DE3277154D1 - Method for producing single crystal semiconductor areas - Google Patents
Method for producing single crystal semiconductor areasInfo
- Publication number
- DE3277154D1 DE3277154D1 DE8282305770T DE3277154T DE3277154D1 DE 3277154 D1 DE3277154 D1 DE 3277154D1 DE 8282305770 T DE8282305770 T DE 8282305770T DE 3277154 T DE3277154 T DE 3277154T DE 3277154 D1 DE3277154 D1 DE 3277154D1
- Authority
- DE
- Germany
- Prior art keywords
- single crystal
- crystal semiconductor
- producing single
- semiconductor areas
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/901—Levitation, reduced gravity, microgravity, space
- Y10S117/902—Specified orientation, shape, crystallography, or size of seed or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/903—Dendrite or web or cage technique
- Y10S117/904—Laser beam
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/316,210 US4388145A (en) | 1981-10-29 | 1981-10-29 | Laser annealing for growth of single crystal semiconductor areas |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3277154D1 true DE3277154D1 (en) | 1987-10-08 |
Family
ID=23228029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282305770T Expired DE3277154D1 (en) | 1981-10-29 | 1982-10-29 | Method for producing single crystal semiconductor areas |
Country Status (4)
Country | Link |
---|---|
US (1) | US4388145A (de) |
EP (1) | EP0078681B1 (de) |
JP (1) | JPS5880832A (de) |
DE (1) | DE3277154D1 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821319A (ja) * | 1981-07-30 | 1983-02-08 | Fujitsu Ltd | レ−ザアニ−ル方法 |
JPS58194799A (ja) * | 1982-05-07 | 1983-11-12 | Hitachi Ltd | 単結晶シリコンの製造方法 |
JPS60127722A (ja) * | 1983-12-15 | 1985-07-08 | Fujitsu Ltd | 半導体装置の製造方法 |
US4585512A (en) * | 1984-01-27 | 1986-04-29 | Sony Corporation | Method for making seed crystals for single-crystal semiconductor devices |
US4536251A (en) * | 1984-06-04 | 1985-08-20 | Xerox Corporation | Method for eliminating laser-induced substrate fissures associated with crystallized silicon areas |
NL8500931A (nl) * | 1985-03-29 | 1986-10-16 | Philips Nv | Werkwijze voor het omzetten van polykristallijn halfgeleidermateriaal in monokristallijn halfgeleidermateriaal. |
FR2582455B1 (fr) * | 1985-05-21 | 1987-08-14 | Menigaux Louis | Procede de fabrication d'un laser a semiconducteur a geometrie a ruban et laser obtenu par ce procede |
USRE33274E (en) * | 1985-09-13 | 1990-07-24 | Xerox Corporation | Selective disordering of well structures by laser annealing |
US4654090A (en) * | 1985-09-13 | 1987-03-31 | Xerox Corporation | Selective disordering of well structures by laser annealing |
US5264072A (en) * | 1985-12-04 | 1993-11-23 | Fujitsu Limited | Method for recrystallizing conductive films by an indirect-heating with a thermal-conduction-controlling layer |
US4771010A (en) * | 1986-11-21 | 1988-09-13 | Xerox Corporation | Energy beam induced layer disordering (EBILD) |
GB2211210A (en) * | 1987-10-16 | 1989-06-28 | Philips Electronic Associated | A method of modifying a surface of a body using electromagnetic radiation |
US5459346A (en) * | 1988-06-28 | 1995-10-17 | Ricoh Co., Ltd. | Semiconductor substrate with electrical contact in groove |
DE3921038C2 (de) * | 1988-06-28 | 1998-12-10 | Ricoh Kk | Verfahren zur Herstellung eines Halbleitersubstrats bzw. Festkörperaufbaus |
US5173446A (en) * | 1988-06-28 | 1992-12-22 | Ricoh Company, Ltd. | Semiconductor substrate manufacturing by recrystallization using a cooling medium |
US5322589A (en) * | 1989-02-09 | 1994-06-21 | Fujitsu Limited | Process and apparatus for recrystallization of semiconductor layer |
US5011567A (en) * | 1989-12-06 | 1991-04-30 | Mobil Solar Energy Corporation | Method of fabricating solar cells |
US5310446A (en) * | 1990-01-10 | 1994-05-10 | Ricoh Company, Ltd. | Method for producing semiconductor film |
US5578520A (en) | 1991-05-28 | 1996-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US5766344A (en) * | 1991-09-21 | 1998-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor |
JP3321890B2 (ja) * | 1992-06-23 | 2002-09-09 | ソニー株式会社 | 半導体結晶の形成方法及び半導体素子 |
US7097712B1 (en) | 1992-12-04 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for processing a semiconductor |
US6897100B2 (en) | 1993-11-05 | 2005-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for processing semiconductor device apparatus for processing a semiconductor and apparatus for processing semiconductor device |
CN1052566C (zh) | 1993-11-05 | 2000-05-17 | 株式会社半导体能源研究所 | 制造半导体器件的方法 |
US6059873A (en) | 1994-05-30 | 2000-05-09 | Semiconductor Energy Laboratory Co., Ltd. | Optical processing method with control of the illumination energy of laser light |
US5893948A (en) * | 1996-04-05 | 1999-04-13 | Xerox Corporation | Method for forming single silicon crystals using nucleation sites |
TWI291729B (en) | 2001-11-22 | 2007-12-21 | Semiconductor Energy Lab | A semiconductor fabricating apparatus |
US7133737B2 (en) | 2001-11-30 | 2006-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer |
US7214573B2 (en) * | 2001-12-11 | 2007-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device that includes patterning sub-islands |
US7135389B2 (en) * | 2001-12-20 | 2006-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Irradiation method of laser beam |
JP4141138B2 (ja) * | 2001-12-21 | 2008-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4887663B2 (ja) * | 2005-05-16 | 2012-02-29 | 井関農機株式会社 | コンバイン |
US20090226694A1 (en) * | 2008-03-06 | 2009-09-10 | Tokyo Electron Limited | POROUS SiCOH-CONTAINING DIELECTRIC FILM AND A METHOD OF PREPARING |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585088A (en) * | 1968-10-18 | 1971-06-15 | Ibm | Methods of producing single crystals on supporting substrates |
US4174422A (en) * | 1977-12-30 | 1979-11-13 | International Business Machines Corporation | Growing epitaxial films when the misfit between film and substrate is large |
DE2837653A1 (de) * | 1978-08-29 | 1980-04-17 | Siemens Ag | Verfahren zur lokal begrenzten erwaermung von festkoerpern |
JPS55115341A (en) * | 1979-02-28 | 1980-09-05 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor device |
US4330363A (en) * | 1980-08-28 | 1982-05-18 | Xerox Corporation | Thermal gradient control for enhanced laser induced crystallization of predefined semiconductor areas |
-
1981
- 1981-10-29 US US06/316,210 patent/US4388145A/en not_active Expired - Lifetime
-
1982
- 1982-10-21 JP JP57183785A patent/JPS5880832A/ja active Pending
- 1982-10-29 DE DE8282305770T patent/DE3277154D1/de not_active Expired
- 1982-10-29 EP EP82305770A patent/EP0078681B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5880832A (ja) | 1983-05-16 |
EP0078681B1 (de) | 1987-09-02 |
EP0078681A2 (de) | 1983-05-11 |
US4388145A (en) | 1983-06-14 |
EP0078681A3 (en) | 1985-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |