DE102004011148B3 - Microphone esp. semiconductor capacitor microphone for use in mobile telephones and the like having space between chip and substrate in pressure communication with space between chip and cover - Google Patents

Abstract

The microphone has a microphone chip (21) with a membrane structure and a counter-structure (61). These structures form a microphone capacitor whose capacitance is variable dependent on the detected sound. The microphone also has a substrate (11) and a cover (1) with a region which allows sound through. The cover is connected to the substrate such that the microphone chip can be received in the space between the substrate and the cover. A sound insulator surrounds the sound letting region of the cover and is arranged between the chip and the cover. At least one fastening device is provided for fastening the chip to the substrate. This is formed such that a space between the chip and the substrate is in pressure communication with a space between the chip and the cover. Independent claims also cover a method of manufacturing such a microphone.

Description

The The present invention relates to a microphone and a method for making a microphone, and more particularly to semiconductor capacitor microphones.

always frequently be in technical devices, especially in portable devices such as cell phones, laptops and PDAs, microphones are used a conversion of an acoustic signal into an electrical signal carry out. The increasing miniaturization of devices such. Mobile phones, laptops, makes the request that the Components, such. For example, the microphones used there also be reduced in their dimensions, or implementation downstream of the acoustic signal into an electrical signal Signal processing units also in the microphone device to get integrated. Another driver of system integration is the increasing cost pressure on the devices and the included therein Components such. B. the microphones.

Additionally put the consumers in ever higher Scope especially to portable devices the requirement, these too to use in outdoor activities, which means that this and the components contained therein especially against environmental influences, such as z. As moisture, dust, etc., must be protected. simultaneously leads the increasing improvement of the processing of speech signals in the Microphones downstream facilities, such. B. digital signal processors, to that, too the characteristics of the microphones are to be improved, since the quality the voice transmission continues to increase.

The US Pat. No. 6,178,249 B1 shows a method to attach a micromechanical microphone to a substrate. The micro phon consists of a membrane and a counter electrode. The microphone is attached to the substrate with fasteners. An isolation ring is placed between the microphone and the substrate, with the counter electrode, the substrate and the isolation ring forming a back chamber.

The WO 02/45463-A2 shows microphones that are in a flip-chip mounting on a substrate are applied, and in which the adhesive for fixing the microphone chips at the same time for sound separation between a back volume of the microphone and a sound input or Acoustic Port is used.

adversely At this procedure, glue the to attach the IC at the same time to use for sound separation, is the complex testing of the arrangement and the critical requirements in manufacturing that the glue to form a soundproof barrier between the chip and the substrate and at the same time no glue on the membrane or in the air gap between the membrane and the counter-structure may reach what the Otherwise destroy the microphone immediately would.

The Application of the adhesive between substrate and microphone chip difficult an optical inspection and testing of the contacts between Microphone chip and substrate.

Also is the for the mounting of chips usually used adhesive or Underfiller only insufficiently suitable, the sound input and the back volume to be acoustically sealed from each other as it is only for attaching a chip is intended on a circuit board.

In addition is it is very difficult while the production of the introduction of adhesive in the region of the membrane and to prevent the counter structure. WO 02/45463 A2 teaches here the use of a protective ring or retaining ring between the Area in which the adhesive is applied, and the area of the Membrane and counter structure.

Further shows the company Sonion / Microtronics (www.sonion.com) in an application Note entitled "Introduction of Microphones ", revised on 2. 9. 2002, miniaturized microphones.

Of the present invention is based on the object, a microphone, which is easier to manufacture and test, and a method for Creating the microphone.

These The object is achieved by a microphone according to claim 1 and a method according to claim 12 solved.

The present invention provides a microphone having the following features: a microphone chip having a membrane structure and a counter-structure, wherein the membrane and the counter-structure form a microphone capacitor whose capacitance is variable depending on a detected sound; a lid having a sound transmissive area, the lid being connected to a substrate such that the microphone chip is received in a space between the lid and the substrate; a sound separation around the sound-transmitting area of the lid, the sound separation being arranged between the microphone chip and the lid; and at least one fastening device for fastening the Mi krophonchips on the substrate, wherein the at least one fastening means is formed so that a space between the microphone chip and the substrate communicates with a space between the microphone chip and the lid in terms of pressure.

Of the The present invention is based on the finding that the functions the attachment and the acoustic separation on two different Pages of the microphone chip are implemented, that is decoupled become.

A high microphone sensitivity is achieved by the microphone chip is attached to a substrate so that a space between the microphone chip and the substrate with a space between the microphone chip and the Lid communicates in terms of pressure, which immediately translates into a high back volume.

Of the Advantage of the invention is that this microphone easy to be finished. The decoupling of fastening device and Acoustic separation makes the use of a protective ring against the Penetration of adhesive into the area of the membrane or counterstructure obsolete.

Besides that is settled on one of the acoustic separation opposite side the attachment functionality, which brings with it the advantage that the fastening device so sound-permeable as possible can be designed, and thus no compromise between mechanical attachment and acoustic separation are.

The Decoupling of acoustic separation and mechanical fastening also increases the longevity of the microphone, because now for the acoustic separation materials can be used the above not porous for a long time become.

Also pulls this decoupling from mechanical attachment and acoustic Separation more flexibility in itself, as the material for The acoustic separation can now be adapted to the specific application can. It is therefore conceivable a very durable material for recording very loud noises in the microphone, while for noises from an average volume For example, an adhesive can be used.

One Another advantage of the decoupling of mechanical fastening and Acoustic separation is that the mechanical fasteners, if not at the same time used for acoustic separation are more easily accessible, which facilitates the electrical testing of the microphone.

The Separation of mechanical fastening and acoustic separation also facilitates the reflow soldering process, since now when heating the mechanical fastening no consideration on any materials for acoustic separation in the neighborhood needs to be taken to the mechanical fasteners.

preferred embodiments The present invention will be described below with reference to FIG the enclosed drawings closer explained. Show it:

1 a microphone according to an embodiment of the present invention;

2 a pressure communication between a space under the microphone chip and a space around the microphone chip;

3a a microphone chip according to an embodiment of the present invention;

3b a top view of the microphone chip of an embodiment according to the present invention;

3c a bottom view of the microphone chip according to the embodiment of the present invention;

4 an embodiment of a chip for signal processing;

5a a lid of a microphone according to an embodiment of the present invention;

5b a substrate according to an embodiment of the present invention; and

6a to 6e a method of manufacturing a microphone of an embodiment of the present invention.

1 shows a microphone according to an embodiment of the present invention. It includes a lid 1 , a substrate 11 , a microphone chip 21 , a Signalverarbei processing device 31 , a sound separation 41 and microphone chip mounts 91 , In the lid 1 there is a recess 151 which is soundproof and as a sound input 151 referred to as. The substrate 11 includes contacts 131 , a contact hole 141 and an adhesive layer 161 , The microphone chip 21 consists of a membrane carrier 51 , a counter structure 61 , an intermediate layer 71 , a membrane structure 81 and a membrane contact 171 , The signal processing beitungseinrichtung 31 includes a signal processing chip 101 , a signal processing chip attachment 111 and a glue 121 ,

The microphone chip 21 is about the microphone chip fixtures 91 , which are also used here for electrical contacting, on the substrate 11 attached. The signal processing chip 101 is about the signal processing chip mounts 111 with the substrate 11 mechanically and electrically connected. The mechanical connection between the signal processing chip 101 and the substrate 11 is through the glue 121 supported. This serves in particular the reliability of the electronics, especially against environmental influences such as humidity and temperature.

An overhead sound wave passes through the sound input 151 into the inside of the microphone. The sound separation 41 represents the acoustic separation of the microphone chip 21 , the lid 1 and the sound separation 41 formed space from the rest of the substrate 11 and the lid 1 safe space. The back volume of the microphone is thus isolated from the incoming sound waves. At the in 1 shown microphone corresponds to the back volume of a space through the lid 1 , the substrate 11 and the microphone chip 21 is formed and is in this embodiment of the order of the lid 1 and the substrate 11 formed housing volume.

The sound waves pass through the perforated counter structure 61 whose shape does not change under the influence of the varying sound pressure. The membrane structure 81 that with the counterstructure 61 forms a capacitor, however, in contrast to the counter-structure 61 deflected by the sound pressure. This changes the capacity of the counterstructure 61 and the membrane structure 81 formed capacitor. The membrane structure 81 is about the interlayer 71 with the membrane carrier 51 connected. At the same time the membrane contact 171 a conductive connection between the membrane structure 81 and one of the microphone chip mounts 91 ago. The signal processing device 31 asks about the contacts 131 and the microphone chip mounts 91 , which are designed to be electrically conductive, the capacity of the counterstructure 61 and the membrane structure 81 formed capacitor from.

In the signal processing chip 101 that's about the signal processing chip mounts 111 with the contacts 131 on the substrate 11 is electrically connected, then takes place a processing of the signal. The signal thus generated is via the contact holes 141 in the substrate 11 to the on the microphone chip 21 remote side of the substrate lying contacts 131 forwarded. These contacts 131 For example, they are mechanically and conductively connected to a circuit board. As a result, the signals to the microphone downstream circuits such. B. digital signal processors in mobile phones, which may for example also be mounted on the board forwarded.

at a preferred embodiment the sound separation or acoustic separation adjusted so that less as 50% of the sound energy from one room to a second adjacent room spread, even a value of less than 1% sound propagation is achieved. Typically, the sound separation by a material with the illustrated sound damping properties causes.

In this embodiment, the substrate comprises 11 even more contact holes and the microphone chip 21 a counter electrode contact and a substrate contact, but this is not shown in this figure.

2 explains how a in 1 from the microphone chip 21 , the microphone chip fixtures 91 and the substrate 11 formed room 175 for convenience in this application also as a space between the substrate 11 and the microphone chip 21 is communicated in terms of pressure with a further space, which in this application also simplifies the space between the microphone chip 21 and the lid 1 referred to as. This extra space between the microphone chip 21 and the lid 1 is strictly speaking from the sound separation 41 , the microphone chip 21 , the microphone chip fixtures 91 , the signal processing device 31 , the substrate 11 and the lid 1 , in an area where this is not due to the sound separation 41 is sealed, formed. The pressure exchange between these two spaces is through the pressure exchange streams 181 , which are both arrow-shaped, shown. This pressure exchange process is crucial to ensure that the sum of the volumes of the two rooms forms the back volume for the microphone, which has an advantageous effect on the sensitivity of the microphone.

The sensitivity of a microphone is determined by the ratio of capacitance change to sound pressure change. When the back volume of a microphone is completed, the diaphragm displacement creates a change in the back volume and thus a change in pressure in the space behind the membrane structure. This change in pressure counteracts the original sound pressure and limits the deflection of the membrane. To get a high sensitivity too Therefore, the relative change in pressure in the space behind the membrane must be kept low, which in turn can be achieved by a small relative volume change that can be achieved by a high back volume. For a large back volume, a volume change by a certain amount results in a smaller relative volume change than a small back volume. Therefore, a high back volume is a prerequisite for high sensitivity of a microphone.

3a - 3c show different views of the microphone chip 21 an embodiment according to the present invention. 3a shows the microphone chip 21 on average diagonal through 3b , Evident are the membrane carrier 51 , the counterstructure 61 , the intermediate layer 71 , the membrane structure 81 , the microphone chip fixtures 91 and the membrane contact 171 , The counterstructure 61 is relative to the membrane structure 81 made rigid, so that a sound wave coming from below the perforations in the counter-structure 61 happens without deflecting it, and this sound wave after hitting the membrane structure 81 leads to a deflection of this. By the deflection of the membrane structure 81 the electrical capacitance between the counterstructure changes 61 and the membrane structure 81 , It is between membrane 81 and counter electrode 61 a constant voltage is applied via a high-impedance load resistor, which is not shown here. This keeps the capacitor at a constant charge level. An acoustic signal leads to the vibrational deflection of the membrane 81 and thus the capacity change. This has an AC voltage result, which of the microphone chip 21 downstream circuit elements, such as here the signal processing device 31 , can be evaluated.

3b shows a view of the microphone chip according to an embodiment of the present invention, which in 3a shown from the side, from above. In this illustration, the membrane carrier 51 , the Microchipbefesti conditions 91 , the membrane structure 81 and the membrane contact 171 to recognize. The membrane contact 171 provides a conductive connection between the membrane structure 81 and a microphone chip attachment 91 ago. This can be done via the Mikrochonchipbefestigung 91 bottom right and the microphone chip mounting 91 bottom left, with the counterstructure 61 is conductively connected, when applying a DC voltage through the current, the changing capacitance can be determined. The substrate isolated from the electrodes is also attached 91 electrically connected.

3c shows the microphone chip 3a from underneath. You can see the counterstructure 61 with their perforations and the membrane carrier 51 , The necessary for the removal of a sacrificial layer perforations in the counter-structure 61 , are used advantageously in this embodiment, this counter-structure 61 as sound-permeable as possible, so that the sound unhindered on the membrane structure 81 can meet. An advantage of this arrangement, in which the sound first passes through the counter-structure before acting on the membrane structure 81 is that this is the deflectable membrane structure 81 , which is very sensitive mechanically, against environmental influences from the outside, such. As dust, dirt or moisture, is shielded, the counter-structure 61 significantly stiffer than the membrane structure 81 is what is achieved either by their greater thickness or their higher layer stress.

4 shows a signal processing chip from the microphone according to an embodiment of the present invention, which in 1 is shown. On the signal processing chip 101 are the signal processing chip mounts 111 upset with the contacts 131 on the substrate 11 mechanically and electrically conductively connected. This is the signal processing chip 101 on the substrate 11 attached and electrically connected to this.

5a shows the lid 1 of in 1 represented microphone according to an embodiment of the present invention. To recognize the recess 151 in the lid 1 , which is sound permeable and through the sound coming from above into the interior of the lid 1 enters.

In 5b is a detailed representation of the substrate 11 shown. The figure shows the substrate layer 12 , The contacts 131 , a signal processing chip contact 131 , a board contact 131b and the contact hole 141 , The signal processing chip 101 is yes with one of the signal processing chip mounts 111 at the signal processing chip contact 131 fixed. At the same time there is this signal processing chip contact 131 an electrically conductive connection. The signal processing chip contact 131 is over the contact hole 141 with the board contact 131b conductively connected. This board contact 131b in turn is electrically and mechanically connected to a board (not shown). This allows the microphone downstream circuit elements, the electrical signals from this, yes from the signal processing chip 101 be delivered, evaluate.

6a - 6e show a method of manufacturing a microphone according to an embodiment Example of the present invention. 6a shows a first step, providing the microphone chip 21 , on which already the Microchipchipbefestigungen 91 are applied, and providing the signal processing chip 101 to which the signal processing chip mounts 111 are applied. Both chips can now be gripped, for example with an SMD placement machine from the back and positioned on the substrate. Of course, any other manual or mechanical positioning of the chips 21 . 101 on the substrate 11 possible. An ensuing arrangement is in 6b shown.

Subsequently, a reflow soldering process is performed, so that the fastening devices 91 . 111 with the contacts 131 of the substrate 11 mechanically and electrically connected. Thereafter, a connection of the signal processing chip 101 or the signal processing chip mounts 111 to the substrate 11 by attaching the adhesive or underfiller 121 in the space between the signal processing chip 101 and the substrate 11 and reinforced in a certain area around this room. The contact between the signal processing chip 101 and the substrate 11 is now protected, for example against mechanical and moisture stress. Such a resulting arrangement is in 6c shown.

After that, on the membrane carrier 51 of the microphone chip 21 the sound seal 41 applied, wherein the soundproofing also alternatively on the inside of the lid 1 can be applied. The soundproofing 41 can be performed either as a sealing ring or sealing lip or in the form of a cured adhesive preferably silicone adhesive. The soundproofing 41 should provide sufficient mechanical decoupling between the microphone chip 21 and lid 1 to ensure. In a further manufacturing step, the adhesive layer 161 on the substrate 11 applied. The resulting arrangement is in 6d shown.

Subsequently, the lid 1 on the adhesive layer 161 , which are dedicated areas of the substrate 11 covered, attached. The resulting structure is in 6e shown.

This results in a housing interior, one from the lid 1 and substrate 11 formed housing, two acoustically separated spaces. A first room around the sound entrance 151 around, through the lid 1 , the sound separation 41 and the microphone chip 21 is limited. A second compartment of the housing interior includes the space that extends from the microphone chip 21 , the sound separation 41 , the lid 1 , the substrate 11 and the signal processing device 31 , which indeed come from the signal processing chip 101 , the signal processing chip mounts 111 and the glue 121 is formed. Both rooms are acoustically separated.

In the above embodiments, the sound separation 41 shown annular and can therefore also be referred to as a sealing ring. There are other geometric dimensions of sound separation 41 possible, as long as this between the lid 1 and the microphone chip 21 is attached and at an acoustic separation from the first room to the sound input 151 around, and the second room is involved.

Also the counter structure 61 and the membrane structure 81 of the microphone chip 21 are circular in the above embodiments and may have any geometric shape.

The number of fixtures 91 of the microphone chip 21 in the above embodiments is four, but any number greater than two is conceivable as long as the space under the microphone chip with the rest of the housing inside can communicate pressure. For stability reasons, the number of fastening devices is advantageously at least three. For contacting two conductive fasteners are needed. Should the attachment 91 have purely mechanical function, which could be implemented in another embodiment of a mounted microphone of the present invention, so only a mounting would be possible. In this case, the electrical connection of the microphone chip could 21 to the substrate 11 also via bonding wires or other conductor track elements. Also the number of fixtures 111 the signal processing chip on the substrate 11 can be chosen arbitrarily large.

The underfiller used as glue 121 can be any material that controls the mechanical connection between the signal processing chip 101 and the substrate 11 supports. The above embodiments use an adhesive to the sound separation 41 on the lid 1 to create. Alternatively, there are other ways of sound separation 41 on the lid 1 or on the microphone chip 21 to install, such. B. a survey in the lid 1 or a rubber ring or a rubber lip.

The fortifications 91 . 101 are preferably designed as a solder bumps, but other compounds of metallic or non-metallic material are conceivable as long as they produce a mechanical and conductive connection.

The manufacturing step of the reflow soldering used in the above embodiments may also be performed by any other manufacturing step, which is a mechanical connection of the microphone chip 21 and the signal processing chip 101 to the substrate 11 makes sure to be replaced.

The above exemplary embodiments show how, for example, silicon microphones, which are to be constructed in particular for mobile applications in SMD packages, can be implemented. In this case, acoustic, mechanical and electrical boundary conditions must be observed. At the same time, the component should be as small as possible, in particular flat, and withstand at least a temperature of 260 ° C. The above embodiments combine the flip-chip mounting by means of solder bumps 91 . 111 on PCB substrates with a back volume that allows sufficient sensitivity. There is no underfiller for this 121 around the microphone chip 21 attached so that the chip 21 like on Solder-Bump columns 91 open on the substrate 11 stands. The acoustic seal, however, takes place at the soundhole 151 of the lid 1 instead of. Hereby lowest construction heights can be achieved. Are feasible z. B. heights of 1 mm, and lateral dimensions, z. B. 4 mm to 3 mm, for example, a back volume of about 2 mm ^{3 is} achieved, which allows a fourfold higher sensitivity to an execution example of a microphone according to the prior art.

In addition, a component manufactured according to the above embodiments can ensure full temperature resistance. Particularly noteworthy is the sound coupling in the above embodiments. In the above embodiments, the microphone consists of the microphone chip 21 , the chip for signal processing 101 that as an amplifier chip 101 is executed, from the substrate 11 and from the lid 1 , On the microphone chip 21 are fastening devices 91 Applied, often as a solder bump 91 are executed. Often these are directly on the pads of the chip 21 applied. The substrate 11 can be metallized on two sides, such. As with a FR4 laminate or ceramic, and the connections 131 to the microphone can by means of vias 141 be led to the bottom on which the solder pads 131 of the microphone. The lid 1 can be designed as a plastic molding, or as a metal deep-drawn part also be made of laminate or ceramic. Its inner height corresponds to a sum of the thickness of the microphone chip 21 , the height of the bumps 91 and the amount of sound separation 41 which is often used as a sealing ring. A soundhole 151 , which serves as the sound input, is at the position of the microphone 21 appropriate. Thus, with such a structure lightweight components with a height of z. B. only 1.1 mm are produced.

In the above embodiments, the membrane is 81 freely accessible from the interior of the housing, whereby the entire housing volume serves as an acoustic back volume. The acoustic isolation to the outside takes over the sound separation 41 between lids 1 and microphone base, which is the top of the membrane carrier 51 equivalent.

A process flow for making a microphone in the above embodiments could be as follows: Both chips, both the microphone chip 21 as well as the signal processing chip 101 , be with solder bumps 91 . 111 Mistake. Using SMD placement machines, they can be gripped from the back and positioned on the substrate. Subsequently, a reflow soldering process takes place. Only the signal processing chip 101 becomes by underfiller 121 protected. The microphone chip 21 typically stays z. B. on four bumps 91 like standing on pillars. Subsequently, an adhesive for the lid 1 on the substrate 11 and for the acoustic seal 41 on the back of the microphone chip 21 around the soundhole 151 attached or dispensed. The glue should have sufficient mechanical decoupling between microphone 21 and lid 1 ensure what z. B. allows a silicone adhesive. The lid 1 is now put on and seals over the edge and the sound hole 151 around the microphone 2l in the volume. Finally, the adhesive is cured.

The acoustic seal 41 was realized in this process by means of adhesive. But it is also conceivable, a rubber ring or a rubber lip in the lid 1 to be provided when sticking to the microphone chip 21 seated. The above embodiments show a unidirectional microphone that can receive sound equally sensitively from all directions. But just as well could be produced with this construction technology a directional microphone. Then the substrate should be 11 be provided with a flow-damped sound hole, so that there is a phase shift, so that sound from the direction of the lid 1 is received unattenuated, and sound coming from the opposite direction is suppressed.

The flow-damped soundhole is preferably a hole in the substrate having a cross-sectional area smaller than the area the hole in the lid is, and preferably less than 50% of the cross-sectional area of the Hole in the lid is. The flow-damped hole can have any cross-section, so be of any size, if it is with a damping element is provided so that the acoustic attenuation of the hole in the lid is 50% smaller than the acoustic attenuation of the hole in the substrate.

1

cover

11

substratum

12

substrate layer

21

microphone chip

31

Signal processing device

41

sound isolation

51

membrane support

61

counter-structure

71

interlayer

81

membrane structure

91

Microphone chip mounting

101

Signal processing chip

111

Signal processing chip mounting

121

Glue

131

Contact

131

Signal processing chip contact

131b

platinum contact

141

contact hole

151

sound input

161

adhesive layer

171

membrane contact

181

Pressure exchange currents

Claims (12)

Microphone comprising: a microphone chip ( 21 ) with a membrane structure ( 81 ) and a counterstructure ( 61 ), wherein the membrane ( 81 ) and the counterstructure ( 61 ) form a microphone capacitor whose capacity is variable depending on a detected sound; a substrate ( 11 ); a lid ( 1 ) with a sound-transmitting area ( 151 ), the lid ( 1 ) with the substrate ( 11 ) is connected so that in a space between the lid ( 1 ) and the substrate ( 11 ) the microphone chip ( 21 ) is included; a sound separation ( 41 ) around the sound-transmitting area ( 151 ) of the lid ( 1 ), the sound separation ( 41 ) between the microphone chip ( 21 ) and the lid ( 1 ) is arranged; and at least one fastening device ( 91 ) for attaching the microphone chip ( 21 ) on the substrate ( 11 ), wherein the at least one fastening device ( 91 ) is formed so that a space between the microphone chip ( 21 ) and the substrate ( 11 ) with a space between the microphone chip ( 21 ) and the lid ( 1 ) communicates in terms of pressure. Microphone according to Claim 1, in which the at least one fastening device ( 91 ) has a solder bump. Microphone according to one of Claims 1 or 2, in which the substrate ( 11 ) Ladder structures ( 131 ) for contacting the microphone capacitor. Microphone according to Claim 3, in which the fastening devices ( 91 ) Have solder bumps and structures with the conductors ( 131 ) on the substrate ( 11 ) are connected to a conductive connection between the substrate ( 11 ) and the microphone chip ( 21 ). Microphone according to one of Claims 1 to 4, in which on the substrate ( 11 ) within the space between the lid ( 1 ) and the substrate ( 11 ) another signal processing chip ( 101 ) is mounted for processing signals generated by the condenser microphone. Microphone according to Claim 5, in which an adhesive ( 121 ) a mechanical connection between the substrate ( 11 ) and the signal processing chip ( 101 ). Microphone according to one of Claims 1 to 6, in which a modulus of elasticity of a sound separation material ( 41 ) 0.1% to 10% of the elastic modulus of one in the lid ( 1 ) used material. Microphone according to one of Claims 1 to 7, in which the microphone chip ( 21 ) and the substrate ( 11 ) exclusively through a plurality of solder bumps ( 91 ) are connected together as fastening devices, wherein the plurality of solder bumps ( 91 ) is dimensioned so that at least two solder bumps ( 91 ) are spaced from each other. Microphone according to one of Claims 1 to 8, in which the microphone chip ( 21 ) by the at least one fastening device ( 91 ) on the substrate ( 11 ), so that the counter-structure ( 61 ) the sound-transmitting area ( 151 ) of the lid ( 1 ) is opposite. Microphone according to Claim 8, in which the counterstructure ( 61 ) comprises a sound-transmitting area. A microphone according to any one of claims 1 to 9, comprising a first space passing through the microphone chip ( 21 ), the sound separation ( 41 ), the lid ( 1 ) and the membrane structure ( 81 ) is formed, and having a second space through the lid ( 1 ), the substrate ( 11 ), the sound separation ( 41 ) and the microphone chip ( 21 ), the first space being acoustically separated from the second space. Method for producing a microphone, comprising the following steps: providing a substrate ( 11 ) with ladder structures ( 131 ) for contacting a microphone capacitor; Providing a microphone chip ( 21 ), which has a membrane structure ( 81 ) and a counterstructure ( 61 ), wherein the membrane ( 81 ) and the counterstructure ( 61 ) form a microphone capacitor whose capacity is variable depending on the detected sound; Attaching the microphone chip ( 21 ) on the substrate ( 11 ), whereby the attachment ( 91 ) is formed so that a space between the microphone chip ( 21 ) and the substrate ( 11 ) with a space between the microphone chip ( 21 ) and one in a later step on the substrate ( 11 ) applied lid ( 1 ) communicates in terms of pressure; Arranging a sound separation ( 41 ) on a substrate ( 11 ) facing away from the surface of the microphone chip ( 21 ); and applying the lid ( 1 ) with a sound-transmitting area ( 151 ) on the substrate ( 11 ), so that the lid ( 1 ) with the substrate ( 11 ) is connected so that in a space between the lid ( 1 ) and the substrate ( 11 ) the microphone chip ( 21 ), and the sound separation ( 41 ) around the sound-transmitting area ( 151 ) of the lid ( 1 ) around between the microphone chip ( 21 ) and the lid ( 1 ) is arranged.