DE102015108117A1 - module - Google Patents

Abstract

A component is specified that consists of a carrier and a light-emitting chip component, wherein the light-emitting chip component has a light exit surface and is mounted on a mounting surface of the carrier. The carrier has a reflective surface located partially above and partially below the plane defined by the mounting surface. The light exit surface faces the reflection surface, the carrier is made in one piece. The light emitting chip component may comprise a laser diode or a laser diode bar.

Description

The invention relates to a light-emitting component.

Light-emitting devices can be realized by inserting a light-emitting chip into a package or applying it to a carrier. In this case, the light exit surface of the light-emitting chip can be arranged so that the light can be emitted directly from the housing, or that the light exit surface is opposite to the carrier. Another possibility is to apply the light-emitting chip to a mounting surface of the housing or of the carrier, the light-emitting surface of the light-emitting chip being perpendicular to the mounting surface. A reflector can then be used to deflect the emitted light of the light-emitting chip. The light-emitting chip and the reflector are placed in the form of individual parts on the support. Such a device is in the DE 10 2012 103 257 A1 disclosed.

An object of the invention is to provide an improved light-emitting device in which a reflector is a part of the carrier for the light-emitting chip. The carrier and the reflector are made in one piece. This object is achieved with a component having the features of claim 1. In the dependent claims various developments are given.

A component comprises a carrier and a light-emitting chip component, wherein the light-emitting chip component has a light exit surface. The carrier has a mounting surface. The light emitting chip component is mounted on the mounting surface of the carrier, wherein the light exit surface is perpendicular to the mounting surface. The carrier also has a reflective surface. The light exit surface of the light-emitting chip faces the reflection surface. The carrier with mounting surface and reflection surface is made in one piece. Due to the one-piece design of the support, whereby in particular mounting surface and reflection surface are at a fixed angle to each other, and wherein the reflection surface is not generated by introducing a further component, the light-emitting component is improved because no deviations may occur during assembly of the reflection surface.

In one embodiment, the reflective surface is disposed partially above and partially below the plane defined by the mounting surface. This allows a flatter design possible.

In one embodiment, the carrier has a recess adjacent to the mounting surface. This is particularly advantageous if the light-emitting chip is placed directly on the edge to this recess on the mounting surface.

In one embodiment, the support is made of a material having a specific thermal conductivity of at least 30 W / (m · K). A specific heat conductivity of the carrier of 30 W / (m · K) allows a reliable heat transfer from the light-emitting chip to the back of the carrier. In particular copper, aluminum or aluminum alloys are suitable as material for the carrier. However, other materials which have a corresponding thermal conductivity can also be used.

In one embodiment, the carrier has a reflective coating in the region of the reflection surface. Due to the reflective coating of the carrier, which can be applied, for example, galvanically or else via a vacuum evaporation method, the reflection of the light of the light-emitting chip component at the reflection surface can be improved. Particularly suitable materials for the coating are materials which have a high reflectivity for the light of the wavelength used.

In one embodiment, the reflective surface is flat. The flat reflecting surface allows the light of the light-emitting chip to be deflected by a specific angle, which depends on the angle at which the reflection surface and the mounting surface are in relation to one another. Otherwise, the light beam of the light-emitting chip is not changed by the flat reflection surface. By the deflection of the flat reflection surface, a component can be produced which has the same beam properties as another component without a reflection surface, in which the light exit direction of the component coincides with the light exit direction of the light-emitting chip component. Due to the reflection surface, it is possible to reduce the height of the component.

In one embodiment, the reflective surface and the mounting surface are at an angle of 40 to 50 ° to each other, in particular at an angle of 45 °. By choosing an angle of 45 ° between the mounting surface and the reflection surface, the light of the light-emitting chip component can be deflected by 90 °. By choosing this angle results in a particularly advantageous design of the component, since this allows the largest reduction in height.

In one embodiment, the reflective surface has a parabolic shape. A parabolic shape of the reflection surface can serve in addition to the deflection of the light of the light-emitting chip component that a first beam shaping of the light of the light-emitting chip component is made possible. With a parabolic shape of the reflecting surface good beam properties of the light leaving the component can be generated.

In one embodiment, the focal point of the parabolic reflection surface lies on the light-emitting surface of the light-emitting chip component facing the reflection surface. This choice of the geometry of the carrier and of the light-emitting chip component ensures that the light which leaves the light-emitting chip component with a certain angular distribution is reflected at the parabolic reflection surface and thereby converted into a parallel beam. As a result, both the component height can be reduced with the reflection surface, as well as a first beam forming done.

In one embodiment, the device has a housing which has two electrically conductive regions that are electrically insulated from one another. The light-emitting chip component has two terminals, one terminal each of the light-emitting chip component being electrically conductively connected to one of the two electrically conductive areas. As a result, an electrical contacting of the light-emitting chip component can be achieved.

In one embodiment, the carrier to which the light-emitting chip component is applied is an electrically conductive region. This is especially the case when the carrier is made of a metal.

In one embodiment, the light-emitting chip component has a submount next to the light-emitting chip. The submount may be interpreted as an additional carrier to which the light-emitting chip is applied. The light-emitting chip is placed on the submount and this prefabricated light-emitting chip component is then placed on the carrier with the reflection surface. The submount simplifies the electrical contacting of the light-emitting chip during production. A light-emitting chip with a submount is easier to place on a support than a light-emitting chip for itself.

In one embodiment, the submount has two contact points, wherein the two contact points are electrically conductively connected to in each case one terminal of the light-emitting chip. In addition, the two contact points are each connected to one of the electrically conductive regions of the housing by means of bonding wire. This ensures the electrical contacting of the light-emitting chip via the submount with the electrically conductive regions of the housing.

In one embodiment, the housing has a circumferential surface. In addition, the device has a cover which is adjacent to the peripheral surface. The cover element is permeable to the radiation of the light-emitting chip component and seals the housing tightly.

In one embodiment, the cover element has a beam-shaping element, a lens or scattering particles. As a result, beam shaping of the light of the light-emitting chip component can be achieved by means of the cover element. With a lens, the light of the light-emitting chip component, for example, can be collimated, with scattering particles, a scattering of the light can be achieved.

In one embodiment, the housing below the cover element is filled with a material permeable to the radiation of the light-emitting chip component. By the cover and the backfilling of the housing with a permeable to the light of the light-emitting chip component material protection against mechanical or other environmental influences on the light-emitting chip component and the reflection surface can be achieved.

In one embodiment, the light-emitting chip component is a laser chip component. In other words, the light-emitting chip is a laser diode. A laser diode is particularly advantageous for use in a light-emitting device of the present invention.

In an embodiment, the laser chip component comprises a laser diode bar, the carrier having a reflection surface for each laser of the laser diode bar. Thereby, the beam shaping property of the reflection surface can be used singly for each laser.

In one embodiment, the component has further components, for example a photodiode.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following description of the embodiments, which will be described in detail in conjunction with the drawings. In the drawings show:

The 1 a cross section through a light-emitting device with a flat reflecting surface;

the 2 a cross section through another light-emitting device with a flat reflecting surface;

the 3 a cross section through a light-emitting component with a parabolic reflection surface;

the 4 the cross section through a light emitting device with housing;

the 5 a cross section through a light emitting device with housing and submount;

the 6 a plan view of a light emitting device with housing and submount;

the 7 a cross section through a light-emitting device with housing, submount and cover;

the 8th a cross section through a light-emitting device with housing, submount, cover and beam shaping element, which is integrated in the cover; and

the 9 a plan view of a light-emitting device with a laser diode bar and a plurality of parabolic reflection surfaces.

The 1 shows a light emitting device 100 that from a carrier 110 and a light-emitting chip component 120 consists. On a top of the vehicle 110 there is a mounting surface 111 on which the light-emitting chip component 120 is appropriate. The light-emitting chip component 120 can directly or via at least one bonding layer on the mounting surface 111 rest. As the bonding layer, for example, an adhesive layer, an epoxy resin layer or a paint layer is conceivable. The light-emitting chip component 120 has a light exit surface 121 on, perpendicular to the mounting surface 111 stands, but also other angles between mounting surface 111 and light exit surface 121 are conceivable. The light exit surface 121 of the light-emitting chip component 120 is a flat reflection surface 112 facing. The carrier 110 with the mounting surface 111 and the reflection surface 112 is made of one piece.

The 2 also shows a light emitting device 100 that from a carrier 110 with flat reflection surface 112 and a light-emitting chip component 120 consists. A mounting surface 111 and the light-emitting chip component 120 are analogous to 1 arranged, the carrier 110 a recess 113 having, wherein the light exit surface 121 of the light-emitting chip component 120 the flat reflection surface 112 and the recess 113 is facing. Through the recess 113 can be achieved that a large proportion of the light, preferably the entire light of the light-emitting chip component 120 on the flat reflection surface 112 meets. The reflection surface 112 is arranged so that it lies partially above and partially below the plane passing through the mounting surface 111 of the carrier 110 is defined. The carrier 110 with the mounting surface 111 and the reflection surface 112 is made of one piece.

In one embodiment, the carrier 110 a recess 113 on, attached to the mounting surface 111 borders.

In one embodiment, the carrier is 110 of a material with a specific thermal conductivity of at least 30 W / (m · K). Due to a specific thermal conductivity of the carrier 110 of at least 30 W / (m · K) can be achieved, that is the heat in the light-emitting chip component 120 is created by the wearer 110 can be derived. This allows efficient cooling of the light-emitting chip component 120 be achieved. Suitable materials for the wearer 110 For example, copper, aluminum or aluminum alloys. However, it is also possible to use other materials which have a specific thermal conductivity of at least 30 W / (m · K).

In one embodiment, the carrier 110 in the area of the reflection surface 112 a reflective coating on. This coating can consist of different materials, depending on the wavelength of the light-emitting chip component 120 having. For red light, for example, a gold layer, but also a passivated silver surface is suitable. For green and blue light, a passivated silver surface is suitable.

In the described embodiment, the reflection surface 112 just. This allows a simple geometry of the device 100 , In order to achieve an optical beam shaping, however, further beam-shaping elements are necessary, the plane reflecting surface 112 deflects the light of the light-emitting chip component only.

In one embodiment, the angle between the planar reflecting surface 112 and the mounting surface 111 a value between 40 and 50 °, in particular 45 °. With an angle of 45 ° can be achieved that the light of light-emitting chip component 120 is deflected by 90 °. As a result, the light emerges from the component perpendicular to the mounting surface.

The 3 shows a component 100 that from a carrier 110 and a light-emitting chip component 120 consists. The carrier has a flat mounting surface 111 on top of which the light-emitting chip component 120 is attached directly or via a connection layer. The light-emitting chip component 120 has a light exit surface 121 on, perpendicular to the mounting surface 111 stands, although other angles between the light exit surface 121 and mounting surface 111 are conceivable. To the mounting surface 111 adjacent to the carrier 110 a recess 113 on. The carrier 110 has a parabolic reflection surface 114 on, with part of the recess 113 has a parabolic surface and the recess 113 into the parabolic reflection surface 114 passes. The light exit surface 121 of the light-emitting chip component 120 is the parabolic reflection surface 114 facing. Through the parabolic reflection surface 114 is achieved that in addition to the deflection of the light of the light-emitting chip component 120 also a first beam shaping on the parabolic reflection surface 114 takes place.

In one embodiment, the focal point of the parabolic reflection surface 114 on the light exit surface 121 of the light-emitting chip component 120 , This ensures that the light rays from the light-emitting chip component 120 be emitted with a certain opening angle, at the parabolic reflection surface 114 be reflected so that parallel light rays arise.

The 4 shows a component 100 that a carrier 110 , a light-emitting chip component 120 and a housing 130 having. The housing 130 consists of several parts, the carrier 110 a part of the housing 130 is. The carrier 110 is also a first electrically conductive area 131 of the housing 130 , The housing 130 also has a second electrically conductive area 132 on. Through an isolation area 133 that does not conduct electrical current is the second electrically conductive region 132 from the first electrically conductive area 110 , separated. Both form the first electrically conductive area 110 , the second electrically conductive area 132 and the isolation area 133 a part of the housing 130 , By means of a bonding wire 134 is the second electrically conductive area 132 with the top of the light-emitting chip component 120 connected. The bottom of the light-emitting chip component 120 lies directly on the mounting surface 111 of the carrier 110 , ie the first electrically conductive area 131 on or is at least a tie layer with the carrier 110 connected. Through the electrically conductive areas 131 . 132 may be the light-emitting chip component 120 be contacted electrically. The carrier 110 also has a recess 113 and a flat reflective surface 112 analogous to 2 on.

The 5 shows a cross section through a further embodiment of a component 100 , The component 100 has a carrier 110 , a housing 130 and a light-emitting chip component 120 on. The carrier 110 has a recess 113 and a flat reflective surface 112 analogous to 2 on. The light-emitting chip component 120 has a submount 140 on. The submount 140 can be understood as an additional carrier, wherein a lichtemitierender chip 120 on the submount 140 attached and the submount 140 on the mounting surface 111 is attached. The submount 140 is between the light-emitting chip 120 and the carrier 110 arranged. The housing 130 has two electrically conductive areas 131 . 132 on, with the two electrically conductive areas 131 . 132 through an isolation area 133 are electrically isolated. The carrier 110 , which is also part of the case 130 is, is also about an isolation area 133 from the electrically conductive area 132 isolated. The submount 140 has a first contact point 141 and a second contact point 142 on. The first electrically conductive area 131 of the housing 130 is with a first bonding wire 135 with the first contact point 141 of the submount 140 connected. The second electrically conductive area 132 of the housing 130 is with a second bonding wire 136 with the second contact point 142 of the submount 140 connected. The second contact point 142 of the submount 140 is with a third bonding wire 137 with the top of the light-emitting chip 120 connected while the bottom of the light-emitting chip 120 to the first contact point 141 of the submount 140 borders. Thus, the electrical connection of the light-emitting chip component 120 over the first electrically conductive area 131 and the second electrically conductive region 132 of the housing 130 respectively. The carrier 110 serves the heat dissipation, with no electrical contacting of the light-emitting chip 120 over the carrier 110 is provided.

In one embodiment, the carrier is 110 intended for heat dissipation, two electrically conductive areas 131 , 132 provide for the electrical contacting of the light-emitting chip component 120 , where no submount 140 is provided.

The 6 shows the device 100 of the 5 in the plan view. The housing 130 has a rectangular shape with a flat surface on all four sides 138 is arranged. The surface 138 is a flat surface. In This embodiment is the surface 138 designed so that a cover on the surface 138 can be hung up.

The 7 shows a cross section through a device 100 which is essentially the component of the 4 and 5 equivalent. The component 100 of the 6 additionally has a cover 150 on that on the surface 138 rests and which is transparent to the radiation of the light-emitting chip component 120 is. The cover element 150 is set up, the complete component 100 close tightly.

In one embodiment, the housing 130 below the cover 150 with a material 180 filled for the light of the light-emitting chip component 120 is permeable. By the cover member and / or the filling with a material that is transparent to the light of the light emitting chip component, a mechanical protection of the light emitting chip component 120 , the bonding wires and the other components of the component 100 be achieved.

The 8th shows a component 100 which is essentially the component of the 6 equivalent. In addition, the cover member 150 a beam-shaping element 160 in the form of a lens. The beam-shaping element 160 is so on the cover 150 arranged that the radiation of the light-emitting chip component 120 this over the light exit surface 121 leaves, at the reflecting surface 112 is mirrored by the cover 150 goes through and then on the beam-shaping element 160 meets. By means of dashed lines is this light path of the light-emitting chip component 120 from the light exit surface 121 over the flat reflection surface 112 through the cover 150 and the lens, or the beam-shaping element 160 represented. Here, the focal length of the lens, which is the beam-shaping element 160 forms, so chosen, that the focal point on the light exit surface 121 lies. This results above the beam-shaping element 160 a parallel beam of light 170 ,

In one embodiment, the beam-shaping element is not integrated on the cover, but in the cover.

In one embodiment, the beam-shaping element consists of scattering particles which are introduced into the cover element.

In one embodiment, the light-emitting chip component is a laser chip component, wherein the light-emitting chip component has a laser diode. Laser diodes, and in particular edge-emitting laser diodes, have large aperture angles of the exiting light beam. By arranging the light exit surface in the direction of a reflector and the arrangement of beam shaping elements, which can either be integrated in the cover, or integrated into the reflector, the diverging light beam of the laser diode can be formed so that the component emits a parallel beam. Edge emitting laser diodes generally have two different aperture angles, depending on whether an emission direction is considered parallel or perpendicular to an active layer of the laser diode. These different opening angles can be taken into account in the selection or in the design of the beam-shaping elements. On the one hand, this consideration can take place by selecting a beam-shaping element of the cover. On the other hand, it is also possible to take into account the two different opening angles in the design of the reflection surface. With a reflection surface in the form of a paraboloid of revolution, it is possible, despite the different opening angles of the two axes, to produce a component with a parallel laser beam.

In one embodiment, the laser chip component has a laser diode bar. This means that the laser chip component has a plurality of laser diodes.

The 9 shows a plan view of a component 100 that is a case 130 and a carrier 110 having. On a mounting surface 111 of the carrier 110 is a laser diode bar 220 arranged. The laser diode bar 220 has a light exit surface 221 on, over which the laser radiation of four active zones 222 from the laser diode bar 220 is decoupled. There may also be more or less active zones 222 be provided. Every active zone 222 can be considered as a separate laser diode. The carrier 110 has a recess 113 on, attached to the mounting surface 110 borders. In addition, the wearer points 110 four parabolic reflection surfaces 114 on, each active zone 222 of the laser bar 220 a parabolic reflection surface 114 is assigned, so that the emitted laser radiation of an active zone 222 on the associated parabolic reflection surface 114 meets. A cross section through the component 100 in the area of the parabolic reflection surface 114 would the parabolic reflection surface 114 of the 3 correspond. Four electrically conductive areas 231 . 232 . 233 . 234 are each with a bonding wire 134 with the laser diode bar 220 connected, with each bonding wire 134 an active zone 222 assigned. This is an isolation area 133 arranged so that the four electrically conductive areas 231 . 232 . 233 . 234 and the carrier 110 are electrically isolated. The respective second electrical contact of the active zones 222 takes place via the carrier 110 , in addition, the heat transfer from the laser diode bar 220 from the casing 130 out possible. The housing 130 has a circumferential surface 138 on, which allows the attachment of a cover.

In one embodiment, the device 100 several individual light-emitting chip components 120 instead of the laser diode bar 220 on. In addition, the reflection surface and other shapes, such as the shape of the 1 exhibit. It can work for any active zone 222 a separate flat reflection surface 112 or a flat reflective surface 112 for all active zones 222 be provided. In addition, on the recess 113 be waived.

In one exemplary embodiment, the component has further elements, for example a photodiode. By means of photodiode, for example, the power of the emitted light during operation of the device can be measured. This is particularly helpful if the light-emitting chip is to be operated at a certain power. In order to contact the further elements electrically, it may be provided that further conductive areas of the housing are provided.

Although the invention has been further illustrated and described in detail by the preferred embodiment, the invention is not limited by the disclosed examples, and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

LIST OF REFERENCE NUMBERS

100

 module

110

 carrier

111

 mounting surface

112

 Plane reflection surface

113

 recess

114

 Parabolic reflection surface

120

 Light-emitting chip component

121

 Light-emitting surface

130

 casing

131

 First electrically conductive area

132

 Second electrically conductive area

133

 Quarantine

134

 bonding wire

135

 First bonding wire

136

 Second bonding wire

137

 Third bonding wire

138

 surface

140

 submount

141

 First contact point

142

 Second contact point

150

 cover

160

 Beam shaping element

170

 Emitted light

180

 material

220

 laser diode bars

221

 Light-emitting surface

222

 Active zone

231

 First electrically conductive area

232

 Second electrically conductive area

233

 Third electrically conductive area

234

 Fourth electrically conductive area

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102012103257 A1 [0002]

Claims (15)

Component ( 100 ), consisting of a carrier ( 110 ) and a light-emitting chip component ( 120 ), wherein the light-emitting chip component ( 120 ) a light exit surface ( 121 ) and on a mounting surface ( 111 ) of the carrier ( 110 ), the support ( 110 ) a reflection surface ( 112 . 114 ), wherein the light exit surface ( 121 ) of the reflection surface ( 112 . 114 ) and wherein the carrier ( 110 ) with the mounting surface ( 111 ) and the reflection surface ( 112 . 114 ) is made in one piece. Component ( 100 ) according to claim 1, wherein the reflection surface ( 112 . 114 ) partly above and partly below the plane passing through the mounting surface ( 111 ) is arranged. Component ( 100 ) according to any one of the preceding claims, wherein the carrier ( 110 ) a recess ( 113 ), which are connected to the mounting surface ( 111 ) adjoins. Component ( 100 ) according to any one of the preceding claims, wherein the carrier ( 110 ) consists of a material with a specific thermal conductivity of at least 30 W / (m K). Component ( 100 ) according to one of the preceding claims, wherein the reflection surface ( 112 ) is just. Component ( 100 ) according to one of claims 1 to 4, wherein the reflection surface ( 114 ) has a parabolic shape. Component ( 100 ) according to claim 7, wherein the focal point of the parabolic reflection surface ( 114 ) on the reflection surface ( 114 ) facing the light exit surface ( 121 ) of the light-emitting chip component ( 120 ) lies. Component ( 100 ) according to one of the preceding claims, wherein the component ( 100 ) a housing ( 130 ), wherein the housing ( 130 ) two electrically conductive areas ( 131 . 132 ), which are electrically insulated from each other and wherein a first electrical connection of the light-emitting chip component ( 120 ) with the first electrically conductive region ( 131 ) and a second electrical connection of the light-emitting chip component ( 120 ) with the second electrically conductive region ( 132 ) is electrically connected. Component ( 100 ) according to claim 8, wherein the carrier ( 110 ) an electrically conductive region ( 131 . 132 ). Component ( 100 ) according to one of the preceding claims, wherein the light-emitting chip component ( 120 ) a submount ( 140 ) having. Component ( 100 ) according to claim 10, wherein the submount ( 140 ) two contact points ( 141 . 142 ), wherein the two contact points ( 141 . 142 ) each having one of the electrically conductive regions ( 131 . 132 ) of the housing ( 130 ) by means of bonding wire ( 135 . 136 ) and wherein the first contact point ( 141 ) with a first electrical connection of the light-emitting chip component ( 120 ) and the second contact point ( 142 ) with a second electrical connection of the light-emitting chip component ( 120 ) is electrically connected. Component ( 100 ) according to one of the preceding claims, wherein the housing ( 130 ) a circumferential surface ( 138 ), wherein the component ( 100 ) a cover element ( 150 ) which is attached to the surface ( 138 ), wherein the cover element ( 150 ) permeable to the radiation of the light-emitting chip component ( 120 ) and the housing ( 130 ) tightly closes. Component ( 100 ) according to claim 12, wherein the cover element ( 150 ) a beam-shaping element ( 160 ), a lens or scattering particles. Component ( 100 ) according to one of claims 12 or 13, wherein the housing ( 130 ) below the cover element ( 150 ) with one for the radiation of the light-emitting chip component ( 120 ) permeable material ( 180 ) is filled. Component ( 100 ) according to one of the preceding claims, wherein the light-emitting chip component ( 120 ) a laser chip component or a laser diode bar ( 220 ), the carrier ( 110 ) for each laser of the laser diode bar ( 220 ) a reflection surface ( 112 . 114 ) having.

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