DE3269020D1 - Branched-spiral wafer-scale integrated circuit - Google Patents

Branched-spiral wafer-scale integrated circuit

Info

Publication number
DE3269020D1
DE3269020D1 DE8282306144T DE3269020T DE3269020D1 DE 3269020 D1 DE3269020 D1 DE 3269020D1 DE 8282306144 T DE8282306144 T DE 8282306144T DE 3269020 T DE3269020 T DE 3269020T DE 3269020 D1 DE3269020 D1 DE 3269020D1
Authority
DE
Germany
Prior art keywords
branched
integrated circuit
scale integrated
wafer
spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282306144T
Other languages
English (en)
Inventor
John Terence Chamberlain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Application granted granted Critical
Publication of DE3269020D1 publication Critical patent/DE3269020D1/de
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/006Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3185Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505Test of Modular systems, e.g. Wafers, MCM's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3185Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511Wafer Test
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C19/00Digital stores in which the information is moved stepwise, e.g. shift registers
DE8282306144T 1981-12-02 1982-11-18 Branched-spiral wafer-scale integrated circuit Expired DE3269020D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08136339A GB2114782B (en) 1981-12-02 1981-12-02 Branched-spiral wafer-scale integrated circuit

Publications (1)

Publication Number Publication Date
DE3269020D1 true DE3269020D1 (en) 1986-03-20

Family

ID=10526329

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282306144T Expired DE3269020D1 (en) 1981-12-02 1982-11-18 Branched-spiral wafer-scale integrated circuit

Country Status (7)

Country Link
US (1) US4519035A (de)
EP (1) EP0080834B1 (de)
JP (1) JPS58502077A (de)
BR (1) BR8207967A (de)
DE (1) DE3269020D1 (de)
GB (1) GB2114782B (de)
WO (1) WO1983002019A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3279328D1 (en) * 1981-12-08 1989-02-09 Unisys Corp Constant-distance structure polycellular very large scale integrated circuit
EP0096027B1 (de) * 1981-12-18 1987-03-11 BURROUGHS CORPORATION (a Delaware corporation) Labyrinthförmig verzweigte integrierte schaltung in wafer-grösse
GB8403229D0 (en) * 1984-02-07 1984-03-14 Standard Telephones Cables Ltd Wafer scale integrated circuit
DE3681463D1 (de) * 1985-01-29 1991-10-24 Secr Defence Brit Verarbeitungszelle fuer fehlertolerante matrixanordnungen.
GB2174518B (en) * 1985-04-15 1989-06-21 Sinclair Res Ltd Wafer scale integrated circuit
GB2177825B (en) * 1985-07-12 1989-07-26 Anamartic Ltd Control system for chained circuit modules
GB2181280B (en) * 1985-09-30 1989-09-06 Anamartic Ltd Improvements relating to wafer scale integrated circuits
GB2181870B (en) * 1985-10-14 1988-11-23 Anamartic Ltd Control circuit for chained circuit modules
GB2185836B (en) * 1986-01-28 1988-11-16 Anamartic Ltd Improvements relating to wafer scale integrated circuits
EP0424979A3 (en) 1986-03-18 1991-07-03 Anamartic Limited Random address system for circuit modules
GB8612454D0 (en) * 1986-05-22 1986-07-02 Inmos Ltd Redundancy scheme for multi-stage apparatus
AU3059689A (en) * 1988-02-04 1989-08-25 City University, The Improvements in or relating to data handling arrays
GB8825780D0 (en) * 1988-11-03 1988-12-07 Microcomputer Tech Serv Digital computer
US5020059A (en) * 1989-03-31 1991-05-28 At&T Bell Laboratories Reconfigurable signal processor
US5203005A (en) * 1989-05-02 1993-04-13 Horst Robert W Cell structure for linear array wafer scale integration architecture with capability to open boundary i/o bus without neighbor acknowledgement
GB2244826A (en) * 1990-06-08 1991-12-11 Anamartic Ltd Linking circuit modules
US5399505A (en) * 1993-07-23 1995-03-21 Motorola, Inc. Method and apparatus for performing wafer level testing of integrated circuit dice
US5654588A (en) * 1993-07-23 1997-08-05 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5594273A (en) * 1993-07-23 1997-01-14 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield
US6577148B1 (en) 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US8074110B2 (en) * 2006-02-28 2011-12-06 Intel Corporation Enhancing reliability of a many-core processor
US9470760B2 (en) * 2011-04-01 2016-10-18 International Business Machines Corporation Functional ASIC verification using initialization microcode sequence

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3665406A (en) * 1970-04-13 1972-05-23 Bunker Ramo Automatic polling systems
US4060713A (en) * 1971-06-23 1977-11-29 The Perkin-Elmer Corporation Analysis of images
GB1377859A (en) * 1972-08-03 1974-12-18 Catt I Digital integrated circuits
US3794983A (en) * 1973-04-17 1974-02-26 K Sahin Communication method and network system
US4038648A (en) * 1974-06-03 1977-07-26 Chesley Gilman D Self-configurable circuit structure for achieving wafer scale integration
US3961251A (en) * 1974-12-20 1976-06-01 International Business Machines Corporation Testing embedded arrays
US4020469A (en) * 1975-04-09 1977-04-26 Frank Manning Programmable arrays
US4037205A (en) * 1975-05-19 1977-07-19 Sperry Rand Corporation Digital memory with data manipulation capabilities
US4191996A (en) * 1977-07-22 1980-03-04 Chesley Gilman D Self-configurable computer and memory system
US4215401A (en) * 1978-09-28 1980-07-29 Environmental Research Institute Of Michigan Cellular digital array processor

Also Published As

Publication number Publication date
EP0080834B1 (de) 1986-02-05
GB2114782A (en) 1983-08-24
EP0080834A3 (en) 1983-07-13
EP0080834A2 (de) 1983-06-08
BR8207967A (pt) 1983-10-04
WO1983002019A1 (en) 1983-06-09
US4519035A (en) 1985-05-21
GB2114782B (en) 1985-06-05
JPS58502077A (ja) 1983-12-01

Similar Documents

Publication Publication Date Title
DE3277047D1 (en) Integrated circuit device
DE3279013D1 (en) Semiconductor integrated circuit
GB2102602B (en) Interface circuit
GB2101374B (en) Interface circuit
GB8314676D0 (en) Integrated weblocker
JPS571256A (en) Integrated circuit
DE3269020D1 (en) Branched-spiral wafer-scale integrated circuit
GB8401959D0 (en) Integrated circuit
GB8309726D0 (en) Integrated circuit arrangement
JPS5760779A (en) Integrated interface circuit
GB2136649B (en) Integrated circuit
GB2091459B (en) Semiconductor integrated circuit
DE3272424D1 (en) Semiconductor integrated circuit
DE3274040D1 (en) An integrated logic circuit
GB8328605D0 (en) Integrated circuit
GB2100543B (en) Chatter-prevention circuit
DE3175781D1 (en) Integrated circuit
DE3275613D1 (en) Semiconductor circuit
DE3264963D1 (en) Semiconductor integrated circuit
GB8412360D0 (en) Integrated circuit
DE3271634D1 (en) Output circuit
DE3273549D1 (en) Restructurable integrated circuit
JPS57169275A (en) Single chip integrated circuit
JPS57207358A (en) Circuit with semiconductor integrated circuit
JPS56122211A (en) Integrated circuit

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee