DE10250868B8 - Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors - Google Patents
Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors Download PDFInfo
- Publication number
- DE10250868B8 DE10250868B8 DE10250868A DE10250868A DE10250868B8 DE 10250868 B8 DE10250868 B8 DE 10250868B8 DE 10250868 A DE10250868 A DE 10250868A DE 10250868 A DE10250868 A DE 10250868A DE 10250868 B8 DE10250868 B8 DE 10250868B8
- Authority
- DE
- Germany
- Prior art keywords
- field effect
- effect transistor
- vertically integrated
- producing
- integrated field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005669 field effect Effects 0.000 title 3
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0676—Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66439—Unipolar field-effect transistors with a one- or zero-dimensional channel, e.g. quantum wire FET, in-plane gate transistor [IPG], single electron transistor [SET], striped channel transistor, Coulomb blockade transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/775—Field effect transistors with one dimensional charge carrier gas channel, e.g. quantum wire FET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10250868A DE10250868B8 (de) | 2002-10-31 | 2002-10-31 | Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors |
US10/533,550 US7709827B2 (en) | 2002-10-31 | 2003-10-29 | Vertically integrated field-effect transistor having a nanostructure therein |
EP03778239A EP1556909A1 (de) | 2002-10-31 | 2003-10-29 | Vertikal integriertes bauelement, bauelement-anordnung und verfahren zum herstellen eines vertikal integrierten bauelements |
PCT/DE2003/003587 WO2004040666A1 (de) | 2002-10-31 | 2003-10-29 | Vertikal integriertes bauelement, bauelement-anordnung und verfahren zum herstellen eines vertikal integrierten bauelements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10250868A DE10250868B8 (de) | 2002-10-31 | 2002-10-31 | Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors |
Publications (3)
Publication Number | Publication Date |
---|---|
DE10250868A1 DE10250868A1 (de) | 2004-05-19 |
DE10250868B4 DE10250868B4 (de) | 2008-03-06 |
DE10250868B8 true DE10250868B8 (de) | 2008-06-26 |
Family
ID=32115051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10250868A Expired - Fee Related DE10250868B8 (de) | 2002-10-31 | 2002-10-31 | Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors |
Country Status (4)
Country | Link |
---|---|
US (1) | US7709827B2 (de) |
EP (1) | EP1556909A1 (de) |
DE (1) | DE10250868B8 (de) |
WO (1) | WO2004040666A1 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10339531A1 (de) * | 2003-08-21 | 2005-03-31 | Hahn-Meitner-Institut Berlin Gmbh | Vertikaler Nano-Transistor, Verfahren zu seiner Herstellung und Speicheranordnung |
DE102004003374A1 (de) * | 2004-01-22 | 2005-08-25 | Infineon Technologies Ag | Halbleiter-Leistungsschalter sowie dafür geeignetes Herstellungsverfahren |
JP4568286B2 (ja) * | 2004-10-04 | 2010-10-27 | パナソニック株式会社 | 縦型電界効果トランジスタおよびその製造方法 |
US7598516B2 (en) * | 2005-01-07 | 2009-10-06 | International Business Machines Corporation | Self-aligned process for nanotube/nanowire FETs |
US9911743B2 (en) * | 2005-05-09 | 2018-03-06 | Nantero, Inc. | Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same |
US7781862B2 (en) * | 2005-05-09 | 2010-08-24 | Nantero, Inc. | Two-terminal nanotube devices and systems and methods of making same |
WO2007064334A1 (en) * | 2005-12-02 | 2007-06-07 | Advanced Micro Devices, Inc. | Polymer-based transistor devices, methods, and systems |
EP1804286A1 (de) * | 2005-12-27 | 2007-07-04 | Interuniversitair Microelektronica Centrum | Halbleitervorrichtung mit einer verlängerten Nanostruktur |
DE102006009721B4 (de) * | 2006-03-02 | 2011-08-18 | Qimonda AG, 81739 | Nanodraht (Nanowire)-Speicherzelle und Verfahren zu deren Herstellung |
US8679630B2 (en) * | 2006-05-17 | 2014-03-25 | Purdue Research Foundation | Vertical carbon nanotube device in nanoporous templates |
KR20090075819A (ko) * | 2006-09-19 | 2009-07-09 | 큐나노 에이비 | 나노스케일 전계 효과 트랜지스터의 조립체 |
US9487877B2 (en) * | 2007-02-01 | 2016-11-08 | Purdue Research Foundation | Contact metallization of carbon nanotubes |
KR101377597B1 (ko) * | 2007-03-21 | 2014-03-27 | 삼성디스플레이 주식회사 | 트랜지스터 및 그 제조방법 |
JP4122043B1 (ja) * | 2007-04-25 | 2008-07-23 | 株式会社クレステック | 面放出型電子源および描画装置 |
US7892956B2 (en) * | 2007-09-24 | 2011-02-22 | International Business Machines Corporation | Methods of manufacture of vertical nanowire FET devices |
WO2009150999A1 (ja) * | 2008-06-09 | 2009-12-17 | 独立行政法人産業技術総合研究所 | ナノワイヤ電界効果トランジスタ及びその作製方法、並びにこれを含む集積回路 |
EP2161755A1 (de) | 2008-09-05 | 2010-03-10 | University College Cork-National University of Ireland, Cork | Übergangsloser Metalloxid-Halbleitertransistor |
US8715981B2 (en) * | 2009-01-27 | 2014-05-06 | Purdue Research Foundation | Electrochemical biosensor |
US8872154B2 (en) * | 2009-04-06 | 2014-10-28 | Purdue Research Foundation | Field effect transistor fabrication from carbon nanotubes |
US8871576B2 (en) | 2011-02-28 | 2014-10-28 | International Business Machines Corporation | Silicon nanotube MOSFET |
US9123780B2 (en) * | 2012-12-19 | 2015-09-01 | Invensas Corporation | Method and structures for heat dissipating interposers |
US9400862B2 (en) | 2014-06-23 | 2016-07-26 | Synopsys, Inc. | Cells having transistors and interconnects including nanowires or 2D material strips |
US10037397B2 (en) | 2014-06-23 | 2018-07-31 | Synopsys, Inc. | Memory cell including vertical transistors and horizontal nanowire bit lines |
US10312229B2 (en) | 2016-10-28 | 2019-06-04 | Synopsys, Inc. | Memory cells including vertical nanowire transistors |
US10217674B1 (en) | 2017-12-13 | 2019-02-26 | International Business Machines Corporation | Three-dimensional monolithic vertical field effect transistor logic gates |
US10325821B1 (en) * | 2017-12-13 | 2019-06-18 | International Business Machines Corporation | Three-dimensional stacked vertical transport field effect transistor logic gate with buried power bus |
US10811322B1 (en) * | 2019-04-10 | 2020-10-20 | International Business Machines Corporation | Different gate widths for upper and lower transistors in a stacked vertical transport field-effect transistor structure |
US11177369B2 (en) | 2019-09-25 | 2021-11-16 | International Business Machines Corporation | Stacked vertical field effect transistor with self-aligned junctions |
CN113113356B (zh) * | 2020-01-10 | 2023-05-05 | 中芯国际集成电路制造(天津)有限公司 | 半导体结构及其形成方法 |
US11600309B2 (en) * | 2020-12-15 | 2023-03-07 | Besang, Inc. | 3D memory with 3D sense amplifier |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001061753A1 (de) * | 2000-02-16 | 2001-08-23 | Infineon Technologies Ag | Elektronisches bauelement mit einer elektrisch leitenden verbindung aus carbon-nanoröhren und verfahren zu seiner herstellung |
DE10036897C1 (de) * | 2000-07-28 | 2002-01-03 | Infineon Technologies Ag | Feldeffekttransistor, Schaltungsanordnung und Verfahren zum Herstellen eines Feldeffekttransistors |
US20020001905A1 (en) * | 2000-06-27 | 2002-01-03 | Choi Won-Bong | Vertical nano-size transistor using carbon nanotubes and manufacturing method thereof |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4757029A (en) * | 1987-05-04 | 1988-07-12 | Motorola Inc. | Method of making vertical field effect transistor with plurality of gate input cnnections |
US4903089A (en) * | 1988-02-02 | 1990-02-20 | Massachusetts Institute Of Technology | Vertical transistor device fabricated with semiconductor regrowth |
US5106778A (en) * | 1988-02-02 | 1992-04-21 | Massachusetts Institute Of Technology | Vertical transistor device fabricated with semiconductor regrowth |
US5362972A (en) | 1990-04-20 | 1994-11-08 | Hitachi, Ltd. | Semiconductor device using whiskers |
US5612563A (en) * | 1992-03-02 | 1997-03-18 | Motorola Inc. | Vertically stacked vertical transistors used to form vertical logic gate structures |
US5286674A (en) * | 1992-03-02 | 1994-02-15 | Motorola, Inc. | Method for forming a via structure and semiconductor device having the same |
US5398200A (en) * | 1992-03-02 | 1995-03-14 | Motorola, Inc. | Vertically formed semiconductor random access memory device |
US5308782A (en) * | 1992-03-02 | 1994-05-03 | Motorola | Semiconductor memory device and method of formation |
US6127839A (en) * | 1998-09-01 | 2000-10-03 | Micron Technology, Inc. | Method and apparatus for reducing induced switching transients |
WO2001057917A2 (en) * | 2000-02-07 | 2001-08-09 | Xidex Corporation | System and method for fabricating logic devices comprising carbon nanotube transistors |
US7335603B2 (en) * | 2000-02-07 | 2008-02-26 | Vladimir Mancevski | System and method for fabricating logic devices comprising carbon nanotube transistors |
JP3731486B2 (ja) * | 2001-03-16 | 2006-01-05 | 富士ゼロックス株式会社 | トランジスタ |
DE10142913B4 (de) * | 2001-08-27 | 2004-03-18 | Hahn-Meitner-Institut Berlin Gmbh | Vertikale Transistoranordnung mit einem flexiblen, aus Kunststofffolien bestehenden Substrat und Verfahren zu deren Herstellung |
US6515325B1 (en) * | 2002-03-06 | 2003-02-04 | Micron Technology, Inc. | Nanotube semiconductor devices and methods for making the same |
US6788453B2 (en) * | 2002-05-15 | 2004-09-07 | Yissum Research Development Company Of The Hebrew Univeristy Of Jerusalem | Method for producing inorganic semiconductor nanocrystalline rods and their use |
-
2002
- 2002-10-31 DE DE10250868A patent/DE10250868B8/de not_active Expired - Fee Related
-
2003
- 2003-10-29 EP EP03778239A patent/EP1556909A1/de not_active Withdrawn
- 2003-10-29 WO PCT/DE2003/003587 patent/WO2004040666A1/de active Application Filing
- 2003-10-29 US US10/533,550 patent/US7709827B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001061753A1 (de) * | 2000-02-16 | 2001-08-23 | Infineon Technologies Ag | Elektronisches bauelement mit einer elektrisch leitenden verbindung aus carbon-nanoröhren und verfahren zu seiner herstellung |
US20020001905A1 (en) * | 2000-06-27 | 2002-01-03 | Choi Won-Bong | Vertical nano-size transistor using carbon nanotubes and manufacturing method thereof |
DE10036897C1 (de) * | 2000-07-28 | 2002-01-03 | Infineon Technologies Ag | Feldeffekttransistor, Schaltungsanordnung und Verfahren zum Herstellen eines Feldeffekttransistors |
Non-Patent Citations (6)
Title |
---|
J.C.Johnson et al.: "Single Nanowire Lasers", J.Phys. Chem. B 105, pp. 11387-11390 (2001) * |
P.J.F. Harris: "Carbon Nanotubes and Related Structures-New Materials for the Twenty-first Century", Cambridge University Press, Cambridge, pp. 1-15, 111-155 (1999) * |
V. Derycke, R. Martel, J. Appenzeller, P. Avouris: Carbon Nanotube Inter- and Intramolecular Logic Gates", Nanoletters, Vol. 1, Nr. 9, pp. 453-456 (2001) * |
Won Bong Choi, Jae Uk Chu, Kwang Seok, Jeong, Eun Ju Bae, Jo-Won Lee, Ju-Jin Kim, Jeong-O Lee: "Ul- trahigh-density nanotransistors by using selecti- vely grown vertical carbon nanotubes", Appl. Phys. Lett., Vol. 79, Nr. 22, pp. 3696-3698 (2001) |
Won Bong Choi, Jae Uk Chu, Kwang Seok, Jeong, Eun Ju Bae, Jo-Won Lee, Ju-Jin Kim, Jeong-O Lee: "Ultrahigh-density nanotransistors by using selectively grown vertical carbon nanotubes", Appl. Phys. Lett., Vol. 79, Nr. 22, pp. 3696-3698 (2001) * |
Y. Huang, X. Duan, Y. Cui, L.J. Lauhon, K.H. Kim, C.M. Lieber: "Logic Gates and Computation from Assembled Nanowire Building Blocks", Science, Vol. 294, pp. 1313-1317 (2001) * |
Also Published As
Publication number | Publication date |
---|---|
DE10250868A1 (de) | 2004-05-19 |
EP1556909A1 (de) | 2005-07-27 |
WO2004040666A1 (de) | 2004-05-13 |
DE10250868B4 (de) | 2008-03-06 |
US7709827B2 (en) | 2010-05-04 |
US20060128088A1 (en) | 2006-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE10250868B8 (de) | Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors | |
DE502004012381D1 (de) | Verfahren zum herstellen eines vertikalen feldeffekttransistors | |
DE602004027743D1 (de) | Verfahren zum einstellen, fertigstellen und aufwältigen eines bohrlochs | |
DE502004006867D1 (de) | Integrierter halbleiterspeicher und verfahren zum herstellen eines integrierten halbleiterspeichers | |
ATE501828T1 (de) | Verfahren und vorrichtung zum herstellen profilierter, zumindest abschnittsweise länglicher bauteile | |
DE50304673D1 (de) | Strömungsmaschine und Verfahren zum Herstellen eines Leitgitters | |
DE602004016923D1 (de) | Gleitelement und Verfahren zum Herstellen des Gleitelements | |
ATE382716T1 (de) | Verfahren zum herstellen eines abriebfesten stahlblechs und so hergestelltes stahlblech | |
ATE400667T1 (de) | Verfahren zum herstellen eines abriebfesten stahlblechs und so hergestelltes stahlblech | |
ATE388247T1 (de) | Verfahren zum herstellen eines abriebfesten stahlblechs und so hergestelltes stahlblech | |
DE502004002926D1 (de) | Vorrichtung und verfahren zum erzeugen eines tieftonkanals | |
DE60315450D1 (de) | Polymerzusammensetzungen und verfahren zum herstellen von rohren daraus | |
DE50313413D1 (de) | Verfahren und einrichtung zum stabilisieren eines gespanns | |
DE10393559D2 (de) | Verfahren und Einrichtung zum Stabilisieren eines Gespanns | |
DE60043483D1 (de) | Verfahren und vorrichtung zum herstellen eines kissens | |
DE102004047325A8 (de) | Einrichtung und Verfahren zum Herstellen einer Bildkorrespondenz | |
DE502005000646D1 (de) | Geschäumtes Fahrzeugteil und Verfahren zum Herstellen eines solchen Fahrzeugteils | |
DE50304800D1 (de) | Ionensensitiver feldeffekttransistor und verfahren zum herstellen eines ionensensitiven feldeffekttransistors | |
DE60311286D1 (de) | Vorrichtung und verfahren zum herstellen von hüllenlosen würsten | |
DE10393560D2 (de) | Verfahren und Einrichtung zum Stabilisieren eines Gespanns | |
DE60329344D1 (de) | Verfahren und Vorrichtung zum Herstellen von Metall-Schichten | |
DE602004016224D1 (de) | Vorrichtung und verfahren zum erzeugen eines senderahmens | |
DE10260613B8 (de) | Verfahren zum Herstellen eines Feldeffekttransistors | |
DE502004004065D1 (de) | Verfahren zum Herstellen eines Verbundbauteils und Zwischenprodukt | |
DE112004000431T8 (de) | Verfahren zum Herstellen von Ventileinstellungsanordnungen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8181 | Inventor (new situation) |
Inventor name: SCHULZ, THOMAS, 81737 MUENCHEN, DE Inventor name: R?SNER, WOLFGANG, DR., 85521 OTTOBRUNN, DE Inventor name: LUYKEN, JOHANNES R., DR., 81825 MUENCHEN, DE Inventor name: LANDGRAF, ERHARD, 81543 MUENCHEN, DE Inventor name: KRETZ, JOHANNES, DR., 80538 MUENCHEN, DE Inventor name: HOFMANN, FRANZ, DR., 80995 MUENCHEN, DE Inventor name: SPECHT, MICHAEL, DR., 80799 MUENCHEN, DE Inventor name: GRAHAM, ANDREW, DR., 81547 MUENCHEN, DE Inventor name: KREUPL, FRANZ, DR., 80469 MUENCHEN, DE Inventor name: H?NLEIN, WOLFGANG, DR., 82008 UNTERHACHING, DE |
|
8127 | New person/name/address of the applicant |
Owner name: QIMONDA AG, 81739 MUENCHEN, DE |
|
8381 | Inventor (new situation) |
Inventor name: KRETZ, JOHANNES, DR., 80538 MUENCHEN, DE Inventor name: GRAHAM, ANDREW, DR., 81547 MUENCHEN, DE Inventor name: LUYKEN, JOHANNES R., DR., 81825 MUENCHEN, DE Inventor name: SPECHT, MICHAEL, DR., 80799 MUENCHEN, DE Inventor name: KREUPL, FRANZ, DR., 80802 MUENCHEN, DE Inventor name: LANDGRAF, ERHARD, 81543 MUENCHEN, DE Inventor name: HOENLEIN, WOLFGANG, DR., 82008 UNTERHACHING, DE Inventor name: SCHULZ, THOMAS, 81737 MUENCHEN, DE Inventor name: HOFMANN, FRANZ, DR., 80995 MUENCHEN, DE Inventor name: ROESNER, WOLFGANG, DR., 85521 OTTOBRUNN, DE |
|
8396 | Reprint of erroneous front page | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |