DE112006002428A5 - Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls - Google Patents

Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls Download PDF

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Publication number
DE112006002428A5
DE112006002428A5 DE112006002428T DE112006002428T DE112006002428A5 DE 112006002428 A5 DE112006002428 A5 DE 112006002428A5 DE 112006002428 T DE112006002428 T DE 112006002428T DE 112006002428 T DE112006002428 T DE 112006002428T DE 112006002428 A5 DE112006002428 A5 DE 112006002428A5
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Germany
Prior art keywords
flip
chip module
generating
chip
module
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DE112006002428T
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English (en)
Inventor
Ernst-A. Weissbach
Jürgen Ertl
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HTC Beteiligungs GmbH
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HTC Beteiligungs GmbH
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Priority claimed from DE102005043910A external-priority patent/DE102005043910A1/de
Application filed by HTC Beteiligungs GmbH filed Critical HTC Beteiligungs GmbH
Publication of DE112006002428A5 publication Critical patent/DE112006002428A5/de
Withdrawn legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
DE112006002428T 2005-09-14 2006-09-13 Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls Withdrawn DE112006002428A5 (de)

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DE102005043910A DE102005043910A1 (de) 2005-09-14 2005-09-14 Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls
DE102005050150.8 2005-10-19
DE102005050150 2005-10-19
PCT/EP2006/008921 WO2007031298A1 (de) 2005-09-14 2006-09-13 Flip-chip-modul und verfahren zum erzeugen eines flip-chip-moduls

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WO2007031298A8 (de) 2007-09-20
WO2007031298A1 (de) 2007-03-22
US8026583B2 (en) 2011-09-27
KR101247138B1 (ko) 2013-03-29
US20110001232A1 (en) 2011-01-06

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