CN1831644B - Micronano transfer device - Google Patents
Micronano transfer device Download PDFInfo
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- CN1831644B CN1831644B CN2005100534175A CN200510053417A CN1831644B CN 1831644 B CN1831644 B CN 1831644B CN 2005100534175 A CN2005100534175 A CN 2005100534175A CN 200510053417 A CN200510053417 A CN 200510053417A CN 1831644 B CN1831644 B CN 1831644B
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Abstract
A micro-nano reprinting device consists of mould, base plate with a forming material layer and energy transfer module with energy transfer piece as well as an energy source. It is featured as connecting energy transfer piece to base plate for providing reprint energy to base plate by energy source to let partial reprint energy penetrate energy transfer piece up to base plate for carrying out reprint - formation of said forming material layer.
Description
Technical field
The invention relates to a kind of transfer device, particularly about a kind of micronano transfer device.
Background technology
In more than ten years, semiconductor industry is being played the part of very important role in global economy in the past, has driven all kinds of micro electronmechanical Products Development and application by development of semiconductor.Yet, along with various product processing live width and line-spacing are contracted to below 100 nanometers gradually, existing optical photomicrography resolution (Photo-lithography) has run into the physical obstacle of optical imagery, the difficulty of process technique and the cost of production equipment also thereby the multiplication.Simultaneously, though there is the people to propose little shadow technology of future generation (Next-generation lithography), this technology still has problems such as equipment cost height and production capacity be low.Therefore, little shadow process technology of extensively being paid close attention at present, be not subjected to the restriction of the photolithography diffraction limit and have little shadow resolution height, the nanometer transfer printing lithography of characteristic such as manufacturing speed is fast, production cost is low (Nanoimprint lithography, NIL).
Roughly, in the field of nanometer transfer technique, be current technology main flow with hot forming and ultraviolet light photopolymerization.The hot forming technology is to utilize High Temperature High Pressure that mould pattern is transferred to the substrate that is coated with macromolecular material, and the ultraviolet light photopolymerization technology then is with UV-irradiation the microstructure sclerosis to be shaped at normal temperatures and pressures.Because forming technique and the process conditions of these two kinds of technology are completely different, so be system module independently separately mostly in conventional device designs.
For example, No. 2004/016406 case of PCT patent WO proposes a kind of micronano transfer device that adopts the ultraviolet light photopolymerization technology, shown in Fig. 4 A and Fig. 4 B.Shown in Fig. 4 A, this micronano transfer device mainly comprises power source 301, imprinter unit bolster 302, imprinter unit 303, ultraviolet light module 304, mould 305, substrate 306, substrate bearing 307, movable feeding platform 308 and platform bearing 309.Shown in Fig. 4 B, this imprinter unit 303 has self-adjusting mechanism 3031, is adjusted the depth of parallelism of 306 of these moulds 305 and this substrates by this self-adjusting mechanism 3031.304 of this ultraviolet light modules comprise ultraviolet source 3041 and refractor 3042.
When carrying out transfer printing, drive these imprinter unit 303 downward feedings by this power source 301, and make this mould 305 contact with this substrate 306, wherein, by the depth of parallelism and the keeping parallelism of 306 of these self-adjusting mechanism 3031 these moulds 305 of adjustment and substrates.At this moment, provide the ultraviolet light energy of suitable power, and transmit energy, with the moulding material sclerosis shaping of 306 of this mould 305 and this substrates by this refractor 3042 by the ultraviolet source 3041 of this ultraviolet light module 304.
Yet, because the power source and the ultraviolet source of this micronano transfer device are to be positioned at the same side, for avoiding light source and power source and in configuration, producing interference such as members such as mould holding mechanisms, must adopt to make light source, just can make the ultraviolet light NE BY ENERGY TRANSFER to moulding material by the side direction light inlet transmits the complexity of energy again by this refractor optical facilities design.Like this, not only make the light source design complex structure, installation cost also presents multiple to be increased.
Simultaneously, this micronano transfer device only can be applicable to the transfer printing processing procedure of small size, when needs carry out large-area transfer printing processing procedure, then needs periodically to repeat the transfer printing processing procedure.Therefore, this prior art except required cycle length that prolongation is manufactured a product, the more direct acceptance rate that influences product of the aligning accuracy error between each cycle.
In addition, also the someone proposes to implement simultaneously the micronano transfer device of hot forming and ultraviolet light photopolymerization processing procedure, and for example United States Patent (USP) 6,482, No. 742 cases.United States Patent (USP) 6,482, No. 742 case proposes a kind of hydrodynamic pressure transfer printing micro-image device, shown in Fig. 5 A and Fig. 5 B, this hydrodynamic pressure transfer printing micro-image device comprises: airtight cavity 401, the fluid intake 402 that is formed at these airtight cavity 401 left and right sides, mould 403, be coated with moulding material 404 substrate 405, be used to encase this mould 403 and the sealing shroud 406 of this substrate 405, the light-permeable window 408 of being located at the heating unit 407 of these airtight cavity 401 inside and being located at these airtight cavity 401 top sides.
When carrying out transfer printing, insert this airtight cavity 401 inside again after by sealing cover 406 this mould 403 being encased with this substrate 405 earlier, after by this heating unit 407 this substrate 405 being heated to predetermined forming temperature, pour into fluid (not marking) from this fluid intake 402 respectively this mould 403 is exerted pressure, carry out the hot forming processing procedure.In addition, when fluid is exerted pressure to this mould 403, also can make outside ultraviolet source (not marking), carry out the ultraviolet light photopolymerization processing procedure by 404 irradiations of the moulding material on 408 pairs of these substrates 405 of light-permeable window.Whereby, just can carry out the nanostructured transfer printing by the design that has hot forming and ultraviolet light photopolymerization shaping function concurrently is shaped.
But, when using the hydrodynamic pressure transfer printing micro-image device of 6,482, No. 742 cases of United States Patent (USP), must expend time in and change on the system module, this certainly will increase installation cost.Simultaneously, owing to need to carry out earlier the storehouse and the sealing of mould and substrate before the transfer printing, and after transfer printing is shaped, also must remove sealing shroud, the depressurization state carries out the demoulding again.Like this, not only the processing cost before and after the transfer printing improves and processing procedure control is discontinuous, prolongs forming period, is unfavorable for volume production.
In addition, the light transmission that adds sealing shroud is not good usually, so pass sealing when cover again when ultraviolet light must pass the light-permeable window, the ultraviolet light energy can be absorbed even form scattering in transmittance process.Like this, because the uncontrollable ultraviolet light energy that provides of this prior art, and can't obtain the uniform transfer printing finished product, have influence on the shaping quality of moulding material.
Therefore, because above-mentioned prior art has light source design mechanism complexity, equipment cost costliness, the transfer printing area is little, processing cost improves, processing procedure control is discontinuous, forming period prolongs and shaping shape quality is difficult to shortcomings such as control, cause that cost height, production capacity are low, bad and be unfavorable for volume production, so there is anxious part to be improved.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, fundamental purpose of the present invention is to propose a kind of micronano transfer device, provides when having different transfer printing processing procedure function concurrently, reaches the effect of simplified structure.
Another object of the present invention is to provide a kind of micronano transfer device that can once finish the large tracts of land transfer printing, improved output.
A further object of the present invention is to provide a kind of micronano transfer device that can carry out transfer printing equably, has improved the shaping quality.
Another purpose of the present invention is to provide a kind of micronano transfer device, reduces installation cost.
Another object of the present invention is to provide a kind of micronano transfer device, shorten forming period.
A further object of the present invention is to provide a kind of micronano transfer device, and design flexibility is provided.
For reaching above-mentioned and other purpose, the invention provides a kind of micronano transfer device, this micronano transfer device comprises mould at least; Substrate, this mould and being provided with has a moulding material layer at least relatively; Transmit energy module, comprise NE BY ENERGY TRANSFER part and at least one energy source, connect by this NE BY ENERGY TRANSFER part and establish this substrate or this mould; Actuating unit is located at this mould top; And power source, connect this actuating unit, be pressed against this substrate to drive this actuating unit of the downward feeding of this actuating unit and this mould by this power source, make this mould contact fully with moulding material layer on this substrate, and just feed-disabling immediately after producing suitable pressure between this mould and this moulding material layer, and maintain packing stage, and make this energy source provide the transfer printing energy to this substrate or this mould, at least make part transfer printing energy penetrate this NE BY ENERGY TRANSFER part, carry out transfer printing and be shaped to this substrate or this mould.
This mold feature physical dimension is below 100 microns, and this mould may be selected to be the light-permeable mould.This substrate this mould relatively is provided with, and this substrate is provided with a moulding material layer at least.This substrate is silicon substrate, glass substrate or other light-permeable substrate.
This micronano transfer device comprises two these energy sources in the present invention.This energy source comprises ultraviolet source and heating source, and this ultraviolet source and this heating source can be arranged on the same side or homonymy not.
Micronano transfer device of the present invention also can comprise this energy source, and this energy source can be ultraviolet source or heating source.
This ultraviolet source is that wavelength is 10 * 10
-9Rice is to 400 * 10
-9Light source between the rice scope.This heating source comprises electromagnetic wave source, electric heating heating source, optical radiation heating source, induction heating source and forms a kind of in the thermal source by above-mentioned heating source more than.This electromagnetic wave source is the heating source of frequency between 300KHz to 300GHz scope.
This NE BY ENERGY TRANSFER part then is the structure that the penetrable material of energy is made.This NE BY ENERGY TRANSFER part is the structure made of light-permeable material partially or completely.This NE BY ENERGY TRANSFER part preferably is selected from a kind of in the combination of being made up of quartz, glass, macromolecule and stupalith.
In sum, because the present invention connects with the transparent NE BY ENERGY TRANSFER part of energy to establish this substrate or this mould, make this energy source adopt structure is set easily and shine, avoided energy source and power source and in configuration, produced interfering such as members such as mould holding mechanisms.So, use the present invention can provide have different transfer printing processing procedure functions concurrently in, simplified the structure of micronano transfer device, solve the light source design mechanism complexity of above-mentioned prior art whereby, the equipment cost costliness, the transfer printing area is little, processing cost improves, processing procedure control is discontinuous, forming period prolongs and formed products is blamed the cost height that causes with shortcomings such as controls, production capacity is low, bad and be unfavorable for problems such as volume production, can once finish the large tracts of land transfer printing and carry out transfer printing equably, improving output, improve the shaping quality, reduce installation cost, when shortening forming period, make Design of device have more dirigibility, improved industrial utilization.
Description of drawings
Fig. 1 is the synoptic diagram of the micronano transfer device of embodiments of the invention 1;
Fig. 2 is the synoptic diagram of the micronano transfer device of embodiments of the invention 2;
Fig. 3 is the synoptic diagram of the micronano transfer device of embodiments of the invention 3;
Fig. 4 A and Fig. 4 B are the synoptic diagram of the micronano transfer device of No. 2004/016406 case of PCT patent WO, and wherein, Fig. 4 A is the structure of whole micronano transfer device, and Fig. 4 B has amplified the relation that is provided with that shows between mould, substrate and sealing shroud; And
Fig. 5 A and Fig. 5 B are United States Patent (USP)s 6,482, the synoptic diagram of the hydrodynamic pressure transfer printing micro-image device of No. 742 cases, and wherein, Fig. 5 A is the structure of whole hydrodynamic pressure transfer printing micro-image device, Fig. 5 B is that the light source that amplifies this device sets up an organization.
Embodiment
Following examples are to further describe viewpoint of the present invention, but are not to limit category of the present invention anyways.
Fig. 1 is that the embodiment 1 according to micronano transfer device of the present invention draws.It should be noted, micronano transfer device of the present invention is applied in the transfer printing nanoscale structures, it is that example describes at the micronano transfer device of 100 microns following nanostructureds that following embodiment employing can be made such as feature structural dimension parameter, but is not as limit person.Because existing nanostructured is applicable object, its structure does not change, so for simplicity, makes feature of the present invention and structure more clear understandable, only shows and the structure of direct correlation of the present invention that in the accompanying drawings remainder slightly removes.
As shown in Figure 1, the micronano transfer device of present embodiment comprises at least: mould 11, substrate 13 and transmission energy module 15.
These mould 11 feature structural dimension parameters are below 100 microns.This substrate 13 relative these moulds 11 and being provided with, and this substrate 13 has a moulding material layer 131 at least, and this substrate can be silicon substrate, glass substrate or other light-permeable substrate.This transmission energy module 15 comprises NE BY ENERGY TRANSFER part 151 and two energy sources 153,155.This NE BY ENERGY TRANSFER part 151 connects establishes this substrate 13, and this NE BY ENERGY TRANSFER part 151 is that energy penetrates the made structure of material.Preferably, this NE BY ENERGY TRANSFER part 151 may be selected to be the made structure of material of part printing opacity or complete printing opacity.More preferably, this NE BY ENERGY TRANSFER part 151 can for example be quartz, glass, macromolecule, pottery or other equivalence element.153,155 of this energy sources can be respectively ultraviolet source and heating source.
These mould 11 tops are provided with actuating unit 17, and this actuating unit 17 is connected with power source (not marking), downwards this actuating unit 17 of feeding and this mould 11.In the present embodiment, this actuating unit 17 comprises: connect this power source keeper 171, kept and can contact the pressing piece 173 of this mould 11 and be located in this keeper 171 and can contact the equal casting dies 175 of this pressing piece 173 by this keeper 171.The present invention also can use other can adjust the high pressure that applies and/or normal pressure evenly carrying out other actuating unit of transfer printing, non-ly exceeds with present embodiment.
When for example carrying out the ultraviolet light photopolymerization processing procedure, can drive these actuating unit 17 downward these actuating units 17 of feeding and this mould 11 is pressed against this substrate 13 by this power source, make this mould 11 contact fully with moulding material layer 131 on this substrate 13, and just feed-disabling immediately after producing suitable pressure between this mould 11 and this moulding material layer 131, and maintain packing stage.At this moment, can be by the suitable energy of energy source 153 outputs of for example ultraviolet source, this ultraviolet source Wavelength-selective is 10 * 10
-9Rice is to 400 * 10
-9Light source between the rice scope, but be not as limit.Like this, just can be by connecing the NE BY ENERGY TRANSFER part 151 of establishing this substrate 13, the moulding material layer 131 of the transfer printing NE BY ENERGY TRANSFER that this energy source 153 is provided to this substrate 13 carries out transfer printing shaping processing procedure to this moulding material layer 131.
When for example carrying out the hot forming processing procedure, can drive these actuating unit 17 downward these actuating units 17 of feeding and this mould 11 is pressed against this substrate 13 by this power source equally, make this mould 11 contact fully with moulding material layer 131 on this substrate 13, and just feed-disabling immediately after producing suitable pressure between this mould 11 and this moulding material layer 131, and maintain packing stage.What be different from above-mentioned ultraviolet light photopolymerization processing procedure is, at this moment, can be by the suitable energy of energy source 155 outputs of for example heating source, wherein, this heating source for example is electromagnetic wave source, electric heating heating source, optical radiation heating source, induction heating source or other equivalent heating source, thermal source in the device can be made up of above-mentioned more than one heating source, exports suitable energy.When using electromagnetic wave source, then this electromagnetic wave source is preferably the heating source of frequency between 300KHz to 300GHz scope, but is not as limit.Like this, just can be by connecing the NE BY ENERGY TRANSFER part 151 of establishing this substrate 13, the moulding material layer 131 of the transfer printing NE BY ENERGY TRANSFER that this energy source 155 is provided to this substrate 13 carries out transfer printing shaping processing procedure to this moulding material layer 131.
Because the normal temperature and pressure process conditions of ultraviolet light photopolymerization processing procedure utilization and the High Temperature High Pressure process conditions of hot forming processing procedure utilization are prior art, so do not repeat them here.
Simultaneously, though the energy source the 153, the 155th in the present embodiment is selected to be arranged on the same side and to place this NE BY ENERGY TRANSFER part 151 belows simultaneously, but in other embodiments, also can establish a switching mechanism (not marking) in addition, be located at the energy source 153 or the energy source 155 of these NE BY ENERGY TRANSFER part 151 belows by this switching mechanism adjustment, use required energy source as required.And present embodiment is to select to connect with bearing 157 to establish this NE BY ENERGY TRANSFER part 151, but the structure that this NE BY ENERGY TRANSFER part 151 is set not is as limit, only otherwise the structure that can interfere this energy source 153,155 to carry out NE BY ENERGY TRANSFER all is applicable to the present invention.
In addition, can use the light-permeable substrate as this substrate 13 in the present embodiment, the ultraviolet light energy that this NE BY ENERGY TRANSFER part 151 is transmitted is transmitted to this moulding material layer 131 by this substrate 13; But in other embodiments, also can use for example mould 11 of light-permeable mould, this mould 11 and the position that is provided with of this substrate 13 are exchanged, the ultraviolet light energy that this NE BY ENERGY TRANSFER part 151 transmits just is transmitted to this moulding material layer 131 by this mould 11.Like this, just can connect by this NE BY ENERGY TRANSFER part 151 and establish this substrate 13 or this mould 11, and make this energy source 153 or energy source 155 provide the transfer printing energy to this substrate 13 or this mould 11, at least make part transfer printing energy penetrate this NE BY ENERGY TRANSFER part 151, carry out different transfer printing shaping processing procedures to this substrate 13 or this mould 11.
With light source design mechanism complexity, equipment cost costliness, the transfer printing area is little, processing cost improves, processing procedure control is discontinuous, forming period prolongs and the unmanageable prior art of formed products matter is compared, the present invention can avoid energy source and power source and produce in configuration such as members such as mould holding mechanisms interfering, make optionally connected this substrate or this mould established of the transparent NE BY ENERGY TRANSFER part of energy, and this energy source can adopt simple and easy, flexible configuration structure to shine, and makes the present invention can adopt the structure of simplification and has different transfer printing processing procedure functions concurrently.
Simultaneously, because the present invention is not subjected to the restriction of prior art light source by the side direction light inlet, can once finish the large tracts of land transfer printing, and can carry out transfer printing equably by applying suitable pressure, processing cost height, the processing procedure having avoided using sealing shroud to cause are controlled shortcomings such as discontinuous and forming period prolongation, help volume production.
In addition, design of the present invention can be satisfied ultraviolet light photopolymerization processing procedure and the required process conditions of hot forming processing procedure at least, except can adjusting required energy source and have concurrently the different transfer printing processing procedure functions according to processing procedure, more interchangeable substrate and mould be oppositely arranged the position, more flexible than prior art.
So, use the present invention can provide have different transfer printing processing procedure functions concurrently in, simplify the structure of micronano transfer device, solve the variety of problems that prior art causes whereby, more can improve the quality of nanostructured product, improve the industrial utilization of device simultaneously.
Fig. 2 is that the embodiment 2 according to micronano transfer device of the present invention draws.Wherein, identical or approximate with embodiment 1 assembly is to represent with identical or approximate element numbers.
As shown in Figure 2, the micronano transfer device of present embodiment comprises at least: mould 11, substrate 13 and transmission energy module 15 '.This NE BY ENERGY TRANSFER part 151 of this transmission energy module 15 ' comprise, energy source 153 ' and energy source 155 ', this energy source 153 ' can for example be ultraviolet source, but this energy source 155 ' then can be the heating source of this mould 11 of clamping, and this energy source 155 ' be arranged on keeper 171 of this actuating unit 17 can be omitted the pressing piece 173 of this mould 11 of contact among the embodiment 1.
Like this, in the time for example will carrying out the ultraviolet light photopolymerization processing procedure, can be by the suitable energy of the energy source 153 that for example is arranged on these NE BY ENERGY TRANSFER part 151 belows ' export, by connecing the NE BY ENERGY TRANSFER part 151 of establishing this substrate 13, with the transfer printing NE BY ENERGY TRANSFER of this energy source 153 ' the provide moulding material layer 131 to this substrate 13; In the time for example will carrying out the hot forming processing procedure, then can be by the suitable energy of the energy source 155 that for example is arranged on these mould 11 tops ' export, again by connecing the NE BY ENERGY TRANSFER part 151 of establishing this substrate 13, with the transfer printing NE BY ENERGY TRANSFER of this energy source 155 ' the provide moulding material layer 131 to this substrate 13.Certainly, the position is set also can exchanges of this mould 11 and this substrate 13 as long as can transfer energy to this moulding material layer 131, carried out the structure that transfer printing is shaped to this moulding material layer 131 and all is applicable to the present invention.
Fig. 3 is that the embodiment 3 according to micronano transfer device of the present invention draws.Wherein, same as the previously described embodiments or approximate assembly is represented with identical or approximate element numbers.
As shown in Figure 3, present embodiment is with the energy source 155 of heating source of this transmission energy module 15 ' for example ' be arranged on this NE BY ENERGY TRANSFER part 151 belows, and this mould 11 tops of the energy source 153 of ultraviolet source ' be arranged on for example.At this moment, can use for example mould 11 of light-permeable mould, for transmitting ultraviolet light.Certainly, also can be with the location swap that is provided with of this mould 11 with this substrate 13, and for example use that the substrate 13 of light-permeable substrate is used to transmit ultraviolet light.
As from the foregoing, connect the mould of establishing the light-permeable mould or the substrate of light-permeable substrate with the transparent NE BY ENERGY TRANSFER part of energy, not only can carry out the ultraviolet light photopolymerization processing procedure and can adopt easy illumination configuration, and do not produce to produce in the prior art and produce the problem of interfering with power source, more can carry out the hot forming processing procedure, provide with the effect of hot pressing and ultraviolet light transfer printing shaping.Simultaneously, but all casting die cooperates the energy source of pressing piece or clamping mould, can once finish large tracts of land and uniform transfer printing, does not need to increase the required cost of forward and backward processing, does not also prolong the shortcoming of forming period.In addition, this mould and this substrate the position is set can exchanges of position and different-energy source be set, so the user can change according to demand, and this variation there is no difficulty.
In sum, micronano transfer device of the present invention not only provide have different transfer printing processing procedure functions concurrently in, reach the effect of simplified structure, more can once finish the large tracts of land transfer printing, improved output, and can carry out transfer printing equably and improve the shaping quality, and reduce installation cost whereby and shorten forming period.So the present invention can solve the various shortcoming of prior art, and the present invention has the dirigibility of design, can effectively improve industrial utilization.
Claims (14)
1. a micronano transfer device is characterized in that, this device comprises at least:
Mould;
Substrate, this mould and being provided with has a moulding material layer at least relatively;
Transmit energy module, comprise the NE BY ENERGY TRANSFER part, ultraviolet source, heating source and the switching mechanism that are arranged in this substrate or this mould, this switching mechanism is in order to adjust this ultraviolet source and heating source;
Actuating unit is located at this mould top; And
Power source, connect this actuating unit, be pressed against this substrate to drive this actuating unit of the downward feeding of this actuating unit and this mould by this power source, make this mould contact fully with moulding material layer on this substrate, and just feed-disabling immediately after producing suitable pressure between this mould and this moulding material layer, and maintain packing stage, and make ultraviolet source and heating source provide the transfer printing energy to this substrate or this mould, at least make part transfer printing energy penetrate this NE BY ENERGY TRANSFER part, carry out transfer printing and be shaped to this substrate or this mould.
2. micronano transfer device as claimed in claim 1 is characterized in that, this mold feature physical dimension is below 100 microns.
3. micronano transfer device as claimed in claim 1 is characterized in that, this mould is the light-permeable mould.
4. micronano transfer device as claimed in claim 1 is characterized in that, this substrate is the light-permeable substrate.
5. micronano transfer device as claimed in claim 1 is characterized in that, this substrate is silicon substrate or glass substrate.
6. micronano transfer device as claimed in claim 1 is characterized in that, this ultraviolet source wavelength is 10 * 10
-9Rice is to 400 * 10
-9Light source between the rice scope.
7. micronano transfer device as claimed in claim 1 is characterized in that, this ultraviolet source and this heating source are arranged on the same side.
8. micronano transfer device as claimed in claim 1 is characterized in that, this ultraviolet source and this heating source are arranged on opposite side.
9. micronano transfer device as claimed in claim 1 is characterized in that, this heating source be selected from by electromagnetic wave source, electric heating heating source, optical radiation heating source and induction heating source form the combination at least a.
10. micronano transfer device as claimed in claim 9 is characterized in that, this electromagnetic wave source is the heating source of frequency between 300KHz to 300GHz scope.
11. micronano transfer device as claimed in claim 1 is characterized in that, this NE BY ENERGY TRANSFER part comprises that quartz, glass, macromolecule and stupalith form a kind of in the combination.
12. micronano transfer device as claimed in claim 1 is characterized in that, this NE BY ENERGY TRANSFER part is the structure that the penetrable material of energy is made.
13. micronano transfer device as claimed in claim 12 is characterized in that, but this NE BY ENERGY TRANSFER part is the structure that the part light-transmitting materials is made.
14. micronano transfer device as claimed in claim 12 is characterized in that, this NE BY ENERGY TRANSFER part is the structure made of light-transmitting materials fully.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2005100534175A CN1831644B (en) | 2005-03-07 | 2005-03-07 | Micronano transfer device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2005100534175A CN1831644B (en) | 2005-03-07 | 2005-03-07 | Micronano transfer device |
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| CN1831644A CN1831644A (en) | 2006-09-13 |
| CN1831644B true CN1831644B (en) | 2010-12-22 |
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| CN2005100534175A Expired - Fee Related CN1831644B (en) | 2005-03-07 | 2005-03-07 | Micronano transfer device |
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| CN101380824B (en) * | 2007-09-07 | 2010-09-29 | 洪荣崇 | Pressure-equalizing device for microstructure transfer printing |
| CN114179537A (en) * | 2020-09-14 | 2022-03-15 | 东北大学秦皇岛分校 | Micro-transfer method and device for controlling SMP (symmetric multi-processing) seal based on focused ultrasound |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6121130A (en) * | 1998-11-16 | 2000-09-19 | Chartered Semiconductor Manufacturing Ltd. | Laser curing of spin-on dielectric thin films |
| US6482742B1 (en) * | 2000-07-18 | 2002-11-19 | Stephen Y. Chou | Fluid pressure imprint lithography |
| CN1409832A (en) * | 1999-12-10 | 2003-04-09 | 奥布杜卡特公司 | Device and method in connection with production of structures |
| US6858308B2 (en) * | 2001-03-12 | 2005-02-22 | Canon Kabushiki Kaisha | Semiconductor element, and method of forming silicon-based film |
-
2005
- 2005-03-07 CN CN2005100534175A patent/CN1831644B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6121130A (en) * | 1998-11-16 | 2000-09-19 | Chartered Semiconductor Manufacturing Ltd. | Laser curing of spin-on dielectric thin films |
| CN1409832A (en) * | 1999-12-10 | 2003-04-09 | 奥布杜卡特公司 | Device and method in connection with production of structures |
| US6482742B1 (en) * | 2000-07-18 | 2002-11-19 | Stephen Y. Chou | Fluid pressure imprint lithography |
| US6858308B2 (en) * | 2001-03-12 | 2005-02-22 | Canon Kabushiki Kaisha | Semiconductor element, and method of forming silicon-based film |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2000-194142A 2000.07.14 |
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