DE102015211843A1 - Electronic component and method for producing an electronic component - Google Patents
Electronic component and method for producing an electronic component Download PDFInfo
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- DE102015211843A1 DE102015211843A1 DE102015211843.6A DE102015211843A DE102015211843A1 DE 102015211843 A1 DE102015211843 A1 DE 102015211843A1 DE 102015211843 A DE102015211843 A DE 102015211843A DE 102015211843 A1 DE102015211843 A1 DE 102015211843A1
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Abstract
Die Erfindung betrifft eine elektronische Komponente (E), umfassend eine Leiterplatte (1) mit zumindest einer elektrisch leitenden Leiterbahn (1.1) und zumindest ein elektronisches Bauteil (2), wobei das zumindest eine elektronische Bauteil (2) als ein integriertes elektronisches Bauelement ausgebildet ist. Erfindungsgemäß ist das zumindest eine elektronische Bauteil (2) mittels mindestens eines Aluminium-Dünndrahts (3) elektrisch leitend mit der Leiterplatte (1) verbunden. Die Erfindung betrifft weiterhin ein Verfahren zur Herstellung einer solchen elektronischen Komponente (E).The invention relates to an electronic component (E), comprising a printed circuit board (1) with at least one electrically conductive conductor track (1.1) and at least one electronic component (2), wherein the at least one electronic component (2) is designed as an integrated electronic component , According to the invention, the at least one electronic component (2) is electrically conductively connected to the printed circuit board (1) by means of at least one aluminum thin wire (3). The invention further relates to a method for producing such an electronic component (E).
Description
Die Erfindung betrifft eine elektronische Komponente, umfassend eine Leiterplatte mit zumindest einer elektrisch leitenden Leiterbahn und zumindest ein elektronisches Bauteil, wobei das zumindest eine elektronische Bauteil als ein integriertes elektronisches Bauelement ausgebildet ist. Des Weiteren betrifft die Erfindung ein Verfahren zur Herstellung einer elektronischen Komponente. The invention relates to an electronic component, comprising a printed circuit board with at least one electrically conductive trace and at least one electronic component, wherein the at least one electronic component is designed as an integrated electronic component. Furthermore, the invention relates to a method for producing an electronic component.
Elektronische Komponenten in Form integrierter Schaltungen umfassen üblicherweise elektronische Baugruppen, die auf einer Leiterplatte zu einer elektrischen Schaltungsanordnung zusammengeführt sind. Derartige elektronische Komponenten werden beispielsweise in Steuergeräten für Kraftfahrzeuge, z. B. in Getriebesteuergeräten, eingesetzt. Electronic components in the form of integrated circuits usually comprise electronic assemblies, which are brought together on a printed circuit board to an electrical circuit arrangement. Such electronic components are used for example in control units for motor vehicles, eg. B. in transmission control units used.
Die Baugruppen auf der Leiterplatte können in Form sogenannter Bare Dies oder als gelötete elektronische Bauteile mit einer Kunststoffabdeckung auf der Flachseite der Leiterplatte angeordnet sein. Als Bare Dies werden integrierte elektronische Baugruppen bezeichnet, die ohne Abdeckung weiterverarbeitet werden. Diese elektronischen Baugruppen werden direkt auf der Leiterplatte aufgebracht und mittels elektrischer Verbindungselemente, insbesondere mittels Bonddrähten mit weiteren auf der Leiterplatte angeordneten elektronischen Bauteilen oder Baugruppen verbunden. The assemblies on the circuit board may be arranged in the form of so-called bare dies or as soldered electronic components with a plastic cover on the flat side of the circuit board. Bare Dies are integrated electronic components that are processed without cover. These electronic assemblies are applied directly to the circuit board and connected by means of electrical connection elements, in particular by means of bonding wires with other arranged on the circuit board electronic components or assemblies.
Zur Verbindung der Bonddrähte auf der Leiterplatte kommen zwei verschiedene Drahtbondprozesse zum Einsatz, wobei die Bonddrähte auf eine Bondfläche zur Verbindung der Leiterplatte mit einem Bare Die aufgebracht werden. Beispielsweise wird ein Bonddraht, z. B. ein Dickdraht mit einem Drahtdurchmesser von 125–500 µm aus Aluminium in einem sogenannten Wedge-Wedge-Verfahren aufgebracht. Bei Leistungskomponenten wie bei Metall-Oxid-Halbleiter-Feldeffekttransistoren (= MOSFET) werden Dickdrähte mit einem Drahtdurchmesser größer als 200 µm verwendet, um hohe Ströme zu transportieren. Für kleine Ströme bzw. Signale wird ein Bonddraht, insbesondere ein Dünndraht mit einem Drahtdurchmesser von 20–50 µm aus Gold aufgebracht, beispielsweise bei Logikbauteilen wie integrierten Schaltungen und/oder bei Halbleitern wie Dioden. Two different wire bonding processes are used to connect the bonding wires to the printed circuit board, wherein the bonding wires are applied to a bonding surface for bonding the printed circuit board to a bare die. For example, a bonding wire, for. B. a thick wire with a wire diameter of 125-500 microns of aluminum applied in a so-called wedge-wedge process. For power components such as metal oxide semiconductor field effect transistors (= MOSFET) thick wires with a wire diameter greater than 200 microns are used to transport high currents. For small currents or signals, a bonding wire, in particular a thin wire with a wire diameter of 20-50 microns of gold is applied, for example, in logic components such as integrated circuits and / or semiconductors such as diodes.
Eine Standardmetallisierung der Bondflächen auf Halbleiterkomponenten, insbesondere auf Bare Dies, ist Aluminium. Eine Materialkombination aus beispielsweise Gold-Bonddraht und Aluminium-Bondfläche neigt zur Ausbildung intermetallischer Phasen und damit verbundenen Fehlermechanismen, z. B. der sogenannte Kirkendall-Effekt, Halogen-Korrosion. Zur Verringerung derartiger Fehlermechanismen wird eine sogenannte Over-Pad-Metallisierung (= OPM) aufgebracht, beispielsweise Nickel/Gold (NiAu) oder Nickel/Palladium/Gold (NiPdAu). A standard metallization of the bond pads on semiconductor components, in particular on bare dies, is aluminum. A material combination of, for example, gold bonding wire and aluminum bonding surface tends to form intermetallic phases and associated failure mechanisms, e.g. As the so-called Kirkendall effect, halogen corrosion. To reduce such failure mechanisms, a so-called over-pad metallization (= OPM) is applied, for example nickel / gold (NiAu) or nickel / palladium / gold (NiPdAu).
Der Erfindung liegt die Aufgabe zugrunde, eine gegenüber dem Stand der Technik verbesserte elektronische Komponente und ein verbessertes Verfahren zur Herstellung einer solchen elektronischen Komponente anzugeben. The invention has for its object to provide an improved over the prior art electronic component and an improved method for producing such an electronic component.
Die Aufgabe wird erfindungsgemäß durch die im Anspruch 1 angegebenen Merkmale gelöst. Hinsichtlich des Verfahrens wird die Aufgabe erfindungsgemäß durch die im Anspruch 8 angegebenen Merkmale gelöst. The object is achieved by the features specified in claim 1. With regard to the method, the object is achieved by the features specified in claim 8.
Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche. Advantageous embodiments of the invention are the subject of the dependent claims.
Eine elektronische Komponente umfasst eine Leiterplatte mit zumindest einer elektrisch leitenden Leiterbahn und zumindest ein elektronisches Bauteil, wobei das zumindest eine elektronische Bauteil als ein integriertes elektronisches Bauelement, insbesondere als ein ungehäuster Mikrochip (auch als Bare Die bekannt) ausgebildet ist. An electronic component comprises a printed circuit board with at least one electrically conductive conductor track and at least one electronic component, wherein the at least one electronic component is designed as an integrated electronic component, in particular as an unhoused microchip (also known as bare die).
Erfindungsgemäß ist das zumindest eine elektronische Bauteil mittels mindestens eines Aluminium-Dünndrahts elektrisch leitend mit der Leiterplatte verbunden. According to the invention, the at least one electronic component is electrically conductively connected to the printed circuit board by means of at least one aluminum thin wire.
Dadurch, dass zur elektrischen Kontaktierung des elektronischen Bauteils ein Dünnbonddraht aus Aluminium verwendet wird, kann ein elektronisches Bauteil mit einer kostengünstigen Metallisierung vorzugsweise aus Aluminium verwendet werden. Damit wird in vorteilhafter Art und Weise eine Kostenreduktion der elektronischen Komponente gegenüber dem Stand der Technik erreicht. Eine daraus resultierende Monometallverbindung, zumindest zwischen dem Bonddraht und dem elektronischen Bauteil, ermöglicht zudem die Verringerung eines Risikos zur Ausbildung intermetallischer Phasen und daraus resultierenden Fehlermechanismen, wie beispielweise der sogenannte Kirkendall-Effekt und Halogen-Korrosionsvorgänge. By using a thin-wire aluminum wire to make electrical contact with the electronic component, it is possible to use an electronic component with a cost-effective metallization, preferably of aluminum. Thus, a cost reduction of the electronic component over the prior art is achieved in an advantageous manner. A resulting monometallic compound, at least between the bonding wire and the electronic component, also allows reducing the risk of forming intermetallic phases and resulting failure mechanisms, such as the so-called Kirkendall effect and halogen corrosion processes.
Die elektronische Komponente ist im Rahmen der Erfindung zur Anordnung in einem Steuergerät eines Kraftfahrzeugs, beispielswiese in einem Getriebesteuergerät, vorgesehen. The electronic component is provided in the context of the invention for arrangement in a control unit of a motor vehicle, for example in a transmission control unit.
Zur Befestigung, insbesondere zur Kontaktierung des mindestens einen Aluminium-Dünndrahts weisen die Leiterplatte wenigstens eine erste Bondfläche und das zumindest eine elektronische Bauteil wenigstens eine zweite Bondfläche auf. Die Bondflächen stellen elektrisch leitende Kontaktflächen dar, die mittels bekannter Metallisierungsverfahren aufgebracht werden können. Auf der Leiterplatte ist die Bondfläche elektrisch leitend mit zumindest einer Leiterbahn verbunden. For attachment, in particular for contacting the at least one aluminum thin wire, the printed circuit board has at least one first bonding surface and the at least one electronic component has at least one second bonding surface. The bonding surfaces represent electrically conductive contact surfaces, which by means of known metallization can be applied. On the circuit board, the bonding surface is electrically conductively connected to at least one conductor track.
Gemäß einer Ausgestaltung der Erfindung ist die wenigstens eine zweite Bondfläche auf dem zumindest einen elektronischen Bauteil aus Aluminium gebildet. Daraus ergibt sich der Vorteil einer Monometallverbindung zwischen dem Bonddraht und dem elektronischen Bauteil, wie bereits zuvor erwähnt. Zusätzlich dazu werden Materialkosten eingespart, wobei die wenigstens eine zweite Bondflächen keine weitere Metallisierung, insbesondere eine sogenannte Over-Pad-Metallisierung, z. B. aus Nickel/Palladium/Gold (NiPdAu), benötigt. Eine Standardmetallisierung der Bondflächen, beispielsweise aus Aluminium, ist kostensparend und ausreichend. According to one embodiment of the invention, the at least one second bonding surface is formed on the at least one electronic component made of aluminum. This results in the advantage of a monometallic connection between the bonding wire and the electronic component, as previously mentioned. In addition, material costs are saved, wherein the at least one second bonding surfaces no further metallization, in particular a so-called over-pad metallization, z. B. of nickel / palladium / gold (NiPdAu) needed. A standard metallization of the bonding surfaces, for example made of aluminum, is cost-saving and sufficient.
Gemäß einer weiteren Ausgestaltung der Erfindung ist die wenigstens eine erste Bondfläche auf der Leiterplatte aus Gold gebildet. Zwar entsteht hierbei eine Bimetallverbindung, allerdings ist eine Schichtdicke der Bondfläche derart gering (im Nanometerbereich), dass eine Zuverlässigkeit der elektrischen Verbindung erhalten bleibt. According to a further embodiment of the invention, the at least one first bonding surface on the printed circuit board is formed of gold. Although this results in a bimetallic connection, however, a layer thickness of the bonding surface is so small (in the nanometer range) that a reliability of the electrical connection is maintained.
Darüber hinaus umfasst die Leiterplatte gemäß einem Ausführungsbeispiel einen Trägerkörper, der aus einer Mehrzahl von Schichten gebildet ist. Die Schichten sind beispielsweise Glasfasermatten, die zur adhäsiven Verbindung untereinander mit einem Harz vorimprägniert sind. In addition, according to one embodiment, the printed circuit board comprises a carrier body, which is formed from a plurality of layers. The layers are, for example, glass fiber mats which are pre-impregnated with a resin for adhesive bonding to one another.
Die wenigstens eine erste Bondfläche ist dabei auf einer ersten Schicht des Trägerkörpers angeordnet, wobei die erste Schicht eine Oberflächenseite der Leiterplatte bildet. Zwischen den Schichten können elektrisch leitende Innenlagen angeordnet sein, die beispielsweise analog zu den Leiterbahnen aus Kupfer gebildet sind. Eine elektrische Verbindung der Innenlagen unterschiedlicher Schichten erfolgt z. B. mittels Durchkontaktierungen (auch als „Vias“ oder „Mikrovias“ bekannt). The at least one first bonding surface is arranged on a first layer of the carrier body, wherein the first layer forms a surface side of the printed circuit board. Between the layers electrically conductive inner layers may be arranged, which are formed, for example, analogous to the conductor tracks made of copper. An electrical connection of the inner layers of different layers is z. By means of vias (also known as "vias" or "microvias").
Gemäß einer weiteren Ausgestaltung der Erfindung ist das zumindest eine elektronische Bauteil mittels eines elektrisch leitenden Klebstoffs stoffschlüssig auf der Leiterplatte fixiert. According to a further embodiment of the invention, the at least one electronic component is fixed by means of an electrically conductive adhesive cohesively on the circuit board.
Bei einem Verfahren zur Herstellung der beschriebenen elektronischen Komponente werden die Leiterplatte mit der zumindest einen Leiterbahn und das zumindest eine elektronische Bauteil bereitgestellt und mittels des zumindest einen Aluminium-Dünndrahts elektrisch leitend miteinander verbunden. In a method for producing the described electronic component, the printed circuit board with the at least one printed conductor and the at least one electronic component are provided and electrically conductively connected to one another by means of the at least one aluminum thin wire.
Mittels der Verwendung eines Aluminium-Dünndrahts als Bonddraht kann auf sogenannte Over-Pad-Metallisierungen auf der Seite des elektronischen Bauteils verzichtet werden. Damit ist eine Herstellung der elektronischen Komponente gegenüber dem Stand der Technik kostengünstiger und zeiteffizienter. By using an aluminum thin wire as a bonding wire can be dispensed so-called over-pad metallizations on the side of the electronic component. Thus, a production of the electronic component over the prior art is cheaper and more time efficient.
Eine Ausgestaltung der Erfindung sieht hierbei vor, dass zur Befestigung des mindestens einen Aluminium-Dünndrahts auf die Leiterplatte wenigstens eine erste Bondfläche und auf das zumindest eine elektronische Bauteil wenigstens eine zweite Bondfläche aufgebracht werden, wobei der mindestens eine Aluminium-Dünndraht mittels Drahtbonden mit den Bondflächen verbunden wird. An embodiment of the invention provides that at least one first bonding surface is applied to the at least one aluminum thin wire and at least one second bonding surface is applied to the at least one electronic component, the at least one aluminum thin wire being bonded to the bonding surfaces by wire bonding is connected.
Die oben beschriebenen Eigenschaften, Merkmale und Vorteile dieser Erfindung sowie die Art und Weise, wie diese erreicht werden, werden klarer und deutlicher verständlich im Zusammenhang mit der folgenden Beschreibung von Ausführungsbeispielen, die im Zusammenhang mit der Zeichnung näher erläutert werden. Dabei zeigt: The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following description of exemplary embodiments which will be described in connection with the drawings. Showing:
Die einzige
Die elektronische Komponente E ist beispielsweise zur Anordnung in einem Steuergerät für ein Kraftfahrzeug, z. B. in einem Getriebesteuergerät, vorgesehen und umfasst eine Leiterplatte
Die Leiterplatte
Auf einer oberen, ersten Schicht S1 ist eine elektrisch leitende Leiterbahn
Weiterhin sind in Schichten S2 bis Sn unterhalb der ersten Schicht S1 elektrisch leitende Innenlagen
Im vorliegenden Ausführungsbeispiel sind die Durchkontaktierungen
Die auf der ersten Schicht S1 angeordneten Leiterbahnen
Das elektronische Bauteil
Das elektronische Bauteil
Das elektronische Bauteil
Das elektronische Bauteil
Damit ist eine Verbindung zwischen den Aluminium-Dünndrähten
Weiterhin ermöglicht eine derartige Monometallverbindung eine Kostenreduzierung bei der Herstellung der elektronischen Bauteile
Die ersten Bondflächen
Zum Schutz der elektronischen Komponente E vor äußeren Einflüssen im Betrieb der elektronischen Komponente E, z. B. vor korrosiven Medien, wie z. B. Getriebeölen, vor Spänen und/oder Schadgasen etc., ist eine Kapselung
Die Kapselung
Die in diesem Ausführungsbeispiel beschriebene elektronische Komponente E kann in sämtlichen Bereichen mit hohen Temperatur- und/oder Bauraumanforderungen und/oder hoher Korrosionsgefahr eingesetzt werden. The electronic component E described in this embodiment can be used in all areas with high temperature and / or space requirements and / or high risk of corrosion.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 1 1
- Leiterplatte circuit board
- 1.1 1.1
- Leiterbahn conductor path
- 1.2 1.2
- Innenlage inner layer
- 1.3 1.3
- Durchkontaktierung via
- 1.4 1.4
- Mikrovia microvia
- 1.5 1.5
- erste Bondfläche first bonding surface
- 2 2
- elektronisches Bauteil electronic component
- 2.1 2.1
- zweite Bondfläche second bond area
- 3 3
- Aluminium-Dünndraht Aluminum thin wire
- 4 4
- Kapselung encapsulation
- E e
- elektronische Komponente electronic component
- S1 S1
- erste Schicht first shift
- S2 bis Sn S2 to Sn
- Schicht layer
- K K
- Klebstoff adhesive
- R R
- Rückseite back
- z z
- Hochachse vertical axis
Claims (9)
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WO2019011456A1 (en) * | 2017-07-13 | 2019-01-17 | Alanod Gmbh & Co. Kg | Optoelectronic device with a component which is surface-mounted on a frame support structure, and reflective composite material for such a device |
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US20020149102A1 (en) * | 2000-11-15 | 2002-10-17 | Conexant Systems, Inc. | Structure and method for fabrication of a leadless multi-die carrier |
US20080157310A1 (en) * | 2006-12-29 | 2008-07-03 | Fairchild Korea Semiconductor, Ltd. | Power device package |
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2015
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US20020149102A1 (en) * | 2000-11-15 | 2002-10-17 | Conexant Systems, Inc. | Structure and method for fabrication of a leadless multi-die carrier |
US20080157310A1 (en) * | 2006-12-29 | 2008-07-03 | Fairchild Korea Semiconductor, Ltd. | Power device package |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019011456A1 (en) * | 2017-07-13 | 2019-01-17 | Alanod Gmbh & Co. Kg | Optoelectronic device with a component which is surface-mounted on a frame support structure, and reflective composite material for such a device |
CN110870085A (en) * | 2017-07-13 | 2020-03-06 | 阿兰诺德股份有限两合公司 | Optoelectronic device with structural elements surface-mounted on a frame support structure and reflective composite material for such a device |
US11444226B2 (en) | 2017-07-13 | 2022-09-13 | Alanod Gmbh & Co. Kg | Optoelectronic device with a component which is surface-mounted on a frame support structure, and reflective composite material for such a device |
CN110870085B (en) * | 2017-07-13 | 2023-05-12 | 阿兰诺德股份有限两合公司 | Optoelectronic device with structural element surface mounted on frame support structure and reflective composite material for such a device |
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