CN2665920Y - Heat radiation type PCB heat board - Google Patents
Heat radiation type PCB heat board Download PDFInfo
- Publication number
- CN2665920Y CN2665920Y CNU2003201005531U CN200320100553U CN2665920Y CN 2665920 Y CN2665920 Y CN 2665920Y CN U2003201005531 U CNU2003201005531 U CN U2003201005531U CN 200320100553 U CN200320100553 U CN 200320100553U CN 2665920 Y CN2665920 Y CN 2665920Y
- Authority
- CN
- China
- Prior art keywords
- pcb board
- type pcb
- utility
- model
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a radiation PCB board, comprising a base body and an insulation layer. The PCB board takes the shape of a regular polygon and a group of subtense is provided with semi-circular limit holes as well as bipolar holes and a group of holes used for fixing LED chip. When in use, the LED chip is positioned at the fixing holes. The utility model can form various types according to demand, and compared with the prior art, the utility model has the advantages of solving radiation problem of LED lamp, improving light conversion rate and intensity of the LED chip, being easy to be assembled to luminous body of various sizes, higher brightness for the assembly of groups of LED than that of a signal LED, being able to illuminate or decorate and energy saving.
Description
Technical field
The utility model relates to a kind of lamp decoration articles for use, refers to a kind of fixing high-power heat radiating type pcb board of led chip that is applied to especially.
Background technology
At present, the application of LED lamp is very general, and like this, its heat dissipation problem just appears suddenly out gradually, and the luminous worker's plate body of employed aluminium base great power LED on the existing market, it assembles extremely inconvenience no matter be that volume or area are all bigger.
The utility model content
The purpose of this utility model is to provide a kind of heat radiating type pcb board, and its volume and area are all little, and is convenient to assembling.
For achieving the above object, solution of the present utility model is: a kind of heat radiating type pcb board, it comprises substrate body and insulating barrier, its profile is configured as regular polygon, wherein one group of opposite side is provided with the location hole of half garden shape, also be provided with the bipolarity hole on it and location hole is covered in one group of reflection, in addition, also be provided with the centre bore of device led chip on it.
Described heat radiating type pcb board, its regular polygon are regular hexagon or octagon.
Described one group of fixing hole is four.
Described heat radiating type pcb board is provided with insulating barrier in its fixing hole.
After adopting said structure, compared with prior art, the utlity model has following advantage:
1, solves the heat dissipation problem of LED lamp, promoted led chip light transfer ratio and intensity;
2, be convenient to assembling, can be combined into the luminous element that varies in size;
3, because many group LED fit together, its brightness is quite high with single ratio, makes its alternative illumination or lamp decoration;
4, little power consumption is saved the energy.
Figure of description
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
The three-dimensional exploded view of Fig. 3 when to be the utility model with the reflection lid cooperate;
Fig. 4 is the utility model user mode figure one;
Fig. 5 is the utility model user mode figure two.
Embodiment
As shown in Figure 1, 2, the utility model discloses a kind of heat radiating type pcb board 1, it comprises substrate body 11 and insulating barrier 12, and its profile is configured as regular polygon, wherein:
Described pcb board 1, one group opposite side 13 is provided with the location hole 14 of half garden shape, is convenient to assembling, also be provided with bipolarity hole 15 on it and be convenient to source of welding current line, the location hole 16 of four fixation reflex lids is convenient to different reflection lids 2 is installed, and changes its lighting angle and promotes luminous intensity;
Described regular polygon is regular hexagon or octagon;
Be provided with insulating barrier 12 in the described location hole 16;
Also be provided with centre bore 17 on the described heat radiating type pcb board 1, it is the device led chip,, puts reflection and covers 2 the corresponding connection with pcb board polarity of led chip polarity with lead;
During use, as shown in Figure 3,2 socle 21 is covered in reflection be inserted in the fixing hole 16, the polarity energized of LED lamp is got final product, and, the utility model can be as required, scrabble up as Fig. 4 or pattern shown in Figure 5, wherein, location hole 14 can increase area of dissipation on the one hand, on the other hand, make between adjacent pcb board fixing.
Compared with prior art, the utlity model has following advantages:
1, solves the heat dissipation problem of LED lamp, promoted led chip light conversion ratio and intensity;
2, be convenient to assembling, can be combined into the illuminator that varies in size;
3, because many group LED fit together, and its brightness is quite high with single ratio, make it can Substitute illumination or lamp decoration;
4, little power consumption is saved the energy.
Claims (5)
1, a kind of heat radiating type pcb board, it is characterized in that: it comprises substrate body and insulating barrier, its profile is configured as regular polygon, wherein one group of opposite side is provided with the location hole of half garden shape, also be provided with bipolarity hole and one group reflection on it and cover location hole, in addition, also be provided with the centre bore of device led chip on it.
2, heat radiating type pcb board as claimed in claim 1 is characterized in that: described regular polygon is a regular hexagon.
3, heat radiating type pcb board as claimed in claim 1 is characterized in that: described regular polygon is an octagon.
4, as claim 1,2 or 3 described heat radiating type pcb boards, it is characterized in that: described fixing hole is four.
5, heat radiating type pcb board as claimed in claim 4 is characterized in that: be provided with insulating barrier in the fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2003201005531U CN2665920Y (en) | 2003-10-15 | 2003-10-15 | Heat radiation type PCB heat board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2003201005531U CN2665920Y (en) | 2003-10-15 | 2003-10-15 | Heat radiation type PCB heat board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2665920Y true CN2665920Y (en) | 2004-12-22 |
Family
ID=34339311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2003201005531U Expired - Fee Related CN2665920Y (en) | 2003-10-15 | 2003-10-15 | Heat radiation type PCB heat board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2665920Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100359709C (en) * | 2005-06-09 | 2008-01-02 | 宁波雷登照明有限公司 | High power and quick heat radiating light emitting diode in white light |
| US7679918B2 (en) | 2007-09-27 | 2010-03-16 | Beijing Boe Optoelectronics Technology Co., Ltd. | LED element and printed circuit board with the same |
| CN101534599B (en) * | 2008-03-14 | 2010-08-25 | 西安孚莱德光电科技有限公司 | LED radiating substrate and manufacturing method thereof |
| CN102287677A (en) * | 2011-05-09 | 2011-12-21 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) light source component, backlight module and liquid crystal display device |
| US8128263B2 (en) | 2008-09-16 | 2012-03-06 | Toshiba Lighting & Technology Corporation | Light source unit and lighting apparatus having light-emitting diodes for light source |
| CN102588813A (en) * | 2011-01-18 | 2012-07-18 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode light bar and manufacturing method for same |
| CN103148460A (en) * | 2008-05-30 | 2013-06-12 | 东芝照明技术株式会社 | Lighting apparatus and light-emitting element substrate having stress absorbing means |
| US8491163B2 (en) | 2009-09-25 | 2013-07-23 | Toshiba Lighting & Technology Corporation | Lighting apparatus |
-
2003
- 2003-10-15 CN CNU2003201005531U patent/CN2665920Y/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100359709C (en) * | 2005-06-09 | 2008-01-02 | 宁波雷登照明有限公司 | High power and quick heat radiating light emitting diode in white light |
| US7679918B2 (en) | 2007-09-27 | 2010-03-16 | Beijing Boe Optoelectronics Technology Co., Ltd. | LED element and printed circuit board with the same |
| CN101400210B (en) * | 2007-09-27 | 2010-06-02 | 北京京东方光电科技有限公司 | Printed circuit board equipped with LED |
| CN101534599B (en) * | 2008-03-14 | 2010-08-25 | 西安孚莱德光电科技有限公司 | LED radiating substrate and manufacturing method thereof |
| US8545051B2 (en) | 2008-05-30 | 2013-10-01 | Toshiba Lighting & Technology Corporation | Lighting apparatus with heat conductive substrate |
| CN103148460A (en) * | 2008-05-30 | 2013-06-12 | 东芝照明技术株式会社 | Lighting apparatus and light-emitting element substrate having stress absorbing means |
| US8556460B2 (en) | 2008-05-30 | 2013-10-15 | Toshiba Lighting & Technology Corporation | Lighting apparatus and light-emitting element mounting substrate having stress absorbing means |
| US9279575B2 (en) | 2008-05-30 | 2016-03-08 | Kabushiki Kaisha Toshiba | Light emitting module having heat conductive substrate |
| US9303855B2 (en) | 2008-05-30 | 2016-04-05 | Toshiba Lighting & Technology Corporation | Light emitting module having heat conductive substrate |
| US9410685B2 (en) | 2008-05-30 | 2016-08-09 | Toshiba Lighting & Technology Corporation | Light emitting module having heat conductive substrate |
| US8128263B2 (en) | 2008-09-16 | 2012-03-06 | Toshiba Lighting & Technology Corporation | Light source unit and lighting apparatus having light-emitting diodes for light source |
| US8491163B2 (en) | 2009-09-25 | 2013-07-23 | Toshiba Lighting & Technology Corporation | Lighting apparatus |
| CN102588813A (en) * | 2011-01-18 | 2012-07-18 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode light bar and manufacturing method for same |
| CN102287677A (en) * | 2011-05-09 | 2011-12-21 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) light source component, backlight module and liquid crystal display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041222 Termination date: 20101015 |