DE3280266D1 - Traeger fuer integrierte schaltungschips. - Google Patents

Traeger fuer integrierte schaltungschips.

Info

Publication number
DE3280266D1
DE3280266D1 DE8282300596T DE3280266T DE3280266D1 DE 3280266 D1 DE3280266 D1 DE 3280266D1 DE 8282300596 T DE8282300596 T DE 8282300596T DE 3280266 T DE3280266 T DE 3280266T DE 3280266 D1 DE3280266 D1 DE 3280266D1
Authority
DE
Germany
Prior art keywords
carrier
integrated circuit
circuit chips
chips
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8282300596T
Other languages
English (en)
Inventor
Francis Nihal Sinnadurai
James Anthony Cook
William Keith Gurnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
British Telecommunications PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Telecommunications PLC filed Critical British Telecommunications PLC
Application granted granted Critical
Publication of DE3280266D1 publication Critical patent/DE3280266D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
DE8282300596T 1981-02-09 1982-02-08 Traeger fuer integrierte schaltungschips. Expired - Lifetime DE3280266D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8103840 1981-02-09

Publications (1)

Publication Number Publication Date
DE3280266D1 true DE3280266D1 (de) 1990-12-06

Family

ID=10519540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282300596T Expired - Lifetime DE3280266D1 (de) 1981-02-09 1982-02-08 Traeger fuer integrierte schaltungschips.

Country Status (8)

Country Link
US (2) US4448306A (de)
EP (1) EP0058068B1 (de)
AU (1) AU559141B2 (de)
CA (1) CA1183280A (de)
DE (1) DE3280266D1 (de)
IE (1) IE56411B1 (de)
NZ (1) NZ199549A (de)
ZA (1) ZA82368B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
AU598253B2 (en) * 1986-05-07 1990-06-21 Digital Equipment Corporation System for detachably mounting semi-conductors on conductor substrates
US5131535A (en) * 1986-06-27 1992-07-21 Symtek Systems, Inc. Electrical device transport medium
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
US4681221A (en) * 1986-10-30 1987-07-21 International Business Machines Corporation Holder for plastic leaded chip carrier
US4931906A (en) * 1988-03-25 1990-06-05 Unitrode Corporation Hermetically sealed, surface mountable component and carrier for semiconductor devices
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) * 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
FR2675632B1 (fr) * 1991-04-18 1997-04-30 Texas Instruments France Dispositif de conditionnement de circuits integres
US5483421A (en) * 1992-03-09 1996-01-09 International Business Machines Corporation IC chip attachment
US5203452A (en) * 1992-03-13 1993-04-20 Illinois Tool Works, Inc. Shipping tray
US5246129A (en) * 1992-03-13 1993-09-21 Illinois Tool Works, Inc. Shipping tray and cover strip
JP3541491B2 (ja) * 1994-06-22 2004-07-14 セイコーエプソン株式会社 電子部品
JP2688664B2 (ja) * 1994-09-07 1997-12-10 シノン電気産業株式会社 半導体デバイス用トレー
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
US5938956A (en) 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US6426484B1 (en) 1996-09-10 2002-07-30 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US6229323B1 (en) * 1998-04-23 2001-05-08 Micron Technology, Inc. Automated multi-chip module handler, method of module handling, and module magazine
JP3877454B2 (ja) 1998-11-27 2007-02-07 三洋電機株式会社 半導体装置の製造方法
US7112305B2 (en) * 2001-01-31 2006-09-26 Agilent Technologies, Inc. Automation-optimized microarray package
US20040105244A1 (en) * 2002-08-06 2004-06-03 Ilyas Mohammed Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
JP6485777B2 (ja) * 2016-05-31 2019-03-20 大口マテリアル株式会社 多列型半導体装置用配線部材及びその製造方法
JP6485776B2 (ja) * 2016-05-31 2019-03-20 大口マテリアル株式会社 多列型半導体装置用配線部材及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3349481A (en) * 1964-12-29 1967-10-31 Alpha Microelectronics Company Integrated circuit sealing method and structure
US3441853A (en) * 1966-06-21 1969-04-29 Signetics Corp Plug-in integrated circuit package and carrier assembly and including a test fixture therefor
US3454154A (en) * 1968-05-07 1969-07-08 Us Air Force Integrated circuit carrier
US3673543A (en) * 1970-04-27 1972-06-27 Thomas & Betts Corp Micro-circuit pack receptacle
US4099615A (en) * 1974-08-22 1978-07-11 Amp, Incorporated Carrier strip mounted electrical components
US3940849A (en) * 1974-09-09 1976-03-02 Minter Jerry B Method for handling connectors
US4026412A (en) * 1974-09-26 1977-05-31 Henson Richard D Electronic circuit carrier and test fixture
GB1515160A (en) * 1975-11-28 1978-06-21 Plessey Co Ltd Electrically integrated circuit package protectors
JPS5384681A (en) * 1976-12-29 1978-07-26 Mitsumi Electric Co Ltd Method of producing leadless package
JPS53114067A (en) * 1977-03-15 1978-10-05 Tokyo Shibaura Electric Co Electronic part device and method of producing same
US4227298A (en) * 1978-09-05 1980-10-14 Motorola, Inc. Method for interconnecting photovoltaic devices
US4223368A (en) * 1978-09-14 1980-09-16 Dattilo Donald P Electrostatic discharge protection device
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier

Also Published As

Publication number Publication date
NZ199549A (en) 1985-01-31
AU7970982A (en) 1982-08-19
IE820247L (en) 1982-08-09
CA1183280A (en) 1985-02-26
US4448306A (en) 1984-05-15
EP0058068A3 (en) 1982-09-08
US4595096A (en) 1986-06-17
ZA82368B (en) 1983-01-26
AU559141B2 (en) 1987-02-26
IE56411B1 (en) 1991-07-31
EP0058068B1 (de) 1990-10-31
EP0058068A2 (de) 1982-08-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition