DE2534777A1 - PROCESS FOR SOLDERING METALS AND MATERIALS ON THE DIAMOND OR BORNITRIDE BASE AND SOLDER FOR CARRYING OUT THIS PROCESS - Google Patents

Description

P AT EN TA Γ-3 WA LT
Dipl.-Phys. R. Luykon

0MÜNCHEN2 .TAL27 OCQ L 7 7

TEL-221527 ^/0 ° ^ ''

1. Institut problem materialovedenija Akademii Nauk Ukrainskbj SSR, Kiev / USSR

2. Tomilinskij zawod Almaznogo instrumenta, Stanaja Tomilino Moskovskoj oblasti / ÜdSSH

3. Vsesojuznyj nautschno-issledovatelskid institut abrazivoT i schlifowanija, Leningrad / tJdSSR

P 61 470

4th August 1975

FOR SOLDERING METALS AND MATERIALS AUP THE DIAMOND OR BORNITRIDE - FOUNDATION AND SOLDER TO PERFORM THIS PROCEDURE

The present invention relates to methods of soldering of metals and materials based on diamond and boron nitride and solders for carrying out these processes,

The invention is expediently used, for example, in soldering of cutting elements made of 7 / mineral materials based on diamond, boron nitride and of metal with subsequent manufacture of cutting and sole tools.

and are known on the diamond boron nitride

- New superhard artificial foundation created Materials used as cutting elements for cutting

and grinding tools are used.

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Since the new, over-hard materials, e.g. compared to natural diamonds, have a low temperature when transitioning to a hexagonal codification, increased brittleness and decreased Have strength, increased chemical resistance and coefficients of thermal expansion that differ from the metals, with which they can be soldered differ greatly, questions about the development of new soldering processes and new solders are increasing which are most suitable for these purposes. As practice shows, the known methods and solders correspond to soldering and metallizing does not fully meet the requirements of new materials intended for the manufacture of cutting and grinding tools Requirements.

A method is known for pouring a liquid solder into the gap between natural diamond and metal under vacuum at a temperature of 900 to 1100 ^° C. The solders are gold-tantalum, gold-niobium, silver-copper-titanium, silver Titanium alloys and alloys containing aluminum and silicon are used (French patent specification No. 1,332,423, US patent specification No. 3,192,620, GB patent specification No. 932,729, 1,151,666, 2,031,913).

Through the process, adhesive strengthens the soldering guaranteed.

A method is known for pressing the diamond crystals into a copper-tin-titanium dead metal powder (Japanese Patent No. 47-44134) or in an alloy on the

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Copper-Tin-Chromium-Tungsten Base (UK Patent No. 1114352 with subsequent liquid phase sintering · By this process no adhesive strength of the soldering also guaranteed

The soldering processes listed have limited use because they are used to generate thermal stresses in soldered joints lead to what happens when soldering particularly brittle materials such as saiamel crystals from over-hard materials on the diamond-boron nitride basis brings about cracking in the body of the overhard material. In addition, the proceedings are due the use of the high vacuum apparatus is not very productive

A method for soldering metal and diamond is known in which a metallization coating made of titanium, zirconium underneath Placement in a vacuum at a temperature that is sufficient to achieve adhesion of the metallization coating to the diamond, with further implementation of the soldering of Ketall and the metallized diamond with silver-copper solder at his Melting point is applied to the soldering surface of the diamond in a vacuum.

By using a plastic solder, the

Elimination

Process the solder seam strength and that of the thermal stresses in the solder joint safely · A disadvantage of the However, the process forms its insufficient reliability due to the easy (strong) oxidizability of the titanium and zirconium coating, which often leads to a decline in the quality of the soldering (reduction in adhesion). Because of the use of the vacuum apparatus the process is also not very productive.

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When soldering and metallizing diamond and boron nitride, a solder based on copper-tin-titanium alloy is used gen (Japanese Patent Publication No. 47-44134), which is the materials based on diamond and boron nitride versus one has high adhesion, most commonly used.

The main disadvantage of this solder is that _{it is} not very plastic, brittle and that its coefficient of thermal expansion differs from the same coefficient for new types of superhard materials based on diamond, boron nitride.All this inevitably leads to thermal stresses in the solder, which cause a large number of hoists on the cutting element and rapid tool wear during work.

The invention is based on the object of providing a method for soldering metals and materials on the diamond and boron nitride-based as well as a solder to implement the process to be developed by the metallization coating used the production of a reliable soldered connection with high strength and tension-free soldered connections (by reducing the possibility of oxidation of the metallization coating for materials based on diamond, boron nitride) and an increase in the performance of the soldering process (in Considering the possibility of soldering in air) able to guarantee.

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This object is achieved in that, in a method for soldering metals and materials on the boron nitride and diamond basis, in which a metallization coating, placing the materials to be soldered in a medium at a temperature necessary for achieving adhesion of the metallization coating to the Soldering materials is sufficient, with further implementation of the soldering of the metal and the material coated with a metallization layer with solders that are plastic and have a melting point of up to 1000 ^° C., is applied to the soldering surface of the materials on the diamond and boron nitride base, according to the invention Metals which have a high level of adhesion to the materials based on diamond and boron nitride and which are used in an amount of 3.0 to 65.0% by weight of the total weight of the coating.

as the remainder S
Det are, as well as'Metalle, which have a reduced oxidisability, form the remainder are used as a metallization coating, while the soldering process takes place in air under a layer of a liquid flux, which is intended for soldering metals with metallic brazing alloys.

The selected adhesive-active metals for the metallization coating with oily materials on the diamond, thus rid basis ensure the adhesion due to their chemical interaction with diamond and boron nitride at temperatures that are sufficient for a chemical reaction (T = 800 to 1000 ⁰ C) ), and those in) with regard to diamond and boron nitride are not

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Adhesively active metals essentially take over the function the oxidation protection of the highly adhesive active metals, To achieve a high adhesion of the metallization coating to the materials on the diamond, boron nitride basis became a optimal concentration range of adhesive-active metals and metals that have a reduced oxidizability, selected ·

To increase the performance of the soldering process, it is carried out in air. The soldering process is carried out under a layer of a liquid flux, which is intended for soldering metals with metallic hard solders because of their low melting point (T s 500 to 700 ⁰ C), so that the high

Adhesion of the metallization coating to the materials on the diamond, boron nitride basis is retained.

As a keball, which has a high adhesive activity to the materials on the diamond and boron nitride basis, can chromium and / or tungsten, molybdenum ^ tantalum, titanium and, as metals, which have a reduced oxidizability, copper and / or silver, tin, lead, nickel, cobalt can be used with the greatest success.

Of the metals mentioned with high adhesion, titanium is the most highly adhesive, while chromium, tungsten, molybdenum, In addition to the high adhesive activity, tantalum has a lower oxidizability compared to titanium; the use of the the latter is most effective.

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In addition to the property mentioned, the metals mentioned, with reduced oxidizability, also have a high level of oxidation Plasticity, which is an additional indispensable condition of the method according to the invention, and good wettability with solder alloys.

The metallization coating is expediently used to achieve firm adhesion and low oxidizability of the metallization coating for the materials on the boron

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nitride and diamond base applied in two stages '' first with the layer of a hard metal, which opposes the materials on the diamond and boron nitride base, which at a temperature T = 800 ⁰ C to 1000 ⁰ C in a vacuum a chemical reaction enter with these materials, whereby a high adhesion of the metallized coating is achieved, has a high Ηε & activity.

To achieve a high level of adhesion, the optimal layer thickness can be 0.0005 to 0.001 mm. Then additionally with the layer of a hard metal,

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the little oxidizable is the function of the oxidation protection

de a ^ -
the layer 'adhesive-active η metal ^ takes over and has good wettability with common solder alloys, coated. The optimum thickness of this layer can be 0.001 to 0.01 mm.

Another equivalent variant of the application of the metallization coating on the materials on the diamond, bornite

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rid-basis which is also firmly adhesive and not very oxidizable is, forms the application of the coating in the form of a metal melt, which has a high adhesive activity towards the materials to be metallized · The adhesion occurs due to the chemical adsorption of an adhesive-active component of the Melt on the material based on diamond, boron nitride and its interaction in a vacuum (or in a protective atmosphere) at a temperature sufficient for a chemical reaction to take place, while the outer layer of the alloy denies

t provides optimal protection against oxidation of the metallized coating. The "thickness of the metallized coating is 0.01 to 0.5 mm.

The metallization process of the surface of a Y / er material on the boron nitride or diamond basis can be any: metal vapor deposition with electron beam heating and deposition of metal vapors on a relatively cold sample (T = 200 to 50O ⁰ C), electrolytic deposition of metals on the material and their subsequent Annealing to achieve the adhesion, immersion of the material in the adhesive melt, application of powdered pastes of the adhesive alloy mixed with an easily burnable organic adhesive and their subsequent baking to achieve a firm adhesion of the metallization layer to the surface, etc. As already mentioned, this forms the preservation a high degree of adhesion of the coating to the surface of the material, which is achieved by using the materials on the boron nitride, diamond

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"y -

-Based against adhesive-active metals and by annealing in a vacuum (argon, helium) at temperatures of the course of chemical reactions at the limit diamond or boron nitride and adhesive-active metals is achieved, an indispensable condition when metallizing materials.

The most expedient are those soldering conditions, under which the process at the melting point of the solder 0.5 t> is 2 minutes with a heating and cooling rate of the surfaces to be soldered of 10 to 30 degrees / sec using a liquid flux that is used for Soldering of metals with metallic hard solders is intended and has a melting point of 500 to 700 ⁰ C is carried out.

Under such operating conditions, the oxygen access to the metallized surface of the materials on the boron nitride, diamond basis, beginning with T = 500 ⁰ C prevents (that · at the beginning of intensive oxidation of the coating and failure of adhesion bonds).

The most common use is the flux with the following composition in% by weight:

Boric anhydride 35

dehydrated potassium fluoride 42

Potassium fluoroborate 23

This composition and the ratio of the components ensure a melting point of 500 ° C and unchangeable Properties during the entire soldering process

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According to the invention, the task set is also achieved by a solder for soldering metals and the materials on the diamond and / or boron nitride base dissolved, the copper, Contains tin and titanium and that in addition to the components mentioned in the following ratio in% by weight:

Copper 13 to 60

Tin 5 to 15

Titan 5 to 25

also in% by weight

Lead 2 to 15

Contains molybdenum and / or tungsten, remainder of tantalum.

The solders based on copper-tin-titanium have a melting point of up to 100O ⁰ Cy, ie an initial temperature at the transition from diamond and cubic (wurtzite) boron nitride to hexagonal modifications and also have a high adhesive activity with regard to the materials on the diamond and Boron nitride based.

The combination of these components of the solder with lead increases the fluidity and plasticity of the solder and the presence of 7 / olfram, molybdenum and tantalum reduces its coefficient of thermal expansion by bringing this coefficient closer to that for materials based on diamond, boron nitride. The tin-copper ratio was selected from the conditions of the strength properties and the melting point of the solder.

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A titan of less than 5 wt.? 5 leads to a severe drop in adhesion and more than 25% by weight of the undesirable Embrittlement of the solder.

The lead content of more than 15% by weight in the solder can lead to a lead to a substantial reduction in its strength properties.

The content of metals of the molybdenum, and / or 7, 'olfram- Tantalum group of more than 40 wt.% Brings an increase in the Melting point of the solder with it, which is because of the possible transition from diamond and cubic (wurtzite) boron nitride to hexagonal Modifications is undesirable.

In order to approximate the coefficient of thermal expansion of the For solder and materials based on diamond and boron nitride, the solder contains a non-metallic filler in one Kenge from 0.5 to 20% by weight with a content of molybdenum, Wolf ram, tantalum from 0.3 to 20 Gevi.%.

In order to increase the plasticity of solder, it is convenient to take the non-metallic filler in the form of a powder with 1 to 50 M, / ΠKorngröße.

This grain size of the powder creates permanent microporosity in the solder, which increases its plasticity promotes.

The present invention is explained in more detail below on the basis of a specific exemplary embodiment.

A method for soldering metals and materials on the boron nitride and diamond basis is proposed, be j

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a ketallization coating with placement of the materials to be soldered in a medium at a temperature which is sufficient to achieve the adhesion of the metallization coating to the materials to be soldered, with further implementation of the soldering of metal and the material coated with a metallization layer with solder, which are plastic and have a melting point of up to 1000 ⁰ C, is applied to the soldering surface of the materials on the boron nitride and diamond base. Invention-js-

As a metallization coating , metals that have a high adhesive activity, namely chromium and / or molybdenum, tantalum, tungsten, titanium in an amount of 3 »0 to 65 wt. % of the total weight of the coating and metals that have a reduced oxidisability, namely copper and / or silver, lead, tin, nickel, cobalt - remainder - use.

The coating is applied in two stages: first with a layer of hard metal, which gives the materials based on diamond and boron nitride a high adhesive activity has, up to a layer thickness of 0.0005 to 0.001 mm and then with a layer of hard metal, which is little oxidizable, up to a layer thickness of 0.001 to 0.01 mm.

Another variant is the application of the coating in the form of a metal melt, which consists of metals, which are compared to the materials on the diamond and boron nitride basis have a high adhesive activity, and of metals that have a

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have low oxidizability, with a layer thickness of 0.01 to 0.5 mm.

The soldering process is at the melting point of the solder 0.5 his

Away,

min with a heating and cooling rate of

Solder areas from 10 to 30 degrees / sak in air and a layer of /
liquid mflux carried out. The flux finds wounds when soldering metals with metallic hard solders. The melting point of this flux beträft 500 to 600 ⁰ C, and its properties do not change up to a temperature of 1000 ⁰ C.

One of the possible compositions of flux no. Can look like this: Flux no, 1 (composition in Wt.%):

Boric anhydride 35

dehydrated potassium fluoride 42

Potassium fluoroborate 23

The other flux No. 2, which is similar in properties to the first, has the following composition in% by weight:

Boric acid 70

Calcium fluoride 9

Borax 21

It is possible to use the flux no. 3 having the following composition in wt.% /

Boric acid 20

Borax 80

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or of the flux No. 4 with the following composition in Weight%:

Sodium fluoride 10

Zinc chloride 8

Lithium chloride 32

Potassium chloride 50

For soldering metals and metallized materials A solder is made on the diamond and cubic boron nitride basis used with the following composition in% by weight: copper 13 to 60

Tin 5 to 15

Titanium 5 to 25,

that according to the invention in gen % also lead 2 to 15,

Contains molybdenum and / or tungsten, tantalum - Best. Another successfully usable solder for soldering forms also the solder with the following composition in% by weight: Copper 13 to 60

Tin 5 to 15

Titan 5 to 25

non-metallic,

Filler insoluble in the solder 0.5 to molybdenum and / or tungsten, tantalum 0.3 to The non-metallic filler is selected in the form of a powder with a grain size of 1 to 50 µm.

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The following are specific examples of the present Invention "treats,

example 1

A 0 3.9 mm and 4.4 mm high Saiamelkrii- metal made of cubic boron nitride iiodification Elbor and a 0 5 mm and 20 mm high metallic steel holder are selected for soldering.

The Elbor saiamel crystal is pre-metallized with a chromium layer in the process of electron beam sputtering of metal and its deposition up to a layer thickness of 0.001 mm j the process is carried out under a vacuum of 1 to 5-ΊΟ "* ⁷ mm Saomel crystal coated with a copper protective layer, which was chemically deposited up to a thickness of 0.005 mm. The weight ratio of the components was: chromium 20% by weight and copper 80 % by weight. Furthermore, the annealing takes place under a vacuum of 2 to 5'10 ^- * ³ mm QS at a temperature of 95O ⁰ C in the course of 20 minutes. The metallized Sa: ane! Crystal is inserted into a previously prepared cylindrical hole in the steel holder, which is drilled through on the front side along its axis, with a soldering gap of 0.15 The high-frequency soldering is carried out in air with the melt of the flux no.

Away/
heating and cooling speed of 20 degrees / sec. guided.

Over · νοη 1.5 min the soldering temperature was 900 ⁰ C. Under the influence of capillary forces flowing the solder when melted in the LotspaIt inside.

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The solder joint came with the solder flowing in uniformly, Without voids, bites in the cutting element made of Blbor and without other solder defects, with good adhesion of the solder to EIbor .

Example 2

For plumbing a 0 4.2 mm and is 4.6 mm high chosen Elbor-Sainmelkristall and a 0 515 mm and 20 mm high metallic tool holder.

Elbor is coated with a chrome layer in the chemical precipitation process Pre-metallized up to a thickness of 0.0008 mm. Furthermore, the collecting crystal is provided with a cobalt protective layer In the process of vacuum metallization coated to a thickness of 0.005 mm · The weight ratio of the components in this case was 15% by weight of chromium and 85% by weight of cobalt. That The metallization coating is annealed under a vacuum

- * 5 ο

from 1 to 5 x 10 x ^ mm square. carried out at a temperature of 950 C in the course of 30 minutes. The metallized Sanmel crystal is placed in a previously prepared cylindrical hole in the steel holder, which is drilled through the front side along its axis, with a soldering gap of 0.10 mm on each side. The high-frequency soldering is carried out in air while the flux no. 2 is melted with a solder containing 20% by weight of tin + 80% by weight of copper at a heating and cooling rate of 30 degrees / sec. Guided for 1 minute. The brazing temperature is 900 ⁰ C. Under the influence of capillary forces flowing the solder when melted into the solder gap inside.

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The solder joint came out with uniform flow of the solder, without voids, cracks and other soldering defects in the cutting element from Elbor, with good adhesion of the solder to Elbor.

Example 3

A 0 3 * 5 w® and 4.6 mm high Saiamelkri-

etall on the black diamond, ie Karbonado basis, and a 0 5 mm and 20 mm high metallic steel holder.

The Karbonado collecting crystal is first coated with a tantalum layer in the process for vacuum metallization up to a thickness of 0.0005 mm and further in the same process with a Silver layer metallized up to a thickness of 0.01 mm.

The weight ratio of the components was 3% by weight of tantalum and 97% by weight of silver. The annealing of the metallic coating is carried out under a vacuum of 1 to 5 · 10 mm QS at a temperature of 900 ^° C. in the course of 15 minutes. The metallized Sarnne! Crystal is placed in a previously prepared cylindrical hole in the steel holder, which is drilled through the front side along its axis, with a soldering gap of 0.10 mm on each side. The high-frequency soldering is carried out in air while melting the flux no. 3 with a solder containing 28% by weight of copper and 72% by weight of silver, with a heating

Abx
cooling and cooling speed of 30 degrees / sec. 0.7 min

long led. The soldering temperature of 800 ⁰ C. Under the influence of capillary forces flowing the solder when melted in the solder gap inside.

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The solder joint came with a uniform flow of the Lotesι without voids, bites and other soldering errors when cutting ** element, with good adhesion of the solder to carbonado.

Example 4

A 4.1 mm, 4.5 mm high Elbor collector crystal is used for soldering and a 0 5 »5 mm and 20 mm high metallic Steel holder chosen.

Elbor is initially in the process with a tantalum layer for vacuum metallization up to a thickness of 0.001 mm and furthermore in the same process with a Mckel layer up to metallized to a thickness of 0.005 mm.

The weight ratio of the constituents was 20% by weight of tantalum and 80% by weight of nickel. Annealing the Metallisierüberzuges is carried out under a reduced pressure of 1 to 5 x 10 ~ "^'? Mm Hg at a temperature of 1000 ⁰ C in the course of 30 minutes. The metallized collecting crystal is in a cylindrical pre-prepared bore in the tool holder, the longitudinal its axis is drilled through on the face side, placed with a soldering gap of 0.20 mm per side.The high-frequency soldering is in air while melting the flux No. 4 with a solder containing 20% by weight of tin and 80% by weight of copper a warming

and cooling speed of 30 degrees / sec. Guided for 1 min. The brazing temperature is 900 ⁰ C. Under the influence of capillary forces flowing the solder when melted into the solder gap inside.

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The solder joint came out with uniform flowing in of the _: solder, without voids, hoists and other soldering defects in the cutting element, with good adhesion of the solder to Elbor.

Example 5

A 4.0 mm and 4.4 mm high Elbor-Sanunel crystal is used for soldering and a J3 5 »0 nm and 20 mm high metallic steel holder chosen.

Elbor is first metallized with a molybdenum layer in the process of vacuum metallization up to a thickness of 0.001 mm and furthermore in the same process with a lead layer up to a thickness of 0.005 mm. The weight ratio of the constituents in this case was 10% by weight of molybdenum and 90% by weight lead. Annealing the Metallisierüberzuges is under a reduced pressure of 1 to 5'1O ^- ^ made mm Hg at a temperature of 700 ⁰ C in the course of 10 minutes. The metallized seam crystal is placed in a cylindrical hole prepared in advance in the steel holder, which is drilled through on the front side along its axis, with a soldering gap of 0.10 mm on each side. The high-frequency soldering is carried out in air while melting the flux no. 2 with a solder containing 15% by weight of tin and 85% by weight.

Ay

Contains copper, with a rate of heating and cooling of 20 degrees / sec. Guided for 1.5 min. The soldering temperature is 920 ° C. Flows under the influence of capillary forces the solder into the soldering gap as it melts.

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The solder joint came with the solder flowing in uniformly Without voids, cracks and other soldering defects in the cutting element from Elbor, with good adhesion of the solder to Elbor.

Example 6

A Ø 3 »7 mm and 4.7 mm high carbon dioxide collector crystal and a Ø 5 mm and 20 mm high metallic steel holder are selected for soldering.

The carbonado collecting crystal is first metallized with a layer of molybdenum in the process for vacuum metallization up to a thickness of 0.0010 mm and then with a copper layer in the process for electrolytic deposits up to a thickness of 0.01 mm. The weight ratio of the components was 30% by weight of molybdenum and 70% by weight of copper. The annealing of the metallization coating is carried out under a vacuum of 1 to 5.10 "^ mm QS at a temperature of 700 ^° C. in the course of 30 minutes. The metallized collecting crystal is placed in a previously prepared cylindrical hole in the steel holder which is drilled through along its axis at the front , placed with a soldering gap of 0.15 mm on each side.The high-frequency soldering is carried out in air while melting the flux no

Away/
Heating and cooling speed of 30 degrees / sec. For 0.7 min. The soldering temperature of 800 ⁰ C. Under the influence of capillary forces flowing the solder when melted in the solder gap in ·

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The solder joint came with a uniform flow of the Solder, without voids, cracks and other solder defects "in the cutting element, with good adhesion of the solder to carbonado.

Example 7

A 4.1 mm and 4.5 mm high Elbor collection crystal is used for soldering and a 0 5 »5 i ™ and 20 mm high metallic Steel holder chosen.

Elbor is first metallized with a tungsten layer in the process of vacuum metallization up to a thickness of 0.0001 mm and then in the same process with a copper layer. The weight ratio of the components was 20% by weight of tungsten and 80% by weight of copper. Annealing the luetallisierüberzuges is carried out under a reduced pressure of 1 to 5 × 10 mm Hg at a temperature of 1000 ⁰ C in the course of 30 minutes ·

The metalized collecting crystal is in a previously prepared cylindrical hole in the steel holder, which is longitudinal its axis is drilled through at the front, with a soldering gap of 0.20 mm per side. The high frequency soldering is on Air to melt the # 4 flux with a solder that

Contains 2.0 wt.% Tin and 80 wt.% Copper, with a heating-off,

and cooling speed of 30 degrees / sec. Guided for 1 min The soldering temperature is 900 ° C. Under the influence of capillary forces, the solder flows into the soldering gap when it melts.

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The solder joint forms with uniform flow of the solder, without voids, bites and other soldering defects in the cutting element, with good adhesion of the solder to Elbor.

Example 8

A φ 4.1 mm and 4.5 mm high Elbor collecting crystal and a Φ 5.5 mm and 20 mm high metallic steel holder are selected for soldering

Elbor is first metallized with a tungsten layer in the process of vacuum metallization up to a thickness of 0.0001 mm and then in the same process with a tin layer. The weight ratio of the components was 20 wt.% Tungsten and 80 wt% tin.. The annealing of the metallization coating is carried out under a vacuum of 1 to 5 · 10 "~ ^ mm QS at a temperature of 100O ⁰ C in the course of 30 minutes Axis is drilled through on the front side, placed with a soldering gap of 0.20 mm on each side.The high-frequency soldering is carried out in air while melting the flux Kr. 4 with a solder containing 20 wt. Tin and 80 wt -.. and cooling rate of 30 degrees / sec performed for 1 minute, the soldering temperature is 900 ⁰ C. Under the influence of capillary forces flowing the solder when melted into the soldering gap.

The solder joint came out with the solder flowing in uniformly, without voids, cracks and other soldering defects in the cutting element, with good adhesion of the solder to Elbor.

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Example 9

A 4.1 mm and 4.5 mm high Elbor collecting crystal is used for soldering and a 0 6 mm and 20 mm high metallic steel holder was chosen.

First of all, the Elbor-Sanmel crystal is coated with one layer Alloy with the following composition in

6 Ti + 10 Pb + 11.5 Sn + 72.5 Gu + 1 Mo

in the process of brush painting the paste of a powdery, with an organic, easily burn-out adhesive mixed with an alloy "metallized up to a thickness of 0.1 mm · Then the collecting crystal is under a vacuum of 1 to 5'10 "^ mm Q.S. at a temperature of 900 C. annealed in the course of 5 minutes.

The metalized collecting crystal is in a previously prepared cylindrical hole in the steel holder, which is longitudinal its axis is drilled through on the face side, with a solder gap of 0.2 mm placed on each side. The high frequency soldering is on Air to melt the flux no. 1 with a solder containing 19% by weight of tin, 78% by weight of copper and 3% by weight of nickel

AIv
a heating and cooling speed of 20 degrees / sec, guided · Under the flow of capillary forces, this solder flows into the solder gap when it melts »The soldering temperature is 900 ° C.

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The solder joint came with a uniform flow of the Solder, without voids, hoists and other soldering defects in the cutting element from Elbor, with good adhesion of the solder to EIt) or up

Example 10

For soldering, a Ø 3.5 mm and 4.2 mm high carbonado collector crystal and a Ø 5.5 mm and 20 mm high metallic steel holder are selected «

First the Karbonado collecting crystal is coated with a layer Alloy with the following composition:

10 Ti + 12 Pb + 7 Sn + 68 Cu + 3 W.

to a thickness of 0.05 mm metallized in the method of immersing the crystal into the melt collecting under a reduced pressure of 1 to 5 x 'Ό mm Hg at a temperature of 900 ⁰ C in the course of 5 minutes.

The metallized collecting crystal is made into a beforehand

prepared cylindrical bore in the steel holder, the län ^ s

is; its axis drilled through on the front side {with a soldering gap of 0.15 mm per side plsBiert, The high-frequency soldering is in air while melting the flux No. 2 with a solder with the following composition in% by weight:

Copper 70, iron 0.1, lead 0.03, bismuth 0.002, antimony 0.05, zinc remainder
guided.

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The heating and cooling speed is 30 degrees / sec. Under the influence of capillary forces in melting the solder flows into the solder gap in · The soldering temperature beträft 850 ⁰ C.

The LöWfuge came with a steady flow of the Iotes, oLne voids, cracks and other solder defects in the cutting element from Elbor, with good adhesion of the solder to Karbonado out.

Example II

A 0 5 »0 mm and 5» 1 now high hexanite collector crystal is used for soldering and a 0 8 mm and 20 mm high metallic steel holder was chosen.

The hexanite collecting crystal is first coated with a layer Alloy with the following composition in% by weight 1

8 Ti + 12 Pb + 11 Sn + 49 Cu + 20 Ta

in the process of brush painting the paste of a powdery alloy mixed with an organic, easily burn-out adhesive in a vacuum up to a thickness of 0.5 mm metallized. The collecting crystal is then annealed under a reduced pressure of 1 to 5 × 10 -4 mm QS at a temperature of 900 ^° C. in the course of 10 minutes.

The metallized Saiamel crystal is put into a prepared in advance cylindrical hole in the steel holder running along its

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Axis is drilled through on the face side, with a soldering gap of 0.2 mm on each side. The Hochfrequenzlötung is in air under melt the flux no. 3 ^m i 't a 20 wt.% Tin and 80 wt.% Of copper-containing solder in melting under the influence of capillary forces in the soldering gap · into fluid with a heating and' cooling speed of 20 degrees / / sec .. The soldering temperature is 900 ⁰ C.

The solder joint came with the solder flowing in uniformly, without voids, cracks and other soldering defects in the cutting element, with good adhesion of the solder to hexanite.

Example 12

For soldering a 0 40 mm and 4.5 mm selected high-Elbor Sacmelkristall and a 0 55 now and 20 mm high metallic tool holder.

First, the Elbor collecting crystal is coated with one layer Alloy with the following composition in weight? Sx

6 Ti + 10 Pb + 10.5 Sn + 73t5 Cu + 0.3 Mo + 0.7

in the process of brush painting the paste of a powdery alloy mixed with an organic, easily burn-out adhesive in a vacuum up to a thickness of 0.2 mm metallized (the dispersity of the aluminum oxide powder was 1 M / m. ). Subsequently, the Sa. is; jaelkristall annealed under a vacuum in front of 1 to 5 x 10 ~ ^ mm Hg at a temperature of 900 ⁰ C in the course von'5 minutes.

6098 1 night / over 600

The metallized collecting crystal is made into a beforehand prepared cylindrical bore in the steel holder, the läncs its frontal axis is drilled through with a solder pad of 0.2 mm placed on each side. The high frequency soldering is on Air with melting of the flux No. 1 with a solder containing 20% by weight of tin and 80% by weight of copper, the "when melting into the solder gap under the influence of capillary forces

Away/
flows, with a heating and cooling rate of

20 degrees / sec. guided. The soldering temperature is 900 ⁰ C.

The solder joint came with the solder flowing in uniformly, without voids, cracks and other soldering errors when cutting * element from Elbor, with good adhesion of the solder to EIbor

Example 13

For soldering, a 0 3 »6 mm and 4.0 mm high carbon fiber - Collect! Crystal and a 0 5 »5 ™ and 20 mm high metallic Steel holder chosen.

First, the Karbonado-Sainmel crystal is treated with a Layer of alloy with the following composition in% by weight »

5 Ti + 10 Pb + 7 Sn + 58 Cu + 0.5 W + 19.5 SiC

in the process of brush painting the paste of a powdery alloy mixed with an organic adhesive that can easily be burned out in a vacuum up to a thickness of 0.3 mm metalli siext (the dispersity of the silicon carbide powder was

609810/0600

Then the Saiame! Crystal is under a negative pressure from 1 to 5 · Ί0 ~ ^ aim Q.S. at a temperature of 900 ° C im Run for 5 minutes to a thickness of 0.05 now annealed.

The metallized Saiunel crystal is placed in a previously prepared cylindrical hole in the holder, which is drilled through the front side along its axis, with a soldering gap of 0.15 μm on each side. The high-frequency soldering is carried out in air while the flux no. 2 is melted with a solder with the following composition in% by weight: copper 70, iron 0.1, lead 0.031, bismuth 0.002, antimony 0.05, zinc remainder that when melted under the influence of capillary forces flows into the soldering gap with a heating and cooling speed of 30 degrees / / sec. guided. The operating temperature is 85O ⁰ C.

The solder joint came with the solder flowing in uniformly, without voids, bites and other soldering defects in the cutting element made of EIbor, with good adhesion of the solder to carbonado out.

Example 14

A 0 5i5 ™ and 5i3 ^ m high hexanite sairtr » Lead crystal and a metal holder on the iron-ifickel-copper -Alloy-base layer in the form of an 8 mm high plate with Dimensions 15 μ χ 15 μ selected.

First, the Hexantt-Sanme lkris tall with one layer Alloy with the following composition in% by weight:

7 Ti + 12 Pb + 11 Sn + 49 Cu + 20 Ta + 1 Bn

609810/0600

In the process of brush painting the paste of a powdery alloy mixed with an organic adhesive that can easily be burned out in a vacuum up to a thickness of 0.4: rjn metallized (the dispersity of the boron nitride powder was 5 / & The SanimelkristaIl is then under a vacuum of 1 to 5.10 "" ^ now QS annealed at a temperature of 9 ^ O ⁰ C in the course of 10 minutes.

The metallized Sa-J ^ is elkristall is drilled into a cylindrical pre-prepared bore in lietallhalter, the Lan _o s its axis at its side surface with a brazing gap of 0.2 mm per side placed. The Hochfrequenzlötung is in air under melt the flux # 3 nit a 20 wt Jo tin and 80 Gev;...% Copper containing solder which flows into the solder gap in melting under the influence of capillary forces, comprising a heating and "Tsühlun ^ s speed of 20 degrees / sec .. The soldering temperature is 900 ° C.

The solder joint came with the solder flowing in uniformly, without voids, cracks and other soldering defects in the cutting element, with good adhesion of the solder to hexanite

6Ü98 1 ü / 0600

Claims (1)

. $ 0 . P 61 470 PATENT CLAIMS * ^{August 1975} Bk / La 1 · Method for soldering metals and materials on the boron nitride and (or) diamond basis, "in which a LIetallisierüberzug by placing the materials to be soldered in a medium at a temperature that is necessary to achieve the adhesion of the metallization to the to be soldered sufficient materials, with further carrying out the soldering operation of Uetall and the material with the applied metallizing ¹ · - · coating with solders that are plastic and have a melting point up to 100 ° ⁰ C, the soldering surface of the materials on the diamond and (or) Boron nitride base is applied, characterized in that metals which have high adhesion to the materials on the diamond and (or) boron nitride base and are present in an amount of from 3.0 to 65% by weight of the total weight of the coating as the rest) are, as well as ^ metals, which have a reduced oxidizability, can be used as a metallic coating, .the/·
while the air'Luft soldering process takes place under a layer of liquid flux, which is intended for soldering metals with metallic hard solders. 2. The method according to claim 1, characterized in that at least one metal from the group which consists of chromium, molybdenum, tantalum, tungsten, titanium, as metals, the materials on the diamond and (or) boron nitride basis have high adhesive activity towards 609810/0 600 and at least one metal from the group consisting of copper, silver, Lead, tin, nickel, and cobalt are made up of metals, the one have reduced oxidizability, are used 3. Method according to claim 1, characterized in that the coating is applied in two stages
is: first with the layer of a hard metal, which has a high adhesive activity compared to the materials on the diamond and (or) boron nitride basis, up to a layer thickness of 0.0005 to 0.001 mm, and then with the layer of a hard metal, which is little oxidizable, up to a layer thickness of 0.001 to 0.01 mm. 4. The method according to claim 1, characterized in that the coating is in the form of a metal melt, which retallen from the materials on the diamond and (or) boron nitride base with respect to a high level of Äaft activity
as well as of metals that are not very oxidizable,
is applied up to a layer thickness of 0.01 to 0.5 nm. 5. The method according to claim 1, characterized in that the soldering process takes place at the melting point of the solder in the course of 0.5 to 2 minutes with a heating and cooling rate of the soldering surfaces of 10 to 30 degrees / sec. using a liquid flux which has a melting point of 500 to 70O ⁰ C is performed. 6098 10/0600 6 · The method according to claim 5 »characterized in that the liquid flux with the following Composition (in wt.%) Is taken i Boric anhydride 35 dehydrated potassium fluoride 42 Potassium fluoroborate 23 7. Solder for soldering metals and the materials on the diamond and (or) boron nitride basis, the copper, tin and Contains titanium, characterized in that it contains, in addition to the components mentioned, the following Ratio (in wt.%) Are taken Copper 13 to Tin 5 dis Titan 5 The 25 also (in% by weight) Lead 2 to 15 as the rest
and at least one metal from the group consisting of molybdenum, 7 «οIfram, which consists of tantalum, contains. 8. Lot according to claim 7 »marked ζ e % j It means that it contains a non-metallic filler in an amount of 0.5 to 20% by weight, the content (in% by weight) of at least one metal from the group consisting of molybdenum, tungsten, tantalum , 0.3 to 20. 9 · Lot according to claim 7, characterized that the non-metallic filler is taken in the form of a powder with 1 to 50/4 β grain size. 600 1 to 5Ολ * 098 1CfYOE