2001-01-31 Delphi Technologies, Inc. A method of extending life expectancy of surface mount components
WO2001037624A1 (en) * 1999-11-16 2001-05-25 Visteon Global Technologies, Inc Apparatus and method for connecting printed circuit boards through soldered lap joints
WO2002058444A2 (en) * 2001-01-16 2002-07-25 Honeywell International Inc. High-g mounting arrangement for electronic chip carrier
WO2002058444A3 (en) * 2001-01-16 2002-11-21 Honeywell Int Inc High-g mounting arrangement for electronic chip carrier
US6744636B2 (en) 2001-01-16 2004-06-01 Honeywell International, Inc. High-G mounting arrangement for electronic chip carrier
DE10137668A1 (en) * 2001-08-01 2002-10-17 Infineon Technologies Ag Component used in production of integrated circuits comprises substrate, semiconductor components connected to substrate via contacts arranged between substrate and semiconductor components, and supporting bodies
DE102012105297A1 (en) * 2012-06-19 2013-12-19 Endress + Hauser Gmbh + Co. Kg Method for connecting a component to a carrier via a soldering and component for connecting to a carrier
DE102012105297A8 (en) * 2012-06-19 2014-03-20 Endress + Hauser Gmbh + Co. Kg Method for connecting a component to a carrier via a soldering and component for connecting to a carrier
US10099318B2 (en) 2012-06-19 2018-10-16 Endress+Hauser Se+Co.Kg Method for connecting a component to a support via soldering and component connectable with a support

Similar Documents

Publication Publication Date Title
DE69938582T2 (en) SEMICONDUCTOR ELEMENT, ITS MANUFACTURE, PCB AND ELECTRONIC APPARATUS
EP0934687B1 (en) Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
EP0920055B1 (en) Cooling device for a heat generating component on a printed board
DE102006004788B4 (en) Semiconductor device and manufacturing process for this
DE4028556C1 (en)
DE10211926B4 (en) Heat Dissipation Arrangement of an Integrated Circuit (IC)
DE10111718A1 (en) Electronic circuit device has one board connected by solder to metal spacers, which are connected to other board by conductive adhesive
DE4192038C2 (en) PCB assembly mfr. permitting wave soldering
DE19526401A1 (en) Combined electronic components with resonator and capacitor elements e.g. for Colpitts oscillator
EP0464232B1 (en) Solder connector and process for making an electrical circuit with this solder connector
DE3536431A1 (en) Soldering of surface mounted devices (SMDs)
DE1590333A1 (en) Connector for thin membrane circuits
DE3932213A1 (en) CONNECTING ARRANGEMENT WITH PCB
WO2006013145A1 (en) Printed circuit board with smd components and at least one wired component and a method for picking fixing and electrical contacting of said components
DE69832407T2 (en) CHIP CARRIER ELEMENT AND ITS USE
DE10045534B4 (en) Electronic component with external connection elements designed as a capillary element, method for the production and arrangement
DE4129964C2 (en) Method for producing an electrically conductive fastening of an integrated circuit on a printed circuit
DE4223371A1 (en) Electronic component mounting method for circuit board assembly - with openings in cover layer overlapping each component receiving conductive paste providing required electrical connections
DE3545560A1 (en) ELECTRICAL PRESSURE FITTING SOCKET FOR A DIRECT CONNECTION TO A SEMICONDUCTOR CHIP
DE19651862A1 (en) Process for reflow soldering of printed circuit boards with SMD components
DE4108667C2 (en) Composite arrangement of a metallic base plate and a ceramic printed circuit board and method for their production
DE10228152A1 (en) Self-adhesive flexible repair circuit
DE4118308C2 (en) Circuit carrier for SMD components
DE102019129971A1 (en) Method for soldering a component onto a printed circuit board, electronic unit and field device in automation technology
DE4226168A1 (en) Electronic module mfr. using heat-conductive adhesive - making holes through pref. copper@-plated area of PCB for injection of adhesive after satisfactory in-situ functional test

Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee