DE10295894T1 - Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser - Google Patents
Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem LaserInfo
- Publication number
- DE10295894T1 DE10295894T1 DE10295894T DE10295894T DE10295894T1 DE 10295894 T1 DE10295894 T1 DE 10295894T1 DE 10295894 T DE10295894 T DE 10295894T DE 10295894 T DE10295894 T DE 10295894T DE 10295894 T1 DE10295894 T1 DE 10295894T1
- Authority
- DE
- Germany
- Prior art keywords
- control device
- laser processing
- focus control
- focus
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
- F01D5/00—Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
- F01D5/12—Blades
- F01D5/14—Form or construction
- F01D5/18—Hollow blades, i.e. blades with cooling or heating channels or cavities; Heating, heat-insulating or cooling means on blades
- F01D5/186—Film cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/001—Turbines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/774,276 US6720567B2 (en) | 2001-01-30 | 2001-01-30 | Apparatus and method for focal point control for laser machining |
PCT/US2002/002432 WO2002074482A1 (en) | 2001-01-30 | 2002-01-28 | Apparatus and method for focal point control for laser machining |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10295894T1 true DE10295894T1 (de) | 2003-12-24 |
Family
ID=25100759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10295894T Ceased DE10295894T1 (de) | 2001-01-30 | 2002-01-28 | Gerät und Verfahren zur Brennpunktsteuerung für eine Bearbeitung mit einem Laser |
Country Status (5)
Country | Link |
---|---|
US (1) | US6720567B2 (de) |
KR (1) | KR100899910B1 (de) |
DE (1) | DE10295894T1 (de) |
GB (1) | GB2393511B (de) |
WO (1) | WO2002074482A1 (de) |
Families Citing this family (82)
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US6737607B2 (en) | 2001-03-16 | 2004-05-18 | Tip Engineering Group, Inc. | Apparatus for laser cutting a workpiece |
WO2004045031A2 (en) * | 2002-11-13 | 2004-05-27 | Ackley Machine Corporation | Laser unit, inspection unit, method for inspecting pellet-shaped articles and pharmaceutical article |
DE10305875A1 (de) * | 2003-02-13 | 2004-09-16 | Robert Bosch Gmbh | Verfahren zur Prozesssicherung bei einem Bohrprozess |
DE10308979A1 (de) * | 2003-02-28 | 2004-09-09 | Mtu Aero Engines Gmbh | Verfahren und Vorrichtung zur Instandsetzung und Fertigung von geometrisch komplexen Bauteilen |
US7057134B2 (en) * | 2003-03-18 | 2006-06-06 | Loma Linda University Medical Center | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
US7060932B2 (en) * | 2003-03-18 | 2006-06-13 | Loma Linda University Medical Center | Method and apparatus for material processing |
US7379483B2 (en) * | 2003-03-18 | 2008-05-27 | Loma Linda University Medical Center | Method and apparatus for material processing |
US7286223B2 (en) * | 2003-03-18 | 2007-10-23 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
US7038166B2 (en) * | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US7880116B2 (en) * | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7361171B2 (en) | 2003-05-20 | 2008-04-22 | Raydiance, Inc. | Man-portable optical ablation system |
JP2005028423A (ja) * | 2003-07-09 | 2005-02-03 | Disco Abrasive Syst Ltd | レーザー加工方法およびレーザー加工装置 |
JP2005028438A (ja) * | 2003-07-11 | 2005-02-03 | Disco Abrasive Syst Ltd | レーザ光線を利用する加工装置 |
US8173929B1 (en) | 2003-08-11 | 2012-05-08 | Raydiance, Inc. | Methods and systems for trimming circuits |
US20050035097A1 (en) * | 2003-08-11 | 2005-02-17 | Richard Stoltz | Altering the emission of an ablation beam for safety or control |
US8921733B2 (en) | 2003-08-11 | 2014-12-30 | Raydiance, Inc. | Methods and systems for trimming circuits |
US9022037B2 (en) | 2003-08-11 | 2015-05-05 | Raydiance, Inc. | Laser ablation method and apparatus having a feedback loop and control unit |
ATE375841T1 (de) * | 2003-08-27 | 2007-11-15 | Alstom Technology Ltd | Adaptive automatisierte bearbeitung von überfüllten kanälen |
JP2005118808A (ja) * | 2003-10-15 | 2005-05-12 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2005138143A (ja) * | 2003-11-06 | 2005-06-02 | Disco Abrasive Syst Ltd | レーザ光線を利用する加工装置 |
US7671297B2 (en) * | 2003-11-20 | 2010-03-02 | Ethicon, Inc. | Method and apparatus for laser drilling workpieces |
EP1550527A1 (de) * | 2003-12-30 | 2005-07-06 | Advanced Laser Separation International (ALSI) B.V. | Verfahren und Vorrichtung zum Trennen in einem aus einem halbleitenden Material erzeugten Wafer hergestellte Halbleiterkomponente - ein mit diesem Verfahren getrenntes Halbleiterelement |
JP4509578B2 (ja) | 2004-01-09 | 2010-07-21 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4598407B2 (ja) * | 2004-01-09 | 2010-12-15 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4601965B2 (ja) * | 2004-01-09 | 2010-12-22 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
US20050263497A1 (en) * | 2004-03-26 | 2005-12-01 | Lehane Christopher J | System for laser drilling of shaped holes |
US7547866B2 (en) * | 2004-04-28 | 2009-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and method for manufacturing semiconductor device including an autofocusing mechanism using the same |
KR100626553B1 (ko) * | 2004-05-04 | 2006-09-21 | 주식회사 탑 엔지니어링 | 비금속재 절단장치 및 비금속재 절단시의 절단깊이 제어방법 |
US7155299B2 (en) * | 2004-06-01 | 2006-12-26 | Manufacturing Integration Technology Ltd | Method and apparatus for precise marking and placement of an object |
US7321421B2 (en) * | 2004-07-30 | 2008-01-22 | The Boeing Company | Apparatus and methods for scanning conoscopic holography measurements |
US7718921B2 (en) * | 2004-11-17 | 2010-05-18 | Metal Improvement Company Llc | Active beam delivery system with variable optical path segment through air |
US8135050B1 (en) | 2005-07-19 | 2012-03-13 | Raydiance, Inc. | Automated polarization correction |
DE102005042270B4 (de) * | 2005-09-06 | 2015-11-19 | MTU Aero Engines AG | Verfahren zum Fertigen von Bohrungen und Fertigungsanordnung hierfür |
US7638731B2 (en) * | 2005-10-18 | 2009-12-29 | Electro Scientific Industries, Inc. | Real time target topography tracking during laser processing |
US8189971B1 (en) | 2006-01-23 | 2012-05-29 | Raydiance, Inc. | Dispersion compensation in a chirped pulse amplification system |
US9130344B2 (en) | 2006-01-23 | 2015-09-08 | Raydiance, Inc. | Automated laser tuning |
US8232687B2 (en) | 2006-04-26 | 2012-07-31 | Raydiance, Inc. | Intelligent laser interlock system |
US7444049B1 (en) | 2006-01-23 | 2008-10-28 | Raydiance, Inc. | Pulse stretcher and compressor including a multi-pass Bragg grating |
US7822347B1 (en) | 2006-03-28 | 2010-10-26 | Raydiance, Inc. | Active tuning of temporal dispersion in an ultrashort pulse laser system |
JP4141485B2 (ja) * | 2006-07-19 | 2008-08-27 | トヨタ自動車株式会社 | レーザ加工システムおよびレーザ加工方法 |
EP2047935B1 (de) * | 2006-07-31 | 2013-05-08 | IHI Corporation | Verfahren zur herstellung einer verstärkungsplatte |
DE102007035715A1 (de) * | 2006-12-27 | 2008-07-03 | Robert Bosch Gmbh | Laserstrahlbearbeitungsvorrichtung sowie Verfahren zum Justieren der Fokuslage |
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JP5071122B2 (ja) * | 2008-01-24 | 2012-11-14 | セイコーエプソン株式会社 | 廃液処理装置及び液体噴射装置 |
JP2009184133A (ja) * | 2008-02-04 | 2009-08-20 | Seiko Epson Corp | 廃液処理装置 |
GB0802944D0 (en) * | 2008-02-19 | 2008-03-26 | Rumsby Philip T | Apparatus for laser processing the opposite sides of thin panels |
JP2009202389A (ja) * | 2008-02-27 | 2009-09-10 | Seiko Epson Corp | 廃液処理装置 |
JP2009248379A (ja) * | 2008-04-02 | 2009-10-29 | Seiko Epson Corp | 廃液処理装置、及び、液体噴射装置 |
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US8498538B2 (en) | 2008-11-14 | 2013-07-30 | Raydiance, Inc. | Compact monolithic dispersion compensator |
US8706288B2 (en) * | 2009-05-21 | 2014-04-22 | Electro Scientific Industries, Inc. | Apparatus and method for non-contact sensing of transparent articles |
JP5172041B2 (ja) * | 2009-07-20 | 2013-03-27 | プレシテック カーゲー | レーザ加工ヘッドおよびレーザ加工ヘッドの焦点位置の変化を補償するための方法 |
US8338745B2 (en) * | 2009-12-07 | 2012-12-25 | Panasonic Corporation | Apparatus and methods for drilling holes with no taper or reverse taper |
US8525073B2 (en) * | 2010-01-27 | 2013-09-03 | United Technologies Corporation | Depth and breakthrough detection for laser machining |
DE202010017939U1 (de) * | 2010-04-26 | 2013-03-26 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserbearbeitungsmaschine mit Prozesslichtüberwachung |
DE102010016862B3 (de) * | 2010-05-10 | 2011-09-22 | Precitec Optronik Gmbh | Materialbearbeitungsvorrichtung mit in-situ Messen des Bearbeitungsabstands |
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US10124410B2 (en) | 2010-09-25 | 2018-11-13 | Ipg Photonics Corporation | Methods and systems for coherent imaging and feedback control for modification of materials |
DE11826290T1 (de) | 2010-09-25 | 2019-10-10 | Ipg Photonics (Canada) Inc. | Verfahren und systeme für kohärente bildgebung und rückkopplungssteuerung zum modifizieren von materialien |
GB2489722B (en) | 2011-04-06 | 2017-01-18 | Precitec Optronik Gmbh | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer |
ITTO20110425A1 (it) * | 2011-05-12 | 2012-11-13 | Adige Spa | Procedimento per la scansione di un tubo destinato a essere lavorato su una macchina di taglio laser |
DE102011051146B3 (de) | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Prüfverfahren zum Prüfen einer Verbindungsschicht zwischen waferförmigen Proben |
US10239160B2 (en) | 2011-09-21 | 2019-03-26 | Coherent, Inc. | Systems and processes that singulate materials |
US9289858B2 (en) * | 2011-12-20 | 2016-03-22 | Electro Scientific Industries, Inc. | Drilling holes with minimal taper in cured silicone |
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DE102012111008B4 (de) | 2012-11-15 | 2014-05-22 | Precitec Optronik Gmbh | Optisches Messverfahren und optische Messvorrichtung zum Erfassen einer Oberflächentopographie |
EP3769898A1 (de) | 2013-03-13 | 2021-01-27 | IPG Photonics (Canada) Inc. | Verfahren und systeme zur kennzeichnung von laserbearbeitungseigenschaften durch messung von schlüssellochdynamiken mittels interferometrie |
TWI543830B (zh) * | 2013-05-10 | 2016-08-01 | 財團法人工業技術研究院 | 視覺誤差校正方法 |
AT514500B1 (de) | 2013-06-17 | 2018-06-15 | Precitec Optronik Gmbh | Optische Messvorrichtung und optisches Messverfahren |
US10244613B2 (en) * | 2015-10-04 | 2019-03-26 | Kla-Tencor Corporation | System and method for electrodeless plasma ignition in laser-sustained plasma light source |
US10573506B2 (en) | 2016-03-11 | 2020-02-25 | Michael Vidra | Method and device for etching patterns inside objects |
US10234265B2 (en) | 2016-12-12 | 2019-03-19 | Precitec Optronik Gmbh | Distance measuring device and method for measuring distances |
DE102017107935B4 (de) * | 2017-04-12 | 2020-10-01 | Eissmann Automotive Deutschland Gmbh | Verfahren zum Einbringen einer definierten Schwächungslinie durch Materialabtrag an einem Überzugsmaterial mit einem gepulsten Laserstrahl |
US10365633B2 (en) * | 2017-06-14 | 2019-07-30 | Ford Motor Company | Method for generating CNC machine offset based on thermal model |
US11571768B2 (en) | 2017-08-16 | 2023-02-07 | General Electric Company | Manufacture of cooling holes for ceramic matrix composite components |
DE102017126310A1 (de) | 2017-11-09 | 2019-05-09 | Precitec Optronik Gmbh | Abstandsmessvorrichtung |
CN111122568B (zh) | 2018-11-01 | 2022-04-22 | 华中科技大学苏州脑空间信息研究院 | 一种高通量光学层析成像方法及成像系统 |
DE102018130901A1 (de) | 2018-12-04 | 2020-06-04 | Precitec Optronik Gmbh | Optische Messeinrichtung |
CN114227026B (zh) * | 2021-12-10 | 2023-04-28 | 西安交通大学 | 一种超快激光可控孔型的群孔精密加工装置和方法 |
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-
2001
- 2001-01-30 US US09/774,276 patent/US6720567B2/en not_active Expired - Lifetime
-
2002
- 2002-01-28 GB GB0316728A patent/GB2393511B/en not_active Expired - Lifetime
- 2002-01-28 KR KR1020037009959A patent/KR100899910B1/ko not_active IP Right Cessation
- 2002-01-28 DE DE10295894T patent/DE10295894T1/de not_active Ceased
- 2002-01-28 WO PCT/US2002/002432 patent/WO2002074482A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US20020153500A1 (en) | 2002-10-24 |
KR20040012719A (ko) | 2004-02-11 |
US6720567B2 (en) | 2004-04-13 |
GB2393511A (en) | 2004-03-31 |
GB2393511B (en) | 2005-04-20 |
WO2002074482A1 (en) | 2002-09-26 |
KR100899910B1 (ko) | 2009-05-28 |
GB0316728D0 (en) | 2003-08-20 |
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