DE102012111755A1 - Housing for power electronics component installed in motor vehicle, has support and cooling structure that is provided with several cooling channels via which coolant is allowed to flow - Google Patents
Housing for power electronics component installed in motor vehicle, has support and cooling structure that is provided with several cooling channels via which coolant is allowed to flow Download PDFInfo
- Publication number
- DE102012111755A1 DE102012111755A1 DE201210111755 DE102012111755A DE102012111755A1 DE 102012111755 A1 DE102012111755 A1 DE 102012111755A1 DE 201210111755 DE201210111755 DE 201210111755 DE 102012111755 A DE102012111755 A DE 102012111755A DE 102012111755 A1 DE102012111755 A1 DE 102012111755A1
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- Germany
- Prior art keywords
- power electronics
- electronics housing
- cooling
- motor vehicle
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Abstract
Description
Die Erfindung betrifft ein Leistungselektronikgehäuse mit integrierten Kühlkanälen, die von einem Kühlmittel durchströmt werden. Die Erfindung betrifft des Weiteren ein Kraftfahrzeug mit einer Leistungselektronik, die in einem vorab beschriebenen Leistungselektronikgehäuse angeordnet ist. The invention relates to a power electronics housing with integrated cooling channels, which are flowed through by a coolant. The invention further relates to a motor vehicle with a power electronics, which is arranged in a power electronics housing described above.
Aus der amerikanischen Offenlegungsschrift
Aufgabe der Erfindung ist es, die Kühlung einer Leistungselektronik in einem Kraftfahrzeug zu vereinfachen und/oder zu verbessern. The object of the invention is to simplify the cooling of a power electronics in a motor vehicle and / or to improve.
Die Aufgabe ist bei einem Leistungselektronikgehäuse mit integrierten Kühlkanälen, die von einem Kühlmittel durchströmt werden, dadurch gelöst, dass das Leistungselektronikgehäuse, zumindest bereichsweise, eine Trag- und Kühlstruktur mit einer Vielzahl von Kühlkanälen aufweist. Gemäß einem wesentlichen Aspekt der Erfindung sind in der Trag- und Kühlstruktur des Leistungselektronikgehäuses eine Tragfunktion mit einer Kühlfunktion kombiniert. Dabei wird bewusst in Kauf genommen, dass das Leistungselektronikgehäuse mit der erfindungsgemäßen Trag- und Kühlstruktur gegebenenfalls eine größere Wanddicke aufweist als ein herkömmliches Elektronikgehäuse mit einer massiven Wandung. Bei dem Kühlmittel handelt es sich vorzugsweise um Kühlluft. The object is achieved in a power electronics housing with integrated cooling channels, which are flowed through by a coolant, characterized in that the power electronics housing, at least partially, a support and cooling structure having a plurality of cooling channels. According to one essential aspect of the invention, a support function with a cooling function are combined in the support and cooling structure of the power electronics housing. It is deliberately accepted that the power electronics housing with the supporting and cooling structure according to the invention optionally has a greater wall thickness than a conventional electronics housing with a solid wall. The coolant is preferably cooling air.
Ein bevorzugtes Ausführungsbeispiel des Leistungselektronikgehäuses ist dadurch gekennzeichnet, dass die Trag- und Kühlstruktur als Wabenstruktur ausgeführt ist. Die Verwendung einer Wabenstruktur hat sich im Hinblick auf die kombinierte Trag- und Kühlfunktion der Trag- und Kühlstruktur als besonders vorteilhaft erwiesen. A preferred embodiment of the power electronics housing is characterized in that the support and cooling structure is designed as a honeycomb structure. The use of a honeycomb structure has proved to be particularly advantageous with regard to the combined support and cooling function of the supporting and cooling structure.
Ein weiteres bevorzugtes Ausführungsbeispiel des Leistungselektronikgehäuses ist dadurch gekennzeichnet, dass ein Großteil des Leistungselektronikgehäuses die Trag- und Kühlstruktur aufweist. Die erfindungsgemäße Trag- und Kühlstruktur ist besonders vorteilhaft in Bereichen des Leistungselektronikgehäuses angeordnet, die im Betrieb stark erhitzt werden. A further preferred embodiment of the power electronics housing is characterized in that a large part of the power electronics housing has the supporting and cooling structure. The support and cooling structure according to the invention is particularly advantageously arranged in areas of the power electronics housing, which are strongly heated during operation.
Ein weiteres bevorzugtes Ausführungsbeispiel des Leistungselektronikgehäuses ist dadurch gekennzeichnet, dass das komplette Leistungselektronikgehäuse die Trag- und Kühlstruktur aufweist. Dadurch wird die Herstellung des Leistungselektronikgehäuses erheblich vereinfacht. Another preferred embodiment of the power electronics housing is characterized in that the complete power electronics housing has the supporting and cooling structure. As a result, the production of the power electronics housing is considerably simplified.
Ein weiteres bevorzugtes Ausführungsbeispiel des Leistungselektronikgehäuses ist dadurch gekennzeichnet, dass die Kühlkanäle in der Trag- und Kühlstruktur parallel zueinander angeordnet sind. Dabei sind die Kühlkanäle vorteilhaft gleichmäßig voneinander beabstandet. A further preferred embodiment of the power electronics housing is characterized in that the cooling channels in the support and cooling structure are arranged parallel to each other. The cooling channels are advantageously evenly spaced from each other.
Ein weiteres bevorzugtes Ausführungsbeispiel des Leistungselektronikgehäuses ist dadurch gekennzeichnet, dass sich die Kühlkanäle geradlinig von einer ersten Stirnseite zu einer zweiten Stirnseite des Leistungselektronikgehäuses erstrecken. Dadurch wird das Zuführen und Abführen von Kühlmittel, insbesondere Kühlluft, vereinfacht. A further preferred embodiment of the power electronics housing is characterized in that the cooling channels extend in a straight line from a first end side to a second end side of the power electronics housing. This simplifies the supply and removal of coolant, in particular cooling air.
Ein weiteres bevorzugtes Ausführungsbeispiel des Leistungselektronikgehäuses ist dadurch gekennzeichnet, dass die Kühlkanäle als Kühlluftkanäle ausgeführt sind. Zur Kühlung des Leistungselektronikgehäuses kann besonders vorteilhaft der Fahrtwind im Betrieb eines mit dem Leistungselektronikgehäuse ausgestatteten Kraftfahrzeugs verwendet werden. Another preferred embodiment of the power electronics housing is characterized in that the cooling channels are designed as cooling air channels. For cooling the power electronics housing, the airstream can be used particularly advantageously during operation of a motor vehicle equipped with the power electronics housing.
Die Erfindung betrifft des Weiteren ein Kraftfahrzeug mit einer Leistungselektronik, die in einem vorab beschriebenen Leistungselektronikgehäuse angeordnet ist. Bei dem Kraftfahrzeug handelt es sich vorzugsweise um ein elektrisch angetriebenes Kraftfahrzeug, insbesondere ein Elektrofahrzeug. Das elektrisch angetriebene Kraftfahrzeug umfasst einen elektrischen Energiespeicher, beispielsweise eine Hochleistungsbatterie, und wenigstens eine Elektromaschine, um das Kraftfahrzeug anzutreiben. Die Leistungselektronik in dem Leistungselektronikgehäuse umfasst eine Mehrzahl elektronischer Baugruppen, die dazu dienen, aus einer Gleichspannung des elektrischen Energiespeichers eine zum Betrieb der Elektromaschine geeignete Wechselspannung zu erzeugen. Im Betrieb der Leistungselektronik entsteht relativ viel Wärme, deren Abfuhr durch das erfindungsgemäße Leistungselektronikgehäuse vereinfacht wird. Dabei kann insbesondere auf eine ansonsten erforderliche relativ aufwendige Wasserkühlung verzichtet werden. The invention further relates to a motor vehicle with a power electronics, which is arranged in a power electronics housing described above. The motor vehicle is preferably an electrically driven motor vehicle, in particular an electric vehicle. The electrically driven motor vehicle comprises an electrical energy store, for example a high-performance battery, and at least one electric machine in order to drive the motor vehicle. The power electronics in the power electronics housing comprises a plurality of electronic modules, which serve to generate from a DC voltage of the electrical energy storage a suitable for operation of the electric machine AC voltage. During operation of the power electronics, a relatively large amount of heat is generated, the dissipation of which is simplified by the power electronics housing according to the invention. In particular, an otherwise required relatively expensive water cooling can be dispensed with.
Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung, in der unter Bezugnahme auf die Zeichnung verschiedene Ausführungsbeispiele im Einzelnen beschrieben sind. Further advantages, features and details of the invention will become apparent from the following description, with reference to the drawing various embodiments are described in detail.
In der einzigen beiliegenden Figur ist ein erfindungsgemäßes Leistungselektronikgehäuse stark vereinfacht dargestellt. In der beiliegenden Figur ist ein Leistungselektronikgehäuse
In der deutschen Offenlegungsschrift
Das Leistungselektronikgehäuse
In einem Bereich
Die Kühlkanäle
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- US 5253613 A [0002] US 5253613 A [0002]
- US 2003/0067747 A1 [0002] US 2003/0067747 A1 [0002]
- US 2007/0000231 A1 [0002] US 2007/0000231 A1 [0002]
- US 2009/0016021 A1 [0002] US 2009/0016021 A1 [0002]
- DE 102010007633 A1 [0014] DE 102010007633 A1 [0014]
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210111755 DE102012111755A1 (en) | 2012-12-04 | 2012-12-04 | Housing for power electronics component installed in motor vehicle, has support and cooling structure that is provided with several cooling channels via which coolant is allowed to flow |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210111755 DE102012111755A1 (en) | 2012-12-04 | 2012-12-04 | Housing for power electronics component installed in motor vehicle, has support and cooling structure that is provided with several cooling channels via which coolant is allowed to flow |
Publications (1)
Publication Number | Publication Date |
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DE102012111755A1 true DE102012111755A1 (en) | 2014-06-05 |
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DE201210111755 Pending DE102012111755A1 (en) | 2012-12-04 | 2012-12-04 | Housing for power electronics component installed in motor vehicle, has support and cooling structure that is provided with several cooling channels via which coolant is allowed to flow |
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Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2976806A (en) * | 1958-03-05 | 1961-03-28 | Gen Dynamics Corp | Missile structure |
DE2813682A1 (en) * | 1978-03-30 | 1979-04-19 | Fraunhofer Ges Forschung | Protective cabinet for electronic circuits - has inbuilt air-air heat exchanger distributed around rear and side walls to reduce pressure loss |
DD146221A1 (en) * | 1979-09-19 | 1981-01-28 | Peter Kurze | KÜHLKOERPERSYSTEM, ESPECIALLY FOR BUILDING ELEMENTS |
EP0112994A2 (en) * | 1983-01-03 | 1984-07-11 | Stephen Koo | Vapor proof housing assembly and system |
US4613931A (en) * | 1984-05-24 | 1986-09-23 | 501 Olympus Corporation | Portable fiberoptic light source for use in hazardous locations |
US4953058A (en) * | 1989-09-01 | 1990-08-28 | General Dynamics Corporation, Space Systems Div. | Modular segment adapted to provide a passively cooled housing for heat generating electronic modules |
US5253613A (en) | 1992-04-30 | 1993-10-19 | General Electric Company | High power AC traction inverter cooling |
DE19545448A1 (en) * | 1995-12-06 | 1997-06-12 | Abb Patent Gmbh | Multi-function housing for static converter of motor vehicle |
US20030067747A1 (en) | 2001-10-05 | 2003-04-10 | Honda Giken Kogyo Kabushiki Kaisha | Cooling structure for high tension electrical equipment |
DE102004033400A1 (en) * | 2003-07-10 | 2005-02-24 | Visteon Global Technologies, Inc., Dearborn | Microelectronics unit in cylindrical housing |
DE102005001148B3 (en) * | 2005-01-10 | 2006-05-18 | Siemens Ag | Electronic unit, has metal housing coupled to MOSFET operated with high frequency, where housing is arranged to metal plate over electrically-isolated isolation layer, and heat sink electrically connected with metal plate or housing |
US20070000231A1 (en) | 2005-07-04 | 2007-01-04 | Honda Motor Co., Ltd. | Cooling apparatus for vehicle electrical packaging unit |
DE202008000381U1 (en) * | 2008-01-10 | 2008-03-20 | Jon Power Manufacturing Co., Ltd. | Honeycomb heat sink |
US20090016021A1 (en) | 2007-07-13 | 2009-01-15 | Hyundai Motor Company | Cooling structure for high voltage electrical parts of hybrid electric vehicle |
DE102010007633A1 (en) | 2010-02-05 | 2011-08-11 | Dr. Ing. h.c. F. Porsche Aktiengesellschaft, 70435 | Vehicle with electric drive device |
US20110222239A1 (en) * | 2010-03-10 | 2011-09-15 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices, power modules, and vehicles incorporating the same |
-
2012
- 2012-12-04 DE DE201210111755 patent/DE102012111755A1/en active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2976806A (en) * | 1958-03-05 | 1961-03-28 | Gen Dynamics Corp | Missile structure |
DE2813682A1 (en) * | 1978-03-30 | 1979-04-19 | Fraunhofer Ges Forschung | Protective cabinet for electronic circuits - has inbuilt air-air heat exchanger distributed around rear and side walls to reduce pressure loss |
DD146221A1 (en) * | 1979-09-19 | 1981-01-28 | Peter Kurze | KÜHLKOERPERSYSTEM, ESPECIALLY FOR BUILDING ELEMENTS |
EP0112994A2 (en) * | 1983-01-03 | 1984-07-11 | Stephen Koo | Vapor proof housing assembly and system |
US4613931A (en) * | 1984-05-24 | 1986-09-23 | 501 Olympus Corporation | Portable fiberoptic light source for use in hazardous locations |
US4953058A (en) * | 1989-09-01 | 1990-08-28 | General Dynamics Corporation, Space Systems Div. | Modular segment adapted to provide a passively cooled housing for heat generating electronic modules |
US5253613A (en) | 1992-04-30 | 1993-10-19 | General Electric Company | High power AC traction inverter cooling |
DE19545448A1 (en) * | 1995-12-06 | 1997-06-12 | Abb Patent Gmbh | Multi-function housing for static converter of motor vehicle |
US20030067747A1 (en) | 2001-10-05 | 2003-04-10 | Honda Giken Kogyo Kabushiki Kaisha | Cooling structure for high tension electrical equipment |
DE102004033400A1 (en) * | 2003-07-10 | 2005-02-24 | Visteon Global Technologies, Inc., Dearborn | Microelectronics unit in cylindrical housing |
DE102005001148B3 (en) * | 2005-01-10 | 2006-05-18 | Siemens Ag | Electronic unit, has metal housing coupled to MOSFET operated with high frequency, where housing is arranged to metal plate over electrically-isolated isolation layer, and heat sink electrically connected with metal plate or housing |
US20070000231A1 (en) | 2005-07-04 | 2007-01-04 | Honda Motor Co., Ltd. | Cooling apparatus for vehicle electrical packaging unit |
US20090016021A1 (en) | 2007-07-13 | 2009-01-15 | Hyundai Motor Company | Cooling structure for high voltage electrical parts of hybrid electric vehicle |
DE202008000381U1 (en) * | 2008-01-10 | 2008-03-20 | Jon Power Manufacturing Co., Ltd. | Honeycomb heat sink |
DE102010007633A1 (en) | 2010-02-05 | 2011-08-11 | Dr. Ing. h.c. F. Porsche Aktiengesellschaft, 70435 | Vehicle with electric drive device |
US20110222239A1 (en) * | 2010-03-10 | 2011-09-15 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices, power modules, and vehicles incorporating the same |
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