DE3061985D1 - Air cooled electronic assemblies - Google Patents

Air cooled electronic assemblies

Info

Publication number
DE3061985D1
DE3061985D1 DE8080102089T DE3061985T DE3061985D1 DE 3061985 D1 DE3061985 D1 DE 3061985D1 DE 8080102089 T DE8080102089 T DE 8080102089T DE 3061985 T DE3061985 T DE 3061985T DE 3061985 D1 DE3061985 D1 DE 3061985D1
Authority
DE
Germany
Prior art keywords
air cooled
electronic assemblies
cooled electronic
assemblies
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080102089T
Other languages
English (en)
Inventor
Un-Pah Hwang
Robert Edward Simons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3061985D1 publication Critical patent/DE3061985D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
DE8080102089T 1979-06-28 1980-04-18 Air cooled electronic assemblies Expired DE3061985D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/052,998 US4233644A (en) 1979-06-28 1979-06-28 Dual-pull air cooling for a computer frame

Publications (1)

Publication Number Publication Date
DE3061985D1 true DE3061985D1 (en) 1983-03-24

Family

ID=21981255

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080102089T Expired DE3061985D1 (en) 1979-06-28 1980-04-18 Air cooled electronic assemblies

Country Status (5)

Country Link
US (1) US4233644A (de)
EP (1) EP0020912B1 (de)
JP (1) JPS568591A (de)
CA (1) CA1124381A (de)
DE (1) DE3061985D1 (de)

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JPS57159115U (de) * 1981-03-31 1982-10-06
JPS58153398A (ja) * 1982-03-05 1983-09-12 株式会社日立製作所 電子機器の冷却機構
JPS619890U (ja) * 1984-06-20 1986-01-21 株式会社 三社電機製作所 風冷式電気機器
FR2570920B1 (fr) * 1984-09-26 1994-09-30 Nec Corp Appareil de refroidissement par air de dispositifs electroniques
AT384343B (de) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich Gehaeuseanordnung fuer belueftete geraete, vorzugsweise der leistungselektronik
US4860444A (en) * 1986-03-31 1989-08-29 Microelectronics And Computer Technology Corporation Method of assembling a fluid-cooled integrated circuit package
US4691274A (en) * 1986-04-29 1987-09-01 Modular Power Corporation Modular electronic power supply
US4672509A (en) * 1986-08-07 1987-06-09 Ncr Corporation Air cooling assembly in an electronic system enclosure
CH672210A5 (de) * 1986-10-01 1989-10-31 Zellweger Uster Ag
FR2609233A1 (fr) * 1986-12-30 1988-07-01 Bull Sa Dispositif de ventilation de composants disposes en rangees sur une plaque
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US4748540A (en) * 1987-04-24 1988-05-31 Honeywell Bull Inc. Compact packaging of electronic equipment within a small profile enclosure
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5103374A (en) * 1990-05-23 1992-04-07 At&T Bell Laboratories Circuit pack cooling using turbulators
US5107397A (en) * 1990-12-19 1992-04-21 At&T Bell Laboratories Technique for component placement and orientation to improve circuit pack cooling
US5202816A (en) * 1991-05-20 1993-04-13 Dewilde Mark A High density circuit board chassis cooling system
US5484262A (en) * 1992-10-23 1996-01-16 Nidec Corporation Low profile fan body with heat transfer characteristics
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5864466A (en) * 1994-07-19 1999-01-26 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5528454A (en) * 1994-12-29 1996-06-18 Compuserve Incorporated Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices containing same
IN192538B (de) * 1995-02-01 2004-05-01 Intel Corp
US5493474A (en) * 1995-02-14 1996-02-20 Hewlett-Packard Company Enclosure with redundant air moving system
US5477416A (en) * 1995-02-14 1995-12-19 Hewlett-Packard Company Enclosure with metered air ducts for mounting and cooling modules
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5707282A (en) * 1996-02-28 1998-01-13 Hewlett-Packard Company Fan diffuser
US5638895A (en) * 1996-03-25 1997-06-17 Dodson; Douglas A. Twin fan cooling device
US5787971A (en) * 1996-03-25 1998-08-04 Dodson; Douglas A. Multiple fan cooling device
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US6069792A (en) * 1997-09-16 2000-05-30 Nelik; Jacob Computer component cooling assembly
US6253834B1 (en) 1998-10-28 2001-07-03 Hewlett-Packard Company Apparatus to enhance cooling of electronic device
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US7028753B2 (en) * 2000-09-20 2006-04-18 Hewlett-Packard Development Company, L.P. Apparatus to enhance cooling of electronic device
US6684942B2 (en) * 2000-12-23 2004-02-03 Korea Advanced Institute Of Science & Technology Heat sink
WO2003030608A1 (en) * 2001-10-04 2003-04-10 Celestica International Inc. Cooling system having independent fan location
US6765796B2 (en) 2002-11-21 2004-07-20 Teradyne, Inc. Circuit board cover with exhaust apertures for cooling electronic components
US6816372B2 (en) * 2003-01-08 2004-11-09 International Business Machines Corporation System, method and apparatus for noise and heat suppression, and for managing cables in a computer system
US20050254208A1 (en) * 2004-05-17 2005-11-17 Belady Christian L Air flow direction neutral heat transfer device
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
CN102112887B (zh) 2008-06-03 2015-06-10 泰拉丁公司 处理存储设备
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
US9253928B2 (en) * 2011-06-27 2016-02-02 Henkel IP & Holding GmbH Cooling module with parallel blowers
US8767400B2 (en) 2011-06-27 2014-07-01 The Bergquist Torrington Company Cooling module with parallel blowers
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
JP2016004872A (ja) * 2014-06-16 2016-01-12 日立金属株式会社 信号伝送装置および冷却装置
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
CN108770298A (zh) * 2018-06-14 2018-11-06 马鞍山方融信息科技有限公司 一种防潮室外弱电通讯箱
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH522057A (de) * 1970-05-29 1972-04-30 Staeubli Ag Einrichtung an einer Schaftmaschine mit Antriebswelle und darauf gelagertem Exzenterring, zum Blockieren im Stillstand oder Sichern eines Keiles beim Kuppeln des Exzenterringes mit der Antriebswelle oder der Kurbelstange
JPS4822146U (de) * 1971-07-21 1973-03-13
FR2157094A5 (de) * 1971-10-18 1973-06-01 Thomson Csf
JPS5259844A (en) * 1975-11-12 1977-05-17 Hitachi Ltd Rack mounted with electronic parts

Also Published As

Publication number Publication date
EP0020912B1 (de) 1983-02-16
JPS568591A (en) 1981-01-28
EP0020912A1 (de) 1981-01-07
JPH0142157B2 (de) 1989-09-11
CA1124381A (en) 1982-05-25
US4233644A (en) 1980-11-11

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee