CN202826099U

CN202826099U - Double-way cutting system for solar silicon wafer

Info

Publication number: CN202826099U
Application number: CN 201220392389
Authority: CN
Inventors: 姚锦嵘; 陆晓清; 黄国顺
Original assignee: HAREON SOLAR TECHNOLOGY Co Ltd
Current assignee: HAREON SOLAR TECHNOLOGY Co Ltd
Priority date: 2012-08-09
Filing date: 2012-08-09
Publication date: 2013-03-27
Anticipated expiration: 2022-08-09

Abstract

The utility model relates to a double-way cutting system for a solar silicon wafer. The system comprises a linear cutting machine (1), wherein a slurry inlet (2) is formed in the top of the linear cutting machine (1); a filtering bag is arranged on the slurry inlet (2) in a sleeving manner; the filtering bag comprises a bag ring (2.1) and a bag body (2.2) arranged on the bag ring (2.1); a cutting frame (3), a cutting line mechanism (4) and a slurry nozzle (5) are arranged in the linear cutting machine (1); the cutting frame (3) is a rectangular structure formed by arranging four cutting guide rollers (3.1); the slurry nozzle (5) is positioned above the cutting frame (3); one end of a cutting line (8) wound on the cutting frame is wound on a wire unwinding roller (4.1) after passing through a reversing wheel (4.4) and a tension wheel (4.3); and the other end of the cutting line (8) is wound on a wire winding roller (4.2) after passing through the reversing wheel (4.4) and the tension wheel (4.3). The double-way cutting system has the advantages that the cutting continuity is good, and the cutting cost can be reduced.

Description

Solar silicon wafers Double Directional Cutting system

Technical field

The utility model relates to a kind of solar silicon wafers Double Directional Cutting system, is used for solar silicon wafers is carried out the line cutting, belongs to technical field of solar.

Background technology

At present, cut the unidirectional cutting of many employings in the process at the line of solar silicon wafers, cutting steel wire is not only wasted in unidirectional cutting, and higher to the quality requirement of various auxiliary materials, poor stability in cutting process causes thickness abnormity and TTV proportion high, thereby causes yields low; There is specially producer to propose Double Directional Cutting for this reason, but for Double Directional Cutting, traditional HCT-B5 wire cutting machine can't be implemented smoothly, thereby the wire casing angle of the used reverse wheel of its line of cut is about 15 °, when carrying out Double Directional Cutting, line of cut is jumped out the wire casing of reverse wheel easily, thereby interrupts cutting operation; And not only price is high with metal filter screen in conventional its charging place of HCT-B5 wire cutting machine, and clean complicated, greatly increased the production cost of line cutting, and screen pack and peripheral sealing effect that the slurry outlet place of HCT-B5 wire cutting machine bottom is used are relatively poor, thereby in process of production, oarse-grained impurity falls in the slurry recovery system easily, thereby the quality of slurry is reclaimed in impact; Simultaneously, it is reasonable not that the cutting groove spacing of conventional cutting deflector roll arranges, and when carrying out the switch operation of Double Directional Cutting, line of cut is jumped out the cutting groove of cutting deflector roll equally easily, thereby force cutting operation to have to interrupt, thereby affected the continuity of technique.

Summary of the invention

The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of continuity of cutting good and can effectively reduce the solar silicon wafers Double Directional Cutting system of cutting cost.

The purpose of this utility model is achieved in that a kind of solar silicon wafers Double Directional Cutting system, described system includes wire cutting machine, described wire cutting machine top is provided with the slurry feeding mouth, be set with filter bag on the described slurry feeding mouth, described filter bag is made of bag ring and the bag that is arranged on the bag ring

Be provided with cutting rack in the described wire cutting machine, line of cut mechanism and slurry nozzle, the rectangular configuration of described cutting rack for arranging and consist of by four cutting deflector rolls, described cutting deflector roll is provided with a plurality of ring-type cutting grooves along its axial direction, line of cut twines formation one frame type structure along the cutting groove of four cutting deflector rolls, described slurry nozzle is positioned at the top of cutting rack, and slurry nozzle links to each other with the slurry feeding mouth, described line of cut mechanism includes unwrapping wire roller take-up roller, straining pulley and reverse wheel, be wrapped in an end of line of cut on the cutting rack through being wrapped in behind reverse wheel and the straining pulley on the unwrapping wire roller, the other end is through being wrapped on the take-up roller behind reverse wheel and the straining pulley.

The utility model solar silicon wafers Double Directional Cutting system, the order number of described bag is 300 orders.

The utility model solar silicon wafers Double Directional Cutting system, the material of described bag is glass fibre.

The utility model solar silicon wafers Double Directional Cutting system, the slot pitch of the adjacent cutting groove on the described cutting deflector roll is 0.3mm.

The utility model solar silicon wafers Double Directional Cutting system, the angle α of the race of described reverse wheel is 30 °.

The utility model solar silicon wafers Double Directional Cutting system, the slurry outlet place, below of described cutting rack is provided with a screen pack, is provided with silicane rubber plate around the described screen pack.

Compared with prior art, the beneficial effects of the utility model are:

The utility model adopts filter bag that slurry is filtered, and filter bag is changed more convenient, and the filter bag cost that the glass fiber is made is more cheap; Simultaneously, adjust the slot pitch of reverse wheel race angle and cutting deflector roll, so that its line of cut when the Double Directional Cutting break-in can not jump out, thereby guaranteed the continuity of producing; And the screen pack in the slurry source of cutting on line motor spindle periphery is installed silicane rubber plate, thereby has increased sealing effectiveness, does not reclaim in the slurry so that the large granular impurity when producing can not drain to, and is conducive to improve the quality that reclaims slurry, reduces cutting cost.

Description of drawings

Fig. 1 is the structural representation of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 2 is the structural representation of the line of cut mechanism of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 3 is the structural representation of the filter bag of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 4 is the bag structure of rings schematic diagram of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 5 is the structural representation of the bag of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 6 is the structural representation of the reverse wheel of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 7 is the structural representation of the cutting deflector roll of the utility model solar silicon wafers Double Directional Cutting system.

Fig. 8 is Fig. 7 of the utility model solar silicon wafers Double Directional Cutting system

Partial enlarged drawing.

Fig. 9 is the structural representation of the screen pack of the utility model solar silicon wafers Double Directional Cutting system.

Wherein:

Wire cutting machine 1, slurry feeding mouth 2, cutting rack 3, line of cut mechanism 4, slurry nozzle 5, screen pack 6, silicon chip to be cut 7, line of cut 8;

Bag ring 2.1, bag 2.2;

Cutting deflector roll 3.1, cutting groove 3.2;

Unwrapping wire roller 4.1, take-up roller 4.2, straining pulley 4.3, reverse wheel 4.4;

Silicane rubber plate 6.1.

The specific embodiment

Referring to Fig. 1 ~ 9, a kind of solar silicon wafers Double Directional Cutting system that the utility model relates to, described system includes wire cutting machine 1, described wire cutting machine 1 top is provided with slurry feeding mouth 2, be set with filter bag on the described slurry feeding mouth 2, described filter bag is made of bag ring 2.1 and a bag 2.2 that is arranged on the bag ring 2.1, and the order number of described bag 2.2 is 300 orders, and the material of described bag 2.2 is glass fibre;

Be provided with cutting rack 3 in the described wire cutting machine 1, line of cut mechanism 4 and slurry nozzle 5, the rectangular configuration of described cutting rack 3 for arranging and consist of by four cutting deflector rolls 3.1, described cutting deflector roll 3.1 is provided with a plurality of ring-type cutting grooves 3.2 along its axial direction, and the slot pitch of the adjacent cutting groove 3.2 on the cutting deflector roll 3.1 is 0.3mm, line of cut 8 twines formation one frame type structure along the cutting groove 3.2 of four cutting deflector rolls 3.1, described slurry nozzle 5 is positioned at the top of cutting rack 3, and slurry nozzle 5 links to each other with slurry feeding mouth 2, described line of cut mechanism 4 includes unwrapping wire roller 4.1, take-up roller 4.2, straining pulley 4.3 and reverse wheel 4.4, an end that is wrapped in line of cut 8 on the cutting rack 3 is wrapped on the unwrapping wire roller 4.1 behind reverse wheel 4.4 and straining pulley 4.3, the other end is wrapped on the take-up roller 4.2 behind reverse wheel 4.4 and straining pulley 4.3, and the angle α of the race of described reverse wheel 4.4 is 30 °;

The slurry outlet place, below of described cutting rack 3 is provided with a screen pack 6, is provided with silicane rubber plate 6.1 around the described screen pack 6.

During use, silicon chip 7 to be cut is positioned on the upper workbench of cutting rack 3 or the lower workbench (as shown in Figure 1), and silicon chip to be cut 7 be positioned on the line of cut 8, during cutting, the cutting slurry sprays to silicon chip 7 to be cut by slurry nozzle 5, thereby has played the effect of lubricated cutting.

Main technologic parameters during cutting is:

Following table is the cost compare of unidirectional cutting and Double Directional Cutting:

Claims

1. solar silicon wafers Double Directional Cutting system, it is characterized in that: described system includes wire cutting machine (1), described wire cutting machine (1) top is provided with slurry feeding mouth (2), be set with filter bag on the described slurry feeding mouth (2), described filter bag is made of bag ring (2.1) and the bag (2.2) that is arranged on the bag ring (2.1)

Be provided with cutting rack (3) in the described wire cutting machine (1), line of cut mechanism (4) and slurry nozzle (5), the rectangular configuration of described cutting rack (3) for arranging and consist of by four cutting deflector rolls (3.1), described cutting deflector roll (3.1) is provided with a plurality of ring-type cutting grooves (3.2) along its axial direction, line of cut (8) twines formation one frame type structure along the cutting groove (3.2) of four cutting deflector rolls (3.1), described slurry nozzle (5) is positioned at the top of cutting rack (3), and slurry nozzle (5) links to each other with slurry feeding mouth (2), described line of cut mechanism (4) includes unwrapping wire roller (4.1), take-up roller (4.2), straining pulley (4.3) and reverse wheel (4.4), an end that is wrapped in line of cut (8) on the cutting rack (3) is wrapped on the unwrapping wire roller (4.1) behind reverse wheel (4.4) and straining pulley (4.3), and the other end is wrapped on the take-up roller (4.2) behind reverse wheel (4.4) and straining pulley (4.3).

2. a kind of solar silicon wafers Double Directional Cutting system as claimed in claim 1, it is characterized in that: the order number of described bag (2.2) is 300 orders.

3. a kind of solar silicon wafers Double Directional Cutting system as claimed in claim 2, it is characterized in that: the material of described bag (2.2) is glass fibre.

4. a kind of solar silicon wafers Double Directional Cutting system as claimed in claim 1, it is characterized in that: the slot pitch of the adjacent cutting groove (3.2) on the described cutting deflector roll (3.1) is 0.3mm.

5. a kind of solar silicon wafers Double Directional Cutting system as claimed in claim 1, it is characterized in that: the angle α of the race of described reverse wheel (4.4) is 30 °.

6. a kind of solar silicon wafers Double Directional Cutting system as claimed in claim 1, it is characterized in that: the slurry outlet place, below of described cutting rack (3) is provided with a screen pack (6), is provided with silicane rubber plate (6.1) around the described screen pack (6).