DE3485085D1 - Elektrisch leitende klebende folie. - Google Patents

Elektrisch leitende klebende folie.

Info

Publication number
DE3485085D1
DE3485085D1 DE8484116388T DE3485085T DE3485085D1 DE 3485085 D1 DE3485085 D1 DE 3485085D1 DE 8484116388 T DE8484116388 T DE 8484116388T DE 3485085 T DE3485085 T DE 3485085T DE 3485085 D1 DE3485085 D1 DE 3485085D1
Authority
DE
Germany
Prior art keywords
electrically conductive
adhesive film
conductive adhesive
film
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484116388T
Other languages
English (en)
Inventor
Yoshio C O Sony Chemi Fujiwara
Hisashi C O Sony Chemical Ando
Naotake C O Sony Che Kobayashi
Hiderhiro C O Sony Chemi Numao
Yuichi C O Sony Chem Matsubara
Kazuaki C O Sony Chemic Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25078883A external-priority patent/JPS60140790A/ja
Priority claimed from JP59023882A external-priority patent/JPS60170176A/ja
Priority claimed from JP59033793A external-priority patent/JPS60178690A/ja
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE3485085D1 publication Critical patent/DE3485085D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
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    • H01L2924/01021—Scandium [Sc]
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    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/01063—Europium [Eu]
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    • H01L2924/01066—Dysprosium [Dy]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
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    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
DE8484116388T 1983-12-27 1984-12-27 Elektrisch leitende klebende folie. Expired - Lifetime DE3485085D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP25078883A JPS60140790A (ja) 1983-12-27 1983-12-27 連結シ−ト
JP59023882A JPS60170176A (ja) 1984-02-10 1984-02-10 透明導電膜との接続構造体
JP59033793A JPS60178690A (ja) 1984-02-24 1984-02-24 配線基板

Publications (1)

Publication Number Publication Date
DE3485085D1 true DE3485085D1 (de) 1991-10-24

Family

ID=27284422

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484116388T Expired - Lifetime DE3485085D1 (de) 1983-12-27 1984-12-27 Elektrisch leitende klebende folie.

Country Status (5)

Country Link
US (1) US4735847A (de)
EP (1) EP0147856B1 (de)
AU (1) AU572615B2 (de)
CA (1) CA1227579A (de)
DE (1) DE3485085D1 (de)

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
JPS6261397A (ja) * 1985-09-11 1987-03-18 ソニ−ケミカル株式会社 配線基板の接続方法
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
AU608745B2 (en) * 1986-02-07 1991-04-18 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
EP0265077A3 (de) * 1986-09-25 1989-03-08 Sheldahl, Inc. Ein Anisotropisches Klebemittel zum Verbinden elektrischer Bauelemente
US4837407A (en) * 1987-03-30 1989-06-06 Aisin Seiki Company, Ltd. Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof
GB2203442B (en) * 1987-04-14 1991-10-16 James Robert Clements Electronic device including uniaxial conductive adhesive and method of making same
US5246771A (en) * 1988-04-18 1993-09-21 Teraoka Seisakusho Co., Ltd. Adhesive tape for preventing implosion and removing electrostatic charge
JPH0717162Y2 (ja) * 1988-05-13 1995-04-19 ミノルタ株式会社 フレキシブルプリント基板
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
CA1307594C (en) * 1988-06-10 1992-09-15 Kenneth B. Gilleo Multilayer electronic circuit and method of manufacture
US5240761A (en) * 1988-08-29 1993-08-31 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
DE3844420A1 (de) * 1988-12-30 1990-07-05 Mst Micro Sensor Tech Gmbh Verfahren und vorrichtung zum anschliessen flexibler leiterbahnen an anschlusskontakte
JPH03125443A (ja) * 1989-10-09 1991-05-28 Sharp Corp 実装基板の電極及び該実装基板の電極を有する液晶表示装置
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
KR950006382B1 (ko) * 1990-02-06 1995-06-14 스미또모 배꾸라이또 가부시끼가이샤 칩형 전자부품 포장용 커버 테이프
US5245751A (en) 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
KR930701561A (ko) * 1990-06-08 1993-06-12 게리 엘. 그리스울드 전자 용품용 재처리가능한 접착제
US5087494A (en) * 1991-04-12 1992-02-11 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
JPH04332404A (ja) * 1991-05-07 1992-11-19 Nec Corp 異方性導電材料及びこれを用いた集積回路素子の接続方法
US5162613A (en) * 1991-07-01 1992-11-10 At&T Bell Laboratories Integrated circuit interconnection technique
US5206585A (en) * 1991-12-02 1993-04-27 At&T Bell Laboratories Methods for testing integrated circuit devices
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
JPH07174788A (ja) * 1993-12-17 1995-07-14 Nhk Spring Co Ltd 導電性接触子
DE4406418C1 (de) * 1994-02-28 1995-07-13 Bosch Gmbh Robert Anisotrop elektrisch leitender Kleber
JPH09510319A (ja) * 1994-03-08 1997-10-14 テレダイン インダストリーズ，インク． 多層結合型剛性及び可撓性印刷回路ボードの製造方法
JPH10502677A (ja) * 1994-06-29 1998-03-10 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 異方性導電性の接着剤及び異方性導電性の接着剤の製造方法
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
FI98899C (fi) * 1994-10-28 1997-09-10 Jorma Kalevi Kivilahti Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
US5621836A (en) * 1994-11-28 1997-04-15 Methode Electronics, Inc. Plastic fiber alignment ferrule and termination method
US5685939A (en) * 1995-03-10 1997-11-11 Minnesota Mining And Manufacturing Company Process for making a Z-axis adhesive and establishing electrical interconnection therewith
DE19510186C2 (de) * 1995-03-21 2003-12-24 Aeg Ges Moderne Inf Sys Mbh Verfahren zum Anschluß eines flexiblen Verbindungselements an ein Substrat
DE19540807C1 (de) * 1995-11-02 1997-04-17 Mayer Textilmaschf Flexibles elektrisches Kabel und aus diesem Kabel bestehende elektrische Verbindung
US5914534A (en) * 1996-05-03 1999-06-22 Ford Motor Company Three-dimensional multi-layer molded electronic device and method for manufacturing same
WO1998003047A1 (en) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Film-like adhesive for connecting circuit and circuit board
US6193139B1 (en) * 1996-10-17 2001-02-27 Jorma Kivilahti Method for joining metals by soldering
US6100178A (en) * 1997-02-28 2000-08-08 Ford Motor Company Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
US7604868B2 (en) * 1997-03-31 2009-10-20 Hitachi Chemical Company, Ltd. Electronic circuit including circuit-connecting material
EP0979854B1 (de) * 1997-03-31 2006-10-04 Hitachi Chemical Company, Ltd. Material zur verbindung von leiterplatten und verfahren zur verbindung von schaltungsanschlüssen
US6019271A (en) * 1997-07-11 2000-02-01 Ford Motor Company Method for ultrasonic bonding flexible circuits
US5958537A (en) * 1997-09-25 1999-09-28 Brady Usa, Inc. Static dissipative label
US6893896B1 (en) * 1998-03-27 2005-05-17 The Trustees Of Princeton University Method for making multilayer thin-film electronics
US5906004A (en) * 1998-04-29 1999-05-25 Motorola, Inc. Textile fabric with integrated electrically conductive fibers and clothing fabricated thereof
JP3955156B2 (ja) * 1998-08-31 2007-08-08 エルジー フィリップス エルシーディー カンパニー リミテッド 電子機器用構成基板と電子機器
EP1010492B1 (de) * 1998-12-10 2004-09-01 Ultex Corporation Ultraschallschwingungsschweissverfahren
JP2001031929A (ja) * 1999-07-21 2001-02-06 Sony Chem Corp 接続構造体
US6449836B1 (en) * 1999-07-30 2002-09-17 Denso Corporation Method for interconnecting printed circuit boards and interconnection structure
US6347521B1 (en) * 1999-10-13 2002-02-19 Komatsu Ltd Temperature control device and method for manufacturing the same
US6727197B1 (en) 1999-11-18 2004-04-27 Foster-Miller, Inc. Wearable transmission device
US6646364B1 (en) * 2000-07-11 2003-11-11 Honeywell International Inc. MEMS actuator with lower power consumption and lower cost simplified fabrication
US6527162B2 (en) * 2000-08-04 2003-03-04 Denso Corporation Connecting method and connecting structure of printed circuit boards
DE60143811D1 (de) * 2000-10-16 2011-02-17 Foster Miller Inc Verfahren zur herstellung eines gewebeartikels mit elektronischer beschaltung und gewebeartikel
US20040092186A1 (en) * 2000-11-17 2004-05-13 Patricia Wilson-Nguyen Textile electronic connection system
JP4105409B2 (ja) * 2001-06-22 2008-06-25 株式会社ルネサステクノロジ マルチチップモジュールの製造方法
US6852395B2 (en) * 2002-01-08 2005-02-08 North Carolina State University Methods and systems for selectively connecting and disconnecting conductors in a fabric
US7348285B2 (en) * 2002-06-28 2008-03-25 North Carolina State University Fabric and yarn structures for improving signal integrity in fabric-based electrical circuits
WO2004070827A1 (ja) * 2003-02-05 2004-08-19 Senju Metal Industry Co., Ltd. 端子間の接続方法及び半導体装置の実装方法
US6860620B2 (en) * 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
AU2004277381B2 (en) 2003-08-22 2008-04-24 Foster-Miller, Inc. Physiological monitoring garment
JP4302607B2 (ja) * 2004-01-30 2009-07-29 株式会社デンソー 半導体装置
US7300397B2 (en) * 2004-07-29 2007-11-27 C2C Cure, Inc. Endoscope electronics assembly
US20070299325A1 (en) * 2004-08-20 2007-12-27 Brian Farrell Physiological status monitoring system
TWM269683U (en) * 2005-01-03 2005-07-01 High Tech Comp Corp Flexible printed circuit board and reinforcing structure thereof
US7754529B2 (en) 2005-02-03 2010-07-13 Panasonic Corporation Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method
JP2006294350A (ja) * 2005-04-07 2006-10-26 Three M Innovative Properties Co ケーブルハーネス体
JP4650456B2 (ja) * 2006-08-25 2011-03-16 日立化成工業株式会社 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
KR100824881B1 (ko) * 2006-11-10 2008-04-23 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
KR100824880B1 (ko) * 2006-11-10 2008-04-23 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
JP2008130803A (ja) * 2006-11-21 2008-06-05 Toshiba Matsushita Display Technology Co Ltd 基板装置および基板
KR100833738B1 (ko) 2006-11-30 2008-05-29 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
KR100824902B1 (ko) * 2006-12-13 2008-04-23 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
JP2008153470A (ja) * 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置および半導体装置の製造方法
US8035789B2 (en) * 2007-03-19 2011-10-11 Sony Corporation Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus
JP4924143B2 (ja) * 2007-03-28 2012-04-25 マツダ株式会社 金属製ワークの接合方法
JP5014890B2 (ja) * 2007-06-20 2012-08-29 パナソニック株式会社 電極芯線の接合方法
GB0714723D0 (en) 2007-07-30 2007-09-12 Pilkington Automotive D Gmbh Improved electrical connector
CN104228324B (zh) * 2008-05-09 2017-12-01 斯塔诺阿埃索澳吉有限公司 在基底上形成导电图案的设备、方法、绝缘基底和芯片组
AU2008356134B2 (en) * 2008-05-09 2015-02-12 Digital Tags Finland Oy An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
DE102008028300B4 (de) * 2008-06-13 2021-10-07 Tdk Electronics Ag Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung
CH700060A1 (de) * 2008-12-04 2010-06-15 Forster Rohner Ag Verfahren zum Anbringen flächiger elektronischer Bauelemente, wie Solarzellen, auf einem flexiblen Flächengebilde.
US8488271B2 (en) * 2009-07-06 2013-07-16 Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd. Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device
CN102118674B (zh) * 2010-01-05 2016-02-10 歌尔声学股份有限公司 一种mems麦克风及其封装方法
US9211085B2 (en) 2010-05-03 2015-12-15 Foster-Miller, Inc. Respiration sensing system
US9028404B2 (en) 2010-07-28 2015-05-12 Foster-Miller, Inc. Physiological status monitoring system
US8585606B2 (en) 2010-09-23 2013-11-19 QinetiQ North America, Inc. Physiological status monitoring system
JP2012233723A (ja) * 2011-04-28 2012-11-29 Micronics Japan Co Ltd プローブ装置及びプローブユニット
US10295367B2 (en) * 2012-10-02 2019-05-21 Japan Science And Technology Agency Signal detection device and signal detection method
JP6192974B2 (ja) * 2013-04-23 2017-09-06 株式会社東芝 テレビジョン受像機および電子機器
WO2016033328A1 (en) 2014-08-27 2016-03-03 North Carolina State University Binary encoding of sensors in textile structures
US10890669B2 (en) * 2015-01-14 2021-01-12 General Electric Company Flexible X-ray detector and methods for fabricating the same
JP6187918B2 (ja) * 2015-04-23 2017-08-30 パナソニックＩｐマネジメント株式会社 回路部材の接続構造、接続方法および接続材料
US10082913B2 (en) 2015-05-10 2018-09-25 Microsoft Technology Licensing, Llc Embroidered sensor assembly
KR102450959B1 (ko) * 2015-08-31 2022-10-04 엘지디스플레이 주식회사 연성 인쇄 회로 필름 및 그를 이용한 디스플레이 장치
KR101751407B1 (ko) * 2016-02-16 2017-07-11 단국대학교 산학협력단 플래시 메모리의 신뢰성 검증을 위한 아날로그 정보 기반 에뮬레이션 방법 및 그 장치
WO2017197228A2 (en) * 2016-05-13 2017-11-16 Warwick Mills, Inc. E-fabric and e-garment having intergral interconnected conductors and embedded devices
KR102626385B1 (ko) * 2016-06-08 2024-01-19 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR20180074264A (ko) 2016-12-23 2018-07-03 엘지디스플레이 주식회사 전자 장치 및 이를 포함하는 표시 장치
US10688731B2 (en) * 2018-01-30 2020-06-23 Te Connectivity Corporation System and method for bonding structural components

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646670A (en) * 1968-07-19 1972-03-07 Hitachi Chemical Co Ltd Method for connecting conductors
US3740366A (en) * 1969-04-28 1973-06-19 Rohm & Haas Pressure sensitive adhesive containing carboxylic acid groups and polyvalent metal
US3778306A (en) * 1971-01-04 1973-12-11 Minnesota Mining & Mfg Tape
US3762946A (en) * 1971-10-21 1973-10-02 Minnesota Mining & Mfg Small particle loaded electrically conductive adhesive tape
US4098945A (en) * 1973-07-30 1978-07-04 Minnesota Mining And Manufacturing Company Soft conductive materials
JPS5724456Y2 (de) * 1977-09-09 1982-05-27
CA1132213A (en) * 1979-04-02 1982-09-21 Matthew Pobog Printed circuit board connector
JPS5670529A (en) * 1979-11-14 1981-06-12 Hitachi Ltd Liquid crystal display unit
JPS56138881A (en) 1980-03-31 1981-10-29 Sony Corp Electric connecting sheet
US4513005A (en) 1981-06-18 1985-04-23 Lilly Industries Limited SRS-A antagonists
CA1184622A (en) * 1981-12-28 1985-03-26 James G. Berg Insulated connector sheet
US4546037A (en) * 1984-09-04 1985-10-08 Minnesota Mining And Manufacturing Company Flexible tape having stripes of electrically conductive particles for making multiple connections
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPS61173471A (ja) * 1985-01-28 1986-08-05 シャープ株式会社 熱圧着コネクタ−

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US4735847A (en) 1988-04-05
EP0147856A3 (en) 1987-05-27
AU572615B2 (en) 1988-05-12
AU3690984A (en) 1985-07-04

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