DE102013201424A1 - Control device used for gear box circuit e.g. automatic transmission in motor car, has carrier element which is made of first material having first thermal expansion coefficient selected in specific range in two directions - Google Patents

Abstract

The device (100) has a plug element (300) whose electrical line (320) is passed between sides (312,314) of a carrier element (310). A casting material (380) is arranged on carrier element to fully enclose a longitudinal portion (322) of electrical line. The carrier element is made of first material having first thermal expansion coefficient selected in a range between 17 ppm/K and 24 ppm/K in two directions. The electrical line and casting material are made of two materials having respective thermal expansion coefficients selected in range between 17 ppm/K and 24 ppm/K.

Description

State of the art

The invention relates to a control unit with the features of the independent device claim and the use of a plug element in a control unit.

In the automotive sector, control devices are used in a wide variety of applications. These controllers have i.d.R. an electronics room with a sensitive electronics arranged therein. They are often exposed to adverse conditions at the point of their installation in the vehicle. These include, in particular, vibration loads, high temperature fluctuations, and often also an environment of aggressive media, e.g. Exhaust gases, brake fluid, fuels, and gear oil.

Before all these influences, especially before contact with aggressive media, the electronics in the control unit must be permanently and reliably protected, otherwise individual electronic components or the entire electronics can be destroyed. For this purpose, the electronics are usually surrounded by a housing, wherein the electrical power supply and the signal lines are usually guided by a plug element into the interior of the housing to the electronics. For electrical insulation of the guided into the housing electrical lines, it is often necessary to surround the electrical lines in the connector element by plastics, preferably by the plug element is made of plastic.

However, this results in the problem that the most metallic electrical cables and the plastic surrounding them have greatly different thermal expansion coefficients (CTE). As a result, the plastic may become loose from the metallic electrical leads during the cooling phase of the injection process, or delamination between the plastic and the electrical lead may occur during thermal cycling over the life of the controller. Such delamination between the plastic and the electrical line, in turn, can open a creepage path for aggressive media from the environment of the controller into the electronics compartment, thereby damaging the electronics of the electronic module and thus malfunctioning or even failure of the controller, before the desired life of the controller Control unit is reached.

The EP 1 697 175 B1 describes a control unit, in which a sealing gel is provided with such a viscosity in a recess in the frame of the control unit, that the sealing gel can flow around the recess passing through the electrical conductor tracks and an insert into the recess Anformung a lid. Due to the elasticity of the sealing gel, the formation of Kriechpfaden should be prevented. However, sealing gel is expensive, at the same time the reliable casting of the entire circumferential recess with the sealing gel is a high requirement for the production technology.

Disclosure of the invention

Advantages of the invention

Compared to the prior art, the control device with the features of the independent device claim has the advantages that the plug part is permanently and reliably sealed media-tight against the ingress of aggressive media from the outside of the controller in the electronics compartment and that kept the amount of costly potting compound particularly low can be. Advantageously, the formation of a creeping path between the electrical line and the plug element is avoided, or at least greatly reduces the probability of occurrence of creepage paths between the electrical line and the plug element.

According to the invention, a control device according to the preamble of the first independent device claim 1 is proposed. The control device comprises, inter alia, a plug element with a carrier element made of a first material having a first coefficient of thermal expansion (CTE1), at least one electrical line made of a second material with a second coefficient of thermal expansion (CTE2), and a potting compound of a third arranged on the carrier element Material with a third thermal expansion coefficient (CTE3). According to the invention, the second material and the third material are selected so that the second coefficient of thermal expansion (CTE2) and the third coefficient of thermal expansion (CTE3) in an interval between 13 ppm / K and 30 ppm / K and in particular in an interval between 17 ppm / K and 24 ppm / K and that the first material is selected such that the first thermal expansion coefficient (CTE1) at least in two spatial directions n an interval between 13 ppm / K and 30 ppm / K and in particular in an interval between 17 ppm / K and 24 ppm / K is. As "ppm" is here to understand "parts per million", so a millionth part. 1 ppm / K corresponds to 1 × 10 ^-6 / K.

Compared to the prior art, the use of a plug element in a control device according to the independent use claim has the advantage that the plug element permanently and reliably media-tight at the junction between the at least one electrical line and the carrier element is formed. In addition, it is advantageously effected that the formation of the plug element leads to a geometric diameter which allows the use of commercially available standard O-rings and thus enables a media-tight arrangement of the plug element in the housing of the control unit. A further advantage is that such a connector element can be prepared as a standardized component, preferably for various applications in large quantities and thus very cost-finished bar.

Advantageous embodiments and further developments of the invention are made possible by the measures specified in the dependent claims.

Characterized in that in the temperature range of -40 ° C to 90 ° C, the second material and the third material are selected such that the second coefficient of thermal expansion (CTE2) and the third thermal expansion coefficient ((CTE3) in an interval between 13 ppm / K and 30 ppm / K, and in particular at an interval between 17 ppm / K and 24 ppm / K, and that the temperature range of -40 ° C to 90 ° C of the first material is selected so that the first thermal expansion coefficient (CTE1) at least is in two spatial directions in an interval between 13 ppm / K and 30 ppm / K and in particular in an interval between 17 ppm / K and 24 ppm / K is advantageously causes over a wide temperature range, a media-tight seal between the support member and the electrical line, between the carrier element and the potting compound and between the potting compound and the electrical line is permanently ensured.

The fact that the potting compound is applied to the first side facing the electronics compartment or to the second side of the carrier element facing the outer space advantageously has the effect that the arrangement of the potting compound can be optimally adapted to the application environment of the control device. Thus, in the case of strong chemical and / or mechanical stress on the second side of the carrier element, the potting compound can preferably be applied to the first side of the carrier element. As a result, the formation of creepage paths from the exterior space of the control unit in the electronics compartment is advantageously permanently prevented or creeping paths between the carrier element and the electrical line are reliably sealed. Under other conditions, the application of the potting compound on the second side of the carrier element can ensure a cost-effective and permanently media-tight seal.

Characterized in that on the first side of the support member, a cup-shaped cavity is formed, wherein the at least one electrical line passes through the cup-shaped cavity, is advantageously effected that a particularly simple and inexpensive arrangement of the potting compound on the support element is possible. The cup-shaped cavity advantageously prevents overflowing or creeping of the potting compound out of the actual potting area. Furthermore, it is advantageously ensured by the cup-shaped cavity that with a preferably smallest possible amount of potting compound, the at least one electrical line is fully enclosed at a longitudinal portion of the electrical line. As a result, the production reliability is advantageously increased and the manufacturing costs are reduced.

The fact that the cup-shaped cavity is at least partially filled with potting compound is advantageously effected that a possibly occurring creepage path between the at least one electrical line and the carrier element does not lead to an ingress of media into the electronics compartment, as the potting compound, limited by the cup-shaped Cavity that hermetically seals at least one electrical line securely on the first side of the support element.

In a development of the invention, it is provided that an opening is arranged in the housing and that the carrier element is arranged on the housing in such a way that the at least one electrical line projects through the opening into the electronics compartment. This has the advantageous effect that the control unit easily and inexpensively manufacturable. For in this development, the housing of the control unit and the support element are separate elements, so that the media-tight sealing of the electrical line in the plug element can be checked before assembling the housing with the plug element. Accordingly, if the media density is not met in the case of a tested connector element, then only this connector element at a low value-added stage is rejected and not the control unit standing on a much higher value-added stage.

Characterized in that between the support member and the housing, a seal is arranged such that the electronics compartment is sealed media-tight against an outer space of the housing, is advantageously effected that the electronic module is permanently and securely protected from penetrating media and that the support member for maintenance purposes is removable ,

Characterized in that the plug element on the housing by a non-positive connection or a positive connection or a cohesive connection is determined, is advantageously causes the assembly of plug element and housing can be made particularly simple and that the connection between the plug element and the housing is permanently reliable. In addition, it is advantageous standard O-rings used, whereby the manufacturing costs can be reduced and the manufacturing reliability can be increased.

In a further development of the invention, the seal is designed as a circumferential seal with a larger diameter than the diameter of the opening. This has the advantageous effect that a particularly reliable and secure seal against media between the plug part and the housing is effected.

By virtue of the fact that the carrier element consists of a thermoplastic material or of a thermoplastic material with a proportion of more than 25% by volume, in particular with a content of more than 35% by volume, of inorganic fillers, in particular glass fibers, it is advantageously effected the carrier element can be produced in a particularly simple and cost-effective manner. In addition, the thermal expansion coefficient of the carrier element in at least two spatial directions can thereby be set particularly advantageously as a function of the degree of filling with inorganic fillers. As a result, a formation of a creepage gap for media between the carrier element and the at least one electrical line is avoided in a particularly advantageous manner.

Brief description of the drawings

Embodiments of the invention

Embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description.

Show it:

1 a cross section through an inventive control device according to a first embodiment,

2 a cross section through a further embodiment of the control device according to the first embodiment,

3 a cross section through a further embodiment of the control device according to the first embodiment and a cross section through a mating connector,

4 a cross section through an inventive control device according to a second embodiment.

1 shows a control unit 100 , as it can be used for example in a transmission control in an automatic transmission of a motor vehicle. The control unit 100 includes an electronics module 500 , a housing 200 , and a plug element 300 with a carrier element 310 , The electronics module 500 is in an electronics room 210 which is inside the housing 200 is located. The electronic module preferably consists of a carrier substrate 510 , which, for example, as a circuit board 512 or for example as a ceramic substrate 514 can be trained. On the carrier substrate 510 are electronic components 550 , eg user-specific electronic circuits (ASIC) 552 , as well as electrical and electronic components 560 , such as capacitors 562 or resistors 564 arranged. The electrical and / or electronic components 550 . 560 are via electrical connectors 554 with the carrier substrate 510 connected. For the electrical connection elements 554 it may be, for example, bonding wires. The carrier substrate 510 is with the case 200 connected, for example by means of an adhesive to the housing 200 is attached.

In an outdoor area 202 of the control unit 100 may be media such as exhaust gases, fuels, aqueous fluids or oils such as gear oil. For the functioning of the control unit 100 It is essential that in the outdoor space 202 existing media not in the electronics room 210 can penetrate. To achieve this, the case faces 200 an opening 220 on which by the plug element 300 and one between the housing 200 and the plug element 300 arranged seal 280 Media-tight is closed. The seal 280 is preferably as an O-ring 282 educated. The plug element 300 is by means of a non-positive, positive or cohesive connection so on the housing 200 attached that housing 200 , the seal 280 and the plug element 300 a media-tight seal of the electronics compartment 210 opposite the outside space 202 guarantee.

The plug element 300 consists of a carrier element 310 which is a first page 312 has, wherein the first page 312 the electronics room 210 assigns. The carrier element 310 also has a second page 314 on, the second page 314 the carrier element 310 at least partially outside 202 assigns. The carrier element 310 forms in the illustrated embodiment, on its first side a cup-shaped cavity 330 out. The plug element 300 also has two electrical lines in the illustrated embodiment 320 on which from the first page 312 on the second page 314 the carrier element 310 passed through. The two electric ones cables 320 are on the second page 314 electrically contacted with a mating connector, not shown here. In another embodiment, which is not shown here, the two electrical lines 320 be contacted by soldering or by welding with a continuing wiring or with other construction and connection technology electrically. For example, in one embodiment, the two electrical leads 320 be designed as pins, preferably as contact pins, these pins or contact pins are soldered in a circuit carrier, such as a printed circuit board, a PCB or in a ceramic. On the first page 312 lead the electrical wires 320 through the cavity 330 the carrier element 310 through and contact the electronics module 500 each by means of an electrical connection part 570 , This electrical connection part 570 For example, as a spring element 572 be configured in the form of a coil spring or an S-spring or as another, in the connection technology usual electrical connection element, be configured.

The cup-shaped cavity 330 the carrier element 310 is with an electrically non-conductive potting compound 380 filled so that they are each of the two electrical wires 320 at a longitudinal section 322 the two electrical wires 320 completely encloses. At the same time closes the potting compound 380 preferably tight with the walls of the cup-shaped cavity 330 from.

To achieve a permanent media tightness, it is particularly important to have a delamination between the electrical lines 320 and the carrier element 310 to prevent. Therefore, the materials involved (for the electrical wires 320 , and for the carrier element 310 ) preferably selected such that their thermal expansion coefficients are largely matched to each other. Thus, thermal stresses, which are often the cause of delaminations, largely avoided. One as a result of any delamination between the electrical lines 320 and the carrier element 310 occurring creepage path is then through the potting compound 380 Media-tight finished.

The potting compound 380 preferably consists of an epoxy resin with or without fillers, of a silicone elastomer with or without fillers, of an acid anhydride-based epoxy resin with or without fillers, of polyurethane (PUR) with or without fillers or of elastomer, rubber or a silicone rubber. By a suitable selection of the material for the potting compound 380 and a suitable selection of fillers can also be the coefficient of thermal expansion of the potting compound 380 Adjust in a wide range as well as the viscosity and the media resistance of the potting compound 380 ,

Preference is given to the potting compound 380 also selected according to their viscosity or elasticity. This makes it possible that thermal stresses between the potting compound 380 and the carrier element 310 on the one hand and between the potting compound 380 and the electrical wires 320 on the other hand by the elastic properties of the potting compound 380 by means of the elasticity of the potting compound 380 be reduced. Thus, preferably delaminations between the potting compound 380 and the carrier element 310 or between the potting compound 380 and the electrical wires 320 be avoided. The cost of the potting compound 380 however, are usually high compared to the cost of the electrical wiring 320 and for the carrier element 310 , Moreover, the application of the potting compound causes 380 on the carrier element 310 an additional step. Therefore, by the mutual adaptation of the second coefficient of thermal expansion (CTE2) of the electrical line 320 , the third thermal expansion coefficient (CTE3) of the potting compound 380 and the first thermal expansion coefficient (CTE1) of the carrier element 310 in at least two spatial directions, the amount of necessary for a secure media seal potting compound can be significantly reduced. Thus, a permanent media density can be produced in a particularly simple and cost-effective manner.

The housing 200 consists for example of two housing half shells, preferably from a first housing part 206 and a second housing part 208 , The housing can be made of plastic, for example made of polyamide (PA66, PA6) or aluminum or a composite of aluminum and plastics. The electrical wires 320 are preferably formed of a metal, such as copper, nickel-plated copper, aluminum, steel, iron, silver or gold. More preferably, they are made of copper or a copper alloy.

The plug element 300 It is preferably composed of semi-crystalline polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyethersulfone (PES) or polyetherimide (PEI). These plastics are particularly preferably provided with fillers, preferably with glass fibers. As a result of the generally elongated extension of the glass fibers, these are arranged in a planar extension within the plastic during injection molding, so that the finished molded plastic part usually has different coefficients of thermal expansion in the three spatial directions for a glass fiber filling. It is usually in a plane in which the Longitudinal axes of the elongated glass fibers extend to observe a lower thermal expansion coefficient than in the direction perpendicular to these planes. Usually, the plane with the low thermal expansion coefficient extends along the flow front of the liquid plastic during the injection process. Thus, the location or the spatial arrangement of this level of the injection process, ie in particular of the mold and the injection points dependent. By varying the degree of filling of the plastic, ie the proportion of fillers (eg glass fibers) on the plastic, the thermal expansion coefficient in the plane with the low coefficient of thermal expansion can be varied within wide limits. In the further course, the two spatial directions, which span the plane with the low coefficient of thermal expansion, are denoted by "x" and "y". The perpendicular spatial direction, which can have a higher coefficient of thermal expansion, is referred to below as "z". Thus, the first thermal expansion coefficient in the xy plane (CTE1 _{x, y} ) is smaller than the first thermal expansion coefficient in the perpendicular z direction (CTE1 _z ). The spatial directions designated by x, y and z thus become relative to the shape of the support member by the manufacturing conditions 310 established.

For the best possible media tightness, it is necessary that in particular at the point of implementation of the electrical lines 320 through the carrier element 310 lowest or no thermal stresses occur. When using a first material of the carrier element 310 With an anisotropic first coefficient of thermal expansion (CTE1), this first thermal expansion coefficient can not be applied to the second coefficient of thermal expansion (CTE2) of the electrical lines simultaneously in all three spatial directions 320 adjusted as would ideally be desirable. Therefore, in this case, special attention is paid to the geometric relationships at the location of the passage of the electric wires 320 through the carrier element 310 and to note the orientation of the anisotropic first thermal expansion coefficient (CTE1). Because of this, the local position of voltage peaks and their intensity is determined in such material networks as a function of the temperature and thus location and probability for the occurrence of delamination between the electrical lines 320 and the carrier element 310 ,

So can the cup-shaped cavity 330 have different geometries. For example, the cup-shaped cavity 330 be formed so that the cup-like depression is very deep against the diameter of the cup bottom. Or the cup-shaped cavity 330 may be formed so that the recess of the cavity 330 is very small against the diameter of the cup bottom.

Particularly, when using a first anisotropic first coefficient of thermal expansion material (CTE1), these dimensional ratios play an important role in how the xy plane of the first coefficient of thermal expansion (low thermal expansion) with respect to the passage direction of the electric wires 320 in the carrier element 310 should be optimally aligned to avoid delaminations.

Depending on the geometric design of the cavity 330 In some cases it may be necessary for the carrier element 310 is made such that the passage direction of the electric wires 320 through the carrier element 310 preferably in the xy plane (low thermal expansion plane) of the first thermal expansion coefficient (CTE1).

Under other geometric constraints, it may again be necessary to use the carrier element 310 such that the passage direction of the electric wires 320 through the carrier element 310 preferably perpendicular to the xy plane (low thermal expansion plane) of the first thermal expansion coefficient (CTE1) extends.

In 2 is another embodiment of the embodiment of 1 shown. In this embodiment, the plug element 300 as in 1 in the opening 220 of the housing 200 arranged. However, in this embodiment, the male member is 300 through a bond 284 on the electronics room 210 facing the media-tight side fastened. The bond 284 Adopts the media-tight seal between the exterior space 202 of the housing and the electronics compartment 210 , The bond 284 is preferably designed such that on the one hand permanently has a media resistance and not by the outdoor space 202 existing media is dissolved. On the other hand, it has an elasticity in such a way that it is subject to thermally induced or other external effects induced mechanical movements between the plug element 300 and the housing 200 can reduce the mechanical stress caused thereby, without causing delamination between the bond 284 and the housing 200 or between the gluing 284 and the plug element 300 comes.

In 3 a section of a further embodiment of the embodiment according to the invention is shown. This covers the plug element 300 the opening 220 of the housing 200 with his second page 314 from. The Plug element is in a cup-shaped structure 270 of the housing 200 introduced, the cup-shaped structure 270 with their walls 272 the plug element 300 surmounted. The seal between the electronics room 210 and the outside space 202 is achieved by the plug element 300 at the bottom of the cup-shaped structure 270 on a seal 280 , which is preferred as an O-ring 284 is formed, comes to the plant. By crimping the walls 272 the cup-shaped structure 270 becomes the plug element 300 against the seal 280 . 284 pressed so that a media-tight seal is made.

The housing 200 points in the outdoor area 202 in the region of the plug element 300 Furthermore, a channel-like guide opening 290 on. In this channel-like guide opening 290 can be a mating connector 600 be introduced. The mating connector 600 is preferred by means of a mating connector 600 circumferential mating seal 630 , particularly preferably as an O-ring 632 trained, media-tight against the outside space 202 sealed. In the mating connector 600 There are also electrical contacts 620 with which the electrical wires 320 on the second side of the carrier element 310 can be contacted electrically.

In 4 another embodiment of the invention is shown. In this embodiment, the plug element 300 laterally in the housing 200 mounted, whereby the electrical connection between the electrical line 320 and the electronics module 500 through an electrical connection part 570 can be made in the form of, for example, a bonding wire. In this embodiment, the electronic module is preferred first 500 on a first housing part 206 of the housing 200 assembled. Subsequently, the plug part 300 at the intended place in the housing 200 arranged. Thereafter, the electrical connection between the electrical line 320 and the electronics module 500 by means of the electrical connection part 570 , preferably in the form of a bonding wire. Finally, the case becomes 200 by placing a second housing part 208 closed media-tight. The media-tight seal is doing by the plug part 300 circumferential seal 280 (preferably an O-ring 282 ) ensures which between the first housing part 206 and the second housing part 208 is firmly clamped and so the media-tight seal between the exterior 202 and the electronics room 210 accomplished.

Such, previously described in the figures controllers are for example suitable for use as control devices for transmission circuits, for example in automatic transmissions. The connector elements described above are suitable for use in such control devices.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 1697175 B1 [0005]

Claims (12)

Control unit ( 100 ) comprising an electronic module ( 500 ), a housing ( 200 ), the electronic module ( 500 ) in an electronics room ( 210 ) located in the housing ( 200 ) is arranged, and comprising a plug element ( 300 ) with a carrier element ( 310 ), wherein the carrier element ( 310 ) a first page ( 312 ) and a second page ( 314 ), wherein the plug element ( 300 ) at least one electrical line ( 320 ), which from the first side ( 312 ) to the second page ( 314 ) of the carrier element ( 310 ) is passed, wherein a casting compound ( 380 ) on the carrier element ( 310 ) is arranged such that the potting compound ( 380 ) the at least one electrical line ( 320 ) at a longitudinal section ( 322 ) of the electrical line ( 320 ) completely surrounds, wherein the support element ( 310 ) is made of a first material having a first thermal expansion coefficient (CTE1), wherein the at least one electrical line ( 320 ) is made of a second material having a second coefficient of thermal expansion (CTE2), the potting compound ( 380 ) is made of a third material having a third thermal expansion coefficient (CTE3), the plug element ( 300 ) on the housing ( 200 ) is received such that the at least one electrical line ( 320 ) in the electronics room ( 210 ), characterized in that the second material and the third material are selected such that the second thermal expansion coefficient (CTE2) and the third thermal expansion coefficient (CTE3) are in an interval between 13ppm / K and 30ppm / K, and more preferably at one interval between 17ppm / K and 24ppm / K and that the first material is selected such that the first coefficient of thermal expansion (CTE1) is at least in two spatial directions at an interval between 13ppm / K and 30ppm / K, and more preferably at an interval between 17ppm / K and 24ppm / K. Control device according to claim 1, characterized in that in the temperature range from -40 ° C to 90 ° C, the second material and the third material are selected so that the second thermal expansion coefficient (CTE2) and the third coefficient of thermal expansion (CTE3) in an interval between 13ppm / K and 30ppm / K and in particular between 17ppm / K and 24ppm / K, and that in the temperature range of -40 ° C to 90 ° C the first material is selected so that the first thermal expansion coefficient (CTE1) at least in two spatial directions in an interval between 13ppm / K and 30ppm / K and in particular in an interval between 17ppm / K and 24ppm / K lies. Control device according to one of claims 1 or 2, characterized in that the potting compound ( 380 ) on the electronics room ( 210 ) facing first side ( 312 ) or on the outside ( 202 ) facing second side ( 314 ) of the carrier element ( 310 ) is applied. Control unit according to one of claims 1 to 3, characterized in that on the first side ( 312 ) of the carrier element ( 314 ) a cup-shaped cavity ( 330 ), wherein the at least one electrical line ( 320 ) through the cup-shaped cavity ( 330 ) passes through. Control device according to claim 4, characterized in that the cup-shaped cavity ( 330 ) at least partially with the potting compound ( 380 ) is filled. Control device according to one of claims 1 to 5, characterized in that in the housing ( 200 ) an opening ( 220 ) is arranged and that the carrier element ( 310 ) on the housing ( 200 ) is arranged such that the at least one electrical line ( 320 ) through the opening ( 220 ) in the electronics room ( 210 ) protrudes. Control device according to claim 6, characterized in that between the carrier element ( 310 ) and the housing ( 200 ) a seal ( 280 ) is arranged such that the electronics compartment ( 210 ) against an outdoor space ( 202 ) of the housing ( 200 ) is sealed medium-tight. Control device according to one of claims 1 to 7, characterized in that the plug element ( 300 ) on the housing ( 200 ) Is determined by a non-positive connection or a positive connection or a material connection. Control device according to one of claims 7 or 8, characterized in that the seal ( 280 ) as a circumferential seal ( 280 ) of larger diameter than the diameter of the opening ( 220 ) is trained. Control device according to one of claims 1 to 9, characterized in that the carrier element ( 310 ) made of a thermoplastic material or of a thermoplastic material with a share of more than 25 Vol%, in particular with a share of more than 35 Vol%, inorganic fillers, in particular glass fibers exists. Control device according to one of claims 1 to 10, characterized in that the potting compound consists of a thermosetting plastic based on epoxy resin or of a silicone elastomer or of a rubber. Plug element for use in a control device according to one of claims 1 to 11 with a carrier element ( 310 ), wherein the carrier element ( 310 ) a first page ( 312 ) and a second page ( 314 ), wherein the plug element ( 300 ) at least one electrical line ( 320 ), which from the first side ( 312 ) to the second page ( 314 ) of the carrier element ( 310 ) is passed, wherein a casting compound ( 380 ) on the carrier element ( 310 ) is arranged such that the potting compound ( 380 ) the at least one electrical line ( 320 ) at a longitudinal section ( 322 ) of the electrical line ( 320 ) completely surrounds, wherein the support element ( 310 ) is made of a first material having a first thermal expansion coefficient (CTE1), wherein the at least one electrical line ( 320 ) is made of a second material having a second coefficient of thermal expansion (CTE2), the potting compound ( 380 ) is made of a third material having a third coefficient of thermal expansion (CTE3), characterized in that the second material and the third material are selected such that the second thermal expansion coefficient (CTE2) and the third thermal expansion coefficient (CTE3) in one interval between 13ppm / K and 30ppm / K and in particular at an interval between 17ppm / K and 24ppm / K and that the first material is selected so that the first thermal expansion coefficient (CTE1) is at least in two spatial directions at an interval between 13ppm / K and 30ppm / K and in particular in an interval between 17ppm / K and 24ppm / K.

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