DE102013009444A1 - Substrate and / or component for the protection of at least one bonding wire - Google Patents

Substrate and / or component for the protection of at least one bonding wire Download PDF

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Publication number
DE102013009444A1
DE102013009444A1 DE102013009444.5A DE102013009444A DE102013009444A1 DE 102013009444 A1 DE102013009444 A1 DE 102013009444A1 DE 102013009444 A DE102013009444 A DE 102013009444A DE 102013009444 A1 DE102013009444 A1 DE 102013009444A1
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Prior art keywords
substrate
component
sensors
depressions
components
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DE102013009444.5A
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German (de)
Inventor
Stephan Karl
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Ams Sensors Germany GmbH
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Jenoptik Polymer Systems GmbH
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Priority to DE202013012118.1U priority Critical patent/DE202013012118U1/en
Priority to DE102013009444.5A priority patent/DE102013009444A1/en
Publication of DE102013009444A1 publication Critical patent/DE102013009444A1/en
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding

Abstract

Die Erfindung betrifft ein Substrat und/oder mindestens ein Bauteil, welches solche Vertiefungen (11; 21; 31; 41) enthält, die so direkt eingearbeitet und angeordnet sowie dimensioniert sind, dass die Bonddrähte darin vollständig versenkbar sind bzw. aufgenommen werden können. Das Bauteil ist insbesondere ein optisches Bauteil, wie eine Linse, oder kann auch ein Abdeckelement, insbesondere aus Glas sein, dass ausgestellte Vertiefungen an den Positionen der Bonddrähte (12; 22; 32; 42), enthält. Die entsprechenden Vertiefungen können flexibel mit der Herstellung des Substrats und/oder Bauteils eingebracht sein oder nachträglich durch bekannte Methoden wie Spritzguss, Wafersägen, Prägen, Lasern, in verschiedenen Formen eingebracht werden. Das Substrat bzw. Bauteil findet insbesondere bei kleinstdimensionierten Halbleiterbauteile, wie Bildsensoren, Zeilensensoren, LED's, Photodioden, Drucksensoren, Oberflächen-Scan-Sensoren Verwendung.The invention relates to a substrate and / or at least one component which contains such depressions (11; 21; 31; 41) which are incorporated and arranged and dimensioned so directly that the bond wires can be completely sunk or received therein. The component is, in particular, an optical component, such as a lens, or can also be a cover element, in particular made of glass, that contains flared depressions at the positions of the bond wires (12; 22; 32; 42). The corresponding depressions can be introduced flexibly with the production of the substrate and / or component or can be introduced subsequently in various forms by known methods such as injection molding, wafer sawing, embossing, lasers. The substrate or component is used in particular in the case of very small semiconductor components, such as image sensors, line sensors, LEDs, photodiodes, pressure sensors and surface scan sensors.

Description

Die vorliegende Erfindung betrifft mindestens ein Substrat und/oder ein optisches Bauteil, in welchem zum Zweck des Schutzes von mindestens einem Bonddraht vor mechanischem Materialstress und Beschädigungen erfindungsgemäße Vertiefungen eingearbeitet sind.The present invention relates to at least one substrate and / or an optical component in which recesses according to the invention are incorporated for the purpose of protecting at least one bonding wire from mechanical stress and damage.

Das Drahtbonden bezeichnet in der Aufbau- und Verbindungstechnik einen Verfahrensschritt, bei dem mittels dünner Drähte (Bonddraht) die Anschlüsse eines integrierten Schaltkreises oder eines diskreten Halbleiters (z. B. Transistor, Leuchtdiode oder Photodiode) mit den elektrischen Anschlüssen des Chipgehäuses verbunden werden. Der Vorgang der Draht-Kontaktierung wird als Drahtbonden bezeichnet. Das Drahtbonden wird aber auch in der Hybridtechnik, als auch bei diskreten Bauteilen angewandt. Bei elektronischen Schaltkreisen sind zum Beispiel die außen sichtbaren Anschlüsse über Bonddrähte im Innern des Gehäuses mit den Chip-Anschlüssen verbunden. Die Aufgabe des Bonddrahtes ist die elektrische Verbindung zwischen der eigentlichen integrierten Schaltung bzw. dem nackten Bauteil und dem Verdrahtungsträger (mechanischer Träger auf dem Leitungsstrukturen zur Verdrahtung elektronischer Bauelemente aufgebracht sind; Leiterplatten oder auch unbestückte Multi-Chip-Module). Der Bonddraht wird von der Anschlussfläche z. B. eines Chips zum inneren Teil des Anschlussbeins gezogen und an beiden Stellen verschweißt. Nach dem Drahtbonden werden die Bauteile verkappt, das heißt, hermetisch in einem Gehäuse eingeschlossen oder in Kunststoffe bzw. Kunstharz eingegossen. Die beiden Verfahrensschritte werden als Zyklus 2 oder „Backend” der Halbleiterfertigung bezeichnet. Es werden hauptsächlich die beiden Verfahren Thermosonicbonden und Ultrasonicbonden angewendet. Die Bondtechnologie hat ihre Bedeutung im gesamten Bereich der mikroelektronischen Aufbau- und Verbindungstechnik, beim Verbinden von Leuchtdioden, der Leuchtdiodenanordnung, bei Photodioden, bei Sensoreinrichtungen, wie beispielsweise Drucksensoren, Bildsensoren oder Zeilensensoren. Die Bonddrähte sind aus Materialien wie zum Beispiel Gold, Aluminium, Kupfer und sind gegebenenfalls auch Aluminium beschichtete Kupfer- und Golddrähte. Um diese Halbleiterbauteile insbesondere vor mechanischem Stress und Beschädigungen zu schützen, werden die Bauteile verkappt, das heilt thermetisch in einem Gehäuse eingeschlossen oder in Plaste bzw. Kunstharz eingegossen. Um Beschädigungen zu vermeiden werden auch Abstandselemente verwendet, die zwischen die Bauteile geklebt oder in geeigneter Weise eingebunden werden, damit eine hermetische Abdichtung gewährleistet wird. Die bekannten Lösungen durch Direktaufkleben oder mit Abstandselementen erfüllen jedoch allesamt nicht die Erfordernisse, um die Forderungen in immer kleiner und leichter werdenden Bauteilen, wie z. B. für Bildsensoren, Oberflächen-Scan-Sensoren für kleinste Chipoberflächen zu realisieren.In the construction and connection technique, wire bonding designates a method step in which the terminals of an integrated circuit or of a discrete semiconductor (eg transistor, light-emitting diode or photodiode) are connected to the electrical connections of the chip housing by means of thin wires (bonding wire). The process of wire bonding is called wire bonding. However, wire bonding is also used in hybrid technology as well as in discrete components. In electronic circuits, for example, the externally visible terminals are connected via bonding wires inside the housing to the chip terminals. The task of the bonding wire is the electrical connection between the actual integrated circuit or the bare component and the wiring carrier (mechanical support on which conductive structures for wiring electronic components are applied, printed circuit boards or even unpopulated multi-chip modules). The bonding wire is z of the pad. B. a chip pulled to the inner part of the connecting leg and welded in two places. After wire bonding, the components are capped, that is hermetically sealed in a housing or molded into plastics or synthetic resin. The two process steps are referred to as cycle 2 or "backend" of semiconductor manufacturing. The two methods thermosonic bonding and ultrasonic bonding are mainly used. Bonding technology has significance in the entire field of microelectronic assembly and connection technology, in the connection of light-emitting diodes, in the light-emitting diode arrangement, in photodiodes, in sensor devices, such as, for example, pressure sensors, image sensors or line sensors. The bonding wires are made of materials such as gold, aluminum, copper and are optionally also aluminum coated copper and gold wires. In order to protect these semiconductor components in particular from mechanical stress and damage, the components are capped, which heals thermally enclosed in a housing or cast in plastic or plastic. In order to avoid damage, spacers are also used which are glued between the components or suitably bound in order to ensure a hermetic seal. However, the known solutions by Direktaufkleben or with spacers do not meet all the requirements to meet the demands in ever smaller and lighter components, such. As for image sensors to realize surface scan sensors for the smallest chip surfaces.

Aufgabe der Erfindung ist es also, eine einfache und kostengünstige Lösung zu finden, um Bonddrähte (12; 22; 32; 42), inklusive deren Beschichtungen, so hermetisch abzudecken, dass Beschädigungen nicht möglich sind. Insbesondere soll diese Lösung bei optischen Bauteilen aus Materialien wie z. B. Glas, Kunststoff, Keramik Verwendung finden können und für kleinste Bauelemente und Bauteile geeignet sein.The object of the invention is thus to find a simple and cost-effective solution for bonding wires ( 12 ; 22 ; 32 ; 42 ), including their coatings, so hermetically cover that damage is not possible. In particular, this solution is in optical components made of materials such. As glass, plastic, ceramic can be used and suitable for the smallest components and components.

Die Aufgabe der Erfindung wird durch ein Substrat und/oder Bauteil realisiert, welches solche Vertiefungen (11; 21; 31; 41) enthält, die so direkt in dem optischen Bauteil eingearbeitet und angeordnet sowie dimensioniert sind, dass die Bonddrähte darin vollständig versenkbar sind bzw. aufgenommen werden können. Das Bauteil ist insbesondere ein optisches Bauteil, wie eine Linse, oder kann auch ein Abdeckelement, insbesondere aus Glas sein, dass ausgestellte Vertiefungen an den Positionen der Bonddrähte (12; 22; 32; 42), enthält. Die entsprechenden Vertiefungen sind so bemessen, dass sie ausreichend und platzsparend die zu schützenden Bonddrähte aufnehmen können. Hierbei sind erfindungsgemäß die Vertiefungen in ein Substrat (optisches Bauteil; Glasabdeckelement oder ähnliches) bereits mit der Herstellung eingearbeitet. Die Vertiefungen können je nach Bedarf und Verwendung flächenhaft oder auch punktuell, in geeigneter Form (rund; eckig; glockenförmig) sein. Die Vertiefungen können aber auch nach der Herstellung auf an sich bekannte Weise eingebracht werden. Das Substrat dient zum Schutz, als hermetische Abdeckung und/oder als optisches Element der Halbleiterbauteile (alle Halbleiter wie z. B. Bildsensoren, Zeilensensoren, LED's, Photodioden, Drucksensoren usw.). Die Vertiefung im Substrat bzw. dem optischen Element kann mittels unterschiedlichsten gebräuchlichen Technologien realisiert werden (z. B. Spritzguss, Wafersägen, Prägen, Lasern, usw.) und ist somit abstimmbar für die jeweilige Anwendung. Die Vertiefungen können auch in Form von Nuten entlang mindestens einer Linie eingebracht bzw. angeordnet sein, die somit beispielsweise auch mehrere in Reihe befindlicher Bonddrähte in einer Matrix von Halbleiterbauteilen abdecken können. Die Vertiefung/en kann/können je nach Ausführungen sowohl direkt in einer Optik eingearbeitet sein, oder können sich auch in einer zwischen der Optik und dem Leiterplattenelement oder Chip oder Sensor eingebrachten Glasabdeckung (20; 30) befinden. Siehe hierzu die Beispielausführungen in 2 und 3.The object of the invention is realized by a substrate and / or component which has such depressions ( 11 ; 21 ; 31 ; 41 ), which are incorporated and arranged so directly in the optical component and dimensioned that the bonding wires are completely retractable therein or can be recorded. The component is, in particular, an optical component, such as a lens, or may also be a cover element, in particular made of glass, in that recessed depressions are provided at the positions of the bonding wires ( 12 ; 22 ; 32 ; 42 ) contains. The corresponding recesses are dimensioned so that they can accommodate sufficient and space-saving to be protected bonding wires. Here, according to the invention, the depressions in a substrate (optical component, glass cover element or the like) have already been incorporated with the production. Depending on requirements and use, the depressions may be planar or also punctiform, in a suitable shape (round, angular, bell-shaped). However, the depressions can also be introduced after production in a manner known per se. The substrate serves for protection, as a hermetic cover and / or as an optical element of the semiconductor devices (all semiconductors such as image sensors, line sensors, LEDs, photodiodes, pressure sensors, etc.). The recess in the substrate or the optical element can be realized by means of various common technologies (eg injection molding, wafer sawing, embossing, lasers, etc.) and is thus tunable for the respective application. The depressions can also be introduced or arranged in the form of grooves along at least one line, which can therefore also cover, for example, a plurality of bonding wires arranged in series in a matrix of semiconductor components. Depending on the embodiments, the depression (s) can be incorporated directly into an optic, or can also be incorporated in a glass cover (shown in FIG. 2) between the optics and the printed circuit board element or chip or sensor. 20 ; 30 ) are located. See the example executions in 2 and 3 ,

In den Ausführungsbeispielen der 1–4 sind unterschiedliche Anwendungen dargestellt.In the embodiments of the 1 - 4 different applications are shown.

Bezugszeichen:Reference numerals:

In den Zeichnungen (1–4) sind wie folgt fürIn the drawings ( 1 - 4 ) are as follows for

BezugszeichenlisteLIST OF REFERENCE NUMBERS

10; 4010; 40
Optik (z. B. Linse)Optics (eg lens)
11; 21; 31; 4111; 21; 31; 41
Vertiefung/enDeepening / s
12; 22, 32; 4212; 22, 32; 42
Bonddrahtbonding wire
13; 23; 33; 4313; 23; 33; 43
Leiterplattecircuit board
14; 24;14; 24;
Chipchip
15; 25; 35; 4615; 25; 35; 46
Trägerplattesupport plate
20; 3020; 30
Glasabdeckungglass cover
3434
Drucksensorpressure sensor
4444
Bildsensorimage sensor
4545
Abstandhalterspacer

Ein weiterer Vorteil der Erfindung ist, dass keine zusätzliche Wärme zugeführt wird muss, die bei eine Verkappung durch das Eingiessen entsteht.Another advantage of the invention is that no additional heat must be supplied, which results from capping by the pouring.

In 1 ist in beispielhafter Ausführung eine Anordnung dargestellt, bei der die Bonddrähte (12), die die Leiterplatte (13) mit einem Chip (14) verbinden, direkt durch eine Optik in Form einer Linse abgedeckt und/oder hermetisch verschlossen wird, bei der an den Positionen direkt über den Bonddrähten eckige Vertiefungen eingearbeitet sind, die im Fall einer Kunststofflinse bereits im Spritzgussherstellungsprozess so gefertigt wurden. Dies ermöglicht eine sehr genaue und angepasste Minimierung des Substrats sowie eine genaue Abstandsregulierung.In 1 is an exemplary embodiment of an arrangement shown in which the bonding wires ( 12 ), the printed circuit board ( 13 ) with a chip ( 14 ), directly covered by an optic in the form of a lens and / or hermetically sealed, in which at the positions directly above the bonding wires angular recesses are incorporated, which were already made in the case of a plastic lens in the injection molding production process. This allows a very accurate and customized minimization of the substrate as well as accurate pitch regulation.

Aus 2 ist eine Ausführung zu entnehmen, bei der mindestens eine geeignete Glasabdeckung (20) mit entsprechenden Vertiefungen an den Positionen der Bonddrähte (22) für eine hermetische und/oder geschützte Abdeckung sorgt. Über der Glasabdeckung kann/können z. B. die entsprechende/n Optik/en (in 2 nicht dargestellt) positioniert werden. 3 zeigt ein Beispiel bei dem ein Drucksensor (34) entsprechend der Anordnung in 2 verdrahtet ist. Aus 4 ist eine Anordnung zu entnehmen, bei der in eine Optik (40) durch geformte kegelartige bzw. glockenartige Vertiefungen der Schutz optimal gewährleistet wird und zugleich ein Optimum an Materialbearbeitung realisierbar ist. Zusätzlich zeigt 4 eine Ausführung, bei der in kombinierter Weise so genannte Abstandshalter (45) zwischen einer Trägerplatte (46) und der Leiterplatte (43) eingebracht sind, die es ermöglichen flexible Aufbauten bei unterschiedlichen Halbleiterbauteilen und/oder Hybridbauteilen auch modul- bzw. systemartig zu realisieren und gegebenenfalls auszugleichen. Es versteht sich, dass die dargestellten Ausführungen in den 1 bis 4 nicht allein, sondern auch in Kombination ihrer Ausführungen anwendbar sind und von der Erfindung erfasst werden. Gegenstand der Erfindung sind auch alle Halbleiterbauteile, wie z. B. Bildsensoren, Zeilensensoren, LED's, Photodioden, Drucksensoren, Leiterplatten usw., bei denen derartige Optiken oder Glaselemente zum Schutz der Bonddrähte eingearbeitet sind, enthalten.Out 2 an embodiment is to be taken in which at least one suitable glass cover ( 20 ) with corresponding recesses at the positions of the bonding wires ( 22 ) provides hermetic and / or protected coverage. About the glass cover can / z. For example, the corresponding optics (in 2 not shown) are positioned. 3 shows an example in which a pressure sensor ( 34 ) according to the arrangement in 2 wired. Out 4 an arrangement can be seen in which in an optic ( 40 ) is optimally ensured by shaped conical or bell-shaped depressions, the protection and at the same time an optimum material processing is feasible. Additionally shows 4 an embodiment in which so-called spacers ( 45 ) between a carrier plate ( 46 ) and the printed circuit board ( 43 ) are introduced, which make it possible to realize flexible structures in different semiconductor devices and / or hybrid components also module or system-like and possibly compensate. It is understood that the illustrated embodiments in the 1 to 4 not only, but also in combination of their embodiments are applicable and are covered by the invention. The invention also provides all semiconductor components, such as. As image sensors, line sensors, LEDs, photodiodes, pressure sensors, circuit boards, etc., in which such optics or glass elements are incorporated to protect the bonding wires included.

Claims (8)

Substrat und/oder Bauteil, insbesondere für Halbleiterbauteile, welche zum Schutz von mindestens einem Bonddraht Vertiefungen (11; 21; 31; 41) enthält, die so direkt in dem Substrat oder Bauteil eingearbeitet und angeordnet sowie dimensioniert sind, dass die Bonddrähte darin vollständig aufgenommen werden können.Substrate and / or component, in particular for semiconductor components, which for the protection of at least one bonding wire depressions ( 11 ; 21 ; 31 ; 41 ), which are incorporated and arranged and dimensioned so directly in the substrate or component that the bonding wires can be completely absorbed therein. Substrat und/oder Bauteil nach Anspruch 1, dadurch gekennzeichnet, dass es ein optisches Bauteil, wie eine Linse, oder ein Abdeckelement, insbesondere aus Glas, ist.Substrate and / or component according to claim 1, characterized in that it is an optical component, such as a lens, or a cover member, in particular made of glass. Substrat und/oder Bauteil nach Anspruch 1 und/oder 2, dadurch gekennzeichnet, dass die Vertiefungen bereits mit der Herstellung des Substrats oder Bauteils enthalten sind, dass sie flächenhaft und/oder punktuell, in geeigneten Formen, wie rund, eckig, kegelartig und/oder glockenförmig sind.Substrate and / or component according to claim 1 and / or 2, characterized in that the recesses are already included in the production of the substrate or component, that they planar and / or punctiform, in suitable shapes, such as round, angular, conical and / or bell-shaped. Substrat und/oder Bauteil nach mindestens einem vorherigen Anspruch, dadurch gekennzeichnet, dass die Vertiefungen in Form von Nuten entlang mindestens einer Linie angeordnet sein, und somit mehrere in Reihe befindlicher Bonddrähte aufnehmen können.Substrate and / or component according to at least one preceding claim, characterized in that the recesses can be arranged in the form of grooves along at least one line, and thus can accommodate a plurality of bonding wires located in series. Substrat und/oder Bauteil nach mindestens einem vorherigen Anspruch, dadurch gekennzeichnet, dass die Vertiefungen matrixartig angeordnet sind.Substrate and / or component according to at least one previous claim, characterized in that the recesses are arranged in a matrix. Halbleiterbauteile, in deren Aufbau optische Bauteile und/oder Abdeckelemente enthalten sind, die solche Vertiefungen enthalten, die ausreichend sind, um Bonddrähte hermetisch und/oder vor Beschädigungen zu schützen.Semiconductor devices, in the construction of which optical components and / or cover elements are included, which contain such depressions, which are sufficient to hermetically and / or protect the bonding wires from damage. Halbleiterbauteile nach Anspruch 6, dadurch gekennzeichnet, dass sie flexible Abstandshalter zwischen einer Trägerplatte und einer Leiterplatte enthalten, die es ermöglichen modulartig optische Bauteile und/oder Abdeckelemente zu verbinden und auszugleichen.Semiconductor devices according to claim 6, characterized in that they comprise flexible spacer between a support plate and a printed circuit board, which enable a modular manner, optical components and / or cover elements to be connected and to compensate. Halbleiterbauteile nach den Ansprüchen 6 und/oder 7, dadurch gekennzeichnet, dass die Halbleiterbauteile Bildsensoren, Zeilensensoren, LED's, Photodioden, Drucksensoren, Oberflächen-Scan-Sensoren sind.Semiconductor components according to claims 6 and / or 7, characterized in that the semiconductor components are image sensors, line sensors, LEDs, photodiodes, pressure sensors, surface scan sensors.
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