DE19601649A1 - Electronic component heat extracting apparatus for e.g. electronics of motor vehicle - Google Patents

Electronic component heat extracting apparatus for e.g. electronics of motor vehicle

Info

Publication number
DE19601649A1
DE19601649A1 DE1996101649 DE19601649A DE19601649A1 DE 19601649 A1 DE19601649 A1 DE 19601649A1 DE 1996101649 DE1996101649 DE 1996101649 DE 19601649 A DE19601649 A DE 19601649A DE 19601649 A1 DE19601649 A1 DE 19601649A1
Authority
DE
Germany
Prior art keywords
circuit board
metal plate
elevations
arrangement according
insulation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE1996101649
Other languages
German (de)
Inventor
Alfred Schuster
Andreas Dipl Ing Heise
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
ITT Automotive Europe GmbH
Continental Teves AG and Co oHG
Original Assignee
ITT Automotive Europe GmbH
Alfred Teves GmbH
Temic Telefunken Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITT Automotive Europe GmbH, Alfred Teves GmbH, Temic Telefunken Microelectronic GmbH filed Critical ITT Automotive Europe GmbH
Priority to DE1996101649 priority Critical patent/DE19601649A1/en
Publication of DE19601649A1 publication Critical patent/DE19601649A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Abstract

The apparatus includes openings (8) in a circuit board (1), and its attached insulating layer (4), in the vicinity of at least one component (3). A metal plate (5) attached to the circuit board via an insulating layer has protrusions (9) whose height correspond to the thicknesses of the circuit board and insulating layer or slightly exceeds these thicknesses. The protrusions protrude through the openings in the circuit board and insulating layer. The insulating layer acts as an adhesive layer and a distance layer. The protrusions are pressed into the metal plate.

Description

Die Erfindung betrifft Anordnung zur Verbesserung der Wärmeableitung bei elektrischen und elektronischen Bauelementen gemäß dem Oberbegriff des Patentanspruchs 1.The invention relates to an arrangement for improving heat dissipation electrical and electronic components according to the preamble of Claim 1.

Einseitig mit elektrischen und elektronischen Bauelementen bestückte Lei­ terplatten, die rückseitig mit einer Isolationsschicht versehen und auf eine Kühlplatte aus Metall geklebt sind, sind in den letzten Jahren in der Automo­ bilelektronik auf breiter Basis in die Serie eingeführt worden. Oft sind derar­ tige Leiterplatten mit Bauelementen wie z. B. Leistungstransistoren bestückt, die beim Betrieb eine hohe Verlustleistung abgeben und sich dabei dem­ entsprechend erwärmen.Lei equipped with electrical and electronic components on one side terplatten, provided on the back with an insulation layer and on a Cooling plates made of metal have been glued to Automo in recent years bilelectronics have been introduced into the series on a broad basis. Often they are term circuit boards with components such. B. equipped with power transistors, which give off a high power loss during operation and thereby heat accordingly.

Nach dem Stand der Technik weist eine derartige Leiterplatte möglichst viele Durchkontaktierungen auf, um die Wärme der zu kühlenden Bauele­ mente von der Vorderseite auf ein mit der Rückseite verklebtes Kühlblech aus Aluminium ableiten zu können. Um eine gute Wärmeleitfähigkeit zu er­ zielen, muß die Isolationsschicht einerseits möglichst dünn ausgeführt sein; eine bestimmte Mindestdicke darf aber nicht unterschritten werden, um andererseits eine genügend hohe Durchschlagsfestigkeit zu garantieren.According to the prior art, such a printed circuit board has as much as possible many vias to the heat of the components to be cooled elements from the front onto a heat sink glued to the back to be able to derive from aluminum. To ensure good thermal conductivity aim, the insulation layer must be made as thin as possible; a certain minimum thickness must not be undercut in order to on the other hand to guarantee a sufficiently high dielectric strength.

Daraus ergibt sich der Nachteil, daß aufgrund der begrenzten Wärmeleitfä­ higkeit der Isolierschicht nur eine ungenügend hohe Ableitung der Wärme möglich ist.This has the disadvantage that due to the limited Wärmeleitfä ability of the insulating layer only insufficient heat dissipation is possible.

Es ist deshalb Aufgabe der Erfindung, eine Anordnung anzugeben, die eine wesentlich bessere Ableitung der Wärme ermöglicht.It is therefore an object of the invention to provide an arrangement which allows a much better heat dissipation.

Zur Lösung dieser Aufgabe wird eine Anordnung zur Verbesserung der Wär­ meableitung bei elektrischen und elektronischen Bauelementen angegeben, bei der eine die Bauelemente tragende Leiterplatte über eine Isolations­ schicht mit einer Metallplatte stoffschlüssig verbunden ist, wobei im Bereich wenigstens eines Bauelements in die Leiterplatte und in die Isolations­ schicht korrespondierende Öffnungen eingebracht sind und die Metallplatte Erhebungen aufweist, deren Höhe der Dicke der Leiterplatte und der Isola­ tionsschicht entspricht oder diese geringfügig übersteigt und wobei die Er­ hebungen durch die Öffnungen hindurchgeführt werden.To solve this problem, an arrangement to improve the heat measurement of electrical and electronic components, in which a circuit board carrying the components has an insulation layer is firmly bonded to a metal plate, being in the area at least one component in the circuit board and in the insulation Corresponding openings are introduced and the metal plate Has elevations, the height of the thickness of the circuit board and the isola tion layer corresponds or slightly exceeds this and the Er Lifts are passed through the openings.

Vorteilhafte Weiterbildungen der Erfindung sind in den Unteransprüchen beschrieben.Advantageous developments of the invention are in the subclaims described.

Die Vorteile der Erfindung liegen darin, daß die Leiterplatte nach wie vor auf herkömmliche Art und Weise bestückt werden kann. Wegen der verbes­ serten Wärmeableitfähigkeit können durch die Verwendung wesentlich gün­ stigerer elektronischer Bauelemente, insbesondere Transistoren, die auf­ grund eines höheren Vorwärtswiderstandes eine größere Verlustleistung aufweisen und dementsprechend mehr Wärme abgeben, Materialkosten eingespart werden.The advantages of the invention are that the circuit board is still can be loaded in a conventional manner. Because of the verbes Serten heat dissipation can be significantly reduced by the use electronic components, in particular transistors, based on due to a higher forward resistance a higher power loss exhibit and accordingly give off more heat, material costs be saved.

Zwei Ausführungsbeispiele der Erfindung sind nachstehend ausführlich er­ läutert und anhand der Figuren dargestellt.Two embodiments of the invention are detailed below refines and represented with the help of the figures.

Es zeigenShow it

Fig. 1: eine aufgeschnittene Seitenansicht einer mit einem Bauelement be­ stückten Leiterplatte und einer damit verbundenen Metallplatte mit gestanzter Erhebung und Fig. 1: a cutaway side view of a component with a component be printed circuit board and an associated metal plate with punched elevation and

Fig. 2: eine aufgeschnittene Seitenansicht einer mit einem Bauelement be­ stückten Leiterplatte und einer damit verbundenen Metallplatte mit aufgesetzter Erhebung. Fig. 2: a cut-away side view of a component with a component be printed circuit board and a metal plate connected to it with an elevation.

Die Fig. 1 und 2 zeigen eine Leiterplatte 1 (einseitig, zweiseitig oder Multi­ layer), die auf ihrer Vorderseite Leitbahnen 2 trägt und mit elektrischen und elektronischen Bauelementen 3, insbesondere mit Leistungsbauelementen, bestückt ist. Auf ihrer Rückseite weist sie eine dünne Isolationsschicht 4 auf, die auch als Klebeschicht dient, um eine als Kühlblech dienende und vorteil­ haft aus Kupfer bestehende Metallplatte 5 auf die Leiterplatte 1 auflaminie­ ren zu können. Jedes Bauelement 3 weist Anschlüsse 6 und auf seiner Rück­ seite ein Lötpad 7 auf, mit dem es auf der Leiterplatte 1 aufliegt. Figs. 1 and 2 show a circuit board 1 (single-sided, two-sided or multi-layer), which carries on its front side conductive lines 2, and is equipped with electrical and electronic components 3, in particular with power devices. On its rear side, it has a thin insulation layer 4 , which also serves as an adhesive layer, in order to be able to laminate a metal plate 5 serving as a cooling plate and advantageously made of copper onto the circuit board 1 . Each component 3 has connections 6 and on its rear side a solder pad 7 with which it rests on the circuit board 1 .

Um die in einem Bauelement 3 entstehende Wärme über das Lötpad 7 abzu­ leiten, weisen die Leiterplatte 1 und die Isolationsschicht 4 korrespondie­ rende Öffnungen 8 auf.In order to conduct the heat generated in a component 3 via the solder pad 7 , the circuit board 1 and the insulation layer 4 have corresponding openings 8 .

In Fig. 1 weist die Metallplatte 5 Erhebungen in Form von Prägenoppen 9 auf. Dabei ist Anordnung, Form und Durchmesser der Öffnungen 8 und der Prägenoppen 9 so aufeinander abgestimmt, daß die Prägenoppen 9 durch die Öffnungen 8 hindurchgeführt werden können. Vorzugsweise werden die Prägenoppen 9 in die Metallplatte 5 mittels eines Stanzvorgangs einge­ preßt, wodurch an der Unterseite der Metallplatte 5 Prägeeindrücke 10 ent­ stehen. Die Höhe der Prägenoppen 9 über der Oberfläche der Metallplatte 5 sollte der Dicke der Leiterplatte 1 plus der Dicke der Isolationsschicht 4 plus ggf. einem Übermaß von z. B. 0,2 mm entsprechen.In Fig. 1, the metal plate 5 has elevations in the form of embossed knobs 9 . The arrangement, shape and diameter of the openings 8 and the embossing knobs 9 are matched to one another in such a way that the embossing knobs 9 can be passed through the openings 8 . Preferably, the embossing knobs 9 are pressed into the metal plate 5 by means of a stamping process, as a result of which 5 embossing impressions 10 are formed on the underside of the metal plate 5 . The height of the embossed knobs 9 above the surface of the metal plate 5 should be the thickness of the printed circuit board 1 plus the thickness of the insulation layer 4 plus an excess of z. B. 0.2 mm.

Beim Verpressen der Kombination aus Leiterplatte 1 und Kühlblech 5 unter Zuhilfenahme der Isolationsschicht 4 als Klebeschicht und Abstandsschicht werden die Prägenoppen 9 auf Maß zurückgepreßt, so daß eine gute Planari­ tät zwischen Prägenoppen 9 und Leiterplatte 1 und damit ein guter Kontakt zwischen Prägenoppen 9 und Lötpad 7 erreicht wird. Beim Heißverzinnen der Leiterplatte 1 nach dem Verpressen werden die Prägenoppen 9 mit den Lötpads 7 verlötet, so daß dadurch die Wärmeleitfähigkeit in das Kühlblech 5 noch verbessert wird. Es ist auch möglich, das Heißverzinnen der Prä­ genoppen 9 während der Leiterplattenherstellung vorzunehmen.When pressing the combination of circuit board 1 and cooling plate 5 with the aid of the insulation layer 4 as an adhesive layer and spacer layer, the embossing knobs 9 are pressed back to size, so that a good planarity between embossing knobs 9 and printed circuit board 1 and thus good contact between embossing knobs 9 and solder pad 7 is achieved. When tinning the printed circuit board 1 after pressing, the embossing knobs 9 are soldered to the soldering pads 7 , so that the thermal conductivity in the cooling plate 5 is further improved. It is also possible to carry out the hot tinning of the embossed knobs 9 during the manufacture of the circuit board.

In Fig. 2 ist ein Noppen oder eine Warze 9 in die Öffnung 8 ein- und auf die Metallplatte 5 aufgesetzt, um für einen besseren Wärmetransport vom Löt­ pad 7 zur Metallplatte 5 zu sorgen. Weisen Lötpad 7 und Metallplatte 5 glei­ ches Potential auf, kann die Isolations- und Klebeschicht 4 zwischen Noppen 9 und Metallplatte 5 derart unterbrochen sein, daß der Noppen 9 direkt auf der Metallplatte 5 aufsitzt. Dadurch ergibt sich ein noch besserer Wärme­ transport zwischen Lötpad 7 und Metallplatte 5.In FIG. 2, a knob or a wart is switched on in the opening 8 and 9 placed on the metal plate 5 in order to improve the heat transfer from the solder pad 7 to the metal plate 5 to provide. If solder pad 7 and metal plate 5 have the same potential, the insulation and adhesive layer 4 between knobs 9 and metal plate 5 can be interrupted such that the knobs 9 are seated directly on the metal plate 5 . This results in an even better heat transport between solder pad 7 and metal plate 5th

Vorzugsweise wird die Oxidschicht der Metallplatte 5 vor dem Heißverzin­ nen mittels eines Ätzprozesses entfernt. Alternativ kann auch eine bereits verzinnte Metallplatte 5 mit einer bereits verzinnten Leiterplatte 1 verpreßt werden.The oxide layer of the metal plate 5 is preferably removed by means of an etching process before hot tinning. Alternatively, an already tinned metal plate 5 can be pressed with an already tinned circuit board 1 .

Anwendbar ist die erfindungsgemäße Anordnung zur Verbesserung der Wär­ meableitung insbesondere im Bereich der Planartechnologie, bei der eine Leiterplatte ein mit ihr stoffschlüssig verbundenes Kühlblech aufweist.The arrangement according to the invention can be used to improve the heat Derivation in particular in the area of planar technology, in which one Printed circuit board has a heat sink integrally connected to it.

Claims (6)

1. Anordnung zur Verbesserung der Wärmeableitung bei elektrischen und elektronischen Bauelementen (3), wobei eine die Bauelemente (3) tragende Leiterplatte (1) über eine Isolationsschicht (4) mit einer Metallplatte (5) stoff­ schlüssig verbunden ist, dadurch gekennzeichnet, daß im Bereich wenig­ stens eines Bauelements (3) in die Leiterplatte (1) und in die Isolationsschicht (4) korrespondierende Öffnungen (8) eingebracht sind, daß die Metallplatte (5) Erhebungen (9) aufweist, deren Höhe der Dicke der Leiterplatte (1) und der Isolationsschicht (4) entspricht oder diese geringfügig übersteigt und daß die Erhebungen (9) durch die Öffnungen (8) hindurchgeführt werden.1. Arrangement for improving the heat dissipation in electrical and electronic components ( 3 ), wherein the components ( 3 ) carrying circuit board ( 1 ) via an insulation layer ( 4 ) with a metal plate ( 5 ) is firmly connected, characterized in that in Area of at least one component ( 3 ) in the circuit board ( 1 ) and in the insulation layer ( 4 ) corresponding openings ( 8 ) are introduced that the metal plate ( 5 ) has elevations ( 9 ), the height of the thickness of the circuit board ( 1 ) and corresponds to or slightly exceeds the insulation layer ( 4 ) and that the elevations ( 9 ) are passed through the openings ( 8 ). 2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Isolati­ onsschicht (4) auch als Klebeschicht und Abstandsschicht dient.2. Arrangement according to claim 1, characterized in that the isolati onsschicht ( 4 ) also serves as an adhesive layer and spacer layer. 3. Verfahren zur Herstellung der Anordnung nach Anspruch 1, dadurch ge­ kennzeichnet, daß die Erhebungen (9) in Form von Prägenoppen mittels eines Stanzvorgangs in die Metallplatte (5) eingepreßt werden.3. A method for producing the arrangement according to claim 1, characterized in that the elevations ( 9 ) in the form of embossed knobs are pressed into the metal plate ( 5 ) by means of a punching process. 4. Verfahren zur Herstellung der Anordnung nach Anspruch 1, dadurch ge­ kennzeichnet, daß die Erhebungen (9) in Form von gut wärmeleitenden Warzen oder Noppen in die Öffnungen (8) eingesetzt werden.4. A method for producing the arrangement according to claim 1, characterized in that the elevations ( 9 ) are used in the form of good heat-conducting warts or knobs in the openings ( 8 ). 5. Verfahren zur Herstellung der Anordnung nach Anspruch 1, dadurch ge­ kennzeichnet, daß die Erhebungen (9) während des Verpressens der Leiter­ platte (1) und der Isolationsschicht (4) mit der Metallplatte (5) auf Maß zu­ rückgepreßt werden.5. A method for producing the arrangement according to claim 1, characterized in that the elevations ( 9 ) during the pressing of the circuit board ( 1 ) and the insulation layer ( 4 ) with the metal plate ( 5 ) to be pressed back to size. 6. Verfahren zur Herstellung der Anordnung nach Anspruch 1, dadurch ge­ kennzeichnet, daß die Erhebungen (9) während der Leiterplattenherstel­ lung heißverzinnt werden.6. A method for producing the arrangement according to claim 1, characterized in that the elevations ( 9 ) are tin-plated during the PCB production.
DE1996101649 1996-01-18 1996-01-18 Electronic component heat extracting apparatus for e.g. electronics of motor vehicle Ceased DE19601649A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1996101649 DE19601649A1 (en) 1996-01-18 1996-01-18 Electronic component heat extracting apparatus for e.g. electronics of motor vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996101649 DE19601649A1 (en) 1996-01-18 1996-01-18 Electronic component heat extracting apparatus for e.g. electronics of motor vehicle

Publications (1)

Publication Number Publication Date
DE19601649A1 true DE19601649A1 (en) 1997-07-24

Family

ID=7783057

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996101649 Ceased DE19601649A1 (en) 1996-01-18 1996-01-18 Electronic component heat extracting apparatus for e.g. electronics of motor vehicle

Country Status (1)

Country Link
DE (1) DE19601649A1 (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0938252A2 (en) * 1998-02-18 1999-08-25 Siemens Aktiengesellschaft Electrical circuit arrangement
DE19805492A1 (en) * 1998-02-11 1999-08-26 Siemens Ag Circuit board e.g. for electrical communications and measurement engineering
EP0963142A2 (en) * 1998-05-29 1999-12-08 Lucent Technologies Inc. Assembly having a back plate with inserts
DE19826023A1 (en) * 1998-06-10 1999-12-16 Siemens Ag Multi-layer electric circuit device with surface mounted devices
DE19919781A1 (en) * 1999-04-30 2000-11-09 Wuerth Elektronik Gmbh Printed circuit board and method of mounting it
FR2796801A1 (en) * 1999-07-23 2001-01-26 Valeo Electronique Assembly of printed circuit board and base comprises layer inserted between PCB and base, and having series of contact blocks extended through apertures of PCB
FR2802714A1 (en) * 1999-12-21 2001-06-22 Sagem Improved car industry electronic power module construction/manufacture having power module first printed circuit board mounted and polymer film adhesive solidly connected second printed circuit board/conductor bar.
DE10214311A1 (en) * 2002-03-28 2003-10-09 Marconi Comm Gmbh Cooling device for electronic component such as SMD, has heat conductor held by friction in opening in circuit board, with heat sink on opposite surface
DE19949429C2 (en) * 1999-10-13 2003-10-09 Conti Temic Microelectronic Process for processing a plated-through circuit board
DE10217214A1 (en) * 2002-04-18 2003-11-27 Hella Kg Hueck & Co Circuit arrangement comprises a circuit carrier with a heat-producing electronic component, and a cooling device connected to the circuit carrier in a heat-conducting manner
EP1496729A2 (en) * 2003-07-10 2005-01-12 NUOVA LAELVI S.r.l. Società Unipersonale Method of assembling a printed circuit to a support
DE10329267A1 (en) * 2003-06-30 2005-01-27 Robert Bosch Gmbh Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
FR2861949A1 (en) * 2003-10-31 2005-05-06 Dav Power switching device for vehicles interconnection housing, has spacer made up of insulating resin presenting insulation at ambient temperature and bonding property at temperature greater than ambient temperature
EP1592288A1 (en) * 2004-04-29 2005-11-02 Fuba Printed Circuits GmbH Printed circuit board
DE102004036960A1 (en) * 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Printed circuit board and method for producing such a printed circuit board
WO2006071577A1 (en) * 2004-12-29 2006-07-06 Agere Systems Inc. Packaging for electronic modules
WO2006099977A1 (en) 2005-03-22 2006-09-28 Sew-Eurodrive Gmbh & Co. Kg Method for producing an electronic appliance, and corresponding electronic appliance
WO2006102875A2 (en) 2005-03-31 2006-10-05 Conti Temic Microelectronic Gmbh Printed circuit board assembly
DE102005019922A1 (en) * 2005-04-27 2006-11-02 Conti Temic Microelectronic Gmbh Multilayer printed board for controller of electrical window lifter in motor vehicle has electrical resistance for measuring input power of electrical or electronic component
DE102005021918A1 (en) * 2005-05-12 2006-11-16 Conti Temic Microelectronic Gmbh Component temperature determination procedure calculates heat input from current flowing and uses this with measured environment temperature
DE102006017267A1 (en) * 2005-05-13 2006-11-23 Lear Corporation, Southfield Circuit board with an adhesively bonded metal section for dissipating heat and distributing energy
DE102005039374A1 (en) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Housing for an electronic circuit having one housing part formed as a heat sink
DE102005039706A1 (en) * 2005-08-23 2007-03-01 Hella Kgaa Hueck & Co. Printed circuit board structure for an electronic device like a choke/controller on a gas discharge lamp has electronic components attached to a heat sink and earthing contacts
US7215204B2 (en) 2004-12-29 2007-05-08 Agere Systems Inc. Intelligent high-power amplifier module
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
ES2347864A1 (en) * 2010-06-11 2010-11-04 Zertan S.A. Heat dissipation system for power transistors (Machine-translation by Google Translate, not legally binding)
DE102009051632A1 (en) * 2009-11-02 2011-05-05 Beru Ag Printed circuit board for glow plug control device, has cooling body designed as metal plate, which carries board and exhibits projections that are engaged or pressed into recess of board, where projections carry electronic components
DE102011007307A1 (en) * 2011-04-13 2012-10-18 Robert Bosch Gmbh Storage unit for storing electrical energy with a cooling element
DE102011113929A1 (en) * 2011-09-21 2013-03-21 Oechsler Aktiengesellschaft Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing
JP2016025229A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP2016025228A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP2016122679A (en) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 Circuit constitution body and manufacturing method for the same
EP3310140A1 (en) * 2016-10-14 2018-04-18 Continental Automotive GmbH Mounting assembly with a heatsink
CN111726933A (en) * 2020-08-18 2020-09-29 辽宁欧立达电子有限公司 Multilayer interconnected three-dimensional circuit board with high heat dissipation performance and preparation method thereof
WO2021069448A1 (en) * 2019-10-09 2021-04-15 Vitesco Technologies GmbH Method for producing a power semiconductor module, and power semiconductor module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT32807B (en) * 1907-04-12 1908-05-11 Loziano Et Finet Fa Cooling device.
DE8228451U1 (en) * 1982-10-09 1983-02-17 Standard Elektrik Lorenz Ag, 7000 Stuttgart Heat sink
DE3315583A1 (en) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München AN ELECTRICAL COMPONENT-CARRYING, EASILY COOLABLE CIRCUIT MODULE
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
DE4107312A1 (en) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
DE4220966A1 (en) * 1992-06-25 1994-01-13 Siemens Ag Mfg. carrier plate for electrical components - providing through opening for heat sink element in form of press-fitting cylindrical plug of metal to contact electronic device
DE4326506A1 (en) * 1993-08-06 1995-02-09 Bosch Gmbh Robert Electrical appliance, in particular a switching device or controller for motor vehicles

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT32807B (en) * 1907-04-12 1908-05-11 Loziano Et Finet Fa Cooling device.
DE8228451U1 (en) * 1982-10-09 1983-02-17 Standard Elektrik Lorenz Ag, 7000 Stuttgart Heat sink
DE3315583A1 (en) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München AN ELECTRICAL COMPONENT-CARRYING, EASILY COOLABLE CIRCUIT MODULE
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
DE4107312A1 (en) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
DE4220966A1 (en) * 1992-06-25 1994-01-13 Siemens Ag Mfg. carrier plate for electrical components - providing through opening for heat sink element in form of press-fitting cylindrical plug of metal to contact electronic device
DE4326506A1 (en) * 1993-08-06 1995-02-09 Bosch Gmbh Robert Electrical appliance, in particular a switching device or controller for motor vehicles

Cited By (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19805492A1 (en) * 1998-02-11 1999-08-26 Siemens Ag Circuit board e.g. for electrical communications and measurement engineering
DE19805492C2 (en) * 1998-02-11 1999-12-02 Siemens Ag Circuit board
EP0938252A3 (en) * 1998-02-18 2001-02-14 Siemens Aktiengesellschaft Electrical circuit arrangement
EP0938252A2 (en) * 1998-02-18 1999-08-25 Siemens Aktiengesellschaft Electrical circuit arrangement
EP0963142A2 (en) * 1998-05-29 1999-12-08 Lucent Technologies Inc. Assembly having a back plate with inserts
EP0963142A3 (en) * 1998-05-29 2000-04-05 Lucent Technologies Inc. Assembly having a back plate with inserts
US6292374B1 (en) 1998-05-29 2001-09-18 Lucent Technologies, Inc. Assembly having a back plate with inserts
DE19826023A1 (en) * 1998-06-10 1999-12-16 Siemens Ag Multi-layer electric circuit device with surface mounted devices
DE19826023C2 (en) * 1998-06-10 2001-01-25 Siemens Ag Multi-layer electrical circuit arrangement
DE19919781A1 (en) * 1999-04-30 2000-11-09 Wuerth Elektronik Gmbh Printed circuit board and method of mounting it
FR2796801A1 (en) * 1999-07-23 2001-01-26 Valeo Electronique Assembly of printed circuit board and base comprises layer inserted between PCB and base, and having series of contact blocks extended through apertures of PCB
WO2001008459A1 (en) * 1999-07-23 2001-02-01 Valeo Electronique Electronic assembly comprising a sole plate forming a heat sink
US6706972B1 (en) 1999-07-23 2004-03-16 Valeo Electronique Electronic assembly comprising a sole plate forming a heat sink
DE19949429C2 (en) * 1999-10-13 2003-10-09 Conti Temic Microelectronic Process for processing a plated-through circuit board
FR2802714A1 (en) * 1999-12-21 2001-06-22 Sagem Improved car industry electronic power module construction/manufacture having power module first printed circuit board mounted and polymer film adhesive solidly connected second printed circuit board/conductor bar.
EP1115274A1 (en) * 1999-12-21 2001-07-11 Sagem S.A. Electrical power module and method for its manufacture
DE10214311A1 (en) * 2002-03-28 2003-10-09 Marconi Comm Gmbh Cooling device for electronic component such as SMD, has heat conductor held by friction in opening in circuit board, with heat sink on opposite surface
DE10217214B4 (en) * 2002-04-18 2004-03-11 Hella Kg Hueck & Co. Cooling arrangement for a circuit arrangement
DE10217214A1 (en) * 2002-04-18 2003-11-27 Hella Kg Hueck & Co Circuit arrangement comprises a circuit carrier with a heat-producing electronic component, and a cooling device connected to the circuit carrier in a heat-conducting manner
DE10329267A1 (en) * 2003-06-30 2005-01-27 Robert Bosch Gmbh Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
EP1496729A2 (en) * 2003-07-10 2005-01-12 NUOVA LAELVI S.r.l. Società Unipersonale Method of assembling a printed circuit to a support
EP1496729A3 (en) * 2003-07-10 2005-07-27 NUOVA LAELVI S.r.l. Società Unipersonale Method of assembling a printed circuit to a support
FR2861949A1 (en) * 2003-10-31 2005-05-06 Dav Power switching device for vehicles interconnection housing, has spacer made up of insulating resin presenting insulation at ambient temperature and bonding property at temperature greater than ambient temperature
EP1592288A1 (en) * 2004-04-29 2005-11-02 Fuba Printed Circuits GmbH Printed circuit board
DE102004036960A1 (en) * 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Printed circuit board and method for producing such a printed circuit board
WO2006071577A1 (en) * 2004-12-29 2006-07-06 Agere Systems Inc. Packaging for electronic modules
US7215204B2 (en) 2004-12-29 2007-05-08 Agere Systems Inc. Intelligent high-power amplifier module
US7433192B2 (en) 2004-12-29 2008-10-07 Agere Systems Inc. Packaging for electronic modules
WO2006099977A1 (en) 2005-03-22 2006-09-28 Sew-Eurodrive Gmbh & Co. Kg Method for producing an electronic appliance, and corresponding electronic appliance
DE102005013763A1 (en) * 2005-03-22 2006-10-05 Sew-Eurodrive Gmbh & Co. Kg Method of manufacturing an electronic device and electronic device
DE102005013763B4 (en) * 2005-03-22 2007-09-13 Sew-Eurodrive Gmbh & Co. Kg Manufacturing method for a heat dissipation device
WO2006102875A2 (en) 2005-03-31 2006-10-05 Conti Temic Microelectronic Gmbh Printed circuit board assembly
DE102005014605A1 (en) * 2005-03-31 2006-10-05 Conti Temic Microelectronic Gmbh Printed circuit board assembly
DE102005019922A1 (en) * 2005-04-27 2006-11-02 Conti Temic Microelectronic Gmbh Multilayer printed board for controller of electrical window lifter in motor vehicle has electrical resistance for measuring input power of electrical or electronic component
DE102005021918B4 (en) * 2005-05-12 2015-04-02 Conti Temic Microelectronic Gmbh Method for determining the temperature of a component
DE102005021918A1 (en) * 2005-05-12 2006-11-16 Conti Temic Microelectronic Gmbh Component temperature determination procedure calculates heat input from current flowing and uses this with measured environment temperature
DE102006017267A1 (en) * 2005-05-13 2006-11-23 Lear Corporation, Southfield Circuit board with an adhesively bonded metal section for dissipating heat and distributing energy
DE102005039374A1 (en) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Housing for an electronic circuit having one housing part formed as a heat sink
DE102005039706A1 (en) * 2005-08-23 2007-03-01 Hella Kgaa Hueck & Co. Printed circuit board structure for an electronic device like a choke/controller on a gas discharge lamp has electronic components attached to a heat sink and earthing contacts
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
WO2009141413A1 (en) * 2008-05-21 2009-11-26 Nujira Limited Printed circuit board with co-planar plate and method of manufacturing therefor
DE102009051632A1 (en) * 2009-11-02 2011-05-05 Beru Ag Printed circuit board for glow plug control device, has cooling body designed as metal plate, which carries board and exhibits projections that are engaged or pressed into recess of board, where projections carry electronic components
ES2347864A1 (en) * 2010-06-11 2010-11-04 Zertan S.A. Heat dissipation system for power transistors (Machine-translation by Google Translate, not legally binding)
DE102011007307A1 (en) * 2011-04-13 2012-10-18 Robert Bosch Gmbh Storage unit for storing electrical energy with a cooling element
DE102011113929B4 (en) * 2011-09-21 2016-11-24 Oechsler Aktiengesellschaft Electromechanical circuit construction
DE102011113929A1 (en) * 2011-09-21 2013-03-21 Oechsler Aktiengesellschaft Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing
JP2016025229A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP2016025228A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP2016122679A (en) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 Circuit constitution body and manufacturing method for the same
EP3310140A1 (en) * 2016-10-14 2018-04-18 Continental Automotive GmbH Mounting assembly with a heatsink
WO2018069476A1 (en) * 2016-10-14 2018-04-19 Continental Automotive Gmbh Mounting assembly with a heatsink
CN109937617A (en) * 2016-10-14 2019-06-25 世倍特集团有限责任公司 Has gelled mounting assembly
US10681801B2 (en) 2016-10-14 2020-06-09 Cpt Group Gmbh Mounting assembly with a heatsink
CN109937617B (en) * 2016-10-14 2020-12-01 世倍特集团有限责任公司 Mounting assembly with heat sink
WO2021069448A1 (en) * 2019-10-09 2021-04-15 Vitesco Technologies GmbH Method for producing a power semiconductor module, and power semiconductor module
CN111726933A (en) * 2020-08-18 2020-09-29 辽宁欧立达电子有限公司 Multilayer interconnected three-dimensional circuit board with high heat dissipation performance and preparation method thereof
CN111726933B (en) * 2020-08-18 2023-05-09 辽宁欧立达电子有限公司 Multilayer interconnection three-dimensional circuit board with high heat dissipation performance and preparation method thereof

Similar Documents

Publication Publication Date Title
DE19601649A1 (en) Electronic component heat extracting apparatus for e.g. electronics of motor vehicle
DE2840514C2 (en)
DE19736962B4 (en) Arrangement, comprising a carrier substrate for power devices and a heat sink and method for producing the same
EP0920055B1 (en) Cooling device for a heat generating component on a printed board
DE10306643B4 (en) Arrangement in pressure contact with a power semiconductor module
EP2043412A1 (en) Conductor rail with heat conduction
DE102006008807B4 (en) Arrangement with a power semiconductor module and a cooling component
DE102018109920A1 (en) Cooling of power electronic circuits
WO2009132922A2 (en) Substrate-mounted circuit module comprising components in a plurality of contact planes
EP0654799A1 (en) Chip form of surface mounted electrical resistance and its manufacturing method
DE102011088218B4 (en) Electronic power module with thermal coupling layers to a cooling element and method of manufacture
DE112016005794T5 (en) Circuit and electrical connection box
DE4332115B4 (en) Arrangement for cooling at least one heat sink printed circuit board
DE4218112A1 (en) Electric switch and control device for motor vehicle - has PCB sandwiched between housing hood and base with connectors through matching peripheral rims
EP3273474A1 (en) Power electronics switching device, arrangement using the same, and method for producing the switch device
EP3273473A1 (en) Power electronics switching device, arrangement using the same, and method for producing the switch device
EP0674827A1 (en) Circuit-board device
DE69936189T2 (en) ELECTRIC CONDUCTOR WITH FLANGED AND GROOVED CROPS SHAPED SURFACE STRUCTURE
EP3273470A1 (en) Power electronics switching device, arrangement using the same, and method for producing the switch device
WO2009121697A1 (en) Current-carrying component comprising a carrier, conductor tracks and conductor laminae
WO2016045930A1 (en) Circuit board
DE102019115573B4 (en) Power electronic switching device and method of manufacture
EP0484756A2 (en) SMD-type resistor arrangement
DE102006001188A1 (en) Arrangement for cooling power components on printed circuit boards and method for producing the same
DE19805492C2 (en) Circuit board

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection