DE19654903C2 - Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter - Google Patents
Vorrichtung zum Behandeln von Substraten in einem Fluid-BehälterInfo
- Publication number
- DE19654903C2 DE19654903C2 DE19654903A DE19654903A DE19654903C2 DE 19654903 C2 DE19654903 C2 DE 19654903C2 DE 19654903 A DE19654903 A DE 19654903A DE 19654903 A DE19654903 A DE 19654903A DE 19654903 C2 DE19654903 C2 DE 19654903C2
- Authority
- DE
- Germany
- Prior art keywords
- nozzles
- fluid
- fluid container
- container
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/26—Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00049—Controlling or regulating processes
- B01J2219/00051—Controlling the temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Description
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19654903A DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE1996116402 DE19616402C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19654903A DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE1996116402 DE19616402C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19654903A1 DE19654903A1 (de) | 1997-11-13 |
DE19654903C2 true DE19654903C2 (de) | 1998-09-24 |
Family
ID=7792328
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19655219A Expired - Fee Related DE19655219C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19654903A Expired - Fee Related DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19655219A Expired - Fee Related DE19655219C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Country Status (10)
Country | Link |
---|---|
US (2) | US5921257A (de) |
EP (1) | EP0895655B1 (de) |
JP (1) | JP3493030B2 (de) |
KR (1) | KR100316823B1 (de) |
AT (1) | ATE259989T1 (de) |
DE (2) | DE19655219C2 (de) |
ID (1) | ID16694A (de) |
MY (1) | MY132460A (de) |
TW (1) | TW446575B (de) |
WO (1) | WO1997040524A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19616400C2 (de) * | 1996-04-24 | 2001-08-30 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19742680B4 (de) * | 1997-09-26 | 2006-03-02 | Siltronic Ag | Reinigungsverfahren für scheibenförmiges Material |
US6273107B1 (en) * | 1997-12-05 | 2001-08-14 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
US5913981A (en) * | 1998-03-05 | 1999-06-22 | Micron Technology, Inc. | Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall |
US6372051B1 (en) * | 1998-12-04 | 2002-04-16 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
US6539963B1 (en) * | 1999-07-14 | 2003-04-01 | Micron Technology, Inc. | Pressurized liquid diffuser |
TW434668B (en) * | 2000-01-27 | 2001-05-16 | Ind Tech Res Inst | Wafer rinse apparatus and rinse method of the same |
US6418945B1 (en) * | 2000-07-07 | 2002-07-16 | Semitool, Inc. | Dual cassette centrifugal processor |
US6840250B2 (en) * | 2001-04-06 | 2005-01-11 | Akrion Llc | Nextgen wet process tank |
US6564469B2 (en) * | 2001-07-09 | 2003-05-20 | Motorola, Inc. | Device for performing surface treatment on semiconductor wafers |
US20030192577A1 (en) * | 2002-04-11 | 2003-10-16 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
US20030192570A1 (en) * | 2002-04-11 | 2003-10-16 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
DE10313692B4 (de) * | 2003-03-26 | 2005-06-23 | Werner Rietmann | Verfahren zur Oberflächen-und/oder Tiefenbehandlung von zumindest einem Halbleitersubstrat und Tauchbadvorrichtung dazu |
US7582180B2 (en) * | 2004-08-19 | 2009-09-01 | Micron Technology, Inc. | Systems and methods for processing microfeature workpieces |
DE102004053337A1 (de) * | 2004-11-04 | 2006-05-11 | Steag Hama Tech Ag | Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür |
US7255747B2 (en) | 2004-12-22 | 2007-08-14 | Sokudo Co., Ltd. | Coat/develop module with independent stations |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
KR100644054B1 (ko) * | 2004-12-29 | 2006-11-10 | 동부일렉트로닉스 주식회사 | 세정 장치 및 게이트 산화막의 전세정 방법 |
US8070884B2 (en) * | 2005-04-01 | 2011-12-06 | Fsi International, Inc. | Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance |
ES2268974B2 (es) * | 2005-06-16 | 2007-12-01 | Universidad Politecnica De Madrid | Reactor epitaxial para la produccion de obleas a gran escala. |
TWI259110B (en) * | 2005-09-22 | 2006-08-01 | Delta Electronics Inc | Ultrasonic cleaning system and method |
US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
US7950407B2 (en) * | 2007-02-07 | 2011-05-31 | Applied Materials, Inc. | Apparatus for rapid filling of a processing volume |
DE102009035341A1 (de) * | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Vorrichtung zur Reinigung von Substraten an einem Träger |
DE102010028883A1 (de) * | 2010-05-11 | 2011-11-17 | Dürr Ecoclean GmbH | Prozessbehälter |
CA2856196C (en) | 2011-12-06 | 2020-09-01 | Masco Corporation Of Indiana | Ozone distribution in a faucet |
CA2992280C (en) | 2015-07-13 | 2022-06-21 | Delta Faucet Company | Electrode for an ozone generator |
JP6441198B2 (ja) * | 2015-09-30 | 2018-12-19 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
CA2946465C (en) | 2015-11-12 | 2022-03-29 | Delta Faucet Company | Ozone generator for a faucet |
JP6664952B2 (ja) * | 2015-12-17 | 2020-03-13 | 東レエンジニアリング株式会社 | 塗布器洗浄装置及び塗布装置 |
WO2017112795A1 (en) | 2015-12-21 | 2017-06-29 | Delta Faucet Company | Fluid delivery system including a disinfectant device |
SE539074C2 (en) * | 2016-04-21 | 2017-04-04 | Spinchem Ab | A reactor comprising a nozzle for cleaning fluid, a kit and a method |
JP2018126697A (ja) * | 2017-02-09 | 2018-08-16 | 新オオツカ株式会社 | 層流超音波洗浄装置 |
JP6836980B2 (ja) * | 2017-10-11 | 2021-03-03 | 株式会社荏原製作所 | 基板洗浄方法 |
JP6985957B2 (ja) | 2018-02-21 | 2021-12-22 | キオクシア株式会社 | 半導体処理装置 |
JP7381370B2 (ja) * | 2020-03-05 | 2023-11-15 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
KR102566668B1 (ko) * | 2021-06-02 | 2023-08-17 | 주식회사 아이에스티이 | 표시장치의 기판을 퍼지하기 위한 디퓨저 구조체 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
JPH05267263A (ja) * | 1992-03-17 | 1993-10-15 | Sony Corp | 半導体ウェーハ洗浄装置 |
US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
JPH06208984A (ja) * | 1992-09-18 | 1994-07-26 | Dainippon Screen Mfg Co Ltd | 浸漬型基板処理装置 |
US5370142A (en) * | 1992-11-10 | 1994-12-06 | Tokyo Electron Limited | Substrate washing device |
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US3964957A (en) * | 1973-12-19 | 1976-06-22 | Monsanto Company | Apparatus for processing semiconductor wafers |
JPS5271871A (en) * | 1975-12-11 | 1977-06-15 | Nec Corp | Washing apparatus |
US4132567A (en) * | 1977-10-13 | 1979-01-02 | Fsi Corporation | Apparatus for and method of cleaning and removing static charges from substrates |
JPS586633A (ja) * | 1981-07-03 | 1983-01-14 | Pioneer Electronic Corp | 送受信システム |
JPS5861632A (ja) * | 1981-10-07 | 1983-04-12 | Matsushita Electric Ind Co Ltd | 洗浄槽 |
JPS59199477A (ja) * | 1983-04-25 | 1984-11-12 | 住友電気工業株式会社 | ウエハ−ボツクス |
US4671206A (en) * | 1983-06-20 | 1987-06-09 | Hoppestad Lamont I | Article support rack |
US4577650A (en) * | 1984-05-21 | 1986-03-25 | Mcconnell Christopher F | Vessel and system for treating wafers with fluids |
US4753258A (en) * | 1985-08-06 | 1988-06-28 | Aigo Seiichiro | Treatment basin for semiconductor material |
US4795497A (en) * | 1985-08-13 | 1989-01-03 | Mcconnell Christopher F | Method and system for fluid treatment of semiconductor wafers |
US4676008A (en) * | 1986-05-16 | 1987-06-30 | Microglass, Inc. | Cage-type wafer carrier and method |
JP2717408B2 (ja) * | 1988-03-16 | 1998-02-18 | 株式会社トプコン | 直線性誤差補正機能を有する光波測距装置 |
US4858764A (en) * | 1988-06-20 | 1989-08-22 | Hughes Aircraft Company | Adjustable carrier device for ceramic substrates and the like |
JP2733771B2 (ja) * | 1988-07-29 | 1998-03-30 | 日本テキサス・インスツルメンツ株式会社 | 液体による処理装置 |
JPH02113331U (de) * | 1989-02-27 | 1990-09-11 | ||
US5149244A (en) * | 1989-08-18 | 1992-09-22 | Applied Materials, Inc. | Apparatus for aligning wafers within a semiconductor wafer cassette |
JPH03116731A (ja) * | 1989-09-28 | 1991-05-17 | Dan Kagaku:Kk | 半導体ウエハ用移送装置 |
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JPH03228329A (ja) * | 1990-02-02 | 1991-10-09 | Nec Corp | ウェハー処理装置 |
JPH03231428A (ja) * | 1990-02-07 | 1991-10-15 | Hitachi Cable Ltd | 半導体ウエハの洗浄方法 |
JPH0480924A (ja) * | 1990-07-24 | 1992-03-13 | Sony Corp | 半導体ウエハの洗浄装置および洗浄方法 |
US5069235A (en) * | 1990-08-02 | 1991-12-03 | Bold Plastics, Inc. | Apparatus for cleaning and rinsing wafers |
JPH0499025A (ja) * | 1990-08-07 | 1992-03-31 | Nec Kyushu Ltd | 水洗装置 |
US5090432A (en) * | 1990-10-16 | 1992-02-25 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
JPH0555191A (ja) * | 1991-08-26 | 1993-03-05 | Hitachi Ltd | 洗浄槽 |
JPH05102118A (ja) * | 1991-10-07 | 1993-04-23 | Mitsubishi Electric Corp | 半導体ウエハの水洗方法および水洗槽 |
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JP2920165B2 (ja) * | 1991-11-29 | 1999-07-19 | エス・イー・エス株式会社 | 枚葉洗浄用オーバーフロー槽 |
JPH05190525A (ja) * | 1992-01-17 | 1993-07-30 | Fujitsu Ltd | 洗浄装置 |
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JPH05291228A (ja) * | 1992-04-07 | 1993-11-05 | Fujitsu Ltd | ウェーハ洗浄装置及び洗浄方法 |
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US5503171A (en) * | 1992-12-26 | 1996-04-02 | Tokyo Electron Limited | Substrates-washing apparatus |
US5383484A (en) * | 1993-07-16 | 1995-01-24 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
JP2888409B2 (ja) * | 1993-12-14 | 1999-05-10 | 信越半導体株式会社 | ウェーハ洗浄槽 |
DE4413077C2 (de) * | 1994-04-15 | 1997-02-06 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
US5672212A (en) * | 1994-07-01 | 1997-09-30 | Texas Instruments Incorporated | Rotational megasonic cleaner/etcher for wafers |
DE19546990C2 (de) * | 1995-01-05 | 1997-07-03 | Steag Micro Tech Gmbh | Anlage zur chemischen Naßbehandlung |
US5593505A (en) * | 1995-04-19 | 1997-01-14 | Memc Electronic Materials, Inc. | Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface |
DE19637875C2 (de) * | 1996-04-17 | 1999-07-22 | Steag Micro Tech Gmbh | Anlage zur Naßbehandlung von Substraten |
DE19703646C2 (de) * | 1996-04-22 | 1998-04-09 | Steag Micro Tech Gmbh | Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter |
-
1996
- 1996-04-24 DE DE19655219A patent/DE19655219C2/de not_active Expired - Fee Related
- 1996-04-24 DE DE19654903A patent/DE19654903C2/de not_active Expired - Fee Related
- 1996-12-06 US US08/762,199 patent/US5921257A/en not_active Expired - Lifetime
-
1997
- 1997-03-27 KR KR1019980708443A patent/KR100316823B1/ko not_active IP Right Cessation
- 1997-03-27 EP EP97915453A patent/EP0895655B1/de not_active Expired - Lifetime
- 1997-03-27 AT AT97915453T patent/ATE259989T1/de not_active IP Right Cessation
- 1997-03-27 JP JP53765197A patent/JP3493030B2/ja not_active Expired - Fee Related
- 1997-03-27 WO PCT/EP1997/001580 patent/WO1997040524A1/de active IP Right Grant
- 1997-04-09 MY MYPI97001552A patent/MY132460A/en unknown
- 1997-04-10 TW TW086104566A patent/TW446575B/zh not_active IP Right Cessation
- 1997-04-22 ID IDP971344A patent/ID16694A/id unknown
-
1998
- 1998-04-07 US US09/056,586 patent/US5992431A/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
JPH05267263A (ja) * | 1992-03-17 | 1993-10-15 | Sony Corp | 半導体ウェーハ洗浄装置 |
JPH06208984A (ja) * | 1992-09-18 | 1994-07-26 | Dainippon Screen Mfg Co Ltd | 浸漬型基板処理装置 |
US5370142A (en) * | 1992-11-10 | 1994-12-06 | Tokyo Electron Limited | Substrate washing device |
Also Published As
Publication number | Publication date |
---|---|
ATE259989T1 (de) | 2004-03-15 |
KR100316823B1 (ko) | 2002-02-19 |
US5992431A (en) | 1999-11-30 |
US5921257A (en) | 1999-07-13 |
DE19655219C2 (de) | 2003-11-06 |
EP0895655A1 (de) | 1999-02-10 |
MY132460A (en) | 2007-10-31 |
TW446575B (en) | 2001-07-21 |
WO1997040524A1 (de) | 1997-10-30 |
ID16694A (id) | 1997-10-30 |
JPH11510965A (ja) | 1999-09-21 |
DE19654903A1 (de) | 1997-11-13 |
EP0895655B1 (de) | 2004-02-18 |
JP3493030B2 (ja) | 2004-02-03 |
KR20000010575A (ko) | 2000-02-15 |
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