DE20120770U1 - Surface-mounted LED multiple arrangement and lighting device with it - Google Patents

Surface-mounted LED multiple arrangement and lighting device with it

Info

Publication number
DE20120770U1
DE20120770U1 DE20120770U DE20120770U DE20120770U1 DE 20120770 U1 DE20120770 U1 DE 20120770U1 DE 20120770 U DE20120770 U DE 20120770U DE 20120770 U DE20120770 U DE 20120770U DE 20120770 U1 DE20120770 U1 DE 20120770U1
Authority
DE
Germany
Prior art keywords
light
circuit board
mounted led
lighting device
led arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20120770U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE20120770U priority Critical patent/DE20120770U1/en
Publication of DE20120770U1 publication Critical patent/DE20120770U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/15—Strips of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (15)

1. Oberflächenmontierte LED-Anordnung (10), mit einer flexiblen Leiterplatte (14); einer Vielzahl von LEDs (12), die auf einer Hauptfläche der flexiblen Leiterplatte an­ geordnet sind; und einem Kühlkörper (16), der mit der den LEDs abgewandten Hauptfläche der flexiblen Leiterplatte ver­ bunden ist, dadurch gekennzeichnet, dass die flexible Leiterplatte (14) mit ihrer den LEDs (12) abge­ wandten Hauptfläche auf einer schmalen Längsseite (19a) des Kühlkörpers (16) montiert ist.1. Surface-mounted LED arrangement ( 10 ), with a flexible circuit board ( 14 ); a plurality of LEDs ( 12 ) which are arranged on a main surface of the flexible printed circuit board; and a heat sink ( 16 ) which is connected to the main surface of the flexible printed circuit board facing away from the LEDs, characterized in that the flexible printed circuit board ( 14 ) with its main surface facing away from the LEDs ( 12 ) on a narrow long side ( 19 a) of the Heatsink ( 16 ) is mounted. 2. Oberflächenmontierte LED-Anordnung nach Anspruch 1, dadurch gekennzeichnet, dass der Kühlkörper (16) aus Metall besteht.2. Surface-mounted LED arrangement according to claim 1, characterized in that the heat sink ( 16 ) consists of metal. 3. Oberflächenmontierte LED-Anordnung nach Anspruch 2, dadurch gekennzeichnet, dass der Kühlkörper (16) aus Aluminium oder Kupfer besteht.3. Surface-mounted LED arrangement according to claim 2, characterized in that the cooling body ( 16 ) consists of aluminum or copper. 4. Oberflächenmontierte LED-Anordnung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die flexible Leiterplatte (14) ein Flexboard ist.4. Surface-mounted LED arrangement according to one of claims 1 to 3, characterized in that the flexible circuit board ( 14 ) is a flexboard. 5. Oberflächenmontierte LED-Anordnung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass zwischen der flexiblen Leiterplatte (14) und dem Kühlkörper (16) eine Zwischenschicht (15) vorgesehen ist, die eine gute Wärmeleitfähigkeit aufweist und elektrisch isolierend ist.5. Surface-mounted LED arrangement according to one of claims 1 to 4, characterized in that an intermediate layer ( 15 ) is provided between the flexible printed circuit board ( 14 ) and the heat sink ( 16 ), which has good thermal conductivity and is electrically insulating. 6. Oberflächenmontierte LED-Anordnung nach Anspruch 5, dadurch gekennzeichnet, dass die Zwischenschicht (15) eine Epoxidharzschicht ist, die mit wärmeleitenden Partikeln versetzt ist. 6. Surface-mounted LED arrangement according to claim 5, characterized in that the intermediate layer ( 15 ) is an epoxy resin layer which is mixed with thermally conductive particles. 7. Oberflächenmontierte LED-Anordnung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass zwischen der flexiblen Leiterplatte (14) und dem Kühlkörper (16) eine Zwischenschicht (15) vorgesehen ist, die eine gute Wärmeleitfähigkeit aufweist und von den LEDs (12) bzw. der Leiterplatte (14) elektrisch isoliert ist.7. Surface-mounted LED arrangement according to one of claims 1 to 4, characterized in that between the flexible circuit board ( 14 ) and the heat sink ( 16 ) an intermediate layer ( 15 ) is provided, which has good thermal conductivity and of the LEDs ( 12 ) or the printed circuit board ( 14 ) is electrically insulated. 8. Oberflächenmontierte LED-Anordnung nach Anspruch 7, dadurch gekennzeichnet, dass die Zwischenschicht (15) eine metallische Schicht mit einer guten Wärmeleitfähigkeit ist.8. Surface-mounted LED arrangement according to claim 7, characterized in that the intermediate layer ( 15 ) is a metallic layer with a good thermal conductivity. 9. Oberflächenmontierte LED-Anordnung nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die beiden Hauptseiten (18a, 18b) des Kühlkörpers (16), die an die mit der flexiblen Leiterplatte (14) verbundene schmale Längsseite (19a) angrenzen, geschwärzt sind und/oder Kühl­ rippen aufweisen und/oder eine Oberflächenaufrauhung auf­ weisen.9. Surface-mounted LED arrangement according to one of claims 1 to 8, characterized in that the two main sides ( 18 a, 18 b) of the heat sink ( 16 ), the narrow longitudinal side ( 19 a.) Connected to the flexible printed circuit board ( 14 ) ) border, are blackened and / or have cooling fins and / or have a surface roughening. 10. Beleuchtungseinrichtung (20), mit einem Lichtleitelement (21), das eine Lichteinkopplungsseite (24) und eine Licht­ auskopplungsseite (22) aufweist, und einer Lichtquelle (26), die mit der Lichteinkopplungsseite gekoppelt ist, dadurch gekennzeichnet, dass die Lichtquelle (26) eine oberflächenmontierte LED-Anordnung (10) nach einem der Ansprüche 1 bis 9 ist, wobei die die LEDs (12) aufweisende Hauptfläche der flexiblen Leiterplatte (14) der Lichteinkopplungsseite (24) des Lichtleitelements (21) zugewandt ist.10. Lighting device ( 20 ), with a light guide element ( 21 ), which has a light coupling-in side ( 24 ) and a light coupling-out side ( 22 ), and a light source ( 26 ), which is coupled to the light coupling-in side, characterized in that the light source ( 26 ) is a surface-mounted LED arrangement ( 10 ) according to one of claims 1 to 9, wherein the main surface of the flexible printed circuit board ( 14 ) having the LEDs ( 12 ) faces the light coupling side ( 24 ) of the light guide element ( 21 ). 11. Beleuchtungseinrichtung nach Anspruch 10, dadurch gekennzeichnet, dass die Lichtauskopplungsseite (22) des Lichtleitelements (21) derart angeordnet und ausgebildet ist, dass das in das Lichtleitelement durch die Lichteinkopplungsseite (24) von der Lichtquelle (26) eingekoppelte Licht im wesentlichen senkrecht zu der Eintrittsrichtung aus der Lichtauskopplungs­ seite austritt.11. Lighting device according to claim 10, characterized in that the light coupling-out side ( 22 ) of the light-guiding element ( 21 ) is arranged and designed such that the light coupled into the light-guiding element through the light-coupling-in side ( 24 ) from the light source ( 26 ) is substantially perpendicular to the entry direction emerges from the light decoupling side. 12. Beleuchtungseinrichtung (30), mit einem Leuchtengehäuse (32), einer Optik (34), einem in dem Gehäuse angeordneten Reflektor (34) und einer in dem Gehäuse angeordneten Licht­ quelle (38), dadurch gekennzeichnet, dass die Lichtquelle (38) eine oberflächenmontierte LED-Anordnung (10) nach einem der Ansprüche 1 bis 9 ist, wobei die die LEDs (12) aufweisende Hauptfläche der flexiblen Leiterplatte (14) dem Reflektor (34) zugewandt ist.12. Lighting device ( 30 ), with a lamp housing ( 32 ), an optical system ( 34 ), a reflector ( 34 ) arranged in the housing and a light source ( 38 ) arranged in the housing, characterized in that the light source ( 38 ) is a surface-mounted LED arrangement ( 10 ) according to one of claims 1 to 9, wherein the main surface of the flexible printed circuit board ( 14 ) having the LEDs ( 12 ) faces the reflector ( 34 ). 13. Beleuchtungseinrichtung nach Anspruch 12, dadurch gekennzeichnet, dass die Beleuchtungseinrichtung (30) eine Außenbeleuchtung eines Kraftfahrzeugs ist.13. Lighting device according to claim 12, characterized in that the lighting device ( 30 ) is external lighting of a motor vehicle. 14. Beleuchtungseinrichtung nach Anspruch 13, dadurch gekennzeichnet, dass die Beleuchtungseinrichtung (30) eine in die Heckscheibe des Kraftfahrzeugs integrierbare Brems- oder Warnleuchte ist.14. Lighting device according to claim 13, characterized in that the lighting device ( 30 ) is a brake or warning light which can be integrated into the rear window of the motor vehicle. 15. Beleuchtungseinrichtung nach Anspruch 13, dadurch gekennzeichnet, dass die Beleuchtungseinrichtung (30) eine Rückleuchte, eine Bremsleuchte, eine Blinkleuchte oder eine Kombination davon ist.15. Lighting device according to claim 13, characterized in that the lighting device ( 30 ) is a rear light, a brake light, a flashing light or a combination thereof.
DE20120770U 2001-12-21 2001-12-21 Surface-mounted LED multiple arrangement and lighting device with it Expired - Lifetime DE20120770U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20120770U DE20120770U1 (en) 2001-12-21 2001-12-21 Surface-mounted LED multiple arrangement and lighting device with it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20120770U DE20120770U1 (en) 2001-12-21 2001-12-21 Surface-mounted LED multiple arrangement and lighting device with it

Publications (1)

Publication Number Publication Date
DE20120770U1 true DE20120770U1 (en) 2002-03-28

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Family Applications (1)

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DE20120770U Expired - Lifetime DE20120770U1 (en) 2001-12-21 2001-12-21 Surface-mounted LED multiple arrangement and lighting device with it

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DE (1) DE20120770U1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1431119A2 (en) * 2002-12-16 2004-06-23 FER Fahrzeugelektrik GmbH Vehicle lamp
EP1508174A1 (en) * 2002-05-29 2005-02-23 Optolum, Inc. Light emitting diode light source
WO2005062089A1 (en) * 2003-12-02 2005-07-07 3M Innovative Properties Company Solid state light device
WO2005083803A2 (en) * 2004-02-26 2005-09-09 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
DE102004016847A1 (en) * 2004-04-07 2005-12-22 P.M.C. Projekt Management Consult Gmbh Light emitting diode arrangement and method for producing a light emitting diode array
DE102004036931A1 (en) * 2004-07-29 2006-03-23 Daimlerchrysler Ag Automobile headlight, has light source including two plate-shaped heat sinks that are thermally and electrically coupled to light emitting diodes, so that heat sinks act not only as electrical conductors but also as thermal cooling units
US7163327B2 (en) 2002-12-02 2007-01-16 3M Innovative Properties Company Illumination system using a plurality of light sources
US7189983B2 (en) 2003-12-02 2007-03-13 3M Innovative Properties Company LED modifying apparatus and method
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
DE102010029318A1 (en) * 2010-05-26 2011-12-01 Wegu Gmbh & Co. Kg Truck-mud wing has base body that is shape-molded from plastic and fastening units that are formed for arranging base body at horizontal running support pipe of truck
EP2887778A1 (en) 2013-12-20 2015-06-24 Zumtobel Lighting GmbH Flexible circuit board with heat sink

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1508174A1 (en) * 2002-05-29 2005-02-23 Optolum, Inc. Light emitting diode light source
EP1508174A4 (en) * 2002-05-29 2005-10-12 Optolum Inc Light emitting diode light source
US7658526B2 (en) 2002-12-02 2010-02-09 3M Innovative Properties Company Illumination system using a plurality of light sources
US7163327B2 (en) 2002-12-02 2007-01-16 3M Innovative Properties Company Illumination system using a plurality of light sources
EP1431119A3 (en) * 2002-12-16 2005-07-27 FER Fahrzeugelektrik GmbH Vehicle lamp
EP1431119A2 (en) * 2002-12-16 2004-06-23 FER Fahrzeugelektrik GmbH Vehicle lamp
US7202489B2 (en) 2003-12-02 2007-04-10 3M Innovative Properties Company LED modifying apparatus and method
WO2005062089A1 (en) * 2003-12-02 2005-07-07 3M Innovative Properties Company Solid state light device
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US7250611B2 (en) 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US7189983B2 (en) 2003-12-02 2007-03-13 3M Innovative Properties Company LED modifying apparatus and method
US7202490B2 (en) 2003-12-02 2007-04-10 3M Innovative Properties Company LED modifying apparatus and method
WO2005083803A2 (en) * 2004-02-26 2005-09-09 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
US8975532B2 (en) 2004-02-26 2015-03-10 OSPAM Opto Semiconductor GmbH Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement
WO2005083803A3 (en) * 2004-02-26 2006-03-09 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
CN102157671B (en) * 2004-02-26 2013-05-01 奥斯兰姆奥普托半导体有限责任公司 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
CN1926685B (en) * 2004-02-26 2011-04-27 奥斯兰姆奥普托半导体有限责任公司 Light-emitting diode arrangement, and method for producing a light-emitting diode arrangement
DE102004016847A1 (en) * 2004-04-07 2005-12-22 P.M.C. Projekt Management Consult Gmbh Light emitting diode arrangement and method for producing a light emitting diode array
DE102004036931B4 (en) * 2004-07-29 2009-02-05 Daimler Ag Automobile headlight
DE102004036931A1 (en) * 2004-07-29 2006-03-23 Daimlerchrysler Ag Automobile headlight, has light source including two plate-shaped heat sinks that are thermally and electrically coupled to light emitting diodes, so that heat sinks act not only as electrical conductors but also as thermal cooling units
DE102010029318A1 (en) * 2010-05-26 2011-12-01 Wegu Gmbh & Co. Kg Truck-mud wing has base body that is shape-molded from plastic and fastening units that are formed for arranging base body at horizontal running support pipe of truck
DE102010029318B4 (en) * 2010-05-26 2012-03-22 Wegu Gmbh & Co. Kg Truck fender with integrated LED light
EP2887778A1 (en) 2013-12-20 2015-06-24 Zumtobel Lighting GmbH Flexible circuit board with heat sink
DE102013226972A1 (en) 2013-12-20 2015-07-09 Zumtobel Lighting Gmbh Flexible printed circuit board with heat sink

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