CN1914001B - 软钎焊用的助焊剂和软钎焊方法 - Google Patents
软钎焊用的助焊剂和软钎焊方法 Download PDFInfo
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- CN1914001B CN1914001B CN2005800032478A CN200580003247A CN1914001B CN 1914001 B CN1914001 B CN 1914001B CN 2005800032478 A CN2005800032478 A CN 2005800032478A CN 200580003247 A CN200580003247 A CN 200580003247A CN 1914001 B CN1914001 B CN 1914001B
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- Prior art keywords
- scaling powder
- scolding tin
- electrode
- soldering method
- soft soldering
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- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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Abstract
提供一种软钎焊用的助焊剂和采用了该助焊剂的软钎焊方法,其不会带来接合不良和绝缘性的降低,能够得到高品质的焊锡接合部。如此的助焊剂,是在将形成有焊锡部第一电极软钎焊于第二电极时,使之介于所述焊锡部和所述第二电极之间的软钎焊用助焊剂,其含有如下而构成:将树脂成分溶解于溶剂的液状的基础剂;具有去除氧化膜的作用的活性成分;由具有比所述焊锡部的熔点高的熔点的金属组成的金属粉,在1~9vol%的范围含有所述金属粉。
Description
技术领域
本发明涉及例如将电子部件软钎焊于基板时所用的软钎焊用的助焊剂,和使用了此助焊剂的软钎焊方法。
背景技术
作为把电子部件往基板上装配时的接合方法,一直以来广泛采用软钎焊的方法。作为软钎焊的形态,采用有如下各种方法:利用焊锡形成设于电子部件的作为接合用电极的金属凸块(bump)的方法,在基板的电极表面形成焊锡层的焊锡预涂层(pre coat)法等。从近年环境保护的观点出发,而采用在上述的焊锡中几乎不含有害的铅,或者彻底不含的所谓无铅焊锡。
因为无铅焊锡与以往使用的铅系焊锡在成分组成上大为不同,所以在软钎焊过程中所用的助焊剂,也不能直接使用现在一般所使用的。即,在现有的助焊剂中,由于活性作用不足,焊锡表面的氧化膜除去不充分,而不容易确保良好的软钎焊性。因此,提出了以无铅焊锡为对象,活性作用更强的类型的助焊剂(例如参照专利文献1、2和3)。
另外,以提供能够以充分量转印到焊球的金属糊料为目的,还提出了使助焊剂包含大量的金属粉(例如参照专利文献4)。
专利文献1:特开2002-1581号公报
专利文献2:特开2000-135592号公报
专利文献3:特开平11-254184号公报
专利文献4:特开2000-31210号公报
然而使用如上述专利文献所示的、活性作用强的现有的助焊剂时,有产生如下问题的情况。近年来,从环境保护和工序简略化的观点出发,免清洗工程法成为主流,其省略了以前进行的软钎焊后的清洗工序,即,把软钎焊过程中所使用的助焊剂,用清洗剂清洗去除的工序省略。为此,软钎焊时所供给的助焊剂整个残留在焊锡接合部。这时,当助焊剂的活性作用强时,由于残留的助焊剂,基板的电路电极和/或电子部件的电极被腐蚀,其结果是,绝缘性降低而容易发生绝缘不良。
另外,将电子部件搭载于基板时,位于它们之间的焊锡凸块变形,如此而将电子部件压向基板,此后,使焊锡凸块熔化,进行软钎焊接合。然而,焊锡凸块由无铅焊锡形成时,因为无铅焊锡的硬度跟现有的铅系焊锡比较相对高,所以元件搭载时的凸块的变形量小,由此在软钎焊时,焊锡凸块的下端部和基板的电极表面之间容易有间隙产生。因此,在软钎焊中,熔化了的焊锡无法以跟电极正常地接触的状态而固化,有电子部件和基板之间的接合不良增大的倾向。
发明内容
因此,本发明目的在于,提供一种软钎焊用的助焊剂和使用了它的软钎焊方法,其能够抑制接合不良和绝缘性的降低,得到最为切实地不使之发生的高品质的焊锡接合部。
本发明提供一种软钎焊用的助焊剂,其在将形成有焊锡部的第一电极软钎焊于第二电极时,介于所述焊锡部和所述第二电极之间,该助焊剂含有如下而构成:
将树脂成分溶解于溶剂的液状的基础剂;
具有去除氧化物作用的活性成分;
金属粉,其由比起形成所述焊锡部的焊锡具有高的熔点的金属构成,以助焊剂的体积为标准,在1~9vol%的范围含有所述金属粉。
含于助焊剂的树脂成分,以如下方式发挥作用:其承担着作为所谓粘合剂的作用,在助焊剂中维持金属粉的分散状态,并且正如后文详细说明的,还将助焊剂适当地供给(例如转印)于对象物(例如焊锡部)并能够在该处保持,如此来确保粘度。除去活性成分的氧化物,是生成于所述焊锡部的表面的氧化物的膜的形态。金属粉特别优选对形成焊锡部的焊锡来说润湿性好的。
本发明提供一种将形成有焊锡部的第一电极软钎焊于第二电极的软钎焊方法,该方法包含如下工序:
第一工序,将所述本发明的助焊剂涂敷于所述焊锡部和所述第二电极的至少一方;
第二工序,通过使所述第一电极和第二电极位置对齐,使所述助焊剂介于所述焊锡部和第二电极之间;
第三工序,通过加热使所述焊锡部熔化;
第四工序,在第三工序后,使所述熔化了的焊锡固化。
在第三工序中,焊锡部熔化而产生的熔化焊锡沿着金属粉的表面润湿扩展。最终,熔化了的焊锡到达第二电极并在其之上展开,在第一电极和第二电极之间就存在熔化状态的焊锡。此后,通过第四工序,例如利用冷却在第一电极和第二电极之间以固化的状态焊锡存在,由焊锡电气地且机械地连接这些电极。
还有,在第二工序中,使电极位置对齐时,在电极间焊锡部存在的状态下,根据需要,可以施加使电极相互接近的力而使焊锡部变形。例如可以朝向一方的电极按压另一方的电极,这能够使焊锡部的平坦度提高。这时,在施加力的状态下,可以实施第三工序,但在其他的形态中,可以在释放了力的状态下实施第三工序,这方面很简便。
根据本发明,在如上所述,另外,使按照规定量含有之后详细说明的金属粉的助焊剂介于焊锡部和第二电极之间的状态下,通过加热能够使设于第一电极的焊锡部熔化,从而使熔化了的焊锡沿着金属粉的表面润湿扩展而接触到第二电极,其结果是,能够抑制接合不良和绝缘性降低,得到高品质的焊锡接合部。
附图说明
图1是在作为采用本发明的助焊剂软钎焊的本发明的软钎焊方法的一实施方式的电子部件装配中,向电子部件供给助焊剂,其后,使电子部件在基板上位置对齐的过程的工序说明图。
图2是在作为采用本发明的助焊剂软钎焊的本发明的软钎焊方法的一实施方式的电子部件装配中,使电子部件在基板上位置对齐后,通过将其加热,在它们之间形成焊锡接合部的过程的工序说明图。
图3是采用本发明的焊锡助焊剂进行软钎焊时,形成焊锡接合部的过程的模式化的说明图。
图4是本发明的一实施方式的电子部件装配中的助焊剂的供给方法的各种的形态的模式化的说明图。
图5是表示采用各种的金属粉含有率的助焊剂而形成的焊锡接合部的接合不良率、与金属粉含有率的关系的曲线图。
图6是表示采用各种的金属粉含有率的助焊剂实施了软钎焊后,绝缘电阻值与金属粉含有率的关系的曲线图。
图中:1基板;2电路电极(或第二电极);2a电路电极的表面;3助焊剂;4电子部件;5外部连接用电极(或第一电极);6凸块(或焊锡部)、(6)过低的凸块;6a熔化状态的焊锡;7助焊剂容器(或转印台);8金属粉;9配送器(dispenser);10转印针;11掩膜板(mask plate);11a图案(pattern)孔;12涂刷器(squeegee);16焊锡接合部。
具体实施方式
接下来,参照附图说明本发明的实施方式。图1和图2,是采用作为本发明的一个实施方式的软钎焊方法装配电子部件的方法的工序说明图,图3是采用本发明的助焊剂的软钎焊过程的说明图,图4是作为本发明的一个实施方式的电子部件装配中的助焊剂的供给方法的说明图,均是模式化地表示从侧面观看时的状况。
首先,参照图1和图2,说明采用了本发明的助焊剂进行软钎焊的电子部件装配,据此来说明本发明的软钎焊方法。在此电子部件装配中,作为第一电极,是通过软钎焊将具有外部连接用电极5的电子部件4,装配到上面以电路电极2作为第二电极所形成的基板1上。还有,第一电极和第二电极,也可以是任意的方式,例如可以是垫片(pad)、连接盘(land)、配线的一部分、凸块(bump)等。另外,构成这些电极的材料,也可以是电极用常规所使用的任意已知的材料。
还有,在使用本发明的助焊剂时,第二电极的焊锡部接合的部分可以为凹部,或者也可以平坦,但是,因为如后述那样形成的接合部具有提高了的绝缘性,所以本发明的助焊剂,对于焊锡部接合,第二电极的部分平坦,或其凹陷量小的情况特别有效。另外,对第二部分与其他的电极或和导体接近的情况有效。因此,本发明的助焊剂,对例如在基板上以狭窄间距在邻接状态下形成第二电极,在这些第二电极上分别接合第一电极的情况有效。
如图1(a)所示,电子部件4在其下面具有外部连接用电极5,在外部连接用电极5上形成有作为焊锡部的凸块6。焊锡部设于第一电极5上,是由无铅焊锡材料形成的构件,其方式可以是上述的凸块的方式,或者也可以是其他任意的适当的方式(例如涂层(coating))。还有,为了将焊锡部设于电极,也可以使用任意适当的已知的方法(例如焊球的熔敷或软钎焊,镀敷法,焊膏(solder paste)印刷法、焊膏分配法(solder paste dispense)等)。
焊锡部为如图所示的凸块6的方式时,其形成是将细微粒状的焊球软钎焊在外部连接用电极5上。还有,只要本发明,所谓焊锡,意思就是由低熔点的多种的金属组成的合金(例如银·锡系合金、锡·锌台词合金、锡·铋系合金、锡·铟系合金等),这些合金中基本不含铅,或者彻底不含,所谓以无铅焊锡为焊料而使用。这样的焊料优选具有240℃以下的熔点,更优选具有210℃以下的熔点。
一般来说,在电极5上形成凸块6后的凸块的尺寸,例如根据焊球的尺寸4的偏差,焊球的附着方法等的原因也不必都一样,在电子部件4的凸块6中,能够发生尺寸不足的凸块(参照图1(a)~(c)中由(6)所示的凸块),其比起规定的尺寸的凸块6,高度尺寸要低一些。因此,图示的各凸块6的下端部(顶部的位置)不在同一平面上,在垂直方向上偏差。即,存在凸块的平坦度不够充分的情况。
在凸块6上,如以下说明,例如通过转印涂敷本发明的助焊剂3。使电子部件4对于形成有助焊剂3的膜的转印台7落下,让凸块6与助焊剂接触后,通过使之上升,如图1(b)所示在凸块6的下端面转印涂敷助焊剂3(第一工序或助焊剂涂敷工序)。在以下说明的用于向基板1装配电子部件4的软钎焊中,助焊剂3,为了使软钎焊性提高,故介于凸块6和电路电极2之间而使用。
在此,说明本发明的助焊剂3。助焊剂3就是在将树脂成分(例如松香、改性松香、聚烷撑二醇(polyalkylene glycol)(例如聚乙二醇(polyethyleneglycol)等)、聚酰胺(polyamide)树脂等)溶解于溶剂(例如丁基卡必醇(butyl carbitol)、异丙醇(isopropyl alcohol)等)的高粘度的液状的基础剂、和活性成分(或活性剂)中混合金属粉8而得到的组成物。活性成分,其采用以除去在凸块6的表面生成的焊锡的氧化膜为目的而存在于助焊剂中,且具有这样的氧化膜去除能力的物质。可示例为:例如树脂酸(例如松香酸(abietic acid)等);有机酸(例如柠檬酸(citric acid)、硬脂酸(stearin acid)等);碱基有机化合物(例如二乙胺盐酸盐(diethylaminehydrochloride)、盐酸苯胺(aniline hydrochloride)等)等。还有,在本发明的助焊剂中,优选包含无需软钎焊后的清洗的低活性的(例如松香酸等)作为活性成分。例如,助焊剂含松香和金属粉而成,不含其他的(或追加的)活性成分时,成为低活性的助焊剂,这种情况下,能够省略软钎焊后的清洗。当然,也可以含有其他的活性成分。
松香和改性松香,因为包含松香酸等的树脂酸,其除了粘合剂的功能外,在软钎焊时作为活性成分也发挥作用,所以在本发明的助焊剂中,将松香和/或改性松香作为树脂成分使用时,不一定非要另外追加活性成分。这种情况下,成为具有低活性的助焊剂,如后述可以省略软钎焊后的清洗。然而,当需要更强的活性时,除了松香,还可以添加追加的活性成分。另外,像聚乙二醇、聚酰胺树脂等这样的树脂成分不具有活性成分的功能时,需要追加活性成分(例如有机酸、碱基有机化合物)。
作为构成金属粉8的材料,是比起作为焊锡部的凸块6所采用的焊锡的熔点(无铅焊锡的情况,例如190℃~220℃)具有更高的熔点(优选为10℃或之上的高熔点,更优选为20℃或之上的高熔点)的金属。作为这样的材料,优选在大气中难以在金属粉8的表面生成自然氧化膜,此外,对于形成凸块6的焊锡的润湿性良好,凸块6熔化的流动状态的焊锡沿金属粉8的表面易于润湿扩展的金属。具体来说,作为满足如此条件的材料,能够例示例如金、银、钯等的贵金属,这些金属特别优选其纯度在90%以上。
向助焊剂3的金属粉的添加,通过在其他成分中混合金属粉而实施。金属粉的添加量,以助焊剂总体的体积为标准,为1~9vol%,优选为2~7vol%,更优选为3~5vol%。还有,在本说明书中,vol%(体积%)是严密地按照以25℃为标准,不考虑构成金属粉的要素(例如粒状物、鳞片状物)间的空隙的金属粉的纯粹体积(即,考虑到这样的空隙的外观不是体积标准)。还有,温度,在实用上即使以通常的室温(20℃~30℃)为标准,金属粉的体积%也没有实质性的差异。
构成金属粉的各要素,可以是各种的粒状或其他的形状(例如平板状、鳞片状、碎片(flake)状、短纤维状、树枝状、薄片状、不规则形状等),例如也可以是球状或不规则粒状,其可以具有角部、凹部、凸部等。当金属粉的构成要素为鳞片状、薄片状或碎片状这样的薄的形状时,或者为树枝状时,特别便于体现后述的桥(bridge)形成功能。
此外,在本发明的助焊剂中使用的金属粉中,还含有如此而构成的金属粉:采用对于焊锡的润湿性良好,且比起该焊锡的熔点具有更高的熔点的金属,涂裹(coating)成为核的金属要素的表面而成的金属粉。即,金属粉的构成要素,由核和其周围的金属涂层构成。例如,可以是用纯度90%以上的金、银、钯的任意一种覆盖锡的颗粒的表面的金属粉,至少是表面对于焊锡部的焊锡的润湿性良好,且比起该焊锡的熔点是具有更高的熔点的金属的金属粉即可。即,此情况下,如上述这样选定的金属的条件,适合作为构成涂层的金属。
还有,在本发明的助焊剂中使用的成分,在除了金属粉的其他的成分中,可以使用一般性的助焊剂中所使用的材料,另外,对于它们的量也可以是一般所采用的量。
在本发明的助焊剂的一例中,含有:将树脂成分(例如松香)溶解于溶剂(例如丁基卡必醇)的液状的基础剂;对除去在凸块6的表面生成的氧化膜有作用的活性成分(例如松香酸);对于形成凸块6的焊锡润湿性良好,且比起该焊锡的熔点具有更高熔点的金属粉8,金属粉在1~9vol%的范围含有。
助焊剂涂敷后,电子部件4被装配到基板1上。电子部件4向基板的装配,其进行是通过为了连接而以电极间的位置相匹配的方式在基板1之上定位电子部件4之后(即,使基板和电子部件相匹配后),通过加热使凸块6熔化而软钎焊于电路电极2的上面。由此,在各自的外部连接用电极5按规定被电连接于相对应的电路电极2上,而且电子部件4,通过熔化焊锡固化所形成的焊锡接合部被粘合在基板1上。
在此装配过程中,使电子部件4位于基板1的上方,将凸块6在电路电极2上位置对齐,相对基板1使之落下。然后,使涂敷有助焊剂3的凸块6着落在电路电极2上,在凸块6和电路电极2之间配置助焊剂3(第二工序或电子部件搭载工序)。还有,根据需要,如图1(c)所示,可以用规定的按压力F对基板1按压电子部件4,由此,在具有平均高度的凸块6中,即使凸块高度有一些偏差,平坦度不充分,但由于高的凸块6受到按压力其高度方向被压制而变低,从而凸块6的高度的偏差也会变小,其结果是,凸块的平坦度提高,大部分的凸块6的下端部通过接触到电路电极2的上面。还有,在按压的情况下,在下面的焊锡熔化工序中也可以继续按压,或者,该操作也可以是释放按压力,只靠电子部件4的自重作用于基板。
相对于此,尺寸不足的凸块(6)(即,高度过低的凸块),即使其他有平均的高度的凸块6受到一些压制,而电子部件4整体的位置也下降那么多,但凸块(6)的下端部还是未与电路电极2的表面接触,从而成为在凸块(6)和电路电极2之间有间隙残留的状态(参照图1(c))。还有,在凸块6的尺寸不存在大的偏差的情况下,电子部件4是在薄型的树脂基板等容易产生翘曲变形的基板的下面形成了凸块6的类型时,由于这样的基板的翘曲变形,位于外缘侧的凸块的下端部和电路电极2之间同样有产生间隙的情况。
对在搭载了电子部件后,使凸块6熔化,将第一电极5软钎焊于电路电极2的软钎焊过程(第三工序或焊锡熔化工序)加以说明。如图1(c)所示,加热搭载了电子部件4的基板1使凸块6熔化。该加热可以通过任何适当的方法实施,例如将搭载了电子部件4的基板1送入回流炉加热。这时,如图2(a)所示,对于具有平均高度的凸块6,是在其下端部接触到电路电极2的状态下进行加热,另外,对于尺寸不足的凸块(6),是在其下端部和电路电极2之间有助焊剂夹杂的状态下进行加热。
通过如此加热,凸块6和(6)一起被软钎焊接合于电路电极2,但是在此按合过程的焊锡的动向,会根据凸块下端部是否接触到电路电极2而有所不同。如图2(b)所示,在凸块下端部接触到电路电极2的凸块6中,若通过加热熔化凸块6,则熔化状态的焊锡6a立即沿着焊锡润湿性优良的材质的电路电极2的表面良好地润湿扩展,外部连接用电极5通过焊锡6a与电路电极2连接。这时,通过含于助焊剂3中的活性成分,凸块6和/或电路电极2的表面的氧化膜被除去。此后冷却,如图2(c)所示,焊锡接合部16形成。
相对于此,在凸块(6)中,由于其下端部和电路电极2的表面2a之间有间隙,所以外部连接用电极5跟电路电极2通过焊锡6a的连结,被推侧为经过图3所示的过程而进行。图3(a)表示通过在回流炉中的加热,作为焊锡部的凸块(6)的熔化开始时的状态。这里,在介于凸块(6)的下端部和电路电极2的表面2a之间的助焊剂3中的金属粉8中,因为金属粉的构成要素(例如,粒、鳞片等)以随意的姿态大量存在,所以,连结凸块(6)的下端部和电路电极2的表面2a的桥容易由金属粉的构成要素形成(参照图3(a)中以箭头a所示的部分)。
这里,所谓桥,是指金属粉8的构成要素处于相互接近的状态,能够视为其正好连续性地变成一体存在的状态。还有,可以是一种构成要素和与其邻接的构成要素间隔很短的距离而分开,或者它们也可以相互接触。然后,所谓的接近状态,是指金属粉8如下的状态:润湿金属粉8的一个构成要素的表面而覆盖的流动状态的焊锡,通过表面张力而形成一定厚度的层或块时,以如此厚度的焊锡的层或块的表面与邻接于这一个构成要素的另一个或多个构成要素接触程度的距离,这些构成要素分离而存在(也包含接触存在的情况)。
由于金属粉8的构成要素的多数以这样的接近状态存在,所以与一体存在的金属粉8的构成要素的一端部相接触的熔化焊锡,覆盖位于端部、由焊锡润湿性良好的金属形成的构成要素的表面并扩展,形成具有一定厚度的熔化焊锡的层或块(优选包住此构成要素),接着,如此形成的熔化焊锡的层或块与邻接于端部的构成要素的其他构成要素接触,覆盖此构成要素的表面并扩展,形成熔化焊锡的层或块,其进一步覆盖相邻接的接下来的构成要素的表面并扩展。如此,焊锡部熔化而生成的熔化焊锡,从靠近侧的一端向另一端,依次覆盖接近而处于一体状态的构成要素并扩展。如此通过熔化焊锡覆盖一体的构成要素,熔化焊锡沿着构成要素移动,熔化焊锡到达电极表面2a。基于此润湿扩展的焊锡的移动,连续发生直到一体的另一端部,由此,这些一体的金属粉8,与图3(a)和图3(b)比较可知,其作为结合凸块(6)的下端部和电路电极2的表面2a的桥发挥作用,通过该桥,熔化焊锡6a能够到达电极表面2a。
在本发明的助焊剂中,作为金属粉8的材质,由于使用比焊锡部所采用的焊锡的熔点要高的金属,例如金和银等的贵金属,所以,即使加热到焊锡成为熔化状态这样的高温时,金属粉8也确实地以固体状态存在。相对于此,采用使助焊剂中含有焊锡粒子的焊锡膏的软钎焊方法中,经过回流时的加热,助焊剂中的焊锡粒子也同时熔化,在凸块(6)的下端部和电路电极2的表面2a之间的间隙内,桥接熔化焊锡的桥没有形成,对此,在本发明的软钎焊助焊剂中,能够确实地形成上述的桥。
在本发明的助焊剂中,作为金属粉8的形状,特别优选采用将上述的金属加工成鳞片状的构成要素。在此情况下,与鳞片形状的厚度相垂直的方向,特别是鳞片形状的构成要素的长方向,以与凸块(6)的下端部和电路电极2的表面2a之间的间隙的桥接方向(即,图3中的纵向)成为平行,或者近乎平行的姿态而使构成要素存在时,金属粉8将更容易形成桥,即使是比较低的金属粉的含有率也能够高效率地形成桥。金属粉由薄片状要素构成时也一样。
若沿着如上述的桥,熔化焊锡6a一旦到达电极表面2a,则流动状态的焊锡6a便沿着焊锡润湿性良好的电极表面2a润湿扩展。通过该焊锡6a的润湿扩展,如图3(c)所示,电极表面2a附近的助焊剂3被推向外侧,即使使用最初在与电路电极2之间有间隙产生的凸块(6),通过焊锡6a,外部连接用电极5也能够全面地和电路电极2连结。
在此情况下,通过包含于助焊剂3中的活性成分,接合性也会提高,但是,由于如上述这样形成有桥,即使凸块表面的氧化膜只被部分地除去时,也能够确保良好的焊锡接合性,因此无需要求含于助焊剂3中的活性成分有很强的活性作用。换言之,通过金属粉8的添加,活性作用弱的低活性助焊剂的使用成为可能,在此情况下,即使在焊锡接合后在助焊剂残留的状态下,由于活性成分而使电路电极被腐蚀的可能性降低。因此,使用本发明的助焊剂时,在软钎焊后不进行用于助焊剂去除的清洗的无清洗的软钎焊工法中,也能够确保接合部的充分的可靠性。
图3(c)表示结束在回流工序中的规定的加热次序(焊锡熔化工序),以第四工序或冷却工序冷却了的状态。即,凸块熔化的焊锡6a通过冷却固化,由此形成利用焊锡接合而将外部连接用电极5和电路电极2加以连结的焊锡接合部16。在此焊锡接合部16的电极表面2a附近,在软钎焊过程中,有被包藏在焊锡中的金属粉8存在,根据情况,以合金状态或固溶状态存在。
还有,电路电极2的表面2a和在其周围由助焊剂溶剂成分蒸发后的残渣(树脂成分和活性成分),与未包藏到焊锡接合部16的金属粉8一起残留(参照图3(c))。在本发明的助焊剂中,金属粉含有率如上述为1~9voi%,优选为2~7vol%,更优选为3~5vol%的范围,由于其为比较低的含量,所以如后所述在焊锡接合后,在相接近的电极(或配线)之间很难引起绝缘不良。特别是当活性成分的活性作用低时,难以进一步引起绝缘不良。在绝缘不良由于移动(migration)而产生时,本发明的助焊剂以如此的低含量而含有金属粉可有利地发挥作用。
图2(c)表示如上述这样连结外部连接用电极5和电路电极2的焊锡接合部16,在整个的外部连接用电极5和电路电极2之间形成的状态。即,在成为软钎焊的对象的外部连接用电极5和电路电极2的组合中,在当初为尺寸不足的凸块(6)中,即使是在其下端部与电路电极2之间有间隙产生的情况下,通过应用本发明的助焊剂和软钎焊方法,也能够进行良好的软钎焊。
还有,在上述的形态中,在供给助焊剂3的助焊剂涂敷工序中,展示了在凸块6上转印助焊剂3而供给的例子,不过,除此之外还能够采用各种的方法。例如,如图4(a)所示,通过从配送器9向电极2上吐出助焊剂3,也可以向电路电极2供给助焊剂3。另外,如图4(b)所示,也可以使用转印针10使其一次性附着助焊剂,通过将该附着的助焊剂3转印到电路电极2上而供给。
此外在其他的形态中,如图4(c)所示,也可以通过丝网印刷在电路电极2上印刷助焊剂3。即,将设有对应于电路电极2的图案孔11a的掩膜板11装配于基板1上,通过涂刷器(squeegee)12在图案孔11a内填充助焊剂3而印刷在电路电极2的表面。可以自然地将本发明的助焊剂只供给到焊锡部或应该连接的电极的任一方,或者也可以向双方供给。
接着,参照图5和图6,说明助焊剂中的金属粉含有率、和采用助焊剂将凸块6接合于电路电极2的焊锡接合部的接合品质的关系。
(助焊剂的调制)
调制助焊剂,其以树脂∶溶剂=3∶2(重量标准),含有松香作为树脂(含活性成分)、醇类或苯作为溶剂,此外以各种比例含金属粉。还有,作为金属粉,使用银的鳞片状物,其含有率为0.5vol%、1.00vol%、3.00vol%、6.00vol%、9.00vol%和12.00vol%。还有,使用的金属粉的最大尺寸的平均值在5μm~20μm的范围内。
调制其他种类的助焊剂,其以树脂∶溶剂∶追加的活性成分=20∶10∶1(重量标准),含有松香作为树脂(含活性成分)、醇类作为溶剂、盐酸苯胺(aniline hydrochloride)作为追加的(或其他的)活性成分,此外以各种的比例含金属粉。还有,作为金属粉,使用银的鳞片状物,其含有率为0.50vol%、1.00vol%、3.00vol%、6.00vol%、9.00vol%和12.00vol%。还有,使用的金属粉的最大尺寸的平均值在5μm~20μm的范围内。
(电子部件的装配)
使用调制好的助焊剂,将作为模型的电子部件4软钎焊于基板1而装配,计算形成的接合部的接合不良率。软钎焊接合参照前面图1和图2所说明的方式实施。作为电子部件4,使用CASIO MICRONICS(株)制WLCSP(wafer level chip size package,112针,间距0.5mm),作为焊锡部设于其外部连接用电极5的凸块(材料:锡-银系无铅焊锡,凸块高度0.25mm,焊球直径0.3mm)之内,在位于四角的位置上,有意地使用低的凸块(即,尺寸不足的凸块)。此低的凸块与其他的凸块的高度的差为0.05mm。把在凸块上涂敷了助焊剂的该电子部件按压而搭载于基板之后,供给于回流炉实施软钎焊。还装配了其他元件,其低的凸块与其他的凸块的高度的差为0.1mm。
(接合性的评价)
图5表示助焊剂中的金属粉含有率与接合不良率的关系,以%表示使金属粉含有率发生各种变化时的接合不良,即,在软钎焊完成状态下,凸块6无法被接合于电路电极2的接合不良的发生度数。
由图5的曲线可知,在助焊剂中金属粉几乎不存在时,显示出高的接合不良率,但是,若金属粉含有率在lvol%以上,则任何的情况下,接合不良率的发生均为0%,从接合的面的角度出发,优选金属粉含有率为1vol%以上。
(绝缘性的评价)
采用如上述这样调制的助焊剂形成焊锡接合部,通过电压外加高温高湿测试(美国电子电路协会(IPC-Association Connecting ElectronicsIndustries)规格IPC/JEDEC J-STD-020C)对绝缘性进行评价。
在此评价中,作为基板使用的是采用了FR-4,在形成于其上的JIS Z3284.3的2型的梳齿型电极上形成有无铅焊锡(Sn-3Ag-0.5Cu)的预涂层(30μm厚)。采用具有厚50μm,开口宽度300μm的图案孔的金属掩膜(metal mask),通过丝网印刷向该基板的焊锡预涂层供给上述的助焊剂,进行回流工序(预热150℃~170℃(60秒),峰值温度240℃),以此模拟软钎焊结束状态的基板。
此后,对得到的基板进行电压高温高湿测试(以温度85℃,湿度85%,外加电压20V的条件实施),测定电极间的电阻值。图6显示助焊剂中的金属粉含量跟绝缘电阻值的关系,其表示由使金属粉含有率进行各种变化时的绝缘电阻值,即,通过假定对软钎焊结束状态的基板进行的电压外加高温高湿测试而测定的电阻值。
由图6曲线图可知,绝缘电阻值表现出随着助焊剂中的金属粉含有率变大而下降的倾向,若过量地添加金属粉8,则显示出软钎焊后的绝缘性降低。还有,当表示绝缘性的允许限度的下限电阻值低于1010Ω时,需要清洗基板除去软钎焊后残留的助焊剂。然而,通过将金属粉含有率设为9vol%以下,就能够成为无需软钎焊后的清洗的免清洗型的助焊剂。若考虑到这一结论,则在本发明的助焊剂中,优选金属粉含有率为9%以下,这时,能够将本发明的助焊剂作为免清洗型的且焊剂使用。
即,如果使金属粉含有率包含在1~9vol%的范围内,如此而设定金属粉8的混合比例,则能够实现接合性和绝缘性均优异的免清洗型的助焊剂3。其结果是,通过硬度高、凸块难以破坏的无铅焊锡,从而在以此凸块作为焊锡部而形成的电子部件为对象的情况下,即使由于凸块尺寸的偏差而在凸块和基板的电路电极之间有间隙产生的状态下,也能够有效地防止凸块与电路电极无法正常软钎焊的装配不良的发生,并且,即使在采用免清洗工法的情况下,即省略了用于软钎焊后的助焊剂去除的清洗的情况下,也能够确保良好的绝缘性。
因此,采用这样的本发明的助焊剂而实施的电子部件装配的软钎焊方法,是将形成有作为焊锡部的凸块6的外部连接用电极5软钎焊于电路电极2的软钎焊方法,其包括:第一工序,将本发明的助焊剂3涂敷于凸块6和电路电极2的至少一方;第二工序,通过使凸块6跟电路电极2位置对齐,使助焊剂介于凸块6和电路电极2之间;第三工序,通过加热使凸块6熔化,沿金属粉8的表面使之润湿扩展,由此使熔化了的焊锡与电路电极2接触;第四工序,在第三工序后,使熔化了的焊锡冷却而固化。
根据此软钎焊方法,即使在凸块6跟电路电极2之间有间隙存在时,也能够利用第三工序中由金属粉8形成的桥来引导凸块6熔化的焊锡,从而使之确实地跟电路电极2接触,能够防止由间隙引起的软钎焊不良。
还有,在上述实施方式中,说明的是将第一电极软钎焊于作为第二电极的电路电极2的例子,第一电极是被形成于电子部件4的外部连接用电极5,焊锡部是被形成于外部连接用电极5的凸块6,不过,本发明并不限定于上述方式,例如,第一电极是被形成于基板的电路电极,焊锡部是被形成于这样的电路电极上的预涂层,像这样的情况也能够适用本发明。
还有,在使用了本发明的助焊剂的软钎焊方法中,如上述,能够不必进行软钎焊后的基板的清洗工序,但是在其他的方式中,也可以在软钎焊后进行清洗工序,在此情况下,能够去除残存的助焊剂残渣而使绝缘性进一步提高。
工业上的利用可能性
若使用本发明的助焊剂,则不会带来接合不良和绝缘性的降低,从而能够得到高品质的焊锡接合部,这对于无铅焊锡的电接合部的形成,例如,通过无铅焊锡将电子部件软钎焊于基板上的软钎焊方法来说非常有用。
关联申请的相互参照
本申请依据日本专利申请:专利申请2004-021090(申请日:2004年1月29日,发明名称:软钎焊助焊剂和软钎焊方法)和专利申请2004-327440(申请日:2004年11月11日,发明的名称:软钎焊用的助焊剂和软钎焊方法)主张优选权,这些专利申请的内容,根据参照以上而纳入本申请说明书。
Claims (37)
1.一种助焊剂,是在将形成有焊锡部第一电极软钎焊于第二电极时,介于所述焊锡部和所述第二电极之间的软钎焊用的助焊剂,
其含有:
将树脂成分溶解于溶剂的液状的基础剂;
具有去除氧化物的作用的活性成分;
金属粉,是由具有核及其周围的涂层的构成要素构成的金属粉,其涂层由具有比所述焊锡部的熔点高的熔点的金属构成,
在1~9vol%的范围含有所述金属粉。
2.根据权利要求1所述的助焊剂,其中,形成构成要素的涂层的金属是从由纯度分别为90%以上的金、银和钯构成的群中选择的至少一种。
3.根据权利要求1或2所述的助焊剂,其中,形成构成要素的涂层的金属,是难以在表面生成自然氧化膜的金属。
4.根据权利要求1或2所述的助焊剂,其中,作为树脂成分及活性成分包含松香或改性松香。
5.根据权利要求4所述的助焊剂,其中,除来自松香或改性松香的活性成分外,还含有其他的活性成分。
6.一种软钎焊方法,是将形成有焊锡部的第一电极软钎焊于第二电极的软钎焊方法,包括:
第一工序,将权利要求1~5中任意一项所述的助焊剂,供给于所述焊锡部和所述第二电极的至少一方;
第二工序,通过使所述第一电极的焊锡部和第二电极位置对齐,使所述助焊剂介于所述焊锡部和第二电极之间;
第三工序,通过加热使所述焊锡部熔化,从而使熔化的焊锡接触到所述第二电极;
第四工序,在第三工序后,使所述熔化的焊锡固化。
7.根据权利要求6所述的软钎焊方法,其中,焊锡部是形成于第一电极的凸块。
8.根据权利要求6所述的软钎焊方法,其中,第一电极是电子部件的外部连接用电极。
9.根据权利要求7所述的软钎焊方法,其中,第一电极是电子部件的外部连接用电极。
10.根据权利要求6所述的软钎焊方法,其中,第二电极是形成于基板上的电路的电极。
11.根据权利要求7所述的软钎焊方法,其中,第二电极是形成于基板上的电路的电极。
12.根据权利要求8所述的软钎焊方法,其中,第二电极是形成于基板上的电路的电极。
13.根据权利要求9所述的软钎焊方法,其中,第二电极是形成于基板上的电路的电极。
14.根据权利要求6所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
15.根据权利要求7所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
16.根据权利要求8所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
17.根据权利要求9所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
18.根据权利要求10所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
19.根据权利要求11所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
20.根据权利要求12所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
21.根据权利要求13所述的软钎焊方法,其中,助焊剂的供给,通过形成助焊剂膜,并使所述焊锡部的下端部与该膜接触而涂敷助焊剂的助焊剂涂敷工序而实施。
22.根据权利要求6所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
23.根据权利要求7所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
24.根据权利要求8所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
25.根据权利要求9所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
26.根据权利要求10所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
27.根据权利要求11所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
28.根据权利要求12所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
29.根据权利要求13所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
30.根据权利要求14所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
31.根据权利要求15所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
32.根据权利要求16所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
33.根据权利要求17所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
34.根据权利要求18所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
35.根据权利要求19所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
36.根据权利要求20所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
37.根据权利要求21所述的软钎焊方法,其中,所述熔融焊锡的固化,通过冷却熔融焊锡的冷却工序而实施。
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- 2005-01-27 CN CN2005800032478A patent/CN1914001B/zh not_active Expired - Fee Related
- 2005-01-27 WO PCT/JP2005/001087 patent/WO2005072906A1/ja not_active Application Discontinuation
- 2005-01-27 EP EP05709373.4A patent/EP1736273B1/en not_active Not-in-force
- 2005-01-27 KR KR1020067013032A patent/KR20060126677A/ko not_active Application Discontinuation
- 2005-01-27 TW TW094102505A patent/TW200536652A/zh unknown
- 2005-01-27 US US10/586,598 patent/US8960526B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
EP1736273A4 (en) | 2009-05-20 |
EP1736273A1 (en) | 2006-12-27 |
EP1736273B1 (en) | 2013-12-04 |
KR20060126677A (ko) | 2006-12-08 |
JP4633630B2 (ja) | 2011-02-16 |
US8960526B2 (en) | 2015-02-24 |
WO2005072906A1 (ja) | 2005-08-11 |
JPWO2005072906A1 (ja) | 2007-09-06 |
CN1914001A (zh) | 2007-02-14 |
US20080244900A1 (en) | 2008-10-09 |
TW200536652A (en) | 2005-11-16 |
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