DE10196240T1 - Flammschutzmittel für Epoxyharze auf Basis von rotem Phosphor, flammhemmende Zusammensetzungen dafür auf Basis von rotem Phosphor, Verfahren zur Herstellung der obigen Materialien, Epoxyharz-Zusammensetzungen zum Abdichten von Halbleitervorrichtungen, Dichtungsmittel und Halbleitervorrichtungen - Google Patents
Flammschutzmittel für Epoxyharze auf Basis von rotem Phosphor, flammhemmende Zusammensetzungen dafür auf Basis von rotem Phosphor, Verfahren zur Herstellung der obigen Materialien, Epoxyharz-Zusammensetzungen zum Abdichten von Halbleitervorrichtungen, Dichtungsmittel und HalbleitervorrichtungenInfo
- Publication number
- DE10196240T1 DE10196240T1 DE2001196240 DE10196240T DE10196240T1 DE 10196240 T1 DE10196240 T1 DE 10196240T1 DE 2001196240 DE2001196240 DE 2001196240 DE 10196240 T DE10196240 T DE 10196240T DE 10196240 T1 DE10196240 T1 DE 10196240T1
- Authority
- DE
- Germany
- Prior art keywords
- red phosphorus
- semiconductor devices
- epoxy resin
- sealants
- flame retardant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/02—Inorganic materials
- C09K21/04—Inorganic materials containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/14—Macromolecular materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/92—Fire or heat protection feature
- Y10S428/921—Fire or flameproofing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000154084 | 2000-05-25 | ||
JP2000-154084 | 2000-05-25 | ||
JP2000383703 | 2000-12-18 | ||
JP2000-383703 | 2000-12-18 | ||
JP2001060647 | 2001-03-05 | ||
JP2001-060647 | 2001-03-05 | ||
PCT/JP2001/004363 WO2001090242A1 (en) | 2000-05-25 | 2001-05-24 | Red phosphorus-base flame retardant for epoxy resins, red phosphorus-base flame retardant compositions therefor, processes for the production of both, epoxy resin compositions for sealing semiconductor devices, sealants and semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10196240T1 true DE10196240T1 (de) | 2003-04-24 |
DE10196240B4 DE10196240B4 (de) | 2006-09-07 |
Family
ID=27343501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10196240T Expired - Fee Related DE10196240B4 (de) | 2000-05-25 | 2001-05-24 | Flammschutzmittel für Epoxyharze auf Basis von rotem Phosphor und Verfahren zur Herstellung derselben |
Country Status (6)
Country | Link |
---|---|
US (1) | US6858300B2 (de) |
JP (1) | JP3909751B2 (de) |
KR (1) | KR100526090B1 (de) |
CN (1) | CN100339439C (de) |
DE (1) | DE10196240B4 (de) |
WO (1) | WO2001090242A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4804651B2 (ja) * | 2001-06-13 | 2011-11-02 | 日本化学工業株式会社 | エポキシ樹脂用赤燐系難燃剤組成物、その製造方法、半導体封止材用エポキシ樹脂組成物、封止材および半導体装置 |
JP2003092379A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | 半導体装置 |
JP4155448B2 (ja) * | 2002-09-30 | 2008-09-24 | 日本化学工業株式会社 | 赤燐粒子を含有するスラリーの製造方法及び安定化赤燐の製造方法 |
US7300796B2 (en) * | 2003-09-09 | 2007-11-27 | International Business Machines Corporation | Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging |
JP2005126626A (ja) * | 2003-10-27 | 2005-05-19 | Fuji Xerox Co Ltd | 難燃性樹脂組成物及びその製造方法、難燃樹脂成型物 |
JP2005336416A (ja) * | 2004-05-31 | 2005-12-08 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
DE602005017509D1 (de) * | 2004-11-26 | 2009-12-17 | Lg Chemical Ltd | Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit |
JP4997704B2 (ja) | 2005-02-24 | 2012-08-08 | 富士ゼロックス株式会社 | 表面被覆難燃性粒子及びその製造方法、並びに難燃性樹脂組成物及びその製造方法 |
JP2006265417A (ja) * | 2005-03-24 | 2006-10-05 | Fuji Xerox Co Ltd | 難燃性樹脂組成物及び難燃性樹脂成形品 |
JP4961677B2 (ja) * | 2005-03-28 | 2012-06-27 | 富士ゼロックス株式会社 | 難燃性エポキシ樹脂組成物並びにそれを用いた電子部品装置、積層基板、多層回路基板及びプリント配線基板 |
JP2007002120A (ja) * | 2005-06-24 | 2007-01-11 | Fuji Xerox Co Ltd | 難燃性樹脂組成物及び難燃性樹脂成形品 |
US7767736B2 (en) * | 2005-12-05 | 2010-08-03 | 3M Innovative Properties Company | Flame retardant polymer composition |
CN101845153B (zh) * | 2010-06-04 | 2011-12-28 | 深圳市联合鑫科技有限公司 | 一种无机粉体添加型阻燃剂及其制备方法 |
CN102179025B (zh) * | 2010-09-16 | 2012-06-27 | 陕西坚瑞消防股份有限公司 | 通过高温升华产生灭火物质的灭火组合物 |
CN102179024B (zh) * | 2010-09-16 | 2012-06-27 | 陕西坚瑞消防股份有限公司 | 通过高温进行组分间发生化学反应产生灭火物质的灭火组合物 |
CN102179026B (zh) | 2010-09-16 | 2012-06-27 | 陕西坚瑞消防股份有限公司 | 通过高温分解产生灭火物质的灭火组合物 |
CN102093593B (zh) * | 2010-12-30 | 2012-10-10 | 中国人民解放军国防科学技术大学 | 树脂基复合材料用添加型阻燃剂、阻燃复合材料及其制备方法 |
US9828501B2 (en) * | 2011-05-28 | 2017-11-28 | Robert Valentine Kasowski | Flame retardant with compositions |
TWI465513B (zh) | 2012-08-13 | 2014-12-21 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
JP7023048B2 (ja) * | 2016-03-17 | 2022-02-21 | レジノカラー工業株式会社 | マスターバッチ、樹脂成形品、マスターバッチの製造方法及び樹脂成形品の製造方法 |
CN107650217A (zh) * | 2017-09-25 | 2018-02-02 | 浙江吉发新材料科技有限公司 | 一种松材线虫疫木制造包装箱用阻燃胶合板材制造方法 |
CN108469501A (zh) * | 2018-06-14 | 2018-08-31 | 云南江磷集团股份有限公司 | 快速测定赤磷稳定性的方法 |
CN114085422B (zh) * | 2021-11-30 | 2023-05-23 | 广东宇星阻燃新材股份有限公司 | 一种无机次磷酸铝的制备方法及无机次磷酸铝在阻燃pbt中的应用 |
CN114805938A (zh) * | 2022-05-12 | 2022-07-29 | 衡阳师范学院 | 一种低卤环磷腈包覆红磷阻燃剂及其制备方法与应用 |
CN114940781A (zh) * | 2022-07-07 | 2022-08-26 | 邵阳市富森阻燃材料有限公司 | 一种复合包覆红磷阻燃剂及其制备方法 |
CN115124766A (zh) * | 2022-07-07 | 2022-09-30 | 邵阳学院 | 一种包覆红磷阻燃剂的制备方法 |
CN115521543B (zh) * | 2022-09-30 | 2024-03-22 | 天津金发新材料有限公司 | 一种低烟气毒性、低热释放速率、高氧指数阻燃pp材料及其制备方法与应用 |
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DE3436161A1 (de) * | 1984-10-03 | 1986-04-10 | Hoechst Ag, 6230 Frankfurt | Phlegmatisierter roter phosphor |
JPS61111342A (ja) * | 1984-11-06 | 1986-05-29 | Nippon Chem Ind Co Ltd:The | 難燃剤およびその製造法 |
JPS61152746A (ja) | 1984-12-27 | 1986-07-11 | Nippon Chem Ind Co Ltd:The | 難燃性樹脂組成物 |
JPS6221704A (ja) | 1985-07-17 | 1987-01-30 | Rin Kagaku Kogyo Kk | 被覆赤リンの製造方法 |
JPS62143921A (ja) * | 1985-12-17 | 1987-06-27 | Sumitomo Chem Co Ltd | エポキシ樹脂組成物 |
JP2696232B2 (ja) * | 1988-10-20 | 1998-01-14 | 日本化学工業株式会社 | 安定化赤リンおよびその製造方法 |
JP2855331B2 (ja) * | 1988-10-20 | 1999-02-10 | 日本化学工業株式会社 | 安定化赤リンおよびその製造方法 |
JP2835955B2 (ja) * | 1988-10-20 | 1998-12-14 | 日本化学工業株式会社 | 安定化赤リンおよびその製造方法 |
JP3244690B2 (ja) | 1990-09-18 | 2002-01-07 | 日本化学工業株式会社 | 安定化赤リンおよび難燃性樹脂組成物 |
DE4039906A1 (de) * | 1990-12-14 | 1992-06-17 | Hoechst Ag | Stabilisierter roter phosphor sowie verfahren zu seiner herstellung |
FR2687407A1 (fr) * | 1992-02-18 | 1993-08-20 | Rhone Poulenc Chimie | Compositions a base de polyamide ignifuge. |
JP2832672B2 (ja) * | 1993-08-12 | 1998-12-09 | 燐化学工業株式会社 | 赤リン系難燃剤及び難燃性樹脂組成物 |
JP2843244B2 (ja) | 1993-12-08 | 1999-01-06 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
JPH07173372A (ja) | 1993-12-20 | 1995-07-11 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH08151427A (ja) | 1994-09-27 | 1996-06-11 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH08245214A (ja) | 1995-03-07 | 1996-09-24 | Denki Kagaku Kogyo Kk | シリカ微粉末、その製造法及び半導体封止用エポキシ樹脂組成物 |
WO1996028511A1 (fr) * | 1995-03-10 | 1996-09-19 | Toshiba Chemical Corporation | Composition a base de resine epoxy ignifugeant sans halogene |
JPH09227765A (ja) | 1995-12-22 | 1997-09-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
US5869553A (en) | 1995-12-22 | 1999-02-09 | Sumitomo Bakelite Company Limited | Epoxy resin composition comprising red phosphorus |
CN1221441A (zh) * | 1996-04-08 | 1999-06-30 | 钟渊化学工业株式会社 | 阻燃热塑性树脂组合物 |
US5965639A (en) * | 1996-10-16 | 1999-10-12 | Toray Industries, Inc. | Flame retardant resin composition |
JP4055215B2 (ja) * | 1996-10-21 | 2008-03-05 | 日立化成工業株式会社 | 接着剤組成物 |
JPH10152599A (ja) | 1996-11-21 | 1998-06-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH10182940A (ja) | 1996-12-27 | 1998-07-07 | Matsushita Electric Works Ltd | 封止材用エポキシ樹脂組成物及びそれを用いた半導体装置 |
ATE258939T1 (de) * | 1997-02-04 | 2004-02-15 | Aventis Pharma Inc | Verfahren zur behandlung von elastomeren zur verminderung von peroxidgehalten |
US6248814B1 (en) * | 1998-03-25 | 2001-06-19 | Teijin Limited | Resin composition |
JPH11323091A (ja) * | 1998-05-11 | 1999-11-26 | Sanyu Resin Kk | 難燃性注型用エポキシ樹脂組成物 |
-
2001
- 2001-05-24 US US10/275,960 patent/US6858300B2/en not_active Expired - Fee Related
- 2001-05-24 DE DE10196240T patent/DE10196240B4/de not_active Expired - Fee Related
- 2001-05-24 KR KR10-2002-7015597A patent/KR100526090B1/ko not_active IP Right Cessation
- 2001-05-24 WO PCT/JP2001/004363 patent/WO2001090242A1/ja active IP Right Grant
- 2001-05-24 JP JP2001587047A patent/JP3909751B2/ja not_active Expired - Fee Related
- 2001-05-24 CN CNB018096123A patent/CN100339439C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3909751B2 (ja) | 2007-04-25 |
WO2001090242A1 (en) | 2001-11-29 |
CN1429251A (zh) | 2003-07-09 |
CN100339439C (zh) | 2007-09-26 |
DE10196240B4 (de) | 2006-09-07 |
KR100526090B1 (ko) | 2005-11-08 |
US20030197159A1 (en) | 2003-10-23 |
US6858300B2 (en) | 2005-02-22 |
KR20030009495A (ko) | 2003-01-29 |
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