DE10295894T1 - Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser - Google Patents

Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser

Info

Publication number
DE10295894T1
DE10295894T1 DE10295894T DE10295894T DE10295894T1 DE 10295894 T1 DE10295894 T1 DE 10295894T1 DE 10295894 T DE10295894 T DE 10295894T DE 10295894 T DE10295894 T DE 10295894T DE 10295894 T1 DE10295894 T1 DE 10295894T1
Authority
DE
Germany
Prior art keywords
control device
laser processing
focus control
focus
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10295894T
Other languages
English (en)
Inventor
Craig A Fordahl
Michael J Hiebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novanta Inc
Original Assignee
GSI Lumonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GSI Lumonics Inc filed Critical GSI Lumonics Inc
Publication of DE10295894T1 publication Critical patent/DE10295894T1/de
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/101Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01DNON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D5/00Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
    • F01D5/12Blades
    • F01D5/14Form or construction
    • F01D5/18Hollow blades, i.e. blades with cooling or heating channels or cavities; Heating, heat-insulating or cooling means on blades
    • F01D5/186Film cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • B23K26/048Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/001Turbines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
DE10295894T 2001-01-30 2002-01-28 Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser Ceased DE10295894T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/774,276 US6720567B2 (en) 2001-01-30 2001-01-30 Apparatus and method for focal point control for laser machining
PCT/US2002/002432 WO2002074482A1 (en) 2001-01-30 2002-01-28 Apparatus and method for focal point control for laser machining

Publications (1)

Publication Number Publication Date
DE10295894T1 true DE10295894T1 (de) 2003-12-24

Family

ID=25100759

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10295894T Ceased DE10295894T1 (de) 2001-01-30 2002-01-28 Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser

Country Status (5)

Country Link
US (1) US6720567B2 (de)
KR (1) KR100899910B1 (de)
DE (1) DE10295894T1 (de)
GB (1) GB2393511B (de)
WO (1) WO2002074482A1 (de)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6737607B2 (en) 2001-03-16 2004-05-18 Tip Engineering Group, Inc. Apparatus for laser cutting a workpiece
WO2004045031A2 (en) * 2002-11-13 2004-05-27 Ackley Machine Corporation Laser unit, inspection unit, method for inspecting pellet-shaped articles and pharmaceutical article
DE10305875A1 (de) * 2003-02-13 2004-09-16 Robert Bosch Gmbh Verfahren zur Prozesssicherung bei einem Bohrprozess
DE10308979A1 (de) * 2003-02-28 2004-09-09 Mtu Aero Engines Gmbh Verfahren und Vorrichtung zur Instandsetzung und Fertigung von geometrisch komplexen Bauteilen
US7057134B2 (en) * 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7060932B2 (en) * 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7379483B2 (en) * 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
US7286223B2 (en) * 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
US7038166B2 (en) * 2003-03-18 2006-05-02 Loma Linda University Medical Center Containment plenum for laser irradiation and removal of material from a surface of a structure
US7880116B2 (en) * 2003-03-18 2011-02-01 Loma Linda University Medical Center Laser head for irradiation and removal of material from a surface of a structure
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
JP2005028423A (ja) * 2003-07-09 2005-02-03 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US20050035097A1 (en) * 2003-08-11 2005-02-17 Richard Stoltz Altering the emission of an ablation beam for safety or control
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
ATE375841T1 (de) * 2003-08-27 2007-11-15 Alstom Technology Ltd Adaptive automatisierte bearbeitung von überfüllten kanälen
JP2005118808A (ja) * 2003-10-15 2005-05-12 Disco Abrasive Syst Ltd レーザー加工装置
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7671297B2 (en) * 2003-11-20 2010-03-02 Ethicon, Inc. Method and apparatus for laser drilling workpieces
EP1550527A1 (de) * 2003-12-30 2005-07-06 Advanced Laser Separation International (ALSI) B.V. Verfahren und Vorrichtung zum Trennen in einem aus einem halbleitenden Material erzeugten Wafer hergestellte Halbleiterkomponente - ein mit diesem Verfahren getrenntes Halbleiterelement
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
US20050263497A1 (en) * 2004-03-26 2005-12-01 Lehane Christopher J System for laser drilling of shaped holes
US7547866B2 (en) * 2004-04-28 2009-06-16 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method and method for manufacturing semiconductor device including an autofocusing mechanism using the same
KR100626553B1 (ko) * 2004-05-04 2006-09-21 주식회사 탑 엔지니어링 비금속재 절단장치 및 비금속재 절단시의 절단깊이 제어방법
US7155299B2 (en) * 2004-06-01 2006-12-26 Manufacturing Integration Technology Ltd Method and apparatus for precise marking and placement of an object
US7321421B2 (en) * 2004-07-30 2008-01-22 The Boeing Company Apparatus and methods for scanning conoscopic holography measurements
US7718921B2 (en) * 2004-11-17 2010-05-18 Metal Improvement Company Llc Active beam delivery system with variable optical path segment through air
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
DE102005042270B4 (de) * 2005-09-06 2015-11-19 MTU Aero Engines AG Verfahren zum Fertigen von Bohrungen und Fertigungsanordnung hierfür
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
JP4141485B2 (ja) * 2006-07-19 2008-08-27 トヨタ自動車株式会社 レーザ加工システムおよびレーザ加工方法
EP2047935B1 (de) * 2006-07-31 2013-05-08 IHI Corporation Verfahren zur herstellung einer verstärkungsplatte
DE102007035715A1 (de) * 2006-12-27 2008-07-03 Robert Bosch Gmbh Laserstrahlbearbeitungsvorrichtung sowie Verfahren zum Justieren der Fokuslage
US8212177B2 (en) * 2007-08-15 2012-07-03 Caterpillar Inc. Variable focus laser machining system
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
JP5071122B2 (ja) * 2008-01-24 2012-11-14 セイコーエプソン株式会社 廃液処理装置及び液体噴射装置
JP2009184133A (ja) * 2008-02-04 2009-08-20 Seiko Epson Corp 廃液処理装置
GB0802944D0 (en) * 2008-02-19 2008-03-26 Rumsby Philip T Apparatus for laser processing the opposite sides of thin panels
JP2009202389A (ja) * 2008-02-27 2009-09-10 Seiko Epson Corp 廃液処理装置
JP2009248379A (ja) * 2008-04-02 2009-10-29 Seiko Epson Corp 廃液処理装置、及び、液体噴射装置
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
US8706288B2 (en) * 2009-05-21 2014-04-22 Electro Scientific Industries, Inc. Apparatus and method for non-contact sensing of transparent articles
JP5172041B2 (ja) * 2009-07-20 2013-03-27 プレシテック カーゲー レーザ加工ヘッドおよびレーザ加工ヘッドの焦点位置の変化を補償するための方法
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
US8525073B2 (en) * 2010-01-27 2013-09-03 United Technologies Corporation Depth and breakthrough detection for laser machining
DE202010017939U1 (de) * 2010-04-26 2013-03-26 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserbearbeitungsmaschine mit Prozesslichtüberwachung
DE102010016862B3 (de) * 2010-05-10 2011-09-22 Precitec Optronik Gmbh Materialbearbeitungsvorrichtung mit in-situ Messen des Bearbeitungsabstands
CN105107758B (zh) 2010-06-01 2020-03-03 阿克莱机械公司 检查系统
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
WO2012037465A1 (en) 2010-09-16 2012-03-22 Raydiance, Inc. Laser based processing of layered materials
US10124410B2 (en) 2010-09-25 2018-11-13 Ipg Photonics Corporation Methods and systems for coherent imaging and feedback control for modification of materials
DE11826290T1 (de) 2010-09-25 2019-10-10 Ipg Photonics (Canada) Inc. Verfahren und systeme für kohärente bildgebung und rückkopplungssteuerung zum modifizieren von materialien
GB2489722B (en) 2011-04-06 2017-01-18 Precitec Optronik Gmbh Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer
ITTO20110425A1 (it) * 2011-05-12 2012-11-13 Adige Spa Procedimento per la scansione di un tubo destinato a essere lavorato su una macchina di taglio laser
DE102011051146B3 (de) 2011-06-17 2012-10-04 Precitec Optronik Gmbh Prüfverfahren zum Prüfen einer Verbindungsschicht zwischen waferförmigen Proben
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
KR101445832B1 (ko) * 2012-11-15 2014-09-30 주식회사 이오테크닉스 레이저 가공장치 및 레이저 가공방법
DE102012111008B4 (de) 2012-11-15 2014-05-22 Precitec Optronik Gmbh Optisches Messverfahren und optische Messvorrichtung zum Erfassen einer Oberflächentopographie
EP3769898A1 (de) 2013-03-13 2021-01-27 IPG Photonics (Canada) Inc. Verfahren und systeme zur kennzeichnung von laserbearbeitungseigenschaften durch messung von schlüssellochdynamiken mittels interferometrie
TWI543830B (zh) * 2013-05-10 2016-08-01 財團法人工業技術研究院 視覺誤差校正方法
AT514500B1 (de) 2013-06-17 2018-06-15 Precitec Optronik Gmbh Optische Messvorrichtung und optisches Messverfahren
US10244613B2 (en) * 2015-10-04 2019-03-26 Kla-Tencor Corporation System and method for electrodeless plasma ignition in laser-sustained plasma light source
US10573506B2 (en) 2016-03-11 2020-02-25 Michael Vidra Method and device for etching patterns inside objects
US10234265B2 (en) 2016-12-12 2019-03-19 Precitec Optronik Gmbh Distance measuring device and method for measuring distances
DE102017107935B4 (de) * 2017-04-12 2020-10-01 Eissmann Automotive Deutschland Gmbh Verfahren zum Einbringen einer definierten Schwächungslinie durch Materialabtrag an einem Überzugsmaterial mit einem gepulsten Laserstrahl
US10365633B2 (en) * 2017-06-14 2019-07-30 Ford Motor Company Method for generating CNC machine offset based on thermal model
US11571768B2 (en) 2017-08-16 2023-02-07 General Electric Company Manufacture of cooling holes for ceramic matrix composite components
DE102017126310A1 (de) 2017-11-09 2019-05-09 Precitec Optronik Gmbh Abstandsmessvorrichtung
CN111122568B (zh) 2018-11-01 2022-04-22 华中科技大学苏州脑空间信息研究院 一种高通量光学层析成像方法及成像系统
DE102018130901A1 (de) 2018-12-04 2020-06-04 Precitec Optronik Gmbh Optische Messeinrichtung
CN114227026B (zh) * 2021-12-10 2023-04-28 西安交通大学 一种超快激光可控孔型的群孔精密加工装置和方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1284809A (en) 1970-06-11 1972-08-09 Mitsubishi Electric Corp A laser processing apparatus
US3689159A (en) * 1970-06-11 1972-09-05 Mitsubishi Electric Corp Laser processing apparatus
CH562078A5 (de) * 1972-05-30 1975-05-30 Omega Brandt & Freres Sa Louis
NL7410642A (nl) 1974-08-08 1976-02-10 Philips Nv Opto-elektronisch fokusseringsdetektiestelsel.
DE2555493A1 (de) * 1974-12-19 1976-06-24 Gen Electric Opto-elektronisches geraet zur erfassung der lage und verfahren
JPS5255657A (en) 1975-10-31 1977-05-07 Seiko Instr & Electronics Ltd Photoelectric type range finding system
JPS571594A (en) 1980-06-03 1982-01-06 Nec Corp Laser working machine
US4501961A (en) 1982-09-01 1985-02-26 Honeywell Inc. Vision illumination system for range finder
US4769523A (en) 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
DE3626944A1 (de) 1986-08-08 1988-02-18 Bias Forschung & Entwicklung Verfahren und vorrichtung zum fokussieren und steuern einer hochleistungsenergiequelle
US4789770A (en) 1987-07-15 1988-12-06 Westinghouse Electric Corp. Controlled depth laser drilling system
US4839497A (en) 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
EP0344339A1 (de) 1988-05-31 1989-12-06 A.L.L. GmbH Verfahren zur Ermittlung des Durchstechzeitpunktes bei der Materialbearbeitung mit einem Laserstrahl
US4918284A (en) 1988-10-14 1990-04-17 Teradyne Laser Systems, Inc. Calibrating laser trimming apparatus
US5063280A (en) 1989-07-24 1991-11-05 Canon Kabushiki Kaisha Method and apparatus for forming holes into printed circuit board
US5168454A (en) 1989-10-30 1992-12-01 International Business Machines Corporation Formation of high quality patterns for substrates and apparatus therefor
DE69114399T2 (de) 1990-08-07 1996-03-21 Amada Co Vorrichtung zum Ermitteln des Schneidzustands bei der Laserstrahlbearbeitung.
WO1992008569A1 (en) 1990-11-14 1992-05-29 Fanuc Ltd Optical axis adjusting method for laser robot and system therefor
US5304773A (en) 1992-02-19 1994-04-19 Trumpf Inc. Laser work station with optical sensor for calibration of guidance system
US5340962A (en) 1992-08-14 1994-08-23 Lumonics Corporation Automatic control of laser beam tool positioning
US5275327A (en) 1992-10-13 1994-01-04 Eg&G Idaho, Inc. Integrated optical sensor
US5751588A (en) 1995-04-28 1998-05-12 International Business Machines Corporation Multi-wavelength programmable laser processing mechanisms and apparatus utilizing vaporization detection
JPH09225661A (ja) 1996-02-21 1997-09-02 Hitachi Constr Mach Co Ltd ダムバー切断装置
US5953137A (en) 1996-10-09 1999-09-14 Optimet, Optical Metrology Ltd. Linear conoscopic holography
JPH10225661A (ja) * 1997-02-14 1998-08-25 Sumitomo Metal Ind Ltd 傾斜型無動力篩
US6054673A (en) 1997-09-17 2000-04-25 General Electric Company Method and apparatus for laser drilling
US6140604A (en) 1998-06-18 2000-10-31 General Electric Company Laser drilling breakthrough detector
US6483071B1 (en) 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site

Also Published As

Publication number Publication date
US20020153500A1 (en) 2002-10-24
KR20040012719A (ko) 2004-02-11
US6720567B2 (en) 2004-04-13
GB2393511A (en) 2004-03-31
GB2393511B (en) 2005-04-20
WO2002074482A1 (en) 2002-09-26
KR100899910B1 (ko) 2009-05-28
GB0316728D0 (en) 2003-08-20

Similar Documents

Publication Publication Date Title
DE10295894T1 (de) Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser
DE50213504D1 (de) Verfahren und vorrichtung zur prädiktion von beweg
DE60209050D1 (de) Gerät und Verfahren zur Anpassung der Fokusposition in einem Iriserkennungssystem
DE602004020817D1 (de) Verfahren zur Laserbearbeitung und Vorrichtung zur Laserbearbeitung
DE60236693D1 (de) Verfahren und Vorrichtung zur Bildverarbeitung
DE60225060D1 (de) Vorrichtung und verfahren zur wiedergabe von inhalten
DE50203544D1 (de) Verfahren und Vorrichtung zur Drehbearbeitung
DE60206052D1 (de) System und verfahren zur bearbeitung von flugplandaten
DE60237007D1 (de) Verfahren und vorrichtung zur kurzfristigen inspekrobustheit
DE60041833D1 (de) Verfahren und vorrichtung zur laser wärmebehandlung
DE60203871D1 (de) Verfahren und Vorrichtung zur selektiven Bildverbesserung
DE60124225D1 (de) Verfahren und Vorrichtung zur Erkennung von Emotionen
DE60228013D1 (de) Vorrichtung und Verfahren zur Fahrzeugsteuerung
DE60215063D1 (de) Anlage und Verfahren zur Bestimmung von Bildübereinstimmung
DE60238736D1 (de) Vorrichtung und Verfahren zur Verwaltung von Bildern
DE60220213D1 (de) Vorrichtung und Verfahren zur Polarisationsanalyse
DE50214236D1 (de) Verfahren und vorrichtung zur automatischen steuer
DE60212556D1 (de) Vorrichtung und Verfahren zur Radardatenverarbeitung
DE60213133D1 (de) Vorrichtung und verfahren zur erfassung von überlappenden poststücken
DE60210888D1 (de) Vorrichtung und Verfahren zur optischen Modulation
DE60222851D1 (de) Optisches Informationsverarbeitungsgerät und Verfahren zur Verarbeitung optischer Information
DE60336111D1 (de) Informationsverarbeitungsgerät und Verfahren zur Steuerung desgleichen
DE60218573D1 (de) Verfahren und Vorrichtung zur Mehrfachsendung
DE60221850D1 (de) Verfahren und vorrichtung zur datenverschlüsselung
DE60224005D1 (de) Verfahren und vorrichtung zur verarbeitung von mehreren audiobitströmen

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8131 Rejection