DE3272669D1 - Plasma-reactor and its use in etching and coating substrates - Google Patents

Plasma-reactor and its use in etching and coating substrates

Info

Publication number
DE3272669D1
DE3272669D1 DE8282102224T DE3272669T DE3272669D1 DE 3272669 D1 DE3272669 D1 DE 3272669D1 DE 8282102224 T DE8282102224 T DE 8282102224T DE 3272669 T DE3272669 T DE 3272669T DE 3272669 D1 DE3272669 D1 DE 3272669D1
Authority
DE
Germany
Prior art keywords
reactor
etching
plasma
coating substrates
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282102224T
Other languages
English (en)
Inventor
Holger Dr Dipl Phys Hinkel
Gerhard Dr Kaus
Georg Kraus
Ulrich Dr Dipl Chem Kuenzel
Reinhold Muhl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
International Business Machines Corp
Original Assignee
IBM Deutschland GmbH
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH, International Business Machines Corp filed Critical IBM Deutschland GmbH
Application granted granted Critical
Publication of DE3272669D1 publication Critical patent/DE3272669D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
DE8282102224T 1982-03-18 1982-03-18 Plasma-reactor and its use in etching and coating substrates Expired DE3272669D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP82102224A EP0089382B1 (de) 1982-03-18 1982-03-18 Plasmareaktor und seine Anwendung beim Ätzen und Beschichten von Substraten

Publications (1)

Publication Number Publication Date
DE3272669D1 true DE3272669D1 (en) 1986-09-25

Family

ID=8188928

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282102224T Expired DE3272669D1 (en) 1982-03-18 1982-03-18 Plasma-reactor and its use in etching and coating substrates

Country Status (4)

Country Link
US (1) US4461237A (de)
EP (1) EP0089382B1 (de)
JP (1) JPS58168236A (de)
DE (1) DE3272669D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5947732A (ja) * 1982-09-10 1984-03-17 Hitachi Ltd 半導体製造装置
US4576698A (en) * 1983-06-30 1986-03-18 International Business Machines Corporation Plasma etch cleaning in low pressure chemical vapor deposition systems
DE3402971A1 (de) * 1984-01-28 1985-08-01 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur beschichtung eines substrates mittels plasma-chemical vapour deposition oder hochfrequenz-kathodenzerstaeubung
US4681653A (en) * 1984-06-01 1987-07-21 Texas Instruments Incorporated Planarized dielectric deposited using plasma enhanced chemical vapor deposition
US4630566A (en) * 1984-08-16 1986-12-23 Board Of Trustees Operating Michigan State University Microwave or UHF plasma improved apparatus
US4762728A (en) * 1985-04-09 1988-08-09 Fairchild Semiconductor Corporation Low temperature plasma nitridation process and applications of nitride films formed thereby
US4657616A (en) * 1985-05-17 1987-04-14 Benzing Technologies, Inc. In-situ CVD chamber cleaner
JP2793821B2 (ja) * 1988-11-22 1998-09-03 東京エレクトロン株式会社 プラズマ処理装置
US5089083A (en) * 1989-04-25 1992-02-18 Tokyo Electron Limited Plasma etching method
US5032202A (en) * 1989-10-03 1991-07-16 Martin Marietta Energy Systems, Inc. Plasma generating apparatus for large area plasma processing
US5298720A (en) * 1990-04-25 1994-03-29 International Business Machines Corporation Method and apparatus for contamination control in processing apparatus containing voltage driven electrode
EP0462730A1 (de) * 1990-06-18 1991-12-27 AT&T Corp. Verfahren und Vorrichtung zur Herstellung planarer Schichten für integrierte Schaltungen
JP3042127B2 (ja) * 1991-09-02 2000-05-15 富士電機株式会社 酸化シリコン膜の製造方法および製造装置
KR100829288B1 (ko) * 1998-12-11 2008-05-13 서페이스 테크놀로지 시스템스 피엘씨 플라즈마 처리장치
JP4454781B2 (ja) * 2000-04-18 2010-04-21 東京エレクトロン株式会社 プラズマ処理装置
US20020185226A1 (en) * 2000-08-10 2002-12-12 Lea Leslie Michael Plasma processing apparatus
WO2006009881A2 (en) * 2004-06-18 2006-01-26 Innovalight, Inc. Process and apparatus for forming nanoparticles using radiofrequency plasmas
DE102005029317A1 (de) * 2005-06-22 2006-12-28 Linde Ag Vorrichtung zum Einleiten von Stoffen in einen Reaktionsraum
DE102007047629A1 (de) * 2007-04-13 2008-10-16 Stein, Ralf Verfahren zum Aufbringen einer hochfesten Beschichtung auf Werkstücke und/oder Werkstoffe
JP6348321B2 (ja) * 2013-05-17 2018-06-27 キヤノンアネルバ株式会社 エッチング装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
SE7700229L (sv) * 1976-01-22 1977-07-23 Western Electric Co Forfarande for beleggning av substrat genom utfellning fran ett plasma
IT1203089B (it) * 1976-03-03 1989-02-15 Int Plasma Corp Procedimento ed apparecchiatura per eseguire reazioni chimiche nella regione della scarica luminescente di un plasma
DD135091A1 (de) * 1978-03-29 1979-04-11 Lothar Reissmueller Einrichtung zum beschichten durch hochratezerstaeubung mit dem plasmatron
US4230515A (en) * 1978-07-27 1980-10-28 Davis & Wilder, Inc. Plasma etching apparatus
JPS5562734A (en) * 1978-11-01 1980-05-12 Toshiba Corp Ion source and ion etching method
DD142568A1 (de) * 1979-03-22 1980-07-02 Harald Bilz EINRICHTUNG ZUM REAKTIVEN BESCHICHTEN MIT DEM PLASM&TRON
US4341593A (en) * 1979-08-17 1982-07-27 Tokuda Seisakusyo, Ltd. Plasma etching method for aluminum-based films
US4333814A (en) * 1979-12-26 1982-06-08 Western Electric Company, Inc. Methods and apparatus for improving an RF excited reactive gas plasma
US4324611A (en) * 1980-06-26 1982-04-13 Branson International Plasma Corporation Process and gas mixture for etching silicon dioxide and silicon nitride

Also Published As

Publication number Publication date
EP0089382B1 (de) 1986-08-20
JPS58168236A (ja) 1983-10-04
US4461237A (en) 1984-07-24
JPH0213810B2 (de) 1990-04-05
EP0089382A1 (de) 1983-09-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee