DE3369576D1 - Stripping compositions and methods of stripping resists - Google Patents

Stripping compositions and methods of stripping resists

Info

Publication number
DE3369576D1
DE3369576D1 DE8383108673T DE3369576T DE3369576D1 DE 3369576 D1 DE3369576 D1 DE 3369576D1 DE 8383108673 T DE8383108673 T DE 8383108673T DE 3369576 T DE3369576 T DE 3369576T DE 3369576 D1 DE3369576 D1 DE 3369576D1
Authority
DE
Germany
Prior art keywords
stripping
compositions
methods
resists
stripping compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383108673T
Other languages
English (en)
Inventor
Irl Eugene Ward
Lisa Gail Hallquist
Thomas Joseph Hurley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE3369576D1 publication Critical patent/DE3369576D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
DE8383108673T 1982-09-02 1983-09-02 Stripping compositions and methods of stripping resists Expired DE3369576D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/413,995 US4403029A (en) 1982-09-02 1982-09-02 Stripping compositions and methods of stripping resists

Publications (1)

Publication Number Publication Date
DE3369576D1 true DE3369576D1 (en) 1987-03-05

Family

ID=23639517

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383108673T Expired DE3369576D1 (en) 1982-09-02 1983-09-02 Stripping compositions and methods of stripping resists

Country Status (12)

Country Link
US (1) US4403029A (de)
EP (1) EP0102628B1 (de)
JP (1) JPS5949538A (de)
AT (1) ATE25295T1 (de)
AU (1) AU555161B2 (de)
CA (1) CA1194764A (de)
DE (1) DE3369576D1 (de)
HK (1) HK33988A (de)
IE (1) IE54405B1 (de)
IL (1) IL69400A0 (de)
SG (1) SG17088G (de)
ZA (1) ZA835588B (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
US4491530A (en) * 1983-05-20 1985-01-01 Allied Corporation Brown stain suppressing phenol free and chlorinated hydrocarbons free photoresist stripper
US4828960A (en) * 1985-01-07 1989-05-09 Honeywell Inc. Reflection limiting photoresist composition with two azo dyes
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
US4692398A (en) * 1985-10-28 1987-09-08 American Hoechst Corporation Process of using photoresist treating composition containing a mixture of a hexa-alkyl disilazane, propylene glycol alkyl ether and propylene glycol alkyl ether acetate
US4983490A (en) * 1985-10-28 1991-01-08 Hoechst Celanese Corporation Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate
US4806458A (en) * 1985-10-28 1989-02-21 Hoechst Celanese Corporation Composition containing a mixture of hexa-alkyl disilazane and propylene glycol alkyl ether and/or propylene glycol alkyl ether acetate
IE59971B1 (en) * 1986-11-10 1994-05-04 Baker J T Inc Stripping compositions and their use for stripping resists from substrates
US4770713A (en) * 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
US4824763A (en) * 1987-07-30 1989-04-25 Ekc Technology, Inc. Triamine positive photoresist stripping composition and prebaking process
JPH02981A (ja) * 1988-02-25 1990-01-05 Hoya Corp 感光性樹脂用剥離液及びこれを用いる感光性樹脂の剥離方法
US5166039A (en) * 1988-02-25 1992-11-24 Hoya Corporation Peeling solution for photo- or electron beam-sensitive resin and process for peeling off said resin
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US6001192A (en) * 1992-06-02 1999-12-14 Elf Atochem S.A. Paint stripping composition
FR2691713B1 (fr) * 1992-06-02 1997-12-26 Atochem Elf Sa Composition pour decaper les peintures.
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5417802A (en) * 1994-03-18 1995-05-23 At&T Corp. Integrated circuit manufacturing
US5591702A (en) * 1995-05-25 1997-01-07 Henkel Corporation Stripping compositions with mixtures or organic solvents and uses thereof
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
KR100271761B1 (ko) * 1997-11-21 2000-12-01 윤종용 반도체장치 제조용 현상장치 및 그의 제어방법
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US6368421B1 (en) 1998-07-10 2002-04-09 Clariant Finance (Bvi) Limited Composition for stripping photoresist and organic materials from substrate surfaces
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US7456140B2 (en) * 2000-07-10 2008-11-25 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductor devices
KR100764888B1 (ko) 2000-07-10 2007-10-09 이케이씨 테크놀로지, 인코포레이티드 반도체 장치용의 유기 및 플라즈마 식각된 잔사의 세척을위한 조성물
CA2331439C (en) * 2001-01-19 2007-01-02 E.Q.U.I.P. International Inc. Paint stripping composition and method of using the same
US7543592B2 (en) * 2001-12-04 2009-06-09 Ekc Technology, Inc. Compositions and processes for photoresist stripping and residue removal in wafer level packaging
EP1468335A4 (de) * 2002-01-11 2006-05-17 Az Electronic Materials Usa Reinigungsmittelzusammensetzung für einen positiv- oder negativ-fotoresist
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
WO2003091376A1 (en) * 2002-04-24 2003-11-06 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
US20050089489A1 (en) * 2003-10-22 2005-04-28 Carter Melvin K. Composition for exfoliation agent effective in removing resist residues
US20110146724A1 (en) * 2009-12-19 2011-06-23 Mr. WAI MUN LEE Photoresist stripping solutions
KR20220058069A (ko) 2020-10-30 2022-05-09 주식회사 이엔에프테크놀로지 세정제 조성물 및 이를 이용한 세정방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2891849A (en) * 1956-11-30 1959-06-23 Eastman Kodak Co Solvent composition
US4165295A (en) * 1976-10-04 1979-08-21 Allied Chemical Corporation Organic stripping compositions and method for using same
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
US4395479A (en) * 1981-09-23 1983-07-26 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists

Also Published As

Publication number Publication date
US4403029A (en) 1983-09-06
ATE25295T1 (de) 1987-02-15
IE831699L (en) 1984-03-02
IE54405B1 (en) 1989-09-27
HK33988A (en) 1988-05-13
AU1744183A (en) 1984-03-08
JPS5949538A (ja) 1984-03-22
CA1194764A (en) 1985-10-08
EP0102628A1 (de) 1984-03-14
ZA835588B (en) 1984-04-25
EP0102628B1 (de) 1987-01-28
AU555161B2 (en) 1986-09-11
JPH0143947B2 (de) 1989-09-25
SG17088G (en) 1988-09-30
IL69400A0 (en) 1983-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee