DE2965860D1 - Semiconductor absolute pressure transducer assembly - Google Patents

Semiconductor absolute pressure transducer assembly

Info

Publication number
DE2965860D1
DE2965860D1 DE7979103666T DE2965860T DE2965860D1 DE 2965860 D1 DE2965860 D1 DE 2965860D1 DE 7979103666 T DE7979103666 T DE 7979103666T DE 2965860 T DE2965860 T DE 2965860T DE 2965860 D1 DE2965860 D1 DE 2965860D1
Authority
DE
Germany
Prior art keywords
pressure transducer
absolute pressure
transducer assembly
semiconductor absolute
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7979103666T
Other languages
English (en)
Inventor
Kazuji Yamada
Seiko Suzuki
Motohisa Nishihara
Kanji Kawakami
Hideo Sato
Shigeyuki Kobori
Ryosaku Kanzawa
Minoru Takahashi
Hitoshi Minorikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14750893&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE2965860(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE2965860D1 publication Critical patent/DE2965860D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
DE7979103666T 1978-09-27 1979-09-27 Semiconductor absolute pressure transducer assembly Expired DE2965860D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11901678A JPS5544786A (en) 1978-09-27 1978-09-27 Pressure sensor

Publications (1)

Publication Number Publication Date
DE2965860D1 true DE2965860D1 (en) 1983-08-18

Family

ID=14750893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7979103666T Expired DE2965860D1 (en) 1978-09-27 1979-09-27 Semiconductor absolute pressure transducer assembly

Country Status (6)

Country Link
US (1) US4291293A (de)
EP (1) EP0010204B2 (de)
JP (1) JPS5544786A (de)
AU (1) AU528367B2 (de)
CA (1) CA1115857A (de)
DE (1) DE2965860D1 (de)

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US4411158A (en) * 1981-04-14 1983-10-25 Ametek, Inc. Apparatus for sensing the condition of a fluid
DE3118366A1 (de) * 1981-05-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Drucksensor
JPS5828876A (ja) * 1981-08-12 1983-02-19 Mitsubishi Electric Corp 半導体圧力センサ装置
US4463336A (en) * 1981-12-28 1984-07-31 United Technologies Corporation Ultra-thin microelectronic pressure sensors
DE3207833A1 (de) * 1982-03-04 1983-09-15 Siemens AG, 1000 Berlin und 8000 München Halbleiter-drucksensor
US4527428A (en) * 1982-12-30 1985-07-09 Hitachi, Ltd. Semiconductor pressure transducer
USRE33518E (en) * 1983-04-29 1991-01-15 Baxter International, Inc. Pressure transducer assembly
HU187896B (en) * 1983-05-05 1986-02-28 Banyaszati Aknamelyitoe Vallalat,Hu Apparatus for determining and indicating the necessary quantity of gas in order to leave a dngerous place in safety, applicable to a basic apparatus with a tank containing gas /oxigen or air/ for people working in dangerous places and with gas feeding organs, applicable preferably to fleeing apparatuses of mining industry
US4545255A (en) * 1984-01-17 1985-10-08 Environmental Control Technology, Inc. Low pressure transducer
EP0161740B1 (de) * 1984-05-09 1991-06-12 Kabushiki Kaisha Toshiba Verfahren zur Herstellung eines Halbleitersubstrates
JPS6341080A (ja) * 1986-08-06 1988-02-22 Nissan Motor Co Ltd 半導体加速度センサ
CA1314410C (en) * 1986-12-08 1993-03-16 Masanori Nishiguchi Wiring structure of semiconductor pressure sensor
JPH0810170B2 (ja) * 1987-03-06 1996-01-31 株式会社日立製作所 半導体絶対圧力センサの製造方法
JP2638813B2 (ja) * 1987-04-09 1997-08-06 株式会社デンソー 半導体圧力センサ
GB8718637D0 (en) * 1987-08-06 1987-09-09 Spectrol Reliance Ltd Sealing electrical feedthrough
US4926155A (en) * 1988-12-12 1990-05-15 Johnson Service Company Integrated circuit silicon pressure transducer package
DE68928611T2 (de) * 1988-12-21 1998-11-12 Gte Prod Corp Lampenquarzkolben mit Molybdanfolie mit Oxydationsbeständiger Fläche, gebildet durch Ionenimplantation
US5155061A (en) * 1991-06-03 1992-10-13 Allied-Signal Inc. Method for fabricating a silicon pressure sensor incorporating silicon-on-insulator structures
WO1993008035A1 (de) * 1991-10-14 1993-04-29 Rainer Achterholt Verfahren, vorrichtung und ventil zum messen und anzeigen des druckes in einem luftreifen
DE4133993C2 (de) * 1991-10-14 1994-06-09 Rainer Achterholt Vorrichtung zum Messen und Anzeigen des Druckes in einem Luftreifen
DE4133999C2 (de) * 1991-10-14 1994-06-09 Rainer Achterholt Ein Drucksignal erzeugendes Reifenventil
DE4133991C2 (de) * 1991-10-14 1994-05-05 Rainer Achterholt Ein Drucksignal erzeugende Ventilkappe für einen mit einem Reifenventil ausgerüsteten Luftreifen
WO1993008036A1 (de) * 1991-10-14 1993-04-29 Rainer Achterholt Verfahren, vorrichtung und ventilkappe zum messen und anzeigen des druckes in einem luftreifen
US5581028A (en) * 1994-06-23 1996-12-03 Hewlett Packard Company Fluid property sensors incorporating plated metal rings for improved packaging
JP3383081B2 (ja) * 1994-07-12 2003-03-04 三菱電機株式会社 陽極接合法を用いて製造した電子部品及び電子部品の製造方法
US5591679A (en) * 1995-04-12 1997-01-07 Sensonor A/S Sealed cavity arrangement method
US5742222A (en) * 1995-05-26 1998-04-21 Avi Systems, Inc. Direct adhering polysilicon based strain gage
JPH0915074A (ja) * 1995-06-27 1997-01-17 Mitsubishi Electric Corp 半導体圧力検出装置及びその製造方法
US5600071A (en) * 1995-09-05 1997-02-04 Motorola, Inc. Vertically integrated sensor structure and method
DE19800574B4 (de) * 1998-01-09 2013-11-14 Robert Bosch Gmbh Mikromechanisches Bauelement
JP2000065662A (ja) * 1998-08-20 2000-03-03 Unisia Jecs Corp 圧力センサおよびその製造方法
EP1234330A2 (de) * 1999-10-19 2002-08-28 Imego Ab Methode für anodisches bonden
US6951797B1 (en) 1999-10-19 2005-10-04 Imego Ab Method relating to anodic bonding
US6612175B1 (en) * 2000-07-20 2003-09-02 Nt International, Inc. Sensor usable in ultra pure and highly corrosive environments
US7152478B2 (en) * 2000-07-20 2006-12-26 Entegris, Inc. Sensor usable in ultra pure and highly corrosive environments
US6564642B1 (en) 2000-11-02 2003-05-20 Kavlico Corporation Stable differential pressure measuring system
US6581468B2 (en) 2001-03-22 2003-06-24 Kavlico Corporation Independent-excitation cross-coupled differential-pressure transducer
WO2003019201A1 (en) * 2001-08-24 2003-03-06 Honeywell International Inc. Hermetically sealed silicon micro-machined electromechanical system (mems) device having diffused conductors
US8718738B2 (en) * 2002-03-08 2014-05-06 Glt Acquisition Corp. Method and apparatus for coupling a sample probe with a sample site
US20090318786A1 (en) * 2002-03-08 2009-12-24 Blank Thomas B Channeled tissue sample probe method and apparatus
US8504128B2 (en) * 2002-03-08 2013-08-06 Glt Acquisition Corp. Method and apparatus for coupling a channeled sample probe to tissue
US20030183943A1 (en) * 2002-03-28 2003-10-02 Swan Johanna M. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6908845B2 (en) * 2002-03-28 2005-06-21 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6848177B2 (en) 2002-03-28 2005-02-01 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
EP1460037A1 (de) * 2003-03-18 2004-09-22 SensoNor asa Mehrlagiges Bauelement und dessen Herstellungsverfahren
EP1522521B1 (de) * 2003-10-10 2015-12-09 Infineon Technologies AG Kapazitiver Sensor
US7816745B2 (en) * 2005-02-25 2010-10-19 Medtronic, Inc. Wafer level hermetically sealed MEMS device
US7622782B2 (en) * 2005-08-24 2009-11-24 General Electric Company Pressure sensors and methods of making the same
DE602007012995D1 (de) * 2007-01-31 2011-04-21 Infineon Technologies Ag Mikromechanischer Drucksensor
US10067022B2 (en) * 2016-08-05 2018-09-04 Denso International America, Inc. Absolute pressure sensor

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3595719A (en) * 1968-11-27 1971-07-27 Mallory & Co Inc P R Method of bonding an insulator member to a passivating layer covering a surface of a semiconductor device
US3820401A (en) * 1972-11-07 1974-06-28 Sperry Rand Corp Piezoresistive bridge transducer
JPS5624387B2 (de) * 1973-10-09 1981-06-05
US3918019A (en) * 1974-03-11 1975-11-04 Univ Leland Stanford Junior Miniature absolute pressure transducer assembly and method
US4079508A (en) * 1975-08-13 1978-03-21 The Board Of Trustees Of The Leland Stanford Junior University Miniature absolute pressure transducer assembly and method
US4023562A (en) * 1975-09-02 1977-05-17 Case Western Reserve University Miniature pressure transducer for medical use and assembly method
DE2617731C3 (de) * 1976-04-23 1979-06-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Miniaturdruckmeßwandler

Also Published As

Publication number Publication date
AU5100679A (en) 1980-04-03
AU528367B2 (en) 1983-04-28
EP0010204B2 (de) 1986-07-16
JPS6313356B2 (de) 1988-03-25
CA1115857A (en) 1982-01-05
US4291293A (en) 1981-09-22
JPS5544786A (en) 1980-03-29
EP0010204A1 (de) 1980-04-30
EP0010204B1 (de) 1983-07-13

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Legal Events

Date Code Title Description
8366 Restricted maintained after opposition proceedings
8339 Ceased/non-payment of the annual fee