DE112006003051A5 - Layoutverfahren für vertikale Leistungstransistoren variierbarer Kanalweite - Google Patents
Layoutverfahren für vertikale Leistungstransistoren variierbarer Kanalweite Download PDFInfo
- Publication number
- DE112006003051A5 DE112006003051A5 DE112006003051T DE112006003051T DE112006003051A5 DE 112006003051 A5 DE112006003051 A5 DE 112006003051A5 DE 112006003051 T DE112006003051 T DE 112006003051T DE 112006003051 T DE112006003051 T DE 112006003051T DE 112006003051 A5 DE112006003051 A5 DE 112006003051A5
- Authority
- DE
- Germany
- Prior art keywords
- channel width
- power transistors
- vertical power
- layout method
- variable channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112006003051T DE112006003051A5 (de) | 2005-10-27 | 2006-10-25 | Layoutverfahren für vertikale Leistungstransistoren variierbarer Kanalweite |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005051417.0 | 2005-10-27 | ||
DE102005051417A DE102005051417A1 (de) | 2005-10-27 | 2005-10-27 | Simulations- bzw. Layoutverfahren für vertikale Leistungstransistoren mit variierbarer Kanalweite und variierbarer Gate-Drain-Kapazität |
DE112006003051T DE112006003051A5 (de) | 2005-10-27 | 2006-10-25 | Layoutverfahren für vertikale Leistungstransistoren variierbarer Kanalweite |
PCT/EP2006/067774 WO2007048812A1 (de) | 2005-10-27 | 2006-10-25 | Layoutverfahren für vertikale leistungstransistoren variierbarer kanalweite |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112006003051A5 true DE112006003051A5 (de) | 2008-10-30 |
Family
ID=37697954
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102005051417A Ceased DE102005051417A1 (de) | 2005-10-27 | 2005-10-27 | Simulations- bzw. Layoutverfahren für vertikale Leistungstransistoren mit variierbarer Kanalweite und variierbarer Gate-Drain-Kapazität |
DE112006003051T Withdrawn DE112006003051A5 (de) | 2005-10-27 | 2006-10-25 | Layoutverfahren für vertikale Leistungstransistoren variierbarer Kanalweite |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102005051417A Ceased DE102005051417A1 (de) | 2005-10-27 | 2005-10-27 | Simulations- bzw. Layoutverfahren für vertikale Leistungstransistoren mit variierbarer Kanalweite und variierbarer Gate-Drain-Kapazität |
Country Status (4)
Country | Link |
---|---|
US (1) | US8448101B2 (de) |
EP (1) | EP1941407A1 (de) |
DE (2) | DE102005051417A1 (de) |
WO (1) | WO2007048812A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2009222165B2 (en) | 2008-02-29 | 2015-07-09 | Smith & Nephew, Inc. | Gradient coating for biomedical applications |
EP2268327B1 (de) | 2008-02-29 | 2019-05-29 | Smith & Nephew, Inc. | Beschichtung und beschichtungsverfahren |
CN102831254B (zh) * | 2011-06-15 | 2015-12-02 | 中国科学院微电子研究所 | Mos器件版图批量化设计方法 |
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US4914058A (en) * | 1987-12-29 | 1990-04-03 | Siliconix Incorporated | Grooved DMOS process with varying gate dielectric thickness |
US5078498A (en) * | 1990-06-29 | 1992-01-07 | Texas Instruments Incorporated | Two-transistor programmable memory cell with a vertical floating gate transistor |
GB9112964D0 (en) * | 1991-06-15 | 1991-08-07 | Odin Dev Ltd | Packaging |
US5780324A (en) * | 1994-03-30 | 1998-07-14 | Denso Corporation | Method of manufacturing a vertical semiconductor device |
DE4429908A1 (de) * | 1994-08-23 | 1996-02-29 | Siemens Ag | Mit Heizrohren ausgestattete Heizkammer für Festgut |
US6433382B1 (en) * | 1995-04-06 | 2002-08-13 | Motorola, Inc. | Split-gate vertically oriented EEPROM device and process |
US5844277A (en) * | 1996-02-20 | 1998-12-01 | Magepower Semiconductor Corp. | Power MOSFETs and cell topology |
US5995734A (en) * | 1996-03-07 | 1999-11-30 | Matsushita Electric Industrial Co., Ltd. | Method for generating transistor placement in an automatic cell layout design |
US5763914A (en) * | 1997-07-16 | 1998-06-09 | Megamos Corporation | Cell topology for power transistors with increased packing density |
US6072216A (en) * | 1998-05-01 | 2000-06-06 | Siliconix Incorporated | Vertical DMOS field effect transistor with conformal buried layer for reduced on-resistance |
US6665849B2 (en) * | 1999-06-09 | 2003-12-16 | Interuniversitair Microelektronica Centrum Vzw | Method and apparatus for simulating physical fields |
JP3474778B2 (ja) * | 1998-06-30 | 2003-12-08 | 株式会社東芝 | 半導体装置 |
JP3332020B2 (ja) * | 1999-09-30 | 2002-10-07 | 日本電気株式会社 | 半導体集積回路の配線レイアウトシステムおよびクロック配線の設計方法 |
US20020073388A1 (en) * | 1999-12-07 | 2002-06-13 | Orshansky Michael E. | Methodology to improve the performance of integrated circuits by exploiting systematic process non-uniformity |
DE10025583A1 (de) * | 2000-05-24 | 2001-12-06 | Infineon Technologies Ag | Verfahren zur Optimierung integrierter Schaltungen, Vorrichtung zum Entwurf von Halbleitern und Programmobjekt zum Entwerfen integrierter Schaltungen |
US6651236B2 (en) * | 2000-09-13 | 2003-11-18 | Ricoh Company, Ltd. | Semiconductor integrated circuit device, and method of placement and routing for such device |
JP2002237591A (ja) * | 2000-12-31 | 2002-08-23 | Texas Instruments Inc | Dmosトランジスタ・ソース構造とその製法 |
US6436774B1 (en) * | 2001-01-26 | 2002-08-20 | Chartered Semiconductor Manufacturing Ltd. | Method for forming variable-K gate dielectric |
US6769007B2 (en) | 2001-04-05 | 2004-07-27 | Sun Microsystems, Inc. | Adder circuit with a regular structure |
DE10125967C1 (de) * | 2001-05-29 | 2002-07-11 | Infineon Technologies Ag | DRAM-Zellanordnung mit vertikalen MOS-Transistoren und Verfahren zu deren Herstellung |
US7037862B2 (en) * | 2001-06-13 | 2006-05-02 | Micron Technology, Inc. | Dielectric layer forming method and devices formed therewith |
JP3617971B2 (ja) * | 2001-12-11 | 2005-02-09 | 株式会社東芝 | 半導体記憶装置 |
US6515325B1 (en) * | 2002-03-06 | 2003-02-04 | Micron Technology, Inc. | Nanotube semiconductor devices and methods for making the same |
GB0208833D0 (en) * | 2002-04-18 | 2002-05-29 | Koninkl Philips Electronics Nv | Trench-gate semiconductor devices |
JP3677489B2 (ja) * | 2002-05-29 | 2005-08-03 | Necエレクトロニクス株式会社 | 縦型電界効果トランジスタ |
US6878999B2 (en) * | 2003-07-15 | 2005-04-12 | Texas Instruments Incorporated | Transistor with improved safe operating area |
US6870221B2 (en) * | 2002-12-09 | 2005-03-22 | Semiconductor Components Industries, Llc | Power switching transistor with low drain to gate capacitance |
TWI222719B (en) * | 2003-08-13 | 2004-10-21 | Nanya Technology Corp | Memory cell of dynamic random access memory and manufacturing method of support circuit region |
KR100639673B1 (ko) * | 2003-12-22 | 2006-10-30 | 삼성전자주식회사 | 고유전 합금으로 이루어지는 게이트 유전막을 구비하는반도체 소자 및 그 제조 방법 |
JP2005236084A (ja) * | 2004-02-20 | 2005-09-02 | Toshiba Corp | 縦型バイポーラトランジスタ及びその製造方法 |
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US7241655B2 (en) * | 2004-08-30 | 2007-07-10 | Micron Technology, Inc. | Method of fabricating a vertical wrap-around-gate field-effect-transistor for high density, low voltage logic and memory array |
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DE102004048278B3 (de) * | 2004-10-05 | 2006-06-01 | X-Fab Semiconductor Foundries Ag | Simulations- und/oder Layoutverfahren für Leistungstransistoren, die für unterschiedliche Leistungen ausgelegt sind |
JP4426955B2 (ja) * | 2004-11-30 | 2010-03-03 | 株式会社ルネサステクノロジ | 半導体装置 |
US7322015B2 (en) * | 2005-01-05 | 2008-01-22 | Honeywell Internatinal Inc. | Simulating a dose rate event in a circuit design |
US7345343B2 (en) * | 2005-08-02 | 2008-03-18 | Texas Instruments Incorporated | Integrated circuit having a top side wafer contact and a method of manufacture therefor |
US7262109B2 (en) * | 2005-08-03 | 2007-08-28 | Texas Instruments Incorporated | Integrated circuit having a transistor level top side wafer contact and a method of manufacture therefor |
US20080048186A1 (en) * | 2006-03-30 | 2008-02-28 | International Business Machines Corporation | Design Structures Incorporating Semiconductor Device Structures with Self-Aligned Doped Regions |
TWI307124B (en) * | 2006-04-06 | 2009-03-01 | Ind Tech Res Inst | Method of fabricating a semiconductor device |
JP2007317741A (ja) * | 2006-05-23 | 2007-12-06 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
DE102006027504A1 (de) * | 2006-06-14 | 2007-12-27 | X-Fab Semiconductor Foundries Ag | Randabschlussstruktur von MOS-Leistungstransistoren hoher Spannungen |
JP4772656B2 (ja) * | 2006-12-21 | 2011-09-14 | 株式会社東芝 | 不揮発性半導体メモリ |
US8653583B2 (en) * | 2007-02-16 | 2014-02-18 | Power Integrations, Inc. | Sensing FET integrated with a high-voltage transistor |
EP2309544B1 (de) * | 2009-10-06 | 2019-06-12 | IMEC vzw | Tunnelfeldeffekt-Transistor mit verbesserter Subschwellenschwingung |
-
2005
- 2005-10-27 DE DE102005051417A patent/DE102005051417A1/de not_active Ceased
-
2006
- 2006-10-25 DE DE112006003051T patent/DE112006003051A5/de not_active Withdrawn
- 2006-10-25 EP EP06807547A patent/EP1941407A1/de not_active Withdrawn
- 2006-10-25 WO PCT/EP2006/067774 patent/WO2007048812A1/de active Application Filing
- 2006-10-25 US US12/091,575 patent/US8448101B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20090007046A1 (en) | 2009-01-01 |
US8448101B2 (en) | 2013-05-21 |
WO2007048812A1 (de) | 2007-05-03 |
DE102005051417A1 (de) | 2007-05-03 |
EP1941407A1 (de) | 2008-07-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |