DE3067705D1 - Heat sink member and aircooling system for semiconductor modules - Google Patents

Heat sink member and aircooling system for semiconductor modules

Info

Publication number
DE3067705D1
DE3067705D1 DE8080106265T DE3067705T DE3067705D1 DE 3067705 D1 DE3067705 D1 DE 3067705D1 DE 8080106265 T DE8080106265 T DE 8080106265T DE 3067705 T DE3067705 T DE 3067705T DE 3067705 D1 DE3067705 D1 DE 3067705D1
Authority
DE
Germany
Prior art keywords
aircooling
heat sink
semiconductor modules
sink member
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080106265T
Other languages
English (en)
Inventor
Edgar Crawford Leaycraft
Sevgin Oktay
Carl David Ostergren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3067705D1 publication Critical patent/DE3067705D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/908—Fluid jets
DE8080106265T 1979-11-23 1980-10-15 Heat sink member and aircooling system for semiconductor modules Expired DE3067705D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/096,942 US4296455A (en) 1979-11-23 1979-11-23 Slotted heat sinks for high powered air cooled modules

Publications (1)

Publication Number Publication Date
DE3067705D1 true DE3067705D1 (en) 1984-06-07

Family

ID=22259852

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080106265T Expired DE3067705D1 (en) 1979-11-23 1980-10-15 Heat sink member and aircooling system for semiconductor modules

Country Status (5)

Country Link
US (1) US4296455A (de)
EP (1) EP0029501B1 (de)
JP (1) JPS5676554A (de)
CA (1) CA1140681A (de)
DE (1) DE3067705D1 (de)

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US20050211418A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
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US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
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JPS6234450Y2 (de) * 1978-06-07 1987-09-02

Also Published As

Publication number Publication date
EP0029501B1 (de) 1984-05-02
EP0029501A3 (en) 1981-06-17
CA1140681A (en) 1983-02-01
EP0029501A2 (de) 1981-06-03
JPS5676554A (en) 1981-06-24
JPS5719864B2 (de) 1982-04-24
US4296455A (en) 1981-10-20

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee